Method for manufacturing a module

FIELD: technology for manufacturing modules.

SUBSTANCE: in accordance to method for manufacturing a module to be built into body of card, on one of the sides of base 4,5,6 of this module current-conductive structure 7 is provided. During manufacture of module base at least its first layer 1, positioned on the lower side 9 directed from current-conductive structure 7, is made of material, properties of which, during mounting of module in the body of card in accordance to certain technology, have important value for aforementioned mounting, and are synchronized with properties of material of this layer of card body.

EFFECT: simplification and decreased costs of manufacturing technology.

3 cl, 3 dwg

 

The present invention relates to a method of manufacturing a module for installation in the card case, with one of the parties to the framework module provide a conductive structure. The invention relates, furthermore, to the appropriate module, as well as how to integrate this module in the card case and the media in the form of cards with this module.

One of the possible methods for the manufacture of information carriers in the form of maps that are used, such as identity cards, passes, credit cards, financial cards or similar cards used for other purposes, is that the module containing the actual media and having contact pads for connecting the storage medium to the reading and/or recording device, is inserted in the space provided under it in case the card slot. This module usually consists of a "framework" or "substrate", on one side of which is conductive structure, forming a contact pad. On the reverse side of the base module is normally located in the chip as a carrier of information. While the inputs and outputs of the chip are electrically connected with pads, passing through the base module end-to-end connections. The manufactured currently, modules are based on typically perform from e the oxide resin, respectively from Kapton etc, and recently for this purpose began to use the PEN (polyethylene-2,6-naphthalenyloxy). However, strong coupling in the connection of such materials with the card can only be achieved with the use of the adhesive layer. Currently known a variety of methods of fixing such a module in the recess in the housing of the card via the adhesive layer.

For example, in EP 0521502 describes how to embed the module in a two-stage recess in the housing of the card. First on the ledge, forming the transition to located at a greater depth of the cut in the card, fix adhesive on two sides of the ring element from the contact adhesive. After that, the hollow insert a module it pads out that its edges attached to the adhesive on two sides of the element located on the scarp of the ditch.

In EP 0493738 described another method of bonding module to the housing of the card. At the bottom, facing away from the pad side of the module, put a layer of thermosetting adhesive. After this module is coated with a layer of glue is inserted into the recess in the housing of the card and stick to it, acting on the adhesive with heat and simultaneously pressing the module to the housing of the card.

From DE 19731737 A1 known method specified in the restrictive part of the independent claims of the type and in castnet is, a method of manufacturing a module for installation in the card case, the implementation of which on one side (upper side) of the module include a conductive structure. Then, in accordance with this known method on the basis of the module with its bottom side on which in the next place the chip features a locking element anchor type, which is made from a material (e.g. aluminum), the parameters of the softening which is completely different from the parameters of the softening of the material of the body is made of card (e.g., plastic). When heated enclosure card material from which it is made, softened, while the locking element remains solid and thanks to it is pressed into formed by an undercut cavity in the card and remains in this cavity embedded in her condition.

From EP 0359632 A1 is known another method of manufacturing a module for installation in the housing of the card, in accordance with which on the basis of the module with the lower sides have locking elements of the anchor type, which are designed to anchor fixing in the enclosure map and therefore should not be softened.

From US 5851854 known method of manufacturing a double-layer media with the electronic module, in accordance with which the surrounding module hollow space is filled with material from the bottom of the second softening temperature. This module is placed in the space provided in the first layer in the recess, resulting in between the first layer and the module remains hollow. On the local areas of the second layer by the printing method applied material with a low softening temperature. Then both layers impose on one another, resulting in this material comes into contact with the module. On subsequent heating, the material softens and penetrates into the hollow space between the module and the first layer. As a result, the module and double layer are glued together.

The disadvantage of this method of bonding is that despite all efforts aimed at finding the optimal adhesive for fixing the modules in the chassis cards obtained adhesive connection always has low strength. The main reason for this is that the adhesive must be equally firmly coupled with the substrate module, and case material card. Since, however, the bonding between the materials always represent materials of different types and therefore have different properties, the choice of glue is necessary to reach a certain compromise.

The present invention was based on the task to find an alternative to the above prior art solution to the problem of connecting the module to the chassis card is.

This task is solved by the features in claim 1 of the claims, and by means of the module presented in item 9 of the claims. The most preferred embodiments of the invention are given in the respective dependent claims.

According to the invention in the manufacture of basics module at least one first layer, located facing away from the conductive patterns of the lower side, it is proposed to run from thermoplastic properties which have to integrate the module in the card case important to connect with the material layer of the shell of the map on a specific technology, for example by sealing, a value consistent with the material properties of the corresponding layer of the shell card in the sense that both polymer material have similar settings softening. This enables extremely simple and reliable connection by welding of polymeric materials with each other. In other words, stick in the end to the body of the map layer basics module will be directly in the manufacturing process of the module, specifically matching the properties of this connected with the body of the map layer with the material properties of the card, as well as with a specific type and connection method.

This correlation properties of the material coedine the CSO with case map layer basics module, with the properties of the material from which made the card case, and thereby provides the optimum strength of the connection. In addition the opportunity to connect both the polymeric material and the other involving the application of glue methods, for example by welding, the quality of the obtained compounds which depends among other things and this has a particularly important factor, as properties connected between the materials. The use of such non-adhesive compounds particularly preferred for the reason that in this case of technological process of manufacture of information carriers in the form of maps eliminates the additional manufacturing operation, which consists in applying the adhesive layer. Due to this it is possible to reduce the process of embedding the module in the card case and thereby reduce costs.

The choice of specific parameters of the softening in the implementation proposed in the invention of the method depends on the relevant welding technology. Thus, in particular, when using a sealing material for manufacturing base module is chosen so that both the polymer material was possible, the close values of their softening temperature. When using ultrasound, high-frequency or VIBROCONTROL welding polymer is haunted materials should be selected so as so they softened at the same frequency.

According to one of the most preferred embodiments of the invention the base module with its bottom facing away from the conductive patterns, the parties are encouraged to perform from the same material from which made connected with him when embedding module in the card case, the layer of this enclosure card. In this case, the properties of both connected between the materials is not a mutually agreed upon, but simply identical. Therefore, for connection of the module with the card case can be used, for example, any of the above welding methods. The benefits associated with such mutual agreement of the properties of both materials appear and when the connection between a conventional method with the use of glue, because in this case you can use glue with adhesive properties, carefully selected just for this specific material that the choice of adhesive eliminates the need to compromise due to the use of different connected between the materials.

In the simplest scenario, the basis of the module are proposed to perform a single layer. In other words, in this case, the basis consists only of a single layer made from specially selected material whose properties are consistent with its is Tami body material card.

However, the base module can be performed with double-layer placed between the first layer connected to the card case, and a conductive structure second layer made from a material whose properties, in turn, are also consistent with the requirements of the basis of the module during its subsequent processing, for example with the terms and conditions applying conductive patterns. The material for this layer can be, for example, so as to give the entire module specific, necessary for its subsequent processing mechanical stability. Two-layer framework modules can produce extremely simple technique of coextrusion.

In accordance with another variant of these first and second layers are encouraged to connect with each other via at least one connecting layer such as adhesive layer. In this case, the base module is, therefore, at least three layers. Such a three-layer framework modules can produce extremely simple technology in the form of laminated film.

Offered in modules invention preferably produce completely analogous to conventional modules in the form of an endless belt with many modules. In this case, such a tape with lots of modules has a tape-based system, which according to the divine cause of conductive structures for a variety arranged along its length modules. While connected ultimately with the body of the card, i.e. facing away from the conductive structures, the layer of tape bases form directly in the manufacturing process of this tape substrate and thereby directly integrate into it. Next the tape with many modules are subjected to subsequent processing similar to the usual well-known tape with many modules, ie, for example, it is conventional to put the chips do end-to-end connection and then fill in the chip sealing composition (compound). At the end of this tape is separated, preferably cut down or cut out, the individual modules.

In the case of a multilayer tape the basis for such forming the connecting layer in the ribbon, with many modules directly in the process of manufacture can be used, for example, coextrusion technology. In another embodiment, such a multilayer tape base can also produce lamination technology, i.e. in the form of an infinite layered film tape. This technology is advisable to use primarily in the manufacture of strip foundations with connecting layers between their individual functional layers of the material, i.e. in the manufacture of three - or multi-layer tape of the basics.

Below the invention is described in more detail on the example of some variant is its implementation with reference to the accompanying drawings, showing:

figure 1 - schematic representation in cross section consisting of multiple modules with a single layer of tape by tape basis,

figure 2 - schematic representation in cross section consisting of multiple modules of the ribbon with double-layer tape base and

figure 3 - schematic representation in cross section consisting of a set of modules with a three-layer tape by tape basis.

Figure 1 is a cross-section, i.e. in the cross-section plane perpendicular to its longitudinal direction, shows the ribbon with many modules, which tape has a base 4 with a single layer 1. With the upper hand with this tape base 4 are connected to the conductive structure 7. Such conductive structure has a number of pads 8, which subsequently function as contacts, with which the reading device reads the information stored in the chip memory module.

For the manufacture of a single layer of tape 1 basics 4 it uses material whose properties are consistent with the properties of the material from which made enclosure cards (not shown), which are embedded in subsequent modules. The extent of such mutual agreement of both properties of these materials, respectively, their choice is specifically agreed between the ow properties depend on the technology used to connect the substrate with a card case. In this embodiment, the layer 1 is made of thermoplastic. Therefore, layer 1 can be welded together with the material from which is made the card case and which usually also used thermoplastic. In this case, involving the use of heat sealing as connection technology fundamentals module with enclosure cards, thermoplastic to perform layer 1 is chosen so that its softening temperature approximately corresponds to the softening temperature of the plastic from which is made the card case. When using other connection methods, such as ultrasonic, high-frequency or VIBROCONTROL welding, the material for layer 1 is chosen so that it softened at about the same frequencies as the plastic from which is made the card case.

In the optimal case, the layer of tape 1 basics 4 should be possible to make from the same material from which is made the card case. In this case, to achieve the optimum properties in the connection of both materials with each other. As materials for the layer 1 ribbon framework 4, it is preferable to use modified polyethylene glycol (MKPATH), thermoplastic elastomer (TPE) or Absplastic.

Figure 2 shows the following variant of the invention, according to which the tape base 5 comprises two separate layers 1 and 2. The material properties of the first layer 1 on the facing away from the conductive patterns 7 of the lower part 9, similarly shown in figure 1 option consistent with the properties of the material of the body of the card. Located between the conductive structure 7 and the first layer 1 and the second layer 2 is made of a material whose properties are consistent with the terms of its subsequent processing as the basis of the module.

Such tape base 5 can be produced, for example, by coextrusion technology, in which these layers ekstragiruyut of two located appropriately relative to each other mouthpieces directly on top of one another in the form of an endless belt, resulting at the same time their connection with each other. Then the upper layer 2 supply conductive structure 7.

To perform the first layer 1 is also preferable to use materials such as MHPATH, TEP or ABS plastic, and to perform the second layer 2 is preferable to use PENG, PET (polyethylene terephthalate) or PC (polycarbonate). As the most suitable have proved the following combinations of materials:

ExamplesThe first layerThe second layer
example No. 1MHPATHPENG
example # 2MHPATHPET
example # 3TEPPENG
example No. 4TEPPET
example No. 5ABSPC

Figure 3 shows the tape base 6, which consists of three layers 1, 2, 3. Similarly, shown in figure 2 option at the bottom of layer 1, which is converted from the conductive patterns 7, the bottom side 9 is a layer 1, the material properties is consistent with the properties of the material of the body of the card-specific method of combining materials with each other. It may be thermoplastic, preferably ABS plastic, PVC (polyvinyl chloride) or MGATP. Equally similarly shown in figure 2 variant for the manufacture of the second layer adjacent to the conductive structure 7, is used a material whose properties are optimally adapted to the conditions of the post-processing module. While it is preferable to use materials such as PAN or Kapton etc.

The middle layer serves as a connecting layer or the connecting layer 3 between the first 1 and second 2 layers. Such a layer may be an adhesive layer, for example one - or two-component acrylate adhesive or one - or two-component polyurethane (PU) system. Such tape base 6 can be produced, for example, in the form of an infinite layered film ribbon mixing together the first 1 and second 2 layers with simultaneous submission of the connecting layer 3 and lamination under pressure. Then on the second layer 2 is applied a conductive structure 7.

For the manufacture of such multi-layer framework is most preferable to use the following combinations of materials:

ExamplesThe first layerThe connecting layerThe second layer
example No. 1ABS, PVC or MHPATHacrylate adhesive (1-/2-component)PENG
example # 2ABS, PVC or MHPATHacrylate adhesive (1-/2-component)Kapton etc
example # 3ABS, PVC or MHPATHpolyurethane systems (1-/2-component)PENG or Kapton etc

Made in accordance with one of the above options tape with many modules can be subjected to further processing analogichnaya the ribbon. So, for example, without any problems, you can put the chip perform end-to-end connection of the inputs and outputs of the chip with contact pads 8 of the conductive patterns 7 and then pour the chip sealing composition (compound). At the end from the tape bases 4, 5, 6 are separated, preferably by cutting or die-cutting, the individual modules.

In line with this, there is no need to make any significant changes in conventional technological processes of manufacture of the modules using the tape base. However, unlike traditional production lines used for the manufacture of the data carrier in the form of maps, you can refuse the use of additional workstation for adhesive lamination when embedding the finished chip modules in the chassis card that allows you to simplify and reduce the cost of production line compared to conventional production lines.

1. A method of manufacturing a module for installation in the card case, with one side of the base (4, 5, 6) of the module include a conductive structure (7), characterized in that in the manufacture of bases (4, 5, 6) of the module at least one first layer (1), is converted from the conductive structure (7), the bottom side (9), made of a thermoplastic properties is consistent with the properties of done the frame of thermoplastic layer of the shell card which (layer) when embedding module in the card case connects the first layer (1) base (4, 5, 6) module, at least in the sense that these thermoplastics have at least similar settings softening.

2. The method according to claim 1, characterized in that the first layer (1) base (4, 5, 6) of the module are made of the same material from which the layer of the shell card connected to this first layer (1) when embedding module in the card case.

3. The method according to claim 1 or 2, characterized in that the base (4) module performs a single layer.

4. The method according to claim 1 or 2, characterized in that the base (5, 6) module performs at least two-layer disposable between the first layer (1) and the conductive structure (7) the second layer (2)made from a material whose properties are consistent with the terms of the subsequent processing fundamentals (5, 6) of the module.

5. The method according to claim 4, characterized in that the first (1) and second (2) layers are connected via at least one connecting layer (3).

6. The method according to any one of claims 1 to 5, characterized in that first made the tape with many modules, with tape-based and is located on the conductive patterns for a variety of modules, making the first layer already during the manufacture of the tape base, then this tape from a variety of modules subject p is the next process and finally separated from her individual modules.

7. The method according to claim 6, characterized in that the multilayer tape base produced by coextrusion technology.

8. The method according to claim 6, characterized in that the multilayer tape base is made by lamination technology.

9. Module for installation in a card case having a base (4, 5, 6), one side of which is provided by the conductive structure (7), characterized in that the base (4, 5, 6) of the module at least with her facing away from the conductive structure (7) of the lower part (9) is made of thermoplastic with properties that are consistent with properties made from a thermoplastic layer of the shell card, which (layer) when embedding module in the card case connects the first layer (1) base (4, 5, 6) module, at least in the sense that these thermoplastics have at least similar settings softening.

10. The module according to claim 9, characterized in that the base (4, 5, 6) module, with her facing away from the conductive structure (7) of the lower part (9) is made of the same material from which the layer of the shell card, connected to the base (4, 5, 6) of the module when it is embedded in the card case.

11. The module according to claim 9 or 10, characterized in that the core (4) has a single layer.

12. The module according to claim 9 or 10, characterized in that it is based on (5, 6) made at least with double-layer located between the first choice of the layer (1) and the conductive structure (7) the second layer (2), made of a material whose properties are consistent with the terms of the subsequent processing fundamentals (5, 6) of the module.

13. Module 12, characterized in that the first (1) and second (2) layers are interconnected via at least one connecting layer (3).

14. The information carrier in the form of a card having a housing and welded it module according to any one of PP-13.



 

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