Method for manufacturing combined contact-non-contact chip-card with substrate of antenna of fiber material

FIELD: chip-cards engineering.

SUBSTANCE: antenna is made by template method on substrate, and bodies of cards are made during lamination of substrate. Milling of hollow is performed on card body, opposite to side of substrate with template print of antenna with possible mounting of module, containing micro-chip and two-side circuit. Slits made at corners of antenna substrate prior to lamination stage provide for engagement of card bodies with each other.

EFFECT: higher efficiency.

11 cl, 6 dwg

 

The technical field

The present invention relates to methods of manufacturing a chip card, in particular a method of manufacturing a contactless chip card antenna which is made on a substrate of fibrous material such as paper.

Prior art:

The contactless chip card is increasingly being used in various fields. So, in the field of transport it was developed as a means of payment. This also applies to the electronic wallet. Many companies use a means of identification of staff using contactless smart cards.

The exchange of information between the combined contact and contactless card and the associated reading device is performed by remote electromagnetic coupling between the antenna performed in a contactless card, and the second antenna in the reader, or directly by contact with the reader. For creating, storing and processing information in the map is an electronic module connected to the antenna. Typically, an antenna and a microchip located on the dielectric substrate, is made of plastic. Their classic industrial production consists of three stages:

performing antenna on a plastic dielectric substrate of polyvinyl chloride (PVC), polyester (PE), Paul is carbonate (PC) by printing chemical process using copper or aluminum

hot lamination by pressing upper and lower plastic layers enclosure cards - PVC, PE, PC, acrylonitrilebutadienestyrene (ABS) on the antenna substrate for the formation of the cards in the form of a monoblock,

installing and connecting the electronic module using conductive glue.

However, this method has several major drawbacks. When implementing this method, perform a complicated layering of plastic material joined by gluing or thermopile and having different coefficients of thermal expansion. Consequently systematically causes irreversible deformation maps (curl, warp), unacceptable to the user, as well as insufficient mechanical strength for regulatory or equivalent tests.

In addition, thermomechanical properties of PVC mediocre. During lamination, there is a considerable turnover of material, which is not stored form of an antenna. This leads to unstable operation of the antenna, so as to change the electrical parameters such as inductance and resistance. Often there is a break of the antenna in areas where there are significant shear stress. In particular, this occurs at the corners or at the level of the electrical connections.

The total thickness of the laminated cards ISO ranges from 780 to 840 microns. the considering the above-mentioned fluidity of the material, it is difficult to ensure that users of mass and controlled distribution among the population.

Used when laminating termopane allows you to get a monoblock map with very mediocre mechanical properties in the compensation plan of the test voltages. During the regulatory test to twist and bend the main voltage is applied to the electronic module, in particular to the points of bonding of providing electrical connections. Point bonding subjected to large stresses and the slightest disturbance bonding breaks the electrical connection between the electronic module and the antenna.

After lamination, printed enclosures cards become visible traces of copper tracks. Although it does not affect the normal operation of the card, but users are not satisfied with this defect, since it impairs the aesthetic appearance of the map.

In addition, the production cost of the card this way too high, so you can talk about the real increase in their consumption.

Finally, the currently known methods do not allow to produce maps that can be seen later mechanical interference map for illegal substitution. For fraud is relatively easy to destroy the card by strong multiple bending, and dalnas the m difficult to prove illegal nature of their actions. For example, the antenna may be terminated prior to the marking of the card. Trade policy companies are focused mainly on a free refund of the defective cards. Systematic replacement of cards leads to increased costs for companies.

A brief statement of the substance of the invention

The present invention is to eliminate these disadvantages by developing a new method of manufacture, allowing the use of a substrate of fibrous material, which by printing stencil conductive paint applied to the antenna, which can significantly reduce the cost of production of contactless or combination of smart cards.

Thus, the present invention relates to a method of manufacturing a contactless smart card with an antenna substrate of fibrous material such as paper, namely, that

make the antenna by screen printing turns through the polymer conductive ink on a substrate of fibrous material and heat treatment of the substrate for sintering paint,

laminated body maps on the substrate of the antenna by prepaymania on each side of the substrate at least two sheets of plastic forming the body of the card, by hot pressing,

perform milling in one of the buildings of the card cavity for module installation, sod is rasego the microchip and the two-way scheme, this cavity contains a smaller inner area, which put a microchip, and more external plot, which put the two-way scheme, and the cavity is performed in the card case, the opposite side of the substrate with conductive paint applied by screen method for printing the antenna, and for cutting open the contact pads of the microchip,

install the module using glue to secure the module and the adhesive containing silver, for connecting the module with the contact pads and position the module in the specified cavity.

Brief description of drawings

The invention is further explained in the description of the preferred variant of the embodiment with reference to the accompanying drawings, in which:

Figa-1C depict various stages of screen printing the antenna on the cover, according to the invention;

Figure 2 depicts a substrate with an antenna caused by screen printing before the step of laminating, according to the invention;

Figure 3 depicts the chip card at the end of the fabrication process according to the invention;

Figure 4 represents a section along the line IV-IV of figure 3, the chip card (General view), according to the invention.

Description of the preferred variant embodiment of the invention

A method of manufacturing a chip card in accordance with the present invention. The substrate perform on Fox is e fibrous material, such as paper. In accordance with the preferred implementation, the antenna is applied by screen method on this material in several steps, in reverse order of the classical method of screen printing. The first stage (Figo) includes applying a stencil method two contact pads 10 and 12 for connecting the antenna with the module and electrical jumpers 14, called "cross-over"to the serial connection of the two coils. During the second stage (pigv) by screen method on top of the electrical jumper 14 is applied insulating strip 16. During the third and last stage, screen printing put two coils 18 and 20. One end of coil 18 is connected with the contact of the lining 10 and the other with an electric jumper 14. Coil 20 is applied by screen printing method from the electrical jumper 14 to the contact pads 12.

After application of the antenna stencil on the substrate, the latest cut to size card. In accordance with a preferred perform in each corner of the substrate make the cut 22 (figure 2). This cut helps direct the soldering between the buildings of the card during lamination.

The lamination is carried out by hot pressing. In the preferred embodiment, for each enclosure cards use two layers of plastic. Usually this layer is a used polyvinyl chloride (PVC), polyester (PE, PEG), polycarbonate (PC) or acrylonitrilebutadienestyrene (ABS). In a preferred embodiment, the use of PVC. Two layers have different hardness. The outer layer is made of rigid PVC, and the inner layer in contact with the substrate of the antenna is made of soft PVC with a lower point value of Vigata (the temperature at which the PVC goes from solid to kauchukopodobnoe state). Both layers may have different thickness. For example, each of the housings card consists of an external layer made of hard PVC, thickness of about 310 μm, and the inner layer, made of soft PVC, thickness of about 80 μm. The antenna substrate is made of paper and has a thickness of approximately 125 μm. In accordance with another exemplary embodiment, which is preferred, each of the housings of the map consists of three layers. In this case, the outer layer of the buildings of the card during printing are coated with transparent PVC sheet or layer of varnish to protect the printed text. This coating has a thickness of about 40 μm, the outer layer of the shell card is in this case a thickness of about 275 μm and an inner layer of a thickness of about 40 microns.

During lamination trying to enter a stack of different layers of PVC, forming the body of the card and the antenna substrate. Then the sandwich is placed in a press for laminating. It takes place not in the heat treatment at a temperature exceeding 100°and preferably 150°C. at the same time it is subjected to pressing spikes for different layers. Under the simultaneous effect of heating and pressing PVC outer layer is softened, and the inner layer formed PVC with a lower point Vicat becomes fluid. Become fluid layer PVC covers its mass stencil paint the antenna that provides the latest higher strength under mechanical stresses arising from the use of chip cards. In addition, the degree of adhesion of the antenna to the body of the card. This adhesion can be improved by the use of double-sided adhesive that is sensitive to compaction and placed between the card and the antenna.

Made in the corners of the sheet antenna openings 22 allow the two layers of PVC to touch each other. When you lock the corners by soldering between the two housings card all mechanical stresses are transmitted to the inside of the card. However, in the case of paper, the latter has a weak strength of internal clutch. When the impact of efforts to shift the core of the paper has a tendency to stratification. With considerable effort, the map opens up to stratification into two parts (the part that contains the antenna, connected to the module continues to function). Thus, given the properties of securities and its internal cohesion, you can use this physical property for manufacturing a card with a built-modulated marker of stress. In accordance with the requirements of the client, the delamination can be faster or slower with the possibility of visual detection limited fold card when the bundle of paper inside it.

The next step includes milling the cavity, which is placed in a module that contains a microchip and two-way scheme. Using milling also provide contact pads for connection of the antenna module. To avoid damaging the stencil imprint antenna, the milling is performed in the card case, the opposite side of the substrate of the antenna with silkscreen imprint of the antenna, i.e. in the case of the card in contact with the side of the substrate without stencil imprint antenna. During milling the antenna substrate is treated prior to application of paint. In addition, since the paint is covered with a mass of PVC inner layer of the shell card, it will not get any such damage like cracks or abrasion. In the case of chip cards, made in ISO format, with the standard installation of the microchip on the card, reverse screen printed antennas and milling a cavity in the housing of the card in contact with the side of the substrate without stencil print, allow you to install the module in the standard places is, maintaining the integrity of the antenna caused by screen method.

The module installation is carried out by means of glue. Using two different adhesives. The first adhesive is electrically conductive and provides a connection module with the contact pads of the antenna. Preferably this adhesive containing silver. The second adhesive is suitable for fixing the module on the map. In accordance with one embodiment of using cyanoacrylate glue. You can also use glue hot melt" (hot mix) in the form of a film which is applied on the lower part of the module before installing it in the map. Upon completion of this phase of the receive map (figure 3). Enclosure cards are connected by termopane corners, where before these were made cutouts 22 on the substrate of the antenna. The module 26 is installed in the standard place, adopted for the chip-card type ISO.

Figure 4 shows a cross section of a chip card. The map contains a substrate of the antenna 28 of the fibrous material, is inserted between the two blocks of the map. Each card contains a coating 30 of a transparent sheet, PVC or varnish layer, the outer layer 32 of rigid PVC and the inner layer 34 made of soft PVC. Coil 36 and contact pads 38 are located within the mass of PVC inner layer 34 of the housing of the card. In the cavity made by milling in the card case, the opposite side of the mean is the LCD with antenna, establish two-way circuit 40 and the chip 42, protected by a layer of insulating resin (not shown). The module is connected with the contact pads 38 of the antenna by means of a layer of conductive adhesive 44, containing silver. Layer 46 cyanoacrylate glue fixation provides the module on the map.

The method in accordance with the present invention enables to produce a map with two main qualities that are attractive to users: protection of electrical elements makes this map great durability, and the ability of fibrous materials such as paper, delaminate allows in case of loss of card to check not been whether it is intensive bends for illegal purposes.

1. A method of manufacturing a combined contact and contactless chip cards containing the substrate of the antenna is made of a fibrous material such as paper, and the card case on each side of the specified antenna substrate, namely, that make the antenna by printing turns on the stencil using a polymer conductive ink on a substrate of fibrous material and heat treatment of the substrate for sintering paint, laminate substrate of the antenna, while you solder by hot pressing on each side of the substrate, at least two of the plastic sheet forming the body ka is you, perform milling in one of the buildings of the card cavity for installation of the module containing the microchip and the two-way scheme, and the cavity contains a smaller inner area, which put a microchip, and more external plot, which put the two-way scheme, and the cavity is performed in the card case, the opposite side of the substrate with conductive paint applied by screen method for printing the antenna, and for cutting open the contact pads of the microchip, install the module using glue to secure the module and the adhesive containing silver, for connecting the module to the pads, and position the module in the specified cavity.

2. A method of manufacturing a chip card according to claim 1, in which use two sheets of plastic for each of the buildings of the card on each side of the antenna substrate of fibrous material, which have different hardness.

3. A method of manufacturing a chip card according to claim 1 or 2, wherein in the manufacture of antennas at the corners of the substrate of the antenna perform the cutouts for the spikes of the two housings card, this card has made the preferred zone of separation, subsequently allowing to detect intentional damage to the card.

4. A method of manufacturing a chip card according to claim 3, in which during manufacture of the antenna by screen printing using a polymer which paint is applied to the substrate contact pads for connection of the antenna module and the electrical jumper by screen printing using a dielectric ink on top of the electrical jumper put the insulation strip, by screen printing with polymer paint on a substrate applied at least two loop antennas, with one of the ends of the two coils is connected to one contact of the lining, and the other with an electric jumper, which enables the antenna with two series-connected coils.

5. A method of manufacturing a chip card according to claim 4, characterized in that the sheet forming the outer layer of the shell card is more rigid than the sheet forming the inner layer of the housing of the card, while the inner layer is a low point Vicat.

6. A method of manufacturing a chip card according to claim 5, characterized in that each of the two sheets forming the card case has a different thickness.

7. A method of manufacturing a chip card according to claim 6, in which the outer sheet of plastic is thicker than the inner sheet of plastic.

8. A method of manufacturing a chip card according to claim 7, in which during the hot pressing of the substrate of the antenna on each card add a third sheet of plastic or lacquer layer, acting as a covering.

9. A method of manufacturing a chip card according to claim 8, in which as the material for the shell card uses material selected from the group consisting of polyvinyl chloride (PVC), is oleaster (PE), polycarbonate (PC) or acrylonitrilebutadienestyrene (ABS).

10. A method of manufacturing a chip card according to claim 9, in which the adhesive for fixing the module is cyanoacrylate glue, applied to the cavity before installing the module.

11. A method of manufacturing a chip card according to claim 9, which is used to secure the module glue is glue "hot melt" in the form of a film which is applied on the lower part of the module before installing it in the map.



 

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