Photocurable adhesive composition and curing method thereof

FIELD: chemistry.

SUBSTANCE: composition contains epoxy diane resin, oligoether acrylate, curing agent, initiator and solid filler. The filler is silica gel or aerosil. The initiator is in form of benzoin or dimethoxyphenyl acetophenone ethers. Oligoether acrylate is selected from a group of dimethacrylate ethers. The curing agent used is aliphatic or aromatic diamine and aliphatic or aromatic tertiary amine. The photocurable adhesive composition is obtained by mixing all components until their complete dissolution. The obtained mixture is put between glued surfaces and exposed to UV light for not less than 5 min. Further, thermal post-polymerisation is carried out at temperature not higher than 50°C, followed by cooling and holding. The invention is used in production of organic light-emitting diodes to prolong their service life.

EFFECT: good adhesion to glass, weather resistance, low chemical aggressiveness, high water resistance and crack resistance when pressed between glass plates.

8 cl, 3 tbl, 3 ex

 

The invention relates to polymeric compositions and the development of fotoallergiyami adhesive compositions which can be used in the production structures of light-emitting diodes based on new organic materials. Organic light emitting diodes - acid or OLED - Organic Light Emitting Diodes are used for creating flat color information screens and color of indicator devices with high consumer properties, as well as cost-effective and efficient light sources. Technology osig is a leading technology next generation in the series of flat panel displays.

Organic electroluminescent display of acid is a monolithic thin-film semiconductor device that emits light by passing through it an electric current. Acid consists of a series of organic thin films, which are enclosed between the two electrodes.

The main disadvantage of acid is the susceptibility of sputtered films of organic semiconductor materials to the surrounding atmosphere, which leads to their rapid destruction under the action of airborne oxygen and water vapor and, consequently, low temporal stability of the device.

To ensure durability in operation of the device is required capsulate, for which trojstvo stick between two glass plates. For wafer bonding is required, the adhesive composition, which must have

good adhesion to glass;

resistance to weathering and water vapor;

low chemical aggressiveness;

high resistance;

not to spread when compressed between glass plates.

Known fototerapia adhesive composition containing oligoarticular(meth)acrylate, a monomer, oligoarticular and the initiator (see patent RF №2138529, aubl.), taken as a prototype. In the same source described the method of curing the composition. The method involves mixing of all components prior to their complete dissolution, placing the mixture between the substrates and exposure to UV light.

Known composition as a necessary and sufficient component contains oligoarticular, which is a Homo - or copolymer of ethylene oxides and propylene with terminal hydroxyl groups, which gives the composition of the chemical aggressiveness, inappropriate for sensitive organic layers, which excludes its use in the production of acid.

The problem to which the invention is directed, is the development of adhesive compositions that combine good adhesion to glass with low chemical aggressiveness, acceptable fluid is thew, high moisture resistance and tightness, suitable for the encapsulation of acid, which increases the service life of the device.

This problem is solved due to the fact that the developed fototerapia adhesive composition containing epoxy resin, oligopyrroles selected from the group dimethacrylate esters, and the initiator, which is used as the ethers of benzoin or dimethoxyphenylacetone, hardener, which is used as an aliphatic or aromatic diamine, and an aliphatic or aromatic tertiary amine, and a solid filler in the following ratio of components, parts:

epoxy resin 40-85

dimethacrylate ether 15-60

aliphatic or aromatic diamine of 0.1-1.0

aliphatic or aromatic tertiary amine is at least 1.0

the initiator of 0.1-2.0

solid filler is 0.05-10

As oligopyrroles selected from the group dimethacrylate esters, can be used dimethacrylate polyethylene glycols with number oxyethylene fragments from 1 to 8, such as triethylene glycol dimethacrylate (industrial brand TGM-3), or oligocarbonate dimethacrylate, for example α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide (ACM-2), or dimethacrylate on the basis of phthalic acid, such as α-methacryloyl-ω-methacryloyl-d is etilenglikole-oligo(diethylenglycol) (MDF-2), or mixtures thereof. These compounds are the most reactive, their use provides vodootvedenie composition in the minimum possible exposure time, of the order of 5-15 minutes, Preferably from the group dimethacrylate esters to use dimethacrylate polyethylene glycols with number oxyethylene fragments from 1 to 8, such as triethylene glycol dimethacrylate (industrial brand TGM-3), or oligocarbonate dimethacrylate, for example α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide (ACM-2), or mixtures thereof as available and traditionally used for the connection.

As aliphatic diamines can be used hexamethylenediamine were, 1,10-decamethylenediamine, 1,4-butylenediamine, 2-methyl-1,4-butylenediamine, 2-ethyl-1,4-butylenediamine and others, as aromatic diamines: para-phenylenediamine, meta-phenylenediamine, N.N'-di-n-butyl-para-phenylenediamine, N.N'-di-n-octyl-para-phenylenediamine and others, as aliphatic tertiary amines can be used N.N-dimethyl-ISO-propanolamine, triethylamine, tri-n-butylamine, N.N-dimethylethanolamine, triethanolamine, etc, as well as aromatic tertiary amines - N.N-dimethylaniline, N.N-diethylaniline, michler ketone, para-bromo-N.-dimethylaniline, N.N-diethyltoluene.

In the preferred embodiment, as the aliphatic diamine is used, for example, g is cimetidine, and as an aromatic for example, para-phenylenediamine as available and traditionally used for the connection.

In the preferred embodiment, as an aliphatic tertiary amine is used, for example, dimethyl-ISO-propanolamine, and as an aromatic, for example, N.N-dimethylaniline as available and traditionally used compounds, these compounds preferably used in the amount of 2-5 parts, which provides a slightly higher strength properties of the composition, although in comparison with 1 parts of a sharp jump in strength properties in the mentioned interval does not occur. However, in some special applications of the composition, it is preferable to use aliphatic or aromatic tertiary amine in an amount of 2-5 parts

As an initiator of photopolymerization use ethers of benzoin and dimethoxyphenylacetone. As esters of benzoin can be used methyl, or ethyl, or butyl, etc. esters of benzoin. In the preferred embodiment, using methyl ether of benzoin as the most available and traditionally used phototherapy initiator.

As filler can be used silica gel, or aerosol, or fullerenes, or dendrimers or hyperbranched polymers, or metal powders is in, or ceramics. Due to the fact that the silica and Aerosil are available and are produced by the domestic industry, examples of their use.

Preferably as a filler to use silica gel or aerosol with a particle size of 3-5 μm as the most accessible, produced by domestic industry fillers. In addition, the use of silica gel or aerosol provides good adhesion, as mentioned fillers consist of silicon dioxide, having the same nature as the bonding material. The specified particle size creates a fixed gap between the bonding surfaces, which is useful when applying the adhesive composition and prevents the possibility of the spreading of the adhesive when compressed between the bonding plates, providing a minimum flow rate of the adhesive composition.

The composition comprising the composition of ingredients and their quantities were chosen empirically and, as the experiments showed, are the most optimal for the task.

For solving the problem are essential conditions of curing of the composition, namely the time photoallergen and temperature, for the above parameters affect the strength of the adhesive joint, and means on the suitability of its use in the manufacture of acid.

The problem is solved also by the fact that a well known method of curing the composition, including the mixing of all components prior to their complete dissolution, placing the mixture between the substrates and exposure to UV light, according to the invention, the irradiation is conducted not less than 5 min, followed by thermopolymerization at a temperature not exceeding 50°C, followed by cooling and maintaining utverzhdenii composition.

From the point of view of technological facilities in a preferred embodiment, it is expedient to irradiation for 5-15 min and thermopolymerization - at 35-50°C for 45-60 minutes. In a preferred embodiment, the exposure time is 8-10 hours.

Selected in the above ratio mentioned oligomers allow you to obtain the adhesive composition with the maximum sensitivity, which when vodootvedenie gives a uniform adhesive layers with high technological and adhesion to glass (see table 1).

Table 1
The influence of composition on the adhesive properties of the adhesive layer to (σ1and after soaking in water for 20 days (σ2)
Composition, partsThe content of the tertiary amine*, partsThe content of the diamine**, parts The content of the initiator***, partsShear strength (σ1), Mn/m2Shear strength (σ2), Mn/m2
100 ACM-2000,20,950
30 ACM-2
- 70 ED-20
50,10,22,9
40 ACM-2
- 60 ED-20
50,10,23.32,63
60 ACM-2
- 40 ED-20
50,10,22,582.0
70 ACM-2
- 30 ED-20
50,10,21,31
100 ED-2050,104,2 3,2
40 ACM-2
- 60 ED-20
20,10,41,14
*) as Amin taken dimethyl-ISO-propanolamine;
**) as diamine taken para-phenylenediamine;
***) as initiator taken dimethoxyphenylacetone.

As components use monomers containing no functional groups capable of interaction with a work material acid. As such, use epoxy resin with the content of epoxy groups of not less than 20-25% and oligopyrroles selected from the group dimethacrylate esters, with epoxy resin provides adhesive properties, and oligopyrroles used as photopolymerizable oligomer. As the epoxy resin used widespread and available Dianova epoxy resin grades ED-16, ED-20, ED-22, etc. for which the content of epoxy groups is 20-22,5%. It is well known that the content of epoxy groups in the resin is inversely proportional to the concentration of hydroxyl groups (encyclopedia of polymers, volume 3, ed. Soviet encyclopedia, M. 1977, s). In this regard, the use of resin with a content of epoxy groups below pointed to by the first interval, in which a high content of hydroxyl groups that are reactive with respect to the material of acid, gives the composition a large chemical aggressiveness, exclude its use in the production of acid. As oligoadenylate selected from the group dimethacrylate esters, use the most reactive compounds, such as dimethacrylate polyethylene glycols with number oxyethylene fragments from 1 to 8, such as triethylene glycol dimethacrylate (industrial brand TGM-3), and oligocarbonate dimethacrylate, for example α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide (ACM-2) and dimethacrylate on the basis of phthalic acid, such as α-methacryloyl-ω-methacryloyl-diethylenglycol-olig(diethylenglycol) (MDF-2), or a mixture thereof.

When the content of the epoxy resin below the specified limit of the adhesive properties of the composition deteriorate sharply, the strength of the adhesive layer decreases from 3.3 to 1.3 Mn/m2and when the content of the above - fototerapia composition does not occur. As photopolymerizable oligomer use oligopyrroles. When the content of oligoadenylate selected from the group dimethacrylate esters, below the specified limit, the photosensitivity of the composition deteriorates (fototerapia increases to 1 hour), and when the content is higher worsen the camping its adhesive properties, the strength of the adhesive layer decreases from 3.3 to 1.3 Mn/m2. The reason is that within the claimed ratios of epoxy resin - oligopyrroles in the composition combines the properties of each component, and outside - in the songs begin to dominate the individual properties of one or another component.

As a hardener epoxy resin used aliphatic or aromatic diamines and aliphatic or aromatic tertiary amines, in the presence of which is formed more rare epoxy mesh than in the presence of traditionally used polyethylenepolyamines. In the case of using an aliphatic or aromatic diamine in the polymer retained enough apachegroup, providing good adhesion to glass. The presence of aliphatic or aromatic tertiary amine enhances the action of the diamine in the composition of the deep stages of polymerization (see table 2).

Table 2
The influence of N.N-dimethyl-ISO-propanolamine (DEPA) on the adhesive properties of the adhesive composition containing 40 parts ACM-2, 60 parts of ED-20 and 0.2 parts of dimethoxyphenylacetone and 0.1 parts of para-phenylenediamine
The content of DMIP, partsShear strength (σ), Mn/m2
10,85
22,45
53,3

Aliphatic or aromatic tertiary amine involved in the process of knitting formed between the polymers of the epoxy resin and oligoadenylate that improves their compatibility. When the content of aliphatic or aromatic diamine below the specified interval adhesive properties of the composition deteriorate in 4 times, and when the content is above a high degree of crosslinking of epoxy resin makes the compatibility of the resulting polymers of epoxy resin and oligoadenylate. The adhesive layer splits into two phases and the adhesive properties are not manifested. When the content of aliphatic or aromatic tertiary amine below the specified value, the adhesion of the polymer composition to the glass is rapidly deteriorating (from 3.3% to 0.07 Mn/m2), and when the content of the above - abrupt changes in adhesion does not occur.

The initiator can be chosen according to ensure curing of the adhesive composition for technically acceptable time (usually not more than 30 min). As an initiator of photopolymerization use photoinitiators, such as benzoin ethers, or dimethoxyphenylacetone providing vodootvedenie the claimed composition in the minimum possible time of exposure (not more than 5-15 min). As the ether of benzoin can be used methyl, or ethyl, or butyl, or other esters of benzoin. When the content of the initiator is below the specified limit is not fototerapia composition, and when the content is above a high degree of crosslinking oligoadenylate leads to delamination polymerizable composition into two phases, with the resulting polymer loses its adhesive properties.

As filler can be used silica gel, or aerosol, or fullerenes, or dendrimers or hyperbranched polymers, or powders of metals or ceramics. Due to the fact that the silica and Aerosil are available and are produced by the domestic industry, examples of their use.

Typically, fillers are used to make the composition thixotropic properties or increasing the viscosity and other (encyclopedia of polymers, volume 3, ed. Soviet encyclopedia, M. 1977, s). In the invention the purpose of the filler with the specified particle size is to create a fixed gap between the bonding surfaces, which prevents the spreading of glue.

The use of solid filler in the specified interval, which specifies the optimal thickness of the adhesive layer and thereby prevents the spreading of glue squeezing between the bonded plates. The size of the filler particles sets the size of the gap between the glass plates of acid, which, in turn, should exceed the thickness of the working layer of the device. When the content of the filler is below 0.05 parts dramatically increases the spreading of the composition on the working surface, and when the content of above 10.0 parts is the aggregation of the filler particles and a significant increase in viscosity, which makes the composition less technological and leads to an uncontrolled increase of the layer thickness. Furthermore, there is the irreproducibility of the size of the gap between the panes of acid. To determine the spreading of the composition with the filler in the uncured state, the composition is subjected to preliminary ultrasonic mixing. Then a portion of the composition by weight of 0.002 g applied to the middle of the glass size is 60·60mm, served on top of another glass, put a weight with a mass of 100 g and, holding the edges of the glass from the offset, allowed to stand for 1 min under the action of ultrasound. Then the weight is removed and measure the diameter of the spot spread composition in mutually perpendicular directions. The test results presented in table 3.

Table 3
The effect of filler on the spreading of the composition composition of 60 parts smo is s ED-20, and 40 parts oligomer ACM-2, subjected to sonication
No. of experimentThe concentration of the filler partsThe diameter of droplets of the composition, mm
1049
20,0515
30,114
41,014
55,014
610,014

The test results show that the introduction of the filler in the amount at which the viscosity of the composition is virtually unchanged (0,05 parts), leads to a decrease of the spreading last more than 3 times. Further increase in the number of filler (10 parts) does not affect the spreading of the composition, which confirms the proposed mechanism of action of the filler, namely particles of filler fix the gap between the plates, limiting the pressure of the coating of glass on the adhesive layer.

The terms of the mode of curing of the composition was the chosen empirically and, as the experiments showed, are the most optimal for the given problem. When the irradiation is less than 5 minutes curing of the composition occurs. After exposure for 5 minutes, the composition hardens and the device is transferred into the heat chamber for depolymerization. Holding thermopolymerization at temperatures up to 50°C provides the necessary strength of the adhesive layer. At temperatures over 50°C - working layers of acid destroyed and the device becomes useless. At the stage of exposure is dauvergne component epoxy adhesive compositions. In the preferred embodiment, it is sufficient 8-10 hours.

From the point of view of technological facilities in a preferred embodiment, it is reasonable exposure to lead for 5-15 min and thermopolymerization - at 35-50°C for 45-60 minutes.

Specified qualitative and quantitative composition of components, and the selected mode of curing give the songs a good adhesion to glass, low chemical aggressiveness, the property does not flow when compressed between glass plates, high moisture resistance and tightness, which allows its use in organic light-emitting diodes to improve their operational longevity. Developed mode of curing the composition provides high coloring strength is ü the adhesive layer in the minimum possible time of exposure.

Thus, the above mentioned signs as part of the composition, and method of curing are essential, as each is necessary, and together they are sufficient for the task.

Example 1

Fototerapia adhesive composition is prepared by mixing the epoxy resin ED-20, oligoadenylate, which is used as the α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide (industrial brand ACM-2), para-phenylenediamine, N.N-dimethyl-ISO-propanolamine, methyl ether, benzoin and 1 parts of silica gel with a particle size of 3-5 microns. The finished composition is applied around the perimeter of the pre-degreased surface of the glass plate. In the chamber in an argon atmosphere combine the plate with a layer of the composition on the other glass plate, which was previously applied layer of metallic calcium. The resulting Assembly is removed from the chamber in an argon atmosphere and irradiated with UV light lamp CES-220 from a distance of 20 cm for 5 minutes Then the Assembly is placed in a heat chamber and heated at a temperature of 45°C for 50 minutes After cooling and aging the resulting Assembly was incubated for 7-10 days, the quality of the deposited calcium mirrors does not change, which indicates the tightness of the structure. The strength of the adhesive layer is determined by the standard method on razryvnymi mark ZWICK-Z005. Moisture resistance is estimated by the strength of the adhesive layer, defined by a standard method on a tensile testing machine after soaking the samples in water for 20 days. Used in the compositions and test results are shown in table 1.

Example 2

Fotoatelier adhesive composition is prepared by mixing 60 parts of epoxy resin ED-20, 40 parts of oligoadenylate, which is used as the α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide (industrial brand ACM-2), 0,1 parts para-phenylenediamine, and 0.2 parts of dimethoxyphenylacetone and 0.2 parts of silica gel with a particle size of 3-5 microns, changing the nature and content of the tertiary amine, namely using N.N-dimethyl-ISO-propanolamine or N,N-dimethylaniline. The finished composition is applied around the perimeter of the pre-degreased surface of the glass plate. In the chamber in an argon atmosphere combine the plate with a layer of the composition on the other glass plate, which was previously applied layer of metallic calcium. The resulting Assembly is removed from the chamber in an argon atmosphere and irradiated with UV light lamp CES-220 from a distance of 20 cm for 5 minutes Then the Assembly is placed in a heat chamber and heated at a temperature of 45°C for 50 minutes After cooling and aging the resulting Assembly was incubated for 7-10 days, the quality of the deposited calcium what about the mirror does not change, which proves the tightness of the structure. The strength of the adhesive layer is determined by a standard method on a tensile testing machine brand ZWICK-Z005. Used in the compositions and test results are shown in table 2.

Example 3.

Fototerapia adhesive composition is prepared by mixing 85 parts of epoxy resin ED-20, and 7.5 parts of oligoadenylate α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide industrial brand ACM-2), and 7.5 parts of oligoadenylate triethylene glycol dimethacrylate (industrial brand TGM-3)and 0.5 parts of para-phenylenediamine, 1 parts N.N-dimethyl-ISO-propanolamine and 0.5 parts methyl ether, benzoin and 0.1 parts Aerosil with a particle size of 3-5 microns. The finished composition is applied around the perimeter of the pre-degreased surface of the glass plate. In a special chamber in an argon atmosphere combine the plate with a layer of the composition on the other glass plate, which was previously applied layer of metallic calcium. The resulting Assembly is removed from the chamber in an argon atmosphere and irradiated with UV light lamp CES-220 from a distance of 20 cm for 5 minutes Then the Assembly is placed in a heat chamber and heated at a temperature of 45°C for 50 minutes After cooling and aging the resulting Assembly was incubated for 7-10 days, the quality of the deposited calcium mirrors does not change that witnesses is of stuet about the tightness of the structure. The strength of the adhesive layer, defined by a standard method on a tensile testing machine brand ZWICK-Z005 is 2,96 Mn/m2through the day of 2.7 Mn/m2after 90 days exposure to air at room temperature for 2.5 Mn/m2. The moisture resistance was evaluated by the strength of the adhesive layer, defined by a standard method on a tensile testing machine after soaking the samples in water for 20 days. The strength of the adhesive layer was 2.1 Mn/m2.

Example 4.

Conditions of experience, as in example 1, except that epoxy resin and oligoadenylate, which used dimethacrylate, triethylene glycol (industrial brand TGM-3) take 40 and 60 parts, respectively, 1 parts diamine, 1 parts of N,N-dimethylaniline, and 2.0 parts of dimethoxyphenylacetone and 0.5 parts of silica gel with a particle size of 3-5 microns. The finished composition is applied around the perimeter of the pre-degreased surface of the glass plate. In a special chamber in an argon atmosphere combine the plate with a layer of the composition on the other glass plate, which was previously applied layer of metallic calcium. The resulting Assembly is removed from the chamber in an argon atmosphere and irradiated with UV light lamp CES-220 from a distance of 20 cm for 5 minutes Then the Assembly is placed in a heat chamber and heated at 50°C for 40 minutes After cooling and lyderic the resulting Assembly was incubated for 7-10 days, the quality of the deposited calcium mirrors does not change, which indicates the tightness of the structure. The strength of the adhesive layer, defined by a standard method on a tensile testing machine brand ZWICK-Z005, is 1.9 Mn/m2through the night of 1.9 Mn/m2after 90 days exposure to air at room temperature of 1.7 Mn/m2. The moisture resistance was evaluated by the strength of the adhesive layer, defined by a standard method on a tensile testing machine after soaking the samples in water for 20 days. The strength of the adhesive layer was 1.5 Mn/m2.

1. Fototerapia adhesive composition containing epoxy resin, oligopyrroles selected from the group dimethacrylate esters, initiator, which is used as the ethers of benzoin or dimethoxyphenylacetone, hardener, which is used as an aliphatic or aromatic diamine, and an aliphatic or aromatic tertiary amine, and a solid filler in the following ratio of components, parts:

Epoxy resin40-85
Dimethacrylate ether15-60
Aliphatic or aromatic diamine0,1-1,0
Aliphatic or aromatic
tertiary aminenot less than
from 1.0 to 7
Initiator0,1-2,0
Solid fillerof 0.05 to 10.0

2. Fototerapia adhesive composition according to claim 1, characterized in that as dimethacrylates ether it contains dimethacrylate polyethylene glycols with number oxyethylene fragments from 1 to 8, for example, triethylene glycol dimethacrylate (industrial brand TGM-3), or oligoribonucleotide, for example, α,ω-bis-(methacryloyloxyethyl-oxycarbonate)ethylenoxide (ACM-2), or dimethacrylate on the basis of phthalic acid, for example, α-methacryloyl-ω-methacryloyl-diethylenglycol-olig(diethylenglycol) (MDF-2), or mixtures thereof.

3. Fototerapia adhesive composition according to claim 1, characterized in that as benzoin ether is used, for example, methyl ether of benzoin.

4. Fototerapia adhesive composition according to claim 1, characterized in that aliphatic diamine it contains, for example, hexamethylenediamine were as aromatic - for example, para-phenylenediamine.

5. Fototerapia adhesive compositions which ia according to claim 1, characterized in that as an aliphatic tertiary amine it contains, for example, N.N-dimethyl-ISO-propanolamine as aromatic - for example, N.N-dimethylaniline in the amount of 2-5 parts

6. Fototerapia adhesive composition according to claim 1, characterized in that the filler it contains Aerosil or silica gel with a particle size of 3-5 microns.

7. The method of curing the adhesive composition, comprising mixing the components according to claims 1-5 until complete dissolution, placing the mixture between the substrates and exposure to UV light, wherein the irradiation is conducted not less than 5 min, followed by thermopolymerization at a temperature not exceeding 50°C, followed by cooling and curing.

8. The method of curing the composition according to claim 7, characterized in that the irradiation are within 5-15 min, thermopolymerization conducted at 35-50°C for 45-60 min and incubated for 8-10 hours



 

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20 cl, 2 tbl, 2 ex

FIELD: bonding materials on base of wood.

SUBSTANCE: proposed method includes hardening amino resin by means of hardening composition containing acid and phenol resin. Proposed method makes it possible to obtain quickly hardened and waterproof adhesive joint.

EFFECT: possibility of obtaining quickly hardened waterproof joint.

42 cl,, 4 tbl, 4 ex

Epoxide composition // 2386655

FIELD: chemistry.

SUBSTANCE: invention relates to preparation of epoxide compositions meant for adhesive, priming, sealing and repair cold setting mixtures. Described is an epoxide composition containing the following (pts. wt): epoxide diane resin -100, low-molecular rubber - urethane prepolymer SKU-PFL-100 with weight fraction of isocyanate groups in the range of 5.3-6.4 % - 3.5-15, plasticiser - EDOS which is a mixture of dioxane alcohols and their high-boiling esters - 1.2-8.0, carbon nanomaterial - fullerenes C2n, where n is not less than 30, or their mixture - 0.15-1.25, polyethylene polyamine hardener 13.5-26.5.

EFFECT: epoxide composition provides good, stable physical and mechanical, adhesion and processing properties with a short preparation process at room temperature.

1 cl, 2 tbl, 4 ex

FIELD: construction.

SUBSTANCE: composition includes the following components, wt parts: epoxide diane or epoxy silicon organic resin 100.0, carboxylated rubber 10.0-20.0, hardener - oligoamide 15.0-40.0, product of formaldehyde and phenol condensation with diethylenetriamine 15.0-40.0 and tris-2,4,6- (dimethylaminomethyl)phenol or product of interaction of diethylaminomethyltrietoxysilane with 1-aminohexamethylene-6-aminomethylenetrietoxysilane 2.0-5.5, mineral filler 5.0-10.0. As oligoamide, composition contains product of polyethylenepolyamine condensation with dimerised methyl esters of soybean oil fatty acids or product of condensation of methyl esters of high unsaturated dicarboxylic acids of electrochemical synthesis with polyethylenepolyamine. As mineral filler - asbestos, titanium dioxide or fused corundum.

EFFECT: produced glue composition has improved viability, reduced duration of its complete hardening process with higher level of initial and final strength of glue joints.

3 cl, 1 tbl, 1 ex

FIELD: preparation of nickel filler for production of current-conducting composition on base of epoxy diane resin ЭД-20 for shielding and contacting of metal surfaces.

SUBSTANCE: proposed method includes drying of nickel powder ПНК-1Л5 which is immersed in alcohol-nephrase mixture before drying at alcohol-to-nephrase ratio of 1:1 and is mixed for 5-10 minutes at temperature of 25±10°C ; drying is first performed at temperature of 25±10°C continued for an hour and then at temperature of 100±10°C continued for 3-5 hours; then, mixture is cooled down to temperature of 25±10°C.

EFFECT: reduction of specific volume resistance of current-conducting adhesive composition.

FIELD: preparation of mastics for sealing-up the welds and/or bonding inedible materials such as wood, iron, brick, polymers; repair of chemical equipment; erection of pipe line fittings for hot and cold water supply systems and sewage systems.

SUBSTANCE: proposed method consists in simultaneous preparation of two compositions followed by mixing at required ratio at which time of hardening and conversion of mastic from flow state to hardening state is no less than 1 h at temperature of from 40 to 20±2°C. First composition in form of resin is obtained through successive addition, mixing and grinding in trough every 60 minutes at temperature of from 10 to 26°C of the following components: 10.715% of dioctyl phthalate with 31.229% of ЭД-20 epoxy resin, 3.15% of opicil-175, 52.144% of polyvinyl chloride ПВХ-ЕП-6602-C, 3.036% of titanium dioxide and 0.00859% of commercial carbon. Product thus obtained is homogeneous of light-gray color at density of 800 Pa·s. Second composition in form of hardening agent is obtained through successive addition, mixing and grinding in trough every 30 minutes of the following components: 5.93% of dioctyl phthalate with 23.75% of euretek, 0.4948 of opicil-175, 0.989% of calcium oxide, 54.437% of titanium dioxide, 14.384 of chalk of MMCX-2 grade and check of sample taken from trough. Product thus obtained has viscosity of 248 Pa·s. Coat of this mastic withstands temperature of from minus 40 to plus 190°C.

EFFECT: enhanced efficiency.

1 tbl, 1 ex

FIELD: gluing compositions and materials.

SUBSTANCE: invention relates to a gluing current-conducting composition designated for fixing articles and providing electric hermeticity in wave-guide systems of electronic engineering technique. The composition comprises components taken in the following ratio, mas. p. p: epoxydiane resin ED-20, 90-110; low-molecular polyamide resin L-20, 55-65; nickel powder of sort PNK-1L5, 500-600; technical cyclohexanone as a solvent, 80-120; titanium-organosilicon oligomer of cross-shaped structure of the general formula: Ti{[OSi(CH3)(C6H5)]2-5OH}4 representing product of TMPhT (tetrakis (methylphenylsiloxanehydroxy) titanium). Invention provides enhancing heat stability, increasing electric hermiticity of wave-guides and decreasing coefficient of stationary wave in wave-guide devices.

EFFECT: improved and valuable properties of composition.

2 tbl, 3 ex

Epoxide composition // 2287003

FIELD: organic chemistry, gluing compositions.

SUBSTANCE: invention relates to preparing an epoxide gluing composition. The composition comprises the following ratio of components, wt.-%: epoxide-diane resin with the content of epoxy groups from 13% to 15%, 22-26; epoxide-diane resin with the content of epoxy groups from 20% to 22.5%, 22-26; oligoester acrylate as a modifying agent, 19-22; 1,3-meta-phenylenediamine as amine hardening agent, 5-8; titanium dioxide as a filling agent, 22-25. Proposed composition is used in rocket technique for armoring charges consisting of ballistic and mixing solid fuel and used for preparing carcasses and filling with mixing fuel, for making and gluing "biscuits". Invention provides enhancing mechanical, elastic, adhesion and exploitation indices of the composition.

EFFECT: improved and valuable properties of composition.

2 tbl, 6 ex

Glue composition // 2285027

FIELD: adhesives.

SUBSTANCE: glue composition usable in medicinal industry for gluing stainless steal needles with polypropylene head in manufacture of disposable injection needles. Composition contains, wt parts: epoxide dian resin 20.7-115.0, diluent 2.0-62.0, dicyanodiamide (curing agent) 3.0-18.0, Cotoran (curing agent) 1.7-37.0, Aerosil 0-2.7, titanium dioxide 0-91, said diluent being (i) ether selected from group consisting of butyl glycidyl ether, cresyl glycidyl ether and/or (ii) aliphatic epoxide resin (DEG-1, TEG-1).

EFFECT: increased adhesive properties and vitality of composition on storage, and also improved workability due to reduced viscosity and opacity.

2 tbl, 9 ex

FIELD: rubber industry.

SUBSTANCE: invention relates to methods for glue-assisted attaching rubber plates to metallic surfaces, including curvilinear ones, and can be used in ship building, mechanical engineering, construction, and chemical engineering. Task of the present invention resides in improvement of coating quality, increase in plate attachment strength, and increased reliability of sealing of gaps between plates. For that, prior to applying glue composition, metallic surface is mechanically treated and mounting surface of rubber plates and their ends are chemically modified.

EFFECT: reduced laboriousness of operation and increased adhesion strength with sealed gaps between rubber plates.

Polymer composition // 2277567

FIELD: polymer materials.

SUBSTANCE: polymer composition for varnishes, adhesives, and coatings is constituted by, weight parts: epoxide dian resin ED-2, 100; maleic anhydride as hardener, 40-80; oil slime as modifier, 10-30; and aniline bottom waste with aniline content 15-18 wt parts, 1-3. Oil slime is composed of hydrocarbon fractions with boiling temperature from 293 to 470°C.

EFFECT: reduced water content and curing time of polymer composition.

1 tbl, 6 ex

Gluing composition // 2275405

FIELD: glues compositions and materials.

SUBSTANCE: invention proposes gluing composition comprising the following ratio of components, mas. p. p.: epoxy diane resin, 30-40; monofunctional oligoester epoxide, 8-10; trifunctional oligoester epoxide, 8-10; tricyclocarbonate polyoxypropylenetriol, 12-15; low-molecular polyamide resin, 18-20, hardening agent of amine type, 7-10, and filing agent, 10-15. Invention provides enhancing relative stretching elongation value of the composition in retention of its high strength and adhesion indices. Invention can be used in gluing heterogeneous materials with different expanding temperature coefficients in units subjecting to high vibration and impact loads and effect of temperature from -150°C to 200°C.

EFFECT: improved and valuable properties of composition.

6 ex

FIELD: chemistry.

SUBSTANCE: compositions are meant for strong joints between detecting elements while providing current-conducting contact when assembling components of communications electronics equipment and integrated circuits, especially flexible integrated microcircuits. The current-conducting adhesive composition contains epoxy resin, a hardener and silver powder. The epoxy resin used is a mixture of epoxy diane resin with diglycidyl ether of 1,4 butanediol or a mixture of epoxy diane resin with diglycidyl ether of 1,4 butanediol and diglycidyl ether of an epichlorohydrin homopolymer. The hardener used is a mixture of an amine-type hardener and oligoaminoamide. The silver powder used is silver flake powder and an additional organic solvent.

EFFECT: adhesive composition has low volume resistivity, which provides high structural strength of adhesive joints between aluminium alloys after hardening, high processibility of the obtained adhesive composition which provides quality joints between miniature elements.

6 tbl

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