Transponder module

FIELD: radio engineering, communication.

SUBSTANCE: invention relates to a chip carrier (15) for contacting with a chip (16) and an antenna (13), lying on a carrier substrate (17). According to the invention, the chip carrier a strip-shaped substrate (18), which is equipped with a system (29) of contacts for electrical contact with the chip, the system being separated from longitudinal ends (25, 26) of the substrate, and two contact pads (27, 28) connected to the antenna, between which said system of contacts for electrical contact with the chip is situated and which are designed for electrical contact with the antenna, wherein the system of contacts for electrical contact with the chip and contact pads connected to the antenna are situated on the working surface (31) of the chip carrier on which, between the system of contacts for electrical contact with the chip and the contact pads connected to the antenna, there is at least one insulation surface (20). Also described is a chip carrier system which consists of a plurality of chip carriers situated on a film-type carrier, a row in at least one row passing in its longitudinal direction and each of which is oriented in the longitudinal direction of the film-type carrier.

EFFECT: providing minimal thickness of a layered structure consisting of an antenna carrier substrate and a chip carrier.

5 cl, 8 dwg

The present invention relates to a transponder module located on the antenna module of the chip module.

Transponder modules with the antenna module, and also in contact with him chip module, widely known and used in a variety of versions of their design for identification or authentication. In one of the more common variants of the structural design of the transponder modules have the antenna module, equipped with an antenna that is printed on the carrier its substrate and forming on it a few turns and provided at their ends contact pads connected to the chip module. Such transponder modules allow you to receive contactless access through the antenna to the chip stored where, for example, identification data can thus be read suitable for this purpose by the reader.

When using such transponder modules for the manufacture of self-adhesive labels, baggage tags, or other similar identification elements each transponder module on both sides provide coating layers, which are optionally used as bearing surfaces for the application of adhesive or printed image and/or text. Despite the usually very small thickness t is some of the layered structure should obviously, to be a sufficient protection is very sensitive to mechanical stress of the chip from damage. To this end it is known supply of the chip is suitable to protect the body. However, the disadvantage associated with the use of such housing, is that its presence leads to the formation of local thickening slightly eye-catching on the outer surface. For this reason, compounded by the subsequent application of printed graphic and/or text on a layered structure of the transponder module, and also hampered the formation of uniformly coupled across the surface of the adhesive connection.

The present invention was used to develop the transponder module, which would provide the ability to accommodate a chip with an effective, reliable protection against mechanical loads and which would allow to the minimum to reduce the increase in the thickness of its layered structure consisting of a carrier antenna substrate and crystallinities.

This problem is solved in the transponder module located on the antenna module of the chip module with chip and crystalloidal made in the form of a strip substrate, and the chip is electrically contacts spaced from the longitudinal ends of the substrate and located between the joined contact with the antenna area is alcami system contacts so that contact pads of the chip directly electrically connected to a given system of contacts for electrical contact with the chip, the system contacts for electrical contact with the chip and connected with the antenna contact pads are located on the working surface of crystallinities, which between contacts for electrical contact with the chip and connected to the antenna pads are made of at least one insulating surface. In the proposed invention the transponder module, the antenna module has an antenna that is supplied with its side carrying the antenna substrate and the contact pad is at least partially pass over made in carrying the antenna substrate contact holes, with the chip module is located on the opposite side of the carrier antenna substrate relative to the supplied antenna side in such a way that connected with the antenna contact pads of the chip module electrically contact with the contact pads of the antenna with their reverse sides, and the chip enters the hole made by him in carrying the antenna substrate.

This implementation proposed in the invention of the transponder module provides the possibility of contact between the contact area the AMI antenna and connect with her pads of the chip module without the need for pads on the opposite (back) side of the carrier antenna substrate. Due to the fact that the chip enters the hole made by him in carrying the antenna substrate, allows the transponder module is especially thin.

In the private embodiment, the transponder module, the hole in the bearing of the antenna substrate can also be performed in a hole of the chip module, i.e. the hole chip and pin holes can be performed as a single hole all placed in it chip module.

In addition, the carrier antenna substrate and the substrate of crystallinities most preferably also made of polyolefin, because, firstly, this ensures a particularly tight fit of the substrate crystallinities carrier to the antenna substrate, and secondly, the use of such material makes it easy to perform lamination to produce a firmly bonded General layered structure of the transponder module.

In this regard, it is preferable to perform the carrier antenna substrate and the substrate of crystallinities chip module from the same material, for example of PET.

The working surface of crystallinities at least individual parts can be provided with an electroconductive adhesive material, which thereby promotes the formation of a mechanically strong connection between the substrate of crystallinities and carried the soup antenna substrate even outside of the pads of the antenna.

In yet another preferred embodiment of crystallinities insulating surface is formed of an adhesive material, thus providing a robust mechanical connection between crystallinities carrier and the antenna substrate even in the area of location of the coils of the antenna.

The adhesive material is particularly preferable to apply at least some areas along the outer edge of the substrate crystallinities, because along with a strong mechanical connection is also the seal of crystallinities on at least provided with adhesive areas.

Quasiparticle seal chip can be achieved by applying an adhesive material around the perimeter along the outer edge of the substrate crystallinities. It is preferable to further perform a system contacts for electrical contact with the chip and connected with the antenna contact pads of aluminum or containing alloy in order first when performing antennas, respectively, at least its pads made of aluminum, respectively, from its containing alloy, to ensure the possibility of effective electrical connection of the chip module to the antenna module by ultrasonic (micro)welding.

When performing the substrate crystallinities from polyolefin, p is IDE just made of polyethylene terephthalate (PET), provides a particularly tight fit of the substrate crystallinities carrier to the antenna substrate minimize the total thickness of the structure and sealed to the location of the substrate crystallinities bearing on the antenna substrate.

The transponder module, the outer edge of the substrate crystallinities most preferably tightly connect the applied at least in some areas of the adhesive material with the surface of at least one loop antenna and/or the bearing surface of the antenna substrate to provide in this way a mechanically rugged connection between the chip module and carrier antenna substrate, respectively, the antenna module.

The antenna of the antenna module can be applied by spraying forming its material to the surface provided on the antenna side of the carrier antenna substrate. According to the invention the contact pads of the antenna, intended for contact with connected with her pads of the chip module are thus above the holes formed in the carrier antenna substrate before applying the antenna.

In accordance with this design of the antenna module makes unnecessary execution of end-to-end connections for contact chip module with an antenna, which is located on the opposite side of the s carrier antenna substrate relative to the supplied antenna side. As small need to perform pads deposition of forming their material on the surface on the opposite side of the carrier antenna substrate is similar to running an antenna provided on its side carrying the antenna substrate. Moreover, the pads have proposed in the invention, the antenna module is formed over the holes in the carrier antenna substrate by spraying forming the antenna material on the bearing surface of the antenna substrate with its supplied antenna side. As a result, the area of holes are formed contact pads, which are not linked to any special expenses.

Below the invention is described in more detail by the example of preferred embodiments of its objects with reference to the accompanying description of the drawings on which is shown:

figure 1 - view of the transponder module is located on the antenna module of the chip module,

figure 2 is a view in plan of the chip module is located on crystalloidal chip

figure 3 - side view shown in figure 2 of the chip module,

figure 4 - film media with many placed on its longitudinal rows of crystallinities,

figure 5 is a view made by one of the following transponder module in the section plane V-V of figure 1,

figure 6 - resembles the WMD figure 5 view made according to another variant of the transponder module,

figure 7 is similar to that shown in figure 5 view made another variant of the transponder module and

on Fig diagram illustrating the placement of the chip modules arranged in a matrix of antenna modules.

Figure 1 shows the transponder antenna module 10 module 11 and the chip module 12.

Shown in figure 1 embodiment, the transponder chip module 10 module 12 is provided with an antenna 13 side 14 of the antenna module 11, it is located at crystalloidal 15 of the chip module 12 chip (crystal) 16 is located between crystallinities carrier 15 and the antenna substrate 17 of the antenna module 11.

Figure 2 in a view in plan showing the chip module 12, for greater clarity of the image of crystallinities 15 chip 16 in the drawing, only its path.

From the figure 2 and 3 images when they are considered in conjunction, it follows that crystalloidal 15 is a basically three-layered and consists of a substrate 18, which in this case is made of PET, deposited on a substrate 18 connecting metallization 19, in this case, preferably made of aluminum, and the insulating layer 20 located on the connecting metallization 19.

As shown first in figure 2, the connecting metallization 19 is made of two parts, the cat who whom are first portion 21 and second portion 22, each speaker has an oblong section 23, 24 respectively with the contact pads. In the zone running parallel to each other speakers oblong sections 23, 24 and the longitudinal ends 25, 26 of the substrate 18 crystallinities insulating layer 20 has a surface recess, the longitudinal ends 25, 26 form connected with the antenna pad 27, 28 respectively, and in the area of the protruding oblong sections 23, 24 form a system of 29 contacts for contacting with a chip.

As shown in figure 2 image system 29 contacts for contacting with the chip, it is shown in this drawing variant equipped with a protruding point contacts, the so-called bar pins 30, which provide contact with only conventionally shown in the drawing, the chip 16 mounted the so-called method of the inverted crystal.

From the figure 2 and 3 images when considered in conjunction follows that performed as the substrate 18 crystallinities, in the form of strips connecting the metallization 19 has a smaller area than the working surface 31 of the substrate 18, and therefore the adhesive insulating layer 20 covers not only the connecting metallization 19, and longitudinal and transverse edges 32, 33 of the working surface 31 is oblozhki of crystallinities, except as connected with the antenna contact pads 27, 28 and systems 29 contacts for contacting with the chip. Thus, on the one hand, is provided by completely insulating cover connecting metallization 19, except system 29 contacts for contacting with the chip and connected to the antenna pads 27, 28. On the other hand, there is formed a closed frame of crystallinities 15 of adhesive material.

Shown in figure 2 and 3 an embodiment of crystallinities 15 insulating layer 20 is formed of a layer of adhesive material, and therefore, the insulation layer 20 in this case has a double function, namely it along with the insulating effect when the location of crystallinities 15, respectively, provided they chip module 12 shown in Fig.1. the antenna module 11 creates a mechanically strong adhesive connection with the bearing of the antenna substrate 17, respectively, with the antenna 13 on its carrier substrate 17. Due to this, along with mechanically reliable connection is ensured quasiparticle placement of the chip 16 between crystallinities carrier 15 and the antenna substrate 17.

Instead of crystallinities 15 may be provided, not shown in the drawings, the coupling module, the purpose of which is in electrical connection of the outer pad 5 shown in figure 1, the antenna 13 is shown in the drawings the contact pad, located next to the one shown in figure 1 radially inner contact pad 49, and in this case, the contact pad 49 and the auxiliary contact ground antenna 13 provide the possibility of contacting with a chip located radially within a restricted antenna 13 parts. With this purpose, the connecting module unlike shown in figure 2 of crystallinities 15 must be made with connecting metallization 19, a fully conductive in the area between the joined with the antenna contact pads 27, 28. For this you can either paramcnt system 29 contacts for contacting with the chip, or you can perform a solid connection metallization 19. Insulating layer, which is made solid in the area between the joined with the antenna contact pads 27, 28 should be at least in those cases where there is a risk of short circuit between one of the coils of the antenna and connecting metallization 19, in other cases the insulating layer is not necessary to perform continuous over the entire surface, and therefore is shown in Fig.2 crystalloidal 15 can already be converted to the connecting unit electrically connecting the protruding oblong sections 23, 24, respectively, the system 29 contacts for contacting with a chip.

the and figure 4 shows the system from a variety of cristallinity 15 tape storage 34, which in this case made in the form of shipping film with perforated longitudinal edges 35 to move plenipotent mechanism. Tape storage 34 are applied directly at him connecting metallization 19, which in this case are six parallel to each other in the longitudinal direction of the film carrier 34, respectively, in the direction of its feed rows 36, 37, 38, 39, 40 and 41. The set of rows 36-41 covered with an insulating layer 20, which, as described above with reference to figure 2 and 3, does not cover those parts of each separate connection metallization 19, where the system 29 contacts for contacting with a chip and two connected with the antenna contact pads 27, 28.

As schematically shown in Fig, the execution of cristallinity 15, respectively, the location of the connecting metallization film 19 on the carrier 34 is shown in figure 4 rows in combination with the location of the bearing of the antenna substrate 17, respectively, the antenna module 11 in the form of a matrix of 64 allows you to separate the individual series 36-41 from the film carrier 34 by appropriate division or cutting along the dividing lines 42 and to impose separated rows 36-41 of cristallinity 15 on the corresponding rows 43, 44, 45, 46, 47 and 48 of the substrate of the antenna module 11. From individual R is Dov 36-41 then you are suitable for this purpose, the cutting mechanisms individually to separate crystalloidal 15 and attach them to the contact pads 49, 50 separate antennas 13, ensuring in this way according to figure 1 of electrically conductive and mechanically strong due to the adhesive insulating layer 20 connection with the antenna module 11.

Figure 5 on an enlarged scale the section plane V-V of figure 1 shows a fragment of the connection between the chip module 12 and the antenna module 11. The chip 16 is located in the intermediate space, which is laterally limited by the coils 51 of the antenna 13, and the top and bottom substrate 18 crystallinities, respectively carrying the antenna substrate 17. In the area of contact with the turns of the antenna 51, which are located between the chip 16 and the contact pads 49, 50 of the antenna 13 is an adhesive insulating layer 20, which at least in some areas is located on the coils 51 of the antenna. The coils of the antenna or at least contact pads 49, 50 antenna 13, as connected with the antenna contact pads 27, 28 crystallinities 15, most preferably from aluminum, because in this case it is possible, as shown in figure 5, by the impact tool 66 for ultrasonic welding on the reverse side of the substrate 18 crystallinities through it connected with the antenna contact pads 27, 28 to easily perform the welded joint between the joined with the antenna contact pads 27, 28 and pads 50, 51 of the antenna.

Figure 6 shows the t of unspoilery module 62 with a different arrangement of the chip module 12 to the transponder module 53, carrying the antenna substrate 54 which in contrast is shown in figure 5 carrier antenna substrate 17 of the transponder module 10 provided with contact holes 55, which provide the contact pads 49, 50 antenna 13 with their reverse sides 56, 57. In addition, as shown in Fig.6, in carrying the antenna substrate (54) has a hole 58 under the chip, which is designed to accommodate the chip 16 and which thereby allows in General to perform transponder module 58, consisting of the antenna module 53 and the chip module 12, ultra-flat, correspondingly thin.

7 shows the transponder module 59 antenna module 60, carrying the antenna substrate 61 which has an opening 62 under chip module, which provides the ability, in General, the adhesive locations of the insulating layer 20 from opposite sides 63 of coils 49 of the antenna. In the insulating layer 20, respectively at least partially covered by the connecting metallization 19 is located/is situated mainly in the same plane with the bearing of the antenna substrate 17.

1. The transponder module (67) located on the antenna module (11) of the chip module (12)having a chip (12) and crystalloidal (15) is made in the form of a strip of backing material (18), and the chip is electrically in contact with spaced longitudinal ends (25, 2) the substrate and located between the connected antenna pads (27, 28) (29) of the contacts so that the contact pads of the chip directly electrically connected to a given system of contacts for electrical contact with the chip, the system contacts for electrical contact with the chip and connected with the antenna contact pads are located on the working surface (31) of crystallinities, which between contacts for electrical contact with the chip and connected to the antenna pads are made of at least one insulating surface (20), characterized in that the antenna module has an antenna (13), which is equipped with its side (14) of the carrier the antenna substrate (54), and pads (49, 50) which at least partially pass over made in carrying the antenna substrate contact holes (55), with the chip module is located on the opposite side of the carrier antenna substrate relative to the supplied antenna side in such a way that connected with the antenna contact pads of the chip module electrically contact with the contact pads of the antenna with their reverse sides (56, 57), and chip (16) is a hole (58)made under him, carrying the antenna substrate (54).

2. The transponder module according to claim 1, characterized in that the opening (58) under the chip and pin hole at back the Oia (55) is performed in the carrier antenna substrate (61) as a single hole (62) under the chip module.

3. The transponder module according to claim 1 or 2, characterized in that the carrier antenna substrate (17, 54, 61) and the substrate (18) of crystallinities made of polyolefin.

4. The transponder module according to claim 1 or 2, characterized in that the bearing of the antenna substrate and the substrate of crystallinities made of the same material, especially polyethylene terephthalate.

5. The transponder module according to claim 3, characterized in that the bearing of the antenna substrate and the substrate of crystallinities made of the same material, especially polyethylene terephthalate.