Carrying film for electronic elements for forming layer in chip- cards

FIELD: electric engineering.

SUBSTANCE: carrying film has at least one current-conducting track with connecting portions, containing multiple interconnected surfaces 7 and empty hollows 8.

EFFECT: higher efficiency, higher reliability.

3 cl, 3 dwg

 

The invention relates to a carrier tape for electronic components to create a layer of plastic cards with an embedded microchip (chip cards), containing at least one conductive track located on the body of the carrier film and is provided consisting of a conductive material connecting portions for connection with other electronic elements or connecting bridges. Additionally, the invention relates to a smart card containing the body, at least one electronic element (chip) and formed in a layer in the body of the chip card carrier tape for electronic components, containing at least one conductive track located on the body of the carrier film and is provided consisting of a conductive material connecting portions for connection with the electronic element. In addition, the invention relates to a method of manufacturing a carrier film according to the invention. Referred to the carrier tape in accordance with the preferred use may be used, in particular, as the antenna carrier film for contactless smart cards, and in this case, a conductive track made in the quality of the antenna coil.

The chip cards are already used widely for different purposes in the prior art, such as phone cards, authorized access, CR is credit cards etc, the data located on a smart card electronic element (chip) and possibly additional elements, such as displays or dip switches, with external readout devices, in principle, there are three different structural forms. Many smart cards mentioned data exchange with external readout devices occurs through contact pads on the outside on a smart card. Another possibility for the exchange of data with the help of readers, working with contactless transmission of data. For this purpose, the smart card contains in its body the corresponding electronic element for contactless data transmission, for example an antenna in the form of an antenna coil. Such antenna coil requires a relatively large area, so placing the chip module is only possible with great difficulty. Therefore, the antenna coil is placed in the body of the chip card separately, and the process of manufacture involves the location of the antenna coil in conjunction with a chip or a separate antenna carrier film, which made for a separate manufacturing operation, and then using the lamination process is implanted in the body of the chip card. For this purpose, the carrier film is covered on its upper and lower sides of one or more layers of the polymer and by pressure and heat connected with the body of the chip card.

As a third option for the exchange of data between the chip card and reader devices are smart cards, which contain both pads for contact communication, and an antenna coil for the contactless exchange of data.

The antenna is located inside the chip card on the carrier foil is for electrical connection with other electronic components such as chip module or indicator devices consisting of a conductive material connecting parts connected to the conductive track or tracks, which form the antenna coil and other electrical connections between the elements. These connecting parts are made usually in the form of a rectangular solid surfaces consist as conductive tracks, mainly from the copper layer and usually have lateral dimensions of about 0.5 × 0.5 mm or more. In addition, the connecting parts may have a round or oval shape, and size is 0.25 mm2or more.

In the manufacture of the carrier film with the conductive paths, and connecting parts in the prior art the problem lies in the fact that due to the different thermal expansion of the material of the carrier film and the conductive connecting sections by heating wasnike the effect similar to the bimetallic effect. This means that the carrier film or the material of the connecting pads in the lamination process for the manufacture of the body of the chip-card spreads. These are bending disadvantage, because on the surface of the laminated chip card sections of the connecting pads are often clearly visible to the naked eye, because the curvature disappears after cooling incomplete.

In addition, turned out to be a disadvantage that the strength of adhesion between the conductive material of the connecting pads and a plastic layer located within the lamination process on the carrier film, is extremely small, which may substantially impair the connection between the mounting pads and a plastic layer inside the body of the card.

Proceeding from the aforementioned, known from the prior art drawbacks, the task according to the invention consists in improving the final quality of smart cards, and increase the holding force between the mounting areas of the carrier film and the surrounding polymer layer.

These tasks are solved by means of the carrier film and the chip card with the appropriate carrier film according to the independent claims. The carrier film according to the invention can be manufactured by the method according to independent claim for a method.

The basic idea of the invention Zack is udaetsya is that the connecting areas have many interconnected consisting of a conductive material partial surfaces and located between the partial surfaces available, not covered with a conductive material surface. The connecting areas are, thus, as is known from the prior art, from a solid surface, and has plenty of Windows, due to which, first, it significantly reduces the extension of the connecting sections due to the heat supply. In addition, the connecting sections, according to the invention, for overlying the carrier polymer film layer gives the possibility that is not covered with a conductive material zones of the connecting sections may be formed with it significantly better adhesion.

A special run of the carrier film according to the invention, are given in the dependent claims related to the main point. Especially preferred and economical design provides that interconnected partial surface in the form of intersecting conductive tracks lying between them a rectangular free surfaces.

In addition, in particular, provided for joining the chip to the module mounting stations was preferably the m to make these connecting areas in the form of made rectangular, consisting of a conductive material partial surfaces and adjacent free surfaces, surrounded connected with this partial surface of the conductive track. Due to this, particularly in the marginal zone consisting of a conductive material partial surfaces can be due to Windows larger area to significantly improve the adhesion of the overlying polymer layer.

The invention finds application mainly in the DIC-cards (Dual Interface Karten), but, of course, not limited to this application. The object of the invention is explained in more detail below using the attached drawings, which represent:

- figure 1 is a top view of a carrier tape according to the invention, located on her antenna coil;

- figa - enlarged view of the carrier foil 1 in the zone provided for the connecting bridge connecting areas;

- fig.1b - enlarged view of the carrier foil 1 in the zone provided for connection with the chip module mounting sites.

Depicted in figure 1 when viewed from above, the carrier film comprises a plastic body 1, which as an antenna for contactless data transmission, mainly koltseobrazno is one or more conductive tracks 2. On one segment of the ring conductive track 2 on either side of her are the Pris is einfeldia sections 3, 4. With respect to the surface of its Foundation, the connecting parts 3, 4 are made, mostly rectangular and are used to obtain the so-called connective bridge between the mounting sections, and the connecting bridge creates an electrical connection between the mounting parts 3, 4, not connecting at the same time located between the mounting sections of the conductive track or tracks. For this purpose, the connecting bridge operates mainly in the form of a jumper in two parts, and in the manufacture of the first operation between the mounting parts 3, 4 on the conductive path 2 have a non-conductive insulating layer, and then over this insulating layer is laid a bridge made of conductive paste.

From figure 1, in addition, it is seen that the carrier film has two additional mounting section 5, 6, serving to attach the electronic element (not shown), such as a chip module, the chip card in which the rolled antenna carrier film.

Mentioned connecting sections 3-6 are, as can be seen from figure 1, significantly greater area than located on the antenna carrier film conductive paths. Because the coefficients of expansion of the material of the connecting sites/conductive paths, which is usually copper, and the material of the carrier plank is different, when forming the carrier film as a layer in the body of the chip-card based because of the necessary heat, there is a danger of occurrence in the area of the connecting sections 3-6 of the corrugations, and which in the finished the body of the chip card is also recognized as such. To address this shortcoming mentioned connecting parts 3, 4 is performed, according to the invention, so that there are many interconnected consisting of a conductive material partial surfaces 7 and located between the partial surfaces of the free, not covered by conductive material sites 8. Special perform well seen, in particular from the enlarged detailed images on figa. Partial surface 7 in combination with the pads 8 formed in the depicted example, the execution of a mesh pattern, and interconnected partial surface 7 is made in the form of intersecting conductive tracks lying between them a rectangular free openings 8. Of course, it is also permissible to provide lying between interconnected partial surfaces 7 free sites 8 circular in projection path. Significant at runtime according to the invention, is the fact that the current remains approximately the same size footprint as the connection phase is in the normal kind, there is no single surface of the conductive material that, on the one hand, provides a polymeric layer covering the best connection with the body 1 of the carrier film on the free sites and at the same time significantly reduces the effect of different thermal expansion (for example, warping of the chip card) connecting sections 3, 4 and the carrier film, in particular in the laminating process.

On fig.1b shows another possible implementation of the invention. We depict here the connecting sections 5, 6 due to the typical specifications of accession provided here chip modules required a certain amount of the connecting sections. In order in this area to improve adhesion between the material of the connecting sections and covering with plastic connecting parts 5, 6 are also available, not covered with a conductive surface material 9, which is surrounded by conductive tracks 10, which is also connected with related to reel ring conductive track 2. Thanks to this implementation, and the connecting sections 5, 6 there is an increase in adhesion to improve the structure of the smart card provided with the antenna coil according to the invention.

The reference list of items

1 - body of the carrier film

2 is a conductive path

3 - mounting area

4 - when soedinitelny plot

5 - mounting area

6 - mounting area

7 is a partial surface

8 - surface

9 - surface

10 is a conductive path

1. Carrier tape for electronic components for forming the layer in the chip cards containing at least one conductive track (2)on body (1) of the carrier film and is provided consisting of a conductive material connecting parts (3, 4, 5, 6) for connection to other electronic elements, characterized in that the connecting sections (3, 4, 5, 6) have many interconnected consisting of a conductive material partial surfaces (7) and located between the partial surfaces (7) available, not covered with a conductive material surface (8, 9).

2. The film according to claim 1, characterized in that a conductive track on a carrier film made in the form of an antenna coil.

3. The film according to claim 1 or 2, characterized in that the interconnected partial surface (7) made in the form of intersecting conductive tracks lying between them a rectangular free surfaces (8).

4. The film according to claim 3, characterized in that the free surface (8) are essentially circular in plan outline.

5. The film according to one of claims 1 to 4, characterized in that the conductive material is copper.

6. The film according to one of claims 1 to 5, characterized in that the connecting sections (3, 4, 5, 6) are composed of a conductive material partial surface (7) and adjacent free surfaces (9), surrounded connected with this partial surface (7) of the conductive path.

7. The film according to claim 6, characterized in that it is surrounded by a free surface (9) has a basically triangular in plan outline.

8. The chip card containing the body, at least one electronic element (chip) and formed in the body of the chip card in the form of a layer of carrier film for other electronic items containing at least one conductive track (2)located on the body of the carrier film and is provided consisting of a conductive material connecting parts (3, 4, 5, 6) for connection with the electronic element or elements, characterized in that the connecting sections (3, 4, 5, 6) have many interconnected consisting of conductive material, the partial surfaces (7) and located between the partial surfaces available, not covered with a conductive material sites (8, 9).

9. A method of manufacturing a carrier film for electronic components for forming the layer in the chip card, and the body (1) of the carrier film includes a carrier film, at least one located on it conductive path (), provided consisting of a conductive material connecting parts (3, 4, 5, 6) for connection with the electronic element, characterized in that the connecting sections (3, 4, 5, 6) is provided with a multitude of interconnected consisting of a conductive material partial surfaces (7) and located between the partial surfaces of the free, not covered by conductive material sites (8, 9).

10. The method according to claim 9, characterized in that the interconnected partial surface (7) are in the form of intersecting conductive tracks lying between them mainly rectangular free sites (8).

11. The method according to claim 9, characterized in that the connecting sections are formed preferably in the form of a rectangular covered with a conductive material partial surfaces (7) and the adjacent United with these partial surfaces of the conductive paths surrounding open areas (8).

12. The method according to claim 10, characterized in that it is surrounded by open areas (9) have the form of a triangle.



 

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