Method for manufacturing non-contact chip-card with substrate of antenna of fiber material

FIELD: chip-cards.

SUBSTANCE: method includes manufacturing antenna by template method at substrate, gluing contacts of microchip to antenna substrate by electric-conductive glue, laminating card on each side by hot pressing on antenna substrate, hence manufacturing two bodies of card. In corners of antenna substrate slits are made, which provide for soldering together of card bodies during lamination.

EFFECT: higher efficiency.

8 cl, 6 dwg

 

The technical field

The present invention relates to methods of manufacturing a chip card, in particular a method of manufacturing a contactless chip card antenna which is made on a substrate of fibrous material such as paper.

Prior art

The contactless chip card is increasingly being used in various fields. So, in the field of transport it was developed as a means of payment. This also applies to the electronic wallet. Many companies use a means of identification of staff using contactless smart cards.

The exchange of information between the contactless card and the associated reading device is carried out by remote electromagnetic coupling between the antenna performed in a contactless card, and the second antenna in the reader. For creating, storing and processing information in the map has a microchip connected to an antenna. Typically, an antenna and a microchip located on the dielectric substrate, is made of plastic. Their classic industrial production consists of three stages:

the manufacture of the antenna on a plastic dielectric substrate of polyvinyl chloride (PVC), polyester (PE), polycarbonate (PC) by printing chemical process using copper or aluminium;

the connection pin in the clutches of the microchip with the contact pads of the antenna with the help of paint or epoxy resin, or conductive polymers, called " technology application "flip-chip" - mirroring;

hot lamination by pressing upper and lower plastic layers enclosure cards (PVC, PE, PC, acrylonitrilebutadienestyrene (ABS) on the antenna substrate for the formation of the cards in the form of a candy bar.

However, this method has several major drawbacks. When implementing this method, perform a complicated layering of plastic material joined by gluing or thermopile and having different coefficients of thermal expansion. Consequently systematically causes irreversible deformation maps (curl, warp), unacceptable to the user, as well as insufficient mechanical strength for regulatory or equivalent tests.

In addition, thermomechanical properties of PVC mediocre. During lamination, there is a considerable turnover of material, which is not stored form of an antenna. This leads to unstable operation of the antenna, so as to change the electrical parameters such as inductance and resistance. Often there is a break of the antenna in areas where there are significant shear stress. In particular, this occurs at the corners or at the level of the electrical connections.

The total thickness of the laminated cards ISO range is t 780 to 840 microns. Given the above-mentioned fluidity of the material, it is difficult to ensure that users of mass and controlled distribution among the population.

Used when laminating termopane allows you to get a monoblock map with very mediocre mechanical properties in the compensation plan of the test voltages. During the regulatory test to twist and bend the main voltage is applied to the microchip, in particular, to the points of bonding of providing electrical connections. Point bonding exposed to high stresses, and the slightest disturbance of the operation of application of the microchip on the antenna (technology application "flip-chip") breaks the electrical connection between the microchip and the antenna.

After lamination, printed enclosures cards become visible traces of copper tracks. Although it does not affect the normal operation of the card, but users are not satisfied with this defect, since it impairs the aesthetic appearance of the map.

In addition, the production cost of the card this way too high, so you can talk about the real increase in their consumption.

Finally, the currently known methods do not allow to produce maps that can be seen later mechanical interference map for illegal substitution. For the cheater sravnitel is but easy to destroy the card by strong multiple bending, and further it is difficult to prove the illegal nature of his actions. For example, the antenna may be terminated prior to the marking of the card. Trade policy companies are focused mainly on a free refund of the defective cards. Systematic replacement of cards leads to increased costs for companies.

A brief statement of the substance of the invention

The present invention is to eliminate these disadvantages by developing a new method of manufacture, allowing the use of a substrate of fibrous material, which by printing stencil conductive paint applied to the antenna, which can significantly reduce the cost of production of contactless or combination of smart cards.

Thus, the present invention relates to a method of manufacturing a contactless smart card with an antenna substrate of fibrous material such as paper, namely, that

make the antenna by screen printing turns through the polymer conductive ink on a substrate of fibrous material and heat treatment of the substrate for sintering paint,

adhesively bonded using a conductive adhesive to the contact pads of the microchip on the contact pads of the antenna,

laminated body maps on the substrate of the antenna by prepaymania on each side mean the Ki of at least two sheets of plastic, forming the card case, by hot pressing.

Brief description of drawings

Further the present invention explained in the description of the preferred variants of its implementation with reference to the accompanying drawings, on which:

Figa-1C depict various stages of screen printing the antenna on the cover, according to the invention;

Figure 2 depicts a substrate with an antenna caused by screen printing before the step of laminating, according to the invention;

Figure 3 depicts the chip card at the end of the fabrication process according to the invention;

Figure 4 depicts in cross section along the line IV-IV in figure 2, 3 chip card (General view), according to the invention.

A detailed description of the preferred variant embodiment of the invention

A method of manufacturing a chip card in accordance with the present invention is as follows. Substrate carry out on a sheet of fibrous material such as paper. In accordance with the preferred implementation, the antenna is applied by screen method on this material in several stages. The first stage (Figo) includes applying a stencil method of the two coils 10 and 12 and two contact pads 14 and 16 of the antenna. During the second stage (pigv) by screen method is applied insulating strip 18, which provides the intersection of the coils 10 and 12 without electrical contact. Time of the third stage (figs) by screen method applied electric jumper 20, for connection of the coil body 10 with the contact lining 14.

After application of the antenna by screen method on a substrate latest cut to size card. In accordance with a preferred perform in each corner of the substrate make the cut 22 (figure 2). This cut helps direct the soldering between the buildings of the card during lamination.

The lamination is carried out by hot pressing. In the preferred embodiment, for each enclosure cards use two layers of plastic. Usually, the use of such plastic polyvinyl chloride (PVC), polyester (PE, PEG), polycarbonate (PC) or acrylonitrilebutadienestyrene (ABS). In a preferred embodiment, the use of PVC. Two layers have different hardness. The outer layer is made of rigid PVC, and the inner layer in contact with the substrate of the antenna is made of soft PVC with a lower point value of Vigata (the temperature at which the PVC goes from solid to kauchukopodobnoe state). Both layers may have different thickness. For example, each of the housings card consists of an external layer made of hard PVC, thickness of about 310 μm and an inner layer, made of soft PVC, thickness of about 80 μm. The antenna substrate is made of paper and has a thickness of approximately 125 μm. In accordance with another exemplary embodiment,which is preferred, every building of the card consists of three layers. In this case, the outer layer of the buildings of the card during printing are coated with transparent PVC sheet or layer of varnish to protect the printed text. This coating has a thickness of about 40 μm, the outer layer of the shell card is in this case a thickness of about 275 μm and an inner layer of a thickness of about 40 microns.

During lamination trying to enter a different stack of cards, the sandwich is placed in a press for laminating. He passes it to heat treatment at a temperature exceeding 100°and preferably 150°C. at the same time it is subjected to pressing spikes for different layers. Under the simultaneous effect of heating and pressing PVC outer layer is softened, and the inner layer formed PVC with a lower point Vicat becomes fluid. Become fluid layer PVC covers its mass stencil paint the antenna that provides the latest higher strength under mechanical stresses arising from the use of chip cards. In addition, the degree of adhesion of the antenna to the body of the card. This adhesion can be improved by the use of double-sided adhesive that is sensitive to compaction and placed between the card and the antenna.

Made in the corners of the sheet antenna openings 22 allow the two with OAM PVC to touch each other. When you lock the corners by soldering between the two housings card all mechanical stresses are transmitted to the inside of the card. However, in the case of paper, the latter has a weak strength of internal clutch. When the impact of efforts to shift the core of the paper has a tendency to stratification. With considerable effort, the map opens up to stratification into two parts (the part that contains the antenna, connected to the module continues to function). Thus, given the properties of paper and its internal clutch, you can use this physical property for manufacturing a card with a built-modulated marker of stress. In accordance with the requirements of the client, the delamination can be faster or slower with the possibility of visual detection limited fold card when the bundle of paper inside it.

At the end of this stage you get the card, shown in figure 3. Enclosure cards are connected by termopane corners, where before these were made cutouts 22 on the substrate of the antenna. The chip 26 is placed deep inside the map and not outwardly visible.

Figure 4 shows a cross section of a chip card. The map contains a substrate of the antenna 28 of the fibrous material, is inserted between the two blocks of the map. Each card contains a coating 30 of transparent PVC sheet or layer of lacquer, outside the Loy 32 of rigid PVC and the inner layer 34 made of soft PVC. Coil 36 and contact pads 38 are located within the mass of PVC inner layer 34 of the housing of the card. The chip 40 is connected with the contact pads 38 of the antenna by means of a layer of electrically conductive adhesive 42. Conductive adhesive is made based paint, epoxy or conductive polymers. In accordance with the special option perform perform bonding technology, called " technology application "flip-chip".

The method in accordance with the present invention enables to produce a map with two main qualities that are attractive to users: protection of electrical elements makes this map great durability, and the ability of fibrous materials such as paper, delaminate allows in case of loss of card to check not been whether it is intensive bends for illegal purposes.

1. A method of manufacturing a contactless chip card containing a substrate of the antenna is made of a fibrous material such as paper, and the card case on each side of the specified antenna substrate, namely, that make the antenna by printing turns on the stencil using a polymer conductive ink on the substrate of fibrous material and heat treatment of the substrate for sintering paint, paste using electroconductive the lei pads of the microchip on the contact pads of the antenna, laminate substrate antenna by prepaymania on each side of the substrate at least two plastic sheets with different hardness by hot pressing, forming the body of the card.

2. A method of manufacturing a chip card according to claim 1, in which in the manufacture of antennas at the corners of the substrate of the antenna perform the cutouts for the spikes of the two housings card, this card has made the preferred zone of separation, subsequently allowing to detect intentional damage to the card.

3. A method of manufacturing a chip card according to claim 2, in which use the plastic sheet forming the outer layer of buildings map, which is more rigid than the plastic sheet forming the inner layer of the buildings of the card, with this internal layer is a low point Vicat.

4. A method of manufacturing a chip card according to any one of the preceding claims 1 to 3, characterized in that use two plastic sheet having a different thickness, each of which forms a housing of the card.

5. A method of manufacturing a chip card according to claim 4, in which use the plastic sheet forming the outer layer, which is thicker than the plastic sheet forming the inner layer.

6. A method of manufacturing a chip card according to any one of the preceding claims 1 to 5, in which the lamination of the substrate of the antenna on each card add a third sheet of plastic or lacquer layer, ispolnyayushiy role covering.

7. A method of manufacturing a chip card according to claim 6, in which as the material for the shell card uses material selected from the group consisting of polyvinyl chloride (PVC), polyester (PE), polycarbonate (PC) or acrylonitrilebutadienestyrene (ABS).

8. A method of manufacturing a chip card according to claim 7, in which the electrically conductive adhesive for bonding the contact pads of the microchip on the contact pads of the antenna is made based paint, epoxy or conductive polymers.



 

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