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Heat-resistant radar-absorbing coating on mineral fibres Heat-resistant radar-absorbing coating on mineral fibres is obtained by applying an electroconductive carbon layer on mineral fibres with diameter of 4…9 mcm. The carbon coating is obtained from flat carbon particles that are chemically activated in sulphuric acid and nitric acid, said particles having thickness of 4.0…7.0 nm and diameter in the layer plane of 800…3000 nm. |
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Ply containing polymer composition is made at, at least, one surface of bearing metallic foil of said mask. Said polymer comprises solid lubricant composed by at least one of the following substances zinc molybdate and molybdenum trioxide. Polymer composition ply depth makes 0.02-0.3 mm. |
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Housing has a base with external leads, covers connected to the base by soldering on the periphery; the outer surface of at least one of the covers, outside the soldering area, has a system of regularly shaped bumps, and the inner surface of the cover with bumps outside the soldering area has a getter layer. |
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Layer of a water-soluble polymer composition, including a water-soluble polymer, a water-soluble lubricating material and 2,7-naphthalenedisulphonate-3-hydroxy-4-[(4-sulpho-1-naphthalene)azo]trisodium salt, is formed on the surface of a metal foil. A layer of the water-soluble polymer composition is obtained by cooling for 60 seconds from the initial cooling temperature, constituting from 120°C to 160°C, to the final cooling temperature, constituting from 25°C to 40°C, at the cooling rate, constituting not less than 1.5°C/s. A degree of crystallinity of the water-soluble polymer composition constitutes not less than 1.2, with the surface hardness of a layer of the water-soluble polymer composition constituting from 8.5 N/mm2 to 20 N/mm2 with the standard deviation of σ value of the surface hardness not higher than 2. |
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Invention relates to ventilation and temperature control in the chambers for electronic equipment, particularly to devices and methods for controlling the air flow in these chambers. The chamber (110) for equipment with temperature control comprises: an air inlet opening (113) with an air blower (228) for supplying air into the chamber from the external environment through the air inlet opening, creating the pressurised air in the chamber when it is turned on; an air outlet opening (150); an air duct (125) extending in the interior volume (115) of the chamber between the cabinet (121) with the equipment and the outlet opening; and exhaust fan (127) to force air through the cabinet and the air duct toward the outlet opening. At that the air duct comprises the means (240) of air bypass, connecting the internal volume of the chamber with an internal volume of the air duct, so that when the air blower is turned off the air moved using the exhaust fan recirculates within the internal volume of the chamber, and when the supply fan is turned on the air is discharged from the chamber through the air outlet opening. |
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Cooling device using internal artificial jets Invention relates to a cooling device that uses artificial jets. The device (1) of the artificial jet cooling for cooling an object (5) comprises a converter (10) adapted so as to produce the waves of speed and a chamber (4) adapted with the ability to receive the waves of speed through the actuated opening (8). The chamber (4) is sufficiently large in order to create at the actuated opening (8) the inner artificial jet inside the chamber (4). In addition, the chamber (4) is made with the ability to contain an object (5), thereby enabling cooling of the object (5) by the inner artificial jet. This arrangement generally allows the multipurpose use of existing chamber comprising the object to be cooled and for its original purpose (e.g. a reflector in a lamp or a LED backlight module) and as a chamber for producing internal artificial jets therefore the cooling device typically requires virtually no extra space and weight and can be provided at low cost. |
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Method of applying carbon/tin mixture on metal or alloy layers Invention relates to a method of applying a coating composition containing carbon in form of carbon nanotubes, graphenes, fullerenes or mixtures thereof and metal particles on a substrate, followed by treatment under pressure and heat treatment of the coating after application on the substrate. The invention also relates to a substrate obtained using the disclosed method and use thereof as an electrochemical structural element. |
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Refrigerating unit built into rack IT-service rack includes a refrigerating unit that comprises at least one refrigerating battery, at least one fan for air circulation through at least one refrigerating battery, a casing in the form of a rectangular prism, which includes at least one refrigerating battery and a fan that is arranged in the casing front zone, and the battery is arranged in the casing rear zone. The casing has dimensions allowing to build an IT-service rack into it and has the possibility of being attached to the rack. The refrigerating unit has the possibility of being installed as per a semi-recessed pattern, in which the fan projects beyond the rack boundaries. Both vertical side pieces of the refrigerating unit are equipped with grids in the casing front zone, in which the fan is located. The side pieces in the casing rear part are covered and include the refrigerating unit between each other. A data processing centre includes a row of posts, each of which includes one or more refrigerating units that are installed as per the semi-recessed pattern, with fans that project beyond the rack boundaries to provide local cooling. |
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Device for cooling of power electronic modules Device includes hollow case out of heat conducting material and consists of two parts, a base with rectangular cavity and a cap. Flat perforated plate dividing the cavity into two chambers is positioned inside the case parallel to the base bottom. Vertical partitions, one between the plate and cap, another between the plate of cavity bottom, are installed along two opposite plate edges not reaching to the case walls. Through holes for cooling agent feed/drain are made at the base bottom, near those two walls. Two other edges of perforated plate, and partition edges adjoin internal surfaces of case walls closely. To prevent plate bending and vibration, distance inserts are positioned at the plate surface at both sides. Perforated plate holes enable stream flow of cooling agent from one chamber to another chamber to the surface to be cooled, which is the base bottom with external side designed for attachment of electronic power modules. Perforated plate with partitions and distance inserts is attached to the cavity bottom by fixation elements. Maintenance cap is connected to the base by fixation elements through sealing pad, or just welded. Efficient cooling is ensured by irrigation of case base bottom with directed cooling agent streams while electronic modules are attached outside. |
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Liquid cooling system for multiprocessor computation complex, package and heat sink module Liquid head sink module comprises top and bottom parts soldered together. Rectangular recesses are cut on the surface of said parts and shaped to pcb electronic components to be fitted therein thereafter. Said module is provided with inner feed and discharge channels. Note here that one end of feed and discharge hoses are rigidly connected by one-piece union with heat sink module. Opposite end of said hoses are connected to inlet and outlet unions of pipelines to feed and discharge heat carrier via fast-release connector. Note also that said package comprises pcb of electronic components mounted on both sides of said heat sink to ensure optimum interface and thermal interface material arranged between heat sink and pcb electronic components. |
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Polymer composition for led cooling radiators and method of its obtainment Composition includes a polypropylene polymer matrix and mix of carbon fibre and carbon nanotubes with dispersion under 100 nm and 9:1 weight ratio of carbon fibre and carbon nanotubes in the mix. To obtain polymer composition, polypropylene polymer matrix solution in organic solvent is mixed with the mix of carbon fibre and carbon nanotubes in ultrasonic cavitation processing mode. Afterwards, obtained sol is precipitated in ice acetone with further flushing and drying. |
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Invention is related to electric engineering, in particular to cooling facilities used for power modules of electronic equipment. A plate of a heat-conductive material is used as a case of a liquid cooler, and both large sides of this plate are intended for fixation of electronic power modules or other heat-producing equipment. In one lateral edge of the plate there are drilled channels in the form of long closed holes for circulation of a cooling agent, and these holes are sealed by plugs. Channels for the cooling agent feed and discharge are made at adjacent faces by drilling of long closed holes, which cross the holes with plugs. At all faces the holes are made in the same plane. Turbulence promoters in the form of spirals made of a flat band may be installed in the channels with plugs. Ends of the turbulence promoters in the areas of holes for feed and discharge of the cooling agent may be shaped as a straight section in order to decrease hydraulic resistance in these areas. |
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Stencil comprises a layer of crystallised water-soluble polymer composition from 0.02 to 0.3 mm thick which is applied onto at least one surface of backing up metal foil. Average size of the crystal grain of the water-soluble polymer composition amounts to 5-70 mcm, and standard grain size deviation does not exceed 25 mcm. Surface roughness Sm in the point of drill bit tip entering the water-soluble polymer composition layer amounts to maximum 8 mcm. The layer is formed by applying of hot melt of the water-soluble polymer composition directly onto the backing up metal foil or by applying of solution containing the water-soluble polymer composition with the following drying and further cooling under the temperature reducing from (120-160)°C to (25-40)°C during 60 sec at cooling rate of at least 1.5°C/sec. |
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Ribbed integrated substrate and method of its fabrication Invention relates to power electronics. In compliance with this process, metallic chassis is connected with ceramic substrate by liquid metal. Multiple heat-emitting rubs is formed at part for cutting that makes a part of chassis by fixation by retainer intended for expansion load to said part for cutting whereat heat-emitting ribs should be made. Besides, it is performed by cutting the grooves at displacement of multiblade cutter. Said cutter consists of multiple disc blades. Cutting is executed over the surface whereto expansion load is applied at rotation of said cutter. This invention covers also the ribbed substrate design. |
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Method of manufacturing flexible microprinted board In this method of manufacturing flexible microprinted board the wafer of single-crystal silicon with the thickness of 20-100 mcm, diameter of 200-300 mm, <100> orientation, is preliminary oxidised, which was preliminary oxidised to the thickness of 1-2 mcm, with subsequent removal of the oxide from one side, and after application of coatings and photolithography the etching of the silicon wafer is carried out with silicon dioxide and the subsequent separation of the polymer film with the electroconductive circuit and the metal-resistive coating. |
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Invention relates to a composite film for absorbing electromagnetic waves and an apparatus for making such a film. The composite film has a plastic film and a single- or multilayer metal film which is formed on at least one surface of said plastic film. The metal film has thickness of 0.01-10 mcm, and is coated with a plurality of substantially parallel, periodic, linear scratches made in at least two different directions. Said scratches in each direction differ on width and space in between them. |
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Apparatus for removing heat from heat-dissipating radio components Invention relates to electronic engineering and is intended to facilitate heat removal from heat-dissipating radio components and can be used in designing converters, high-power amplifiers, rectifiers and multipliers. Between a ceramic electric insulator, on one side of which radio components are soldered, and a heatsink situated on the other side of the electric insulator, a plate made of a copper-molybdenum composite pseudoalloy is placed, said plate being mounted on the heatsink by one screw. Temperature coefficients of linear expansion of the electric insulator and the copper-molybdenum composite pseudoalloy (MD) are identical. The plate made of MD alloy and the heatsink are connected by a screw at one point. As temperature changes, surfaces thereof, which are separated by a heat-conducting lubricant, slide on each other. Filling part of the apparatus, besides the heatsink, with an electroconductive compound ensures high-potential insulation. To increase the distance between current-conducting parts of the device which are at different potentials, the ceramic electric insulator is made such that its periphery protrudes relative to the edge of the plate made of MD alloy by a few millimetres, and the layout of the metal coating on two sides is situated at the same distance from the edge of the ceramic electric insulator. |
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Production of printed boards from foil dielectrics Invention relates to production of printed circuit boards from foil dielectrics by dimensional electrochemical treatment. Printed board conducting patter in negative picture is made at the surface of flat electrode tool. Prior to processing, said electrode tool is set parallel with foil dielectric surface, current being fed to foil dielectric from the side of electrolyte exit from spark gap. To rule out current isolated unprocessed islands, such electrolyte is used which features specific conductance decreasing at its motion through said spark gap owing to its heating and gas-filling. |
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Jumpers manufacturing method fit for serial production as per roll-type production Method suggested in the invention can be applied, in particular, for manufacturing of printed circuit boards containing antennas for radio frequency identification (RFID). In jumpers manufacturing method as per roll-type production on a substrate (1) of electric insulating material a conductive pattern (2) is applied of electroconductive material, for example, of metal foil, at that at least one strip lug (3) is made of the above electroconductive material, not fixed at the substrate and coupled to the conductive pattern (2) by its one end, this lug is bended onto a section of the conductive pattern (2) which is subject to electric insulation from the above strip lug (3) and the above strip lug (3) is connected electrically to another target section (5) of the conductive pattern (2). |
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Apparatus for soldering or unsoldering microcircuits on printed-circuit board Invention can be used in soldering and repair centres or infrared soldering stations for soldering microcircuits in a BGA housing and other surface mounted microcircuits. A housing having an infrared heater mounted inside is mounted such that it can be positioned over a work bench with a printed-circuit board at a controlled distance. The lower part of the housing is fitted with a diaphragm with an opening which bounds the heating area of the soldered microcircuit. The diaphragm has an infrared radiation concentrator situated on the periphery of the opening of the diaphragm and is in form of a reflecting element, placed vertically and/or inclined in the direction from the infrared heater. The ratio of the dimensions of the opening of the diaphragm, height and/or angle of inclination of the reflecting element is selected based on a condition for obtaining given dimensions of the heating area and specific power of infrared radiation in the area of the soldered microcircuit. |
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Heat sink and unit for flat bodies, providing for cooling and assembly Invention relates to power electronics, more specifically, to up-to-date cooling of power electronics. The result is achieved by a heat sink (300), designed for direction cooling of at least one body (20) of an electronic device. The body of the electronic device has an upper contact surface (22) and a lower contact surface (24). The heat sink comprises a cooling element (310), made at least from one heat-conducting material. This cooling element limits inlet headers (12) of coolant and outlet headers (14) of coolant. Inlet and outlet headers are located with alternation. The cooling element additionally limits millichannels (16) made as capable of receiving coolant from inlet headers and supplying coolant to outlet headers. Millichannels, inlet and outlet headers are additionally made with capability of direct cooling of one of contact surfaces of the electronic device body, upper or lower on, due to direct contact with coolant, so that this heat sink is made as a whole. |
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Method of producing electrically conducting surface on polymer roll material Invention relates to sputtering of thin films in vacuum with the help of reeling machine, particularly, to production of RFID-antennas for radio-frequency identification marks. Proposed method comprises the stage of selective surface copper spraying with further copper layer build-up by electrolytic process. Selective spraying of polymer material is conducted in vacuum with preliminary application of mask coat on polymer surface, perfluorine polyether being used as the polymer, and with thermal copper spraying on polymer substrate. |
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Device of conditioning for cooling of air in cabinet for electronic devices Invention relates to a device of conditioning for air cooling in a cabinet for electronic devices. The conditioning device comprises a body with the first side and the second side, opposite to the first side, a device for air supply and a heat exchanger. The device for air supply sucks air at the first side, sends it via the heat exchanger to the second side and releases it in the radial direction at the second side. The heat exchanger is connected with the inner or outer cooling device for supply of cooled cooling medium into the heat exchanger. |
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Thermoelectric cooling device consists of a thermoelectric module 1, two radiators (heat-exchange plates) for the hot 2 and cold 3 sides of the module, a temperature thermostat (not specified) and the following air ducts: an input air duct 4, an air duct for hot air removal 5, an air duct for cooled air removal 6, a sparger aerator 7, a fan 8 and a power supply unit and a body 9 where the above components are mounted. The air cooling system is active, it is low-dependent on the environment, for example, the outside ambient temperature is 36°C and the cold air flow at the system output is 20°C. |
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Current rectifier module with cooled busbar system Invention is related to current rectifier module. The current rectifier module consists of at least two semiconductor power modules (2, 4), connected in thermal-conductive and mechanical way to a liquid heat-removal (6) and conductively connected by a busbar system (8) which has at least two conductor lines isolated from each other to outputs of the current rectifier module. The busbar system (8) is connected to at least one line (24) of coolant supply, at that the busbar system (8) and the line (24) of coolant supply form the united structural assembly. According to the invention by this line (24) of coolant supply additional loss power in the laminated busbar system (8) is extracted. |
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Invention relates to packaged-type radioelectronic units in which metal frames of electronic modules are part of the housing of the radioelectronic unit, and can be used in manufacturing radioelectronic equipment based on same-type electronic modules, e.g. on-board devices and systems operating in conditions of exposure to intense mechanical loads and confined space. In the radioelectronic unit, having a housing consisting of metal frames, a cover and a base connected into a package by screws, printed circuit assemblies and detachable connectors are mounted on the metal frames. A power supply unit is placed at the base. An additional detachable connector is placed on the cover for direct connection of radioelectronic units to each other and forming radioelectronic systems. A radioelectronic cell, which is a standard element of the design of the disclosed radioelectronic unit, comprises a metal frame with male and female stepped protrusions on which a printed circuit assembly is mounted using bushings. The female protrusion is shorter than the male protrusion. The detachable connector is directly mounted on the frame using bars and screws. The detachable connector consists of a plug and a socket mounted on opposite sides of the printed circuit assembly in different directions: plug down - socket up, and vice-versa. |
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System of heat control for electronic display Invention relates to cooling systems, and, in particular, to cooling systems for electronic displays. In a cooling unit for an electronic image unit and a display unit that comprises it, in some versions of realisation they use ambient gas for cooling of power supply modules and/or the image unit (sometimes back lighting). In other versions they use a closed circuit of circulating gas, which passes along the front surface of the image unit and via a heat exchanger. The open circuit passes via the heat exchanger and extracts heat from the circulating gas. Atmospheric air may be used as ambient gas. For cooling of the rear section of the image unit or back lighting with the help of ambient gas they may use a non-obligatory additional channel. In some versions of realisation they also use heat-conducting plates and ribs to distribute heat and to exclude hot points in the display. |
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Invention relates to radioelectronics and can be used to solve problems of removing heat from heat-loaded radioelectronic components on printed-circuit boards. In the disclosed radioelectronic unit, a heat-loaded radioelectronic component 3 is mounted on the outermost printed-circuit board 2, where said component is fitted with a heat-conducting plate 4 with fins 5 and grooves 6 in which fins 7 and grooves 8 of a heat-conducting cover 1 are inserted, respectively, when assembling the radioelectronic unit, and gaps between the fins 5 and 7 are filled with heat-conducting material 9. |
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Composite for electromagnetic shielding Invention relates to composite for electromagnetic shielding, which contains copper foil and resin film laminated on it. Composite for electromagnetic shielding, containing copper foil, which has thickness 5-15 mcm, Ni coating on one surface of copper foil with amount of coating 90-5000 mcg/dm2, layer of Cr oxide, formed on the surface of Ni coating at 5-100 mcg/ dm2, basing on Cr weight, and layer of resin, laminated on opposite surface of copper foil. |
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Group of inventions relates to heat exchange and can be used for cooling of air or equipment, as well as for waste heat utilisation. As per one of the versions, a heat-to-cold conversion device includes the first heat exchanger 2, steam generator 3, liquid heat carrier (cooling agent) 4, a thin plate with hole 5, condenser 6, grid 7, the second heat exchanger 8, overflow valve 9, vertical pipeline 10, counter pressure valve 11, dosing mechanism 12, turbine with magnetic coupling 13, fan 14, the second thin plate with hole 15, and solar collector 16. |
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Light-emitting diode module cooling system Invention relates to radio electronics and can be used in designing efficient cooling systems of powerful LED modules. The LED module cooling system consists of a heat-removing base merged with a heatsink made of microporous material with microchannels and filled with a liquid coolant and LEDs mounted thereon. The microchannels are located in the heat-removing base under the LEDs perpendicular to the mounting plane of the LEDs, wherein their ends adjoining the LEDs form, in maximum proximity to the p-n junctions of the LEDs, a surface which intensifies boiling and evaporation due to a layer of microporous material deposited between each LED and the end of the adjoining microchannel, wherein the size of the pores of the microporous material is considerably smaller than that of pores of the material filling the heat-removing base of the LED module, wherein the size of the pores of the microporous material decreases towards the LED. The system requires one-time filling with liquid and is less sensitive to variations of the initial volume of the liquid. |
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Circuit board, manufacturing method of card, display panel and display device Invention is referred to circuit board with enhanced corrosion resistance, manufacturing method of the card, display panel and display device. Active matrix underlay (20) contains glass substrate (21); metal conductor (22) made at glass substrate (21); insulating film (24) of the gate covering metal conductor (22); interlayer insulating film (29) covering (24) insulating film (24) of the gate; and transparent electrode (33) shaped at interlayer insulating film (29). Conductor (22) contains contact area (55) where transparent electrode (33) is applied directly to conductor (22). Transparent electrode (33) passes over the contact area (55) so that it covers end surface (29a) of interlayer insulating film (29) faced to contact area (55) and end surface (24a) of insulating film (24) of the gate faced to contact area (55). |
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Power converter module with cooled busbar arrangement Invention relates to a power converter module with a at least one thermally active power semiconductor module (2, 4), mechanically connected to a liquid-cooled heat sink (6) and are electrically actively connected to leads of the power converter module by a busbar arrangement (8), having at least two power buses insulated from each other. The busbar arrangement (8) is connected via power and/or geometric closing with a second liquid-cooled heat sink (10). Between the top power bus of the busbar arrangement (8) and the second liquid-cooled heat sink there is a thermally active and electrically insulating layer (36). Additional power loss arising in the busbar arrangement (8) is removed through said second liquid-cooled heat sink (10), which is clamped to the surface of the busbar arrangement (8) of the power converter module using clamping elements. |
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Radiator includes a wall and heat exchange elements forming external and internal finning. External finning consists of straight projections alternating with passes the cross sectional area of which in upper part of the wall is smaller than in its middle part, and internal finning consists of alternating passes separated with fins and having the cross sectional area of a constant value and passes with cross sectional area of a variable value, which are made as close as possible to outside surface of the straight projection. Straight projections are located opposite passes with cross sectional area of the variable value of the internal finning. In order to mix air and increase the area of the radiator heat-removing surface, there is at least one through hole in the projections. |
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Device for photoresist coating by centrifuging Photoresist coating device has a protective housing with a cover, a substrate holder, nuts and a centrifuge shaft. The protective housing is mounted on the centrifuge shaft. The substrate holder is mounted on the centrifuge shaft and is fastened by nuts. The substrate holder has a base, a cover, stop pins and filling holes. On the inner surfaces of the base and the cover of the holder there are through grooves with a stepped side surface for fitting substrates. Stop pins are placed on the peripheral parts of the substrate holder. The cover of the holder has feed holes. |
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Automotive safety means control unit and method of its assembly Invention relates to automotive industry. Proposed control unit gas one p.c.b. to accommodate electronic components, plastic cover and plastic bottom, said p.c.b. being arranged there between. Said bottom and cover make the control unit case. Method of assembly consists in fitting said p.c.b. between said plastic cover and plastic bottom. Said case is locked by one joint with forced and/or geometrical closure. |
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Composite capacity and its application Each of capacitor units contains many base capacitors installed on special module printed-circuit board (PCB). All the base capacitors of capacitor units are identical, thus simplifying both manufacturing and maintenance of capacity component. Formation of composite capacity on base capacitors of the same type simplifies significantly their manufacturing and maintenance. Space flexibility achieved due to application of lots of electrically interconnected capacitor units is preferable in such power devices where capacity available to capacity component inside the device may be limited in at least one direction. Geometrically flexible arrangement provided by separate capacitor units allows their arrangement at random angle to each other thus occupying available space in power devices increasing their composite capacity. |
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Invention relates to a body (1) for a connection block, in particular, an electronic block, at least with one first pin slot (2a) and one first pin axis (4a) of the first pin slot (2a). The body (1) comprises the first strip (6a), besides, the first longitudinal axis (8a) of the first strip (6a) is arranged in one first spatial plane (10a) with the first pin axis (4a) of the first pin slot (2a). |
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Lining cover plate of electric device Invention relates to a lining cover plate (2) of an electric device (1), comprising at least one opening (22, 32) for access to at least one functional part (5) of the electric device and formed by means of imposing of a rear assembly plate (20, 30) including at the back the facilities for installation on a bracket (4) of the device and a front finishing plate (10) onto each other, which gives attractive appearance to the specified lining cover plate. According to the invention the rear assembly plate comprises on its front side a seat (24), where the specified front plate fully enters so that the front side (11) of this finishing front plate is arranged aflush or is slightly away from the front side (21) of the specified assembly rear plate. |
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Heat removal device consists of a housing with a heat sink, elastic elements, which are arranged in it and installed between the heat sink and a heat-stressed electronic module, a heat-conducting structure located between the heat sink and the heat-stressed electronic module; the heat sink has finning and inclined surfaces and is installed by means of fastening assemblies in the housing wall; on outer and inner surfaces of the heat sink there are heat-conducting gaskets, and elastic elements are located between the heat sink and the housing. |
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Cascade light-emitting thermoelectric unit Light-emitting thermomodules are used. A light-emitting thermomodule allows reducing parasite conductive transfer from the hot junction side, which is heated not as mush as that due to the fact that some part of energy is taken away in the form of an emission, and it is not converted to heat on the hot junction. Reduction of heat transfer by conduction between hot and cold junctions allows performing p-n-junctions and the junctions themselves in the form of thin films. Structure of the thermoelectric device represents a cascade (multilayer) thermomodule consisting of thermomodules, in which such materials of semiconductor branches of p-type 4 and n-type 5 are chosen that the flowing current on one of the junctions 2 will form emission, and not heating as in a common thermomodule; with that, in other junction 3 there will be absorption of heat energy in compliance with Peltier effect. Cascades are separated with electrically-insulating layers 1 with high transparency and heat conductivity. Direct current is fed from source 6. |
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Condensation thermoelectric cabinet In a device consisting of a tightly packed sealed housing, two and more injectors serving for injection of a mixture to an internal cavity of the cabinet; a highly heat-conducting plate with an installed heat-emitting equipment; a thermoelectric unit; a pin fin heat sink; a fan unit; a control unit (CU); a condensate flowdown chute; a pump serving for supply of condensate to injectors; a temperature sensor; a protective casing, it is proposed to use an evaporation and condensation cooling principle. The temperature sensor supplies a signal to CU that includes a pump for liquid supply to injectors located on the cabinet ceiling. The mixture is injected to the internal cavity of the cabinet and deposited on heat-emitting elements; its evaporation process takes place, therefore, cooling of heat-emitting elements is achieved. When vapours of the mixture go upwards, they are condensed on the ceiling (upper part of the cabinet) that is technically inclined to the rear part of the cabinet for directed condensate flowdown onto a special chute located throughout the length of the rear wall. Then it enters CU, in which the pump is installed. The mixture is supplied again to the injections through liquid channels under action of the pump. In order to amplify condensation properties of the evaporated liquid, the thermoelectric units are used, the cold junctions of which are in close contact with the upper cover of the cabinet, and the installed pin fin heat sink that is in the same close contact with the junctions of the thermoelectric units, but is on the hot side, performs heat removal. The fan unit consisting of four fans is controlled by the control unit (CU) that provides the possibility of their paired actuation for the purpose of electric energy saving. |
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Building for computer centre equipped with efficient cooling devices Computer centre intended for accommodating multiple communication racks (202), each of which provides storage space for computer hardware (101), a first cooling circuit (205) designed to supply at least some of the racks (202) with a coolant and the first cooling circuit (205) is also designed to remove the heated coolant from at least some of the racks (202), wherein said racks (202) have heat exchanger units (206, 207) designed transferring the generated heat to the coolant, and the dimensions of the heat exchanger units (206, 207) are selected such that it is possible to remove the amount of heat generated by computer hardware (101) through said units, such that during operation, hot air is not transferred from the multiple racks (202) in the building of the computer centre. |
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Invention relates to drilling mask for frilling in copper-clad laminar material or in sandwich board. Said mask is made of metal foil one side of which is coated with water soluble polymer composition B containing 80 to 98 wt % of polyethylene [polyoxyethylene] glycol with mean molecular weight making 15000 to 35000, 2 to 20 wt % of polyethylene oxide with mean molecular weight making 50000 to 200000, and 0.1 to 5 wt % of at least one water soluble substance selected from the group of polyatomic spirits, amino acid derivatives of spirits, organic acids and organic acid salts. |
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Sealing, system containing sealing and method of sealing fabrication Sealing designed mostly to reduce interference from electronic noise and radio frequency interference (EMI/RFI) consists of seal housing that has circular cavity and ring spring inside circular cavity. Seal housing includes composite material that contains thermoplastic material and filler. Composite material can have Young's elastic modulus at least approximately equal to 0.5 GPa, bulk resistivity less than approximately 200 Ohm·cm, modulus of elongation at least approximately equal to 20%, surface resistivity less than approximately 104 Ohm/square or their any combination. |
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Semiconductor electric energy converter module Semiconductor electric energy converter module contains power semiconductor modules (2, 4) which are connected mechanically to liquid heat sink (6) and by means of busbars (8) having busducts (26, 28; 28, 30) isolated from each other by insulating layer (32) are connected electrically to contacts (10, 12, 14) of semiconductor electric energy converter - insulating layer (32) has two isolating layers (36, 38), which are interconnected by material so that between these two isolating layers (36, 38) there is hollow space (40) of set shape which ends at input and output side at least at one lateral surface (48, 50) of this insulating layer (32); this hollow space (40) at input and output side is equipped with respective branch tubes (42), which are connected so that liquid can pass through liquid heat sink (6). |
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Equipment mounting frame comprises two side support structures of a selected height, wherein each side support structure (a) comprises one or more upright working members defining the width of that side support structure and (b) comprises a foot structure extending from at least one end of the upright working member(s). The foot structure defines the depth of that side support structure and extends across at least one quarter, preferably at least half, more preferably at least three quarters, especially preferably substantially all of the said width, and (c) carries an upright group or row of fixing members, wherein the two side support structures are connectable together at a distance from each other to enable equipment trays or blocks to be mounted in assembled array between the side structures through said fixing members. Each of said side support structures each with the said foot structure(s) extending therefrom is formed to be nested together when disconnected from each other for shipment or storage within a volume less than twice the volume defined by said width, depth and height. |
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Cockpit glazing with electromagnetic shield and aircraft Invention relates to aircraft cockpit glazing, particularly, to protection against electromagnetic interferences. Aircraft cockpit glazing comprises multiple translucent stacked panels, inner and outer holders, sealing, film electromagnetic shield and connection film. Holders are made of current conducting material for stacked panels to be fitted there between. Sealing is fitted between double glass outer holder and glazing panels. Electromagnetic shield is arranged between two adjacent glazing panels and made of electrically conducting material. Connection film is made of current conducting material to connect electromagnetic film outer edges with double glass outer holder. |
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Cooling device with low noise level Cooling device 1, using a pulsating fluid medium for object cooling, comprising the following: a converter 2, having a membrane made as capable of generation of pressure waves with working frequency fw; and a cavity 4, which holds the first side of the membrane. The cavity 4 has at least one hole 5, which is made as capable of emission of a pulsating flow of the fluid medium minus the losses to the specified object, at the same time the opening 5 communicates with the second side of the membrane. The cavity 4 is quite small to prevent action of the fluid medium in the specified cavity 4 as a spring in the resonating mass-spring system in the operating range. This is an advantage, since the volume speed u1 around the hole is substantially equal to the volume speed u1 near the second side of the membrane, excluding the minus sign. Thus, at the working frequency the pulsating fluid medium minus the losses may be to a considerable extent suppressed due to the antiphase of pressure waves at the second side of the membrane, causing as a result the volume speed close to zero in the remote area. |
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Printed circuit board comprises a dielectric base (1) with contact sites (3) on the first side, connected by through metallised transition holes (5) with metallised sections (4) on the second side. At the same time each contact site (3) is connected with the specified transition holes (5) not more than with one metallised section, at the same time areas of the metallised sections (4) are in direct proportion to quantity of contact sites (3), with which they are accordingly connected electrically. |
Another patent 2513127.