Method for contacting semiconductor micro-circuits in chip cards

FIELD: chip cards with body, semiconductor circuit and substrate, while substrate on both sides is provided with flat contacts and conductors of contact openings, which connect upper and lower flat contacts electrically to each other.

SUBSTANCE: because conductors of contact openings are hollow inside, air moisture can penetrate chip card through hollow gaps and damage semiconductor micro-circuit, of conductors of contact openings are not closed. Method includes positioning conductors of contact openings so close to edge of substrate, that their lower ends project into base of external hollow and close together there.

EFFECT: prevented penetration of moisture into inner hollow, wherein micro-circuit is positioned, without need for special protection of contact opening conductors.

10 cl, 2 dwg

 

The invention relates to a smart card (a card with a chip), which is the case of chip cards, the semiconductor chip and fixed in the case of the chip-card substrate from which the semiconductor chip is connected electrically and mechanically, in this case the chip card has a first cavity and a second cavity, the second cavity is made in the base of the first cavity, the first cavity extends into the sides over the second cavity, and the base area of the first cavity comprises a second cavity, and the substrate is placed in the first cavity and at its upper side has an upper flat contacts for reading the chip-card, and on its lower side has a flat bottom contacts, which by passing through substrate conductors contact hole electrically connected to each other, with the semiconductor chip through the electrical connections associated with the lower flat contacts of the substrate and the conductors of the contact holes in contact with the lower flat contacts, and the upper flat contacts and placed in the area of the first cavity, which extends to the outside of the second cavity, and the conductors of the contact holes in the base of the first plane are closed.

Smart cards are essentially out of the chassis (body) of the chip card, usually plastic the arts, which has a cavity for placing a semiconductor chip. This cavity is usually from an external flat cavity in the ground plane which made one internal cavity. The inner cavity has a smaller cross-section than the external cavity so that the external cavity extends over the inner cavity in the side of the latter. The ground plane (bottom) of the external cavity surrounds the internal cavity.

The inner cavity is used to accommodate the semiconductor chip in the case of chip cards. In the external cavity is the substrate from which the semiconductor chip is connected electrically and mechanically. The electrical connections of semiconductor chips, flat contacts on the upper side of the substrate provide the ability to read maps and depending on the chip card write information in the semiconductor chip with a corresponding upper contact flat contact through the machine for smart cards.

The substrate is mounted on the ground plane of the external cavity and almost completely fills the external cavity. The substrate simultaneously closes an internal cavity in which a semiconductor chip. Thus, the substrate protects the semiconductor chip from external influences.

Known chipcard, substrates which have on their upper side of the flat contacts on the opposite sides of which are attached and soldered joints, for example the United soldering wire, which electrically connect the semiconductor chip with flat contacts. To be able to connect the wire from opposite sides of the flat contacts on the upper side of the substrate, the substrate has a hole under each contact.

In addition, the chip-card substrate which has on its lower side flat contacts. These flat contacts are electrically connected with a semiconductor chip as flat contacts on the top side of the chip card. For electrical connection of the upper and lower flat contact with each other in the substrate, the conductors of the contact holes, the so-called transitional (intermediate) holes. Such transient opening preferably is a cylindrical hole in the substrate having a diameter ranging from 0.1 to 1 mm, and passes from the lower side to the upper side of the substrate, with the upper end of the transition holes or, respectively, the guide pin holes are often served top flat contacts. Cylindrical inner wall conductors of the contact holes machined in such a way that he who is conductive. Due to the metal or other conductive coating of the inner wall of the contact hole is an electrical conductor. He held respectively between the upper and lower flat contact surfaces.

The semiconductor chip is connected by the electrical connection with the lower flat contacts of the substrate and therefore can electrically be controlled through vias from the top side of the substrate.

Built-in smart card semiconductor chip must be isolated from environmental influences, so that the moisture or contained in ambient air of harmful substances into the semiconductor chip. To prevent contact formed by the inner cavity of the hollow space with the external environment, vias constituting the through hole in the substrate, can be placed outside of the ground plane of the second cavity in the ground plane of the first cavity. Thus creating an obstacle to the exchange of outside air with the air inside the second cavity.

However, there is a possibility that during the process of manufacturing the microclimate, providing long-term adverse effect on a semiconductor chip, including moisture and/or harmful substances, is blocked in the second cavity. Harmful alongside the effects of microclimate on the semiconductor chip cannot be avoided in a reliable manner and with the protective mass, which closes facing to the substrate top side of the integrated circuit. Harmful substances in the composition of such a climate can diffuse into the protective earth or the boundary planes between the protective mass and the semiconductor chip.

The present invention is the creation of a chip card, in which the effective shielding of the semiconductor chip from harmful contaminants and moisture is implemented in a cost efficient manner and in relation to closed in the second cavity of the air volume.

The specified task in accordance with the invention is solved in that the substrate on its lower side with an adhesive layer, which from the Foundation of the first cavity extends into the second cavity and covers the area of the semiconductor circuit, mounted on the ground plane of the first cavity.

In accordance with the invention, the shielding greater part of the volume of air confined in the second cavity is achieved by the adhesion layer, which in the traditional chip-cards designed for fastening substrate is also provided in the second cavity. Typically, the adhesive layer is placed only in the area of the ground plane of the first cavity outside the second cavity and has a second cavity cut, as there are in the height of the ground plane of the first cavity posted by electrical contacts for p the semiconductor chip. In accordance with the invention provides that the adhesive layer from the base of the first cavity extends into the second cavity and covers the area of the semiconductor chip. This adhesive layer for fixing the substrate is usually provided only on the ground plane outside the second cavity, in accordance with the invention covers also inside the second cavity semiconductor chip on its lower side and extends close to the side surfaces of the semiconductor chip to the ground plane of the first cavity, through which the air volume of the second cavity is divided in two. Adhesion layer screens the greater part of the air volume from the semiconductor chip, so that only a certain fraction of the moist air and/or harmful substances are in contact with the semiconductor integrated circuit. This results in an effective shielding of the microclimate that is implemented at no additional cost. In particular, provided that the adhesive layer covers the semiconductor chip in the second cavity from the bottom. As the adhesive layer surrounds the protruding above the bottom side of the substrate of the semiconductor chip, it is an additional protective sheath.

The preferred form of execution provides that the semiconductor chip in the region and their electrical connections with the lower flat contacts of the substrate is covered with an electrically insulating or anisotropic conductive protective mass and that of the adhesion layer covers the semiconductor region scheme, not covered with a protective mass. Based on the invention of the seals on the surface of the external cavity volume of the internal cavity with respect to the empty space in conductors, vias, and in relation to the external environment of chip cards, the volume of the internal cavity of climate shielded. If, however, a strong mechanical load case of chip cards will lead to the penetration of moisture into the internal cavity, the protective mass will protect the electrical connections between the semiconductor chip and the lower flat contacts from corrosion. In addition, this can also be used anisotropic conductive protective mass (pasta with anisotropic conductivity) or adhesive bonding with an anisotropic conductivity (adhesive anisotropic conductivity).

If the conductors of the contact holes placed in the region of the first cavity that extends into the side beyond the second cavity, the conductors of the contact holes extend in the plane of the base of the first cavity, where the conductors of the contact holes are automatically closed. Due to this arrangement of the conductors of the contact holes is no longer required for protection of the semiconductor chip to apply a coating to the conductors of the contact holes, as they no longer are in the inner space of the WTO the second cavity. The chip card can be manufactured economically and protects the semiconductor chip from external climatic influences, so that may not occur microclimate, with harmful effects on the semiconductor chip.

The preferred way provided that the conductors of the contact holes are closed by means of the adhesive layer. In this case, the conductors of the contact holes end in the adhesive layer, which is applied to the base of the first, outer, the body cavity of the chip card and which holds the substrate. Adhesive layer that covers the ground plane of the external cavity, covers the edge of the lower side of the substrate and simultaneously lower hole conductors of the contact holes, placed on the edge of the substrate.

Alternatively, provided that the conductors of the contact holes over the cut adhesive layer and the adhesive layer surrounds and seals formed by the cut of empty space. In the adhesive layer of the shell smart card provided by the cutouts, which are located in the same lateral position as the conductors of the contact holes of the substrate. The bottom hole conductors of the contact holes it does not come in contact with the adhesion layer; instead, they size is received at a distance, equal to the thickness of the adhesive layer relative to the ground plane external to the body cavity of the chip card. This may be preferable when the flat surface of the bottom contact due to manufacturing conductors of the contact holes slightly increased, for example, when the hole conductor contact hole surrounded by the annular protrusion. Since the end of the conductor pin hole ends in the empty space, this projection is not directly brought into contact with the base of the outer cavity and prevents thereby the contact between the substrate and the adhesive layer.

Preferably provides that the lower flat contacts of the substrate pass through the inner edge of the ground plane of the first cavity to the outside, above the semiconductor chip inside the second cavity. The conclusions of the semiconductor chip can be a vertical, that is oriented perpendicular to the plane of the body of the chip card contact pins, which are held in a lateral direction of the pads on the bottom side of the substrate. If located in the area of these contact pins, the inner ends of the lower flat contact is made with the large size, the semiconductor chip will maintain reliable contact with low lateral offsets.

With the responsibly in the preferred form of the semiconductor chip is soldered by the method of the inverted crystal to the bottom of the flat contacts of the substrate. When the fastening method of the inverted crystal semiconductor chip is rotated 180 degrees, that is integrated into the body of the chip card in connection with the substrate bottom, being turned upside down. While not contacting the upper side of the semiconductor chip facing toward the base of the second internal cavity and protected it from the bottom side of the map, not containing electrical contacts.

As for the material of the adhesion layer, the preferred embodiments of the provide that the adhesive layer is made from a material that is glued only at elevated temperatures, or from a curable liquid adhesive material, preferably the curing of cyanacrylate. The adhesive layer of the adhesive only at elevated temperature material has the advantage that in the cold, yet not sticky state in the adhesive layer can be easily vyshtampovanny cuts, which will then enter the conductors of the contact holes. In the case of applying the liquid adhesive material is provided by the ease of filling the insides of the conductors of the contact holes and thereby achieve increased square plot is to be placed.

Made in accordance with the invention, the smart card preferably is a map for mobile communication.

The invention is described below with reference to the drawings, in which presents the following:

Figure 1 is a cross section corresponding to the invention, the chip card and

Figure 2 is a view in section of the upper side corresponding to the invention of the smart card.

Figure 1 shows in cross section the body 1 of chip cards, which may consist of flexible or rigid synthetic material, and the thickness of the chip card corresponds to the height shown in figure 1 of the housing 1, the chip card. Case 1 smart card has an external cavity 10, which in the lateral direction, i.e. parallel to the plane of the chip card has a larger cross-section than the other cavity 20, which is made in the base 15 of the external cavity. External cavity 10 extends in the left and right side, and perpendicular to the plane of the drawing up and down over the inner cavity 20, so that the plane 15 of the base surrounds the section of the inner cavity. In the external cavity 10 posted by substrate 2. In the inner cavity 20 posted semiconductor chip 3, which is an electric connection 9 is connected with the substrate 2. The substrate 2 is attached through the adhesive layer 7 to the plane 15 of the base of the external cavity 10 and in this way secured in the housing 1 is PI-card. The substrate 2 is, on the one hand, the fact that the semiconductor chip 3 pin no direct contact with the flexible to the extent possible, housing 1 chip-card, and on the other hand, to ensure electrical contact with the semiconductor chip 3 to read smart cards. To this end, the upper side 11 of the substrate are many flat contacts 4. The substrate 2 has on its lower side 12 other flat pins 5, which have a different cross-section plane in comparison with the upper flat contacts 4. They are, in particular, to a greater extent to the middle of the substrate than the upper flat contacts 4. The substrate 2 may be in the center of the upper part 11 and lower part 12 contacts the ground, the so-called Islands, which themselves are not contacting with the substrate. The semiconductor chip 3 is connected by an electric connection 9 with the flat contacts 5 on the bottom side 12 of the substrate 2. The electrical connection between the lower flat contacts 5 and the flat contacts 4 on the upper side 11 of the semiconductor chip, where contacts have been established machine for reading chip cards, are implemented through the so-called transitional (intermediate) holes 6. MTG, as shown in figure 1, is a hole itlocale substrate 2, which connects the upper side 11 from the lower side 12. Figure 1 is a top planar contacts 4 and the lower flat contacts 5 are punched with the relevant transitional hole 6. MTG can break through these contacts within their pads or on the edge. Shown in figure 1, denoted by reference positions 4, 5 respectively, and are separated by a transitional hole region 6 respectively illustrate part of the same contact, so that figure 1 shows only two of the top 4 and the bottom two 5 flat contact.

MTG is a hollow channel in the mass of the substrate 2, through which the inside of the chip card can penetrate the outer air. Wall 16 vias 6 are processed in such a way that they are electrically conductive. They have a coating of electrically conductive material, which, as the wall has the shape of a hollow cylinder. Consequently, the conductive layer covering MTG is a conductor 6 of the contact holes. The inside of the conductor 6 of the contact hole is hollow, as a result, if only the conductor 6 of the contact holes at least on one side of the substrate 2 is not closed, is climate exchange between ambient air and the internal volume of the body 2 of the card.

The conductors 6 of the contact hole at back the of s do not have to be in the cross section of the flat contact; they can also be placed on the edge of the flat contacts 4 and 5, for example at the edge of the substrate 2.

Located in the inner cavity 20 of the semiconductor chip 3 through the electrical connections 9, the lower flat contact conductors 5 and 6 of the contact holes connected to the upper flat contacts 4 of the substrate 2. As the upper flat contacts 4 go to the location above the internal cavity 20, the conductors 6 of the contact holes can be placed within the width of the internal cavity 20. In this case, the lower flat pins 5 would have to cover only a short lateral distance between the conductors 6 of the contact holes and electrical connections 9 of the semiconductor chip 3. In this arrangement the conductors 6 of the contact holes, the external air could penetrate into the internal cavity 20 and thus create a microclimate that are harmful to the semiconductor chip 3. In particular, the moisture contained in the air of harmful substances can diffuse through the body material of the semiconductor chip 3 and to have a harmful effect, unless the conductors of the contact holes are not filled or are not closed.

A typical chip-card substrate, which on both sides are equipped with flat contacts, have a so-called blind vias, which is on the upper side 11 of the substrate 2 are closed and locked by means of flat contacts 4, applied after performing the conductors 6 of the contact holes. These conductors contact holes are therefore only to the lower side of the flat metal contacts 4, i.e. only to the upper side of the substrate 2. Therefore, the upper contact pads 4 should be applied after the manufacture of the conductors of the contact holes, which increases the manufacturing substrate, and thereby the chip card.

In accordance with the invention, the conductors 6 of the contact holes are placed in the external cavity 10, which extends into the internal cavity 20, so that the conductors 6 of the contact holes over the base 15 of the external cavity with a lateral offset relative to the internal cavity 20 and there are closed, without requiring their own assistive devices. Corresponding to the invention the smart card thereby protects the semiconductor chip 3 from the harmful effects of microclimate and, moreover, can be manufactured economically.

The conductors 6 of the contact holes can be closed at their lower ends in various ways. In this regard, figure 1 shows two preferred forms of execution. Shown in figure 1 to the right MTG 6 closed adhesive layer 7, whereby the substrate 2 is fixed on the base 15 of the external cavity 10 in the housing 1 chip here is you. Shown in figure 1 to the left MTG 6, according to an alternative form of execution, surrounded by the cutout 8 in the adhesive layer 7. The adhesive layer 7 formed around the cutout 8 empty space in the plane 15 of the base of the external cavity 10 with all parties and seals the hollow space in this plane from all sides. Falling through MTG 6 external air is therefore unable to penetrate into the region of the internal cavity 20. The semiconductor chip 3 are connected by electrical connections 9 with the lower flat contacts 5 of the substrate 2. Mounted on the semiconductor chip 3 conclusions 9 (contact bars) can pripisivaetsya to contacts 5, or if, as shown in the drawing, the contacts 5 applied protective mass 13 electrically connect through it with these contacts so that the semiconductor chip 3 is pressed against the substrate 2 up until protective weight 13 will not harden and will be securely and firmly hold the pin 9 of the chip on the flat contacts 5. Protective (adhesive) weight 13 may be printed on the flat contacts 5 before pressing the semiconductor circuit 3, and in this case, the pressing shipped contacts 9 occurs through the protective mass 13.

Anchored method of the inverted crystal, that is, upside down, on a substrate 2 of semiconductor mikros the EMA 3 and the substrate 2 together form a module is a chip card. The substrate 2 is preferably a flexible conductive plate, which consists of a base material, on both sides 11, 12 which caused the flat contacts 4, 5. Through a multi-layer substrate formed by the base material and bilateral flat contacts pass through the conductors 6 of the contact holes, so that the substrate 2 itself cannot prevent the penetration of moisture into the internal cavity 20, and thus the malfunction of the chip.

To secure the module 2, 3 map case 1, the chip card is layer 7, which may consist of synthetic material (melting at a high temperature hot melt), which at high temperatures has an adhesive property. Can also be applied liquid hot glue or, in the alternative, fast-curing synthetic material, as, for example, cyanacrylat.

The adhesive layer 7 shown in figure 1 in accordance with the invention as continuously passes, that is, it passes into the internal cavity 20 and there surrounds the semiconductor chip 3 from the bottom. Thus, the chip 3 is additionally shielded and thus shielded from most of the volume of air trapped in the second cavity. Therefore, the harmful effects of microclimate on the semiconductor chip can be manifested to a much lesser extent than is the case in conventional chip-ka is the same. In addition provide shielding is implemented in a cost efficient manner.

Figure 2 shows a section corresponding to the invention, the chip card in the schematic view. In the external cavity 10 in the housing 1, the chip card is made more passing into the housing 1 smart card internal cavity 20. In the upper cavity 10, which extends in part over the inner cavity 20 posted substrate 2. Between the bottom side of the substrate 2 and the base of the outer cavity 10 posted by adhesion layer 7, indicated by hatching, which is located only in the areas of external cavity 10, which are located on the sides outside the dashed inner cavity 20.

Within this adhesive layer over the three shown in figure 2 on the right side of the substrate 2 of the conductor 6 of the contact holes and snapped this layer. In an alternative form of execution of the conductors 6 of the contact holes can result in voids in the adhesive layer 7, and in this case, achieving a complete seal, as in the plane of the base of the first cavity 10 of the adhesive layer 7 surrounds the neck 8 with all parties and seals it. In addition, the adhesion layer 7 surrounds as well as the ground plane of the first external cavity 10, the inner cavity 20 from all sides and thus prevent climate exchange with the external environment.

P is a list of reference designations positions

1 - case of chip cards

2 - base

3 is a semiconductor chip

4 is a top planar contact

5 is a bottom planar contact

6 - conductor contact hole (contact hole)

7 - adhesion layer

8 - neckline

9 - contact chip (bar output)

10 - the first cavity

11 top side of the substrate

12 bottom side of the substrate

13 - protective mass

15 - the ground plane of the first cavity

20 - second cavity

1. The chip card, which has a housing (1) of the chip card, the semiconductor chip (3), and fixed in the housing (1) chip-card substrate (2)with which the semiconductor chip (3) is connected electrically and mechanically, with a housing (1) of the chip card has a first cavity (10) and a second cavity (20), and the second cavity (20) is made at the base of the first cavity (10) so that the first cavity (10) extends in the lateral side of the second cavity (20), and plane (15) of the base of the first cavity (10) comprises a second cavity (20), the substrate (2) is placed in the first cavity (10) and at its upper side (11) has an upper flat pins (4) to read smart cards, and on its lower side (12) has a flat bottom contacts (5), through which pass through the substrate (2) conductors (6) of the contact holes electrically connected to each other, and the semiconductor is the first chip (3) through electrical connections (9) is connected with the lower flat contacts (5) of the substrate (2), and with the conductors (6) of the contact holes passing through the lower flat pins (5)and through the upper flat contacts (4), and placed in the area of the first cavity (10), which extends to the outside of the second cavity (20), and conductors (6) of the contact holes in the base of the first plane (10) is closed, characterized in that the substrate (2) with its lower side (12) with an adhesive layer (7), which from the Foundation of the first cavity (10) extends into the second cavity (20) and covers the area of the semiconductor chip (3), mounted on a plane (15) of the base of the first cavity (10).

2. The chip card according to claim 1, characterized in that the adhesive layer (7) surrounds the bottom of the semiconductor chip (3) in the second cavity (20).

3. The chip card according to claim 1 or 2, characterized in that the semiconductor chip (3) in their electrical connections (9) with the lower flat contacts (5) of the substrate (2) is covered with an electrically insulating or anisotropic conductive protective mass (13)and adhesive layer (7) covers the area of the semiconductor chip (3)not covered by a protective mass (3).

4. The chip card according to claim 1 or 2, characterized in that the conductors (6) contact holes are closed by means of adhesive layer (7).

5. The chip card according to claim 1 or 2, characterized in that the conductors (6) of the contact holes end in the cut (8)adhesive layer (7) and adhesive layer (7) surrounds and seals formed by the cutouts (8) empty space.

6. The chip card according to claim 1 or 2, characterized in that the lower flat contacts (5) of the substrate (2) pass over the inner edge plane (15) of the base of the first cavity (15) and over the semiconductor chip (3) within the second cavity (20).

7. The chip card according to claim 1 or 2, characterized in that the semiconductor chip (3) is soldered to the lower flat contacts (5) of the substrate (2) by the method of the inverted installation.

8. The chip card according to claim 1 or 2, characterized in that the adhesive layer (7) made of a material which becomes adhesive only at elevated temperature.

9. The chip card according to claim 1 or 2, characterized in that the adhesive layer (7) made of a curable liquid adhesive, preferably of the curing of cyanacrylate.

10. The chip card according to claim 1 or 2, characterized in that the chip card is the card of mobile communication.



 

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