Apparatus for soldering or unsoldering microcircuits on printed-circuit board. RU patent 2516365.
 Electronic board with built-in heating resistance / 2484607Subject of the present invention is an electronic board (1), having a zone (20) which forms a BGA type electronic component (10) substrate, an electrical heating resistance (25A) opposite said zone, wherein the heating resistance is capable of supplying an amount of heat to solder the component on the board. The board according to the invention has multiple electroconductive layers (21, 23, 25, …), which alternate with electrically-insulating layers (22, 24, 26), wherein said resistance (25A) forms one of the electroconductive layers lying immediately under the surface layer (21). If needed, the board has a heat sink. The subject of the present invention is also an apparatus for applying the method, which enables to repair an electronic board by replacing faulty components without the danger of unsoldering or damaging neighbouring components. |
 Soldered joint of printed circuit boards / 2435338In a soldered joint of a flexible printed circuit board with a stiff printed circuit board in the form of a contact unit, comprising at least two metallised contacts joined with current-conducting paths, arranged on surfaces of switching layers, made on the basis of the dielectric material matched with each other and joined with each other by electrically and mechanically electroconductive binding material, metallised contacts of the flexible printed circuit board are made with at least one bend, the flat surface and the bend form an electric contact with the stiff printed circuit board to form a hollow chamfer from electroconductive binding material at the side of the bend. |
 Method of vacuum soldering of electronic hardware power modules and device to this end / 2412790Invention may be used in producing electronic hardware power modules. Conduction heating of heater marmite is performed to create liquid phase of solder between heat-sink base and microstrip p.c.b. Both are pressed together smoothly to increase pressure area from center to edges under atmospheric pressure and with smooth adjustment of vacuum in working zone. Solder crystallisation temperature reached, vacuum level in working chamber is decreased smoothly to atmospheric pressure. Device vacuum chamber is formed by detachable cover consisting of the frame tightly closed by elastic film and trough provided with vacuum suction channels. Detachable cover is jointed to trough by sealer and back-folding appliances of the frame clamping. |
 Method of convection soldering of sm components and device to this end / 2389163Invention can be used for assembly/disassembly of SM components on one-side, double-side and multi-layer PCBs of radio electronic modules with the help of convective heating. Proposed method exploits air flow effects on component terminals in the following soldering conditions, i.e. temperature saturation, melting and cooling at different air temperature and airflow action duration. Note that melting conditions is realised by reducing and locking the distance between SM component and solder iron by hot air with the help of spring-loaded lever. Note also that required distance is set with the help of limiter with locking screw, bracket lever travel fine adjustment screw and measuring plate. |
 Method of resistance soldering of electrical contacts with holders / 2379165Surfaces of parts to be soldered together are preliminary wetted with saturated water solution of soldering flux. Mix of phosphorus-containing copper-based solder with powder of said flux is arranged between the parts, said mix representing a minced chips with particle size of 0.5 to 1 mm. Flux amount in said max makes 3 to 8 wt %. Electrodes press the parts together to heat them to soldering temperature by passing electric current through electrodes, parts and solder. Temperature of 800 to 820°C reached, aforesaid solder representing a wire element is introduced in joint along contact outline till the end of soldering. |
 Method for installation of various types of surface-mounted components onto circuit board with help of vacuum pincers / 2374794Invention may be used in technological process of manual installation of surface-mounted components (SMC) onto circuit boards under conditions of experimental, pilot and small-scale multiproduct production. SMC 8 are installed onto circuit boards 2, surfaces of which in zones of soldering are previously coated with layer 13 of flux or soldering paste. On suction head 9 of vacuum pincers 6 vacuum is pulled, which provides for suction force F1, sufficient for reliable gripping and retention of SMC 8, but less than total force of adhesion engagement F2 of the latter to layer 13 of flux or solder paste. Separate SMC 8 gripped with the help of vacuum pincers 6 are transferred to circuit board 2 in area of their installation, afterwards they are separated from vacuum pincers without disconnection from vacuum. Separation of each SMC 8 from vacuum pincers 6 at the place of their installation is done by force F3, equal to difference between force of adhesive engagement F2 and suction force F1. Installation of components of various type is carried out serially. Each time prior to installation of SMC of another type, according value of vacuum is established on pincers. |
 Method of soldering with soft solder / 2372175Proposed method can be used in wave or fountain soldering, or cascade soldering, or dip soldering or soldering with solder leveling by hot air knife, primarily, in producing p.c.b. Active additive liquid layer is kept up on molten solder surface, aforesaid layer containing dimmer acid to remove metal oxide from solder and absorb it. Said active additive represents organic liquid with nucleophilic and/or electrophilic groups. Molten solder is purified in situ to make soldering more efficient, particularly in using leadless solder. Removal of metal oxide cleans the bath and reduces solder viscosity to up reliability of soldered connections. |
 Method and device for soldering by reflowed solder with control of volume flow / 2329624In compliance with one aspect of the given invention, the problem of fast heating of an object being soldered is solved by reducing an initially large volume flow at constant or increasing temperature, thus preventing an overheat of minor components. Application of a volume flow of convective heater to control actual supply of heat onto the object to be soldered makes it possible to flexibly adjust the soldering process to specific requirements. |
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Precision flexible loop and method for high density assembly of electronic device using such loops / 2312474 In accordance to the invention, as substrate material, polyimide, polyether and fluoroplastic films are used. Polyimide film substrates make it possible to achieve high thermal stability of loops and allow usage of different methods of assembly, including welding and soldering, and fluoroplastic films are most usable for making loops based on them for assembly of UHF circuits, due to low losses in UHF frequency range and possible constant wave resistance of loops which connect UHF modules and devices. Structure and placement of contact areas, meant for assembly of electronic components or connection of loop to other devices or electronic boards, and also materials and covers, used for forming aforementioned contact areas, must also provide for high density inter-cell connection in electronic equipment. To that end, contact areas are positioned on the other side of flexible substrate and connected to working conductors via through metallized apertures in the substrate. External sides of contact areas are tin-plated, for example, covered in layer of tin-bismuth alloy, onto the surface of contact areas which is adjacent to substrate, a layer of material is applied to prevent spreading of soldering alloy, chromium for example, and connection of contact areas of loop to contacts of electronic devices is realized by welding-soldering using double electrode tool for micro-mounting, brought to contact with the other surface of contact area via through aperture in the film positioned above the contact area. |
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Soldering method of lead-free electric radio components to printed circuit board / 2311272 Method comprises steps of preliminarily drying electric radio components; applying flux onto places for mounting components in printed circuit board and drying it in air for 10 - 15 min; simultaneously heating for 20 -25 min electric radio components and printed circuit board till temperature that differs from melting temperature of solder by 100 -150°C; then placing components onto respective sites on printed circuit board and soldering them for 2 - 3 s. |
 Device for soldering cutting element to holder / 2471596Invention may be used for production of cutting tools, for example drill nits, cutters, mills, etc, to be attached to holders by soldering. Top and bottom brackets are arranged on post top and bottom ends. Opposite ends of said brackets accommodate two beds to support cutting and holders. Top bracket can turn in plane crossing the holder and cutting tool and is mounted on aforesaid post to bring holder in contact with cutting tool on soldering zone and withdraw it therefrom. Aforesaid bed located at bottom bracket is made from unwettable material not interacting with soldering material. Induction heater creates heating zone at contact between holder body and cutting tool. |
 Gun and electrode element for electric arc soldering of rail connector tips / 2450898Set of invention may be used for soldering tips of rail electrical connections to rail surface. Gun body incorporates electromagnetic device including core made up of two cylinders and housing spring performing several functions. It presses electrode element against surface of soldering. It doubles as electromagnet winding to push core and to conduct operating current. Ring arranged on core face surface delays core breakaway to facilitate cooling of fused solder, hence, to prevent its spitting from soldering zone in motion of electrode element. Closure of two contacts and feed of operating current occur solely with pressed electrode element, contracted spring and certain retraction of central core with lock sleeve. In soldering, switch-on button is retained in ON position. Optimum gap in soldering is maintained by displacing tapered cylinder-holder and observing visually indicator out stroke from body hole. |
 Method of soldering rail bond tips to rail by electric arc and device to this end / 2449867Set of invention may be used for soldering tips of rail electrical connections to rail surface. Juvenile surfaces are formed at rail-to-connector joint some 5 min prior to soldering. Soldering is performed for 1.0-2.0 s by electric current pulses with constant relative duration and pulse period of (30-70)×10-6 s at current density of 6-8 A/mm2. Continuity of arc burning in period pause is ensured by power accumulated by throttle by operating current pulse rise-up portion. Some 10-2 s before soldering cycle termination, current magnitude is smoothly reduced to zero by reducing pulse relative duration. Soldering device comprises storage battery, electronic unit and control unit. Soldering gun is connected to negative polarity power connector and comprises means of retention of electrode with solid solder and its displacement by electric magnet. |
 Method and device for thermal treatment of parts in making joint between solder and solder substrate / 2420376Invention may be used for thermal treatment of workpiece 19 or parts to produced soldered joint between solder and, at least, one part that makes a solder substrate. Heating and cooling of part 19 is performed in two sections (13, 14) of process chamber (12) incorporated in device (10) that may be separated by condensation device (15). The latter is cooled, at least, in position of availability for use. Prior to heating part (19) and for separation of chamber sections (13, 14), condensation device (15) made up of protective screen is changed from aforesaid position into position of bulkhead separating aforesaid chamber sections. In heating part (19), vacuum is produced in chamber heating section (13) and protective gas is fed into cooling section (14) and/or heating section (13). Volatile evaporations generated in treatment get settled on condensation device which prevents their condensation in the chamber cooling section. |
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Method of vacuum soldering of electronic hardware power modules and device to this end / 2412790 Invention may be used in producing electronic hardware power modules. Conduction heating of heater marmite is performed to create liquid phase of solder between heat-sink base and microstrip p.c.b. Both are pressed together smoothly to increase pressure area from center to edges under atmospheric pressure and with smooth adjustment of vacuum in working zone. Solder crystallisation temperature reached, vacuum level in working chamber is decreased smoothly to atmospheric pressure. Device vacuum chamber is formed by detachable cover consisting of the frame tightly closed by elastic film and trough provided with vacuum suction channels. Detachable cover is jointed to trough by sealer and back-folding appliances of the frame clamping. |
 Device for pressure tight soldering vacuumised flat panels of solar collectors / 2410213Device facilitates pressure tight soldering metal coating (5) along perimetre of transparent wall (4) with metal frame (3) along perimetre of bearing structure (2) of solar collector. Soft metal strip or band (6), particularly, lead and/or copper, is designed for pressure tight sealing an interval between transparent wall (4) and metal frame (3) and for soldering with metal frame (3) and metal coating (5) along perimetre of transparent wall (4). The device consists of heating facility (24) for heating part of transparent wall (4), having section of metal coating (5) along its perimetre, and part of bearing structure (2) containing section of metal frame (3) along perimetre and of connecting strip or band (6). Holding down device (25) ensures mechanical contact of melt solder of the connecting band with metal frame (3) and metal coating (5) while solder solidifies. The said devices are preferably made in form of the frame. |
 Method and device for manufacture of honeycomb element / 2357840Method and device may be used in manufacture of metal honeycomb elements used for neutralisation of spent gases produced during operation of automobile and other internal combustion engine. Components of honeycomb element prior to soldering is equipped with adhesive, which is applied in the form of drops precisely onto specified separate sections. Mentioned sections are located together with extremes of profile structure, at that adhesive is not applied on the surface of extreme itself. It is most preferable to apply adhesive by methods of jet printing, bubble-jet printing, drop-jet printing. |
 Method of brazing heat exchanger with scanning electron beam and device to this end / 2355526Present invention relates to brazing laminated-finned and pipe-shaped heat exchangers in a vacuum and can be used in aircraft engine-building and other fields of engineering. In the method of brazing a heat exchanger with a scanning electron beam, the brazed objects are put into a vacuum, heated, held and then cooled. The degree of irregularity of heating is determined and temperature equalisation is then done on the brazed surface until attaining a given brazing temperature by varying the brazing parametres. The device for implementing the method has a vacuum chamber with an illuminator, an electron beam gun with a two-dimensional beam deflection system and power supply unit, and a sweep generator of the electron beam, connected to the two-dimensional beam deflection system of the beam gun. A control unit is connected to the power supply of the electron beam gun and the sweep generator of the electron beam. The device also has a thermal radiation detector and an information computer system, connected to the thermal radiation detector and made with provision for displaying the temperature field of the brazed surface of the object. |
 Repair-soldering head and methods realised by means of this head / 2340431Invention may be used for replacement of printed circuit boards components, in particular, for components soldering or unsoldering, for removal of residual solder, for servicing of installation place. Repair-soldering head has receiving element for component subject to soldering or unsoldering with supply channel for heat-transmitting medium and return channel for its discharge. Mentioned channels may be formed with internal tube and external tube that surrounds it. As heat-transmitting medium, for instance, liquid solder may be used, which is sent through supply pipeline to component of the circuit and flows back again through return channels. Component removal is done by means of vacuum connection, which provides suction of component to receiving element. |
 Device for internal butt welding of multi-layer structures of panel type / 2340430Upper and lower support disks of device sealing system are located in mirror-like manner in relation to each other with the possibility of soldered structure ends sealing and are connected to each other by means of tie rods. One of two transfer rods of sealing system lever mechanism is installed with support on the upper disk, and the other one - on tie rod end. In transfer rods yoke is installed, which is equipped with micrometric adjusting screw. Every support disk is arranged with annular groove for communication of internal cavity of soldered structure with environment and vacuumizing system. Vacuumising system contains container with alkali connected to internal cavity of soldered structure and valve of carbonic acid gas supply into mentioned cavity. |
 Method for making tubular joint of alumina ceramics and metal / 2515722Invention can be used in making metal ceramic joints by soldering, for example, of ceramic and titanium tubes. Assembly of ceramic and titanium parts with an aluminium solder alloy placed in between is prepared. The area of the ceramics and titanium joint is heated at continuous rotation of the assembly by a focused electron beam in a vacuum chamber under the pressure of 5-15 Pa until the solder alloy melts. After holding in such a state for 1-2 minutes the electron source is switched off and the assembly is taken out of the vacuum chamber after being cooled. |
FIELD: physics.
SUBSTANCE: invention can be used in soldering and repair centres or infrared soldering stations for soldering microcircuits in a BGA housing and other surface mounted microcircuits. A housing having an infrared heater mounted inside is mounted such that it can be positioned over a work bench with a printed-circuit board at a controlled distance. The lower part of the housing is fitted with a diaphragm with an opening which bounds the heating area of the soldered microcircuit. The diaphragm has an infrared radiation concentrator situated on the periphery of the opening of the diaphragm and is in form of a reflecting element, placed vertically and/or inclined in the direction from the infrared heater. The ratio of the dimensions of the opening of the diaphragm, height and/or angle of inclination of the reflecting element is selected based on a condition for obtaining given dimensions of the heating area and specific power of infrared radiation in the area of the soldered microcircuit.
EFFECT: high uniformity and specific power of the temperature field generated by infrared rays on the surface of the board and microcircuit owing to reflection of the infrared rays.
7 cl, 5 dwg
The invention relates to soldering equipment, and can be used in soldering and repair centers or infrared soldering stations, in particular, for soldering chip BGA and other electronic components.
Known devices for soldering or tap chips infrared rays Ersa IR-550, Ersa IR-650, Ersa HR 600, QUICK BGA2015, Jovy Systems, RE-8500, using upper infrared heater that sits just above the center of the chip.
To restrict zone heat (radiation) PCBs currently used two systems.
1. Adjustable aperture (movable shutters)at which the limit of the zone of irradiation (window through which emits infrared heater) with adjustment flat metal sliding shutters.
2. Replacement of diaphragms, which are located under the IR heater, thus supplied with soldering station is a few diaphragms with different dimensions of the window, and as necessary™ these diaphragms are replaced.
The closest analogue of the device can be regarded as a device for soldering or tap a chip on the PCB, including case with mounted therein infrared heater placed in the lower part of the housing with a diaphragm with a hole that is installed with the possibility of accommodation at a given distance from working Desk with a fixed printed Board with brazed chip, disclosed in the patent JP 2010-278248 A1, IPC UK 1/005, 09.12.2010.
The disadvantages of the given systems constraints heating zone, including devices, taken as a prototype, are the following.
1. The scattering of radiation in a large area of the PCB due to the diffusion of radiation heater (full angle of exposure). However during this process, you will need to cover sensitive areas of the PCB reflect infrared rays material.
2. The loss of output due to the overlap shutters or aperture part of the heater surface.
3. The need to bring the heater to the Board at the small distance to reduce space heating, which results in worsening conditions for the visual control of soldering process.
The objective of the invention is to improve the quality of heating by changing the design of the diaphragm with the hub of the infrared rays.
The technical result, which is provided using the proposed device for soldering, is to increase the uniformity and specific power generated IR rays of the temperature field on the surface of the Board and microcircuit due to the reflection of infrared rays from the walls of the hub.
In addition, decreasing the effective angle of heating is an increase in the concentration of IR rays on a smaller area of the Board. Thus, at the constant power infrared heater allocated power is concentrated on a smaller area, leading to increased power density of radiation per unit area of the PCB.
The technical result is achieved due to the fact that the device for soldering or tap a chip on the PCB, including case with mounted it an infrared heater, installed with the possibility of its positioning on the desktop to the circuit Board on the regulated distance, while in the lower part of the body is placed aperture with a hole, limiting the zone the brazed heat circuits, in accordance with the proposed invention referred aperture contains the hub of infrared radiation, located on a path to aperture and made as reflecting element, vertical and/or tilted in the direction from infrared heater, the ratio of the size of the pupil, height and/or fragile tilt reflecting element is selected from the condition of given sizes heating zones and specific power of infrared radiation in the zone brazed chips.
Reflecting the device element can be made in the form of paired inclined and vertical parts.
Reflecting the item or its part may be flat or curved reflecting surface, for example, parabolic or hyperbolic form.
Moreover, reflecting the element or part of it can be made with the possibility of changing the angle of inclination and/or height.
Reflecting element can be made in the form of walls of various height and/or with different angles.
Aperture and the hub of infrared radiation can be in the form of a single structural element, or in the form of separate constructive elements.
Figure 1 shows the construction of the body with infrared heater and flat aperture with the scheme of distribution of infrared radiation, according to the prototype.
The figures 2-5 shows the construction of the body with infrared heater and a hub with a scheme of distribution of infrared radiation, according to the options of the proposed device.
Figure 2 - hub-infrared radiation with a reflective surface in the form of vertical planes
Figure 3 - the hub IR radiation with a reflective surface in the form of inclined planes
Figure 4 - hub-infrared radiation with reflective surfaces in the form of vertical and inclined planes
Figure 5 - the hub of IR radiation with curvilinear reflecting surface (similar to a hub with reflective surfaces in the form of vertical and inclined planes presented on figure 4).
Below indicate the positions used on reported figures.
1. The housing.
2. Infrared heater.
3. Blinds or flat aperture.
4. The chip.
5. Printed circuit Board.
6. The direct rays.
7. The rays reflected from the diaphragm (loss radiation).
8. Effective angle of heating.
9. Full angle of radiation.
10. The hub of IR radiation.
11. The reflected rays.
The proposed device combines limiting diaphragm of the heating zone (exposure) infrared rays with redirection cut off rays in the area soldering due to their reflection from the vertical wall (figure 2), located at the shape of the hole, or reflections from the inclined wall of the diaphragm (figure 3), which leads to an increase in the intensity (power density) heat at constant power infrared heater. The elements mentioned diaphragm form the hub of the infrared rays.
In addition, versions of aperture with complex the hub, shown in figure 4 and figure 5, by the reflection of infrared rays using an inclined plot aperture allows to use the IR rays that in cases in accordance with figure 2-3 did not participate in the heated, which were attributed to the loss of radiation. Such an implementation, further increases the efficiency of heating circuits.
As can be seen from the figure 2-5 schemes, the use of hubs IR rays reduces as full angle of radiation and effective angle of heat, making it close to renounce the use of protective reflecting plates on the free areas of the PCB, sensitive to overheating.
By increasing the power density of radiation conditions are being created to increase the clearance between the motherboard and the bottom of the device, at least from a distance "b" to the distance "A", thus by increasing gap improve conditions for the visual control of the soldering process, and due to the presence visually visible wall simplifies the process of positioning the top infrared heater above the center of the chip.
The shape of the window in the diaphragm may be rectangular, but may be round, oval or any other form depending on the configuration of chip package.
Proposed installation can be used in different types of infrared heaters, including, in the visible and non-visible range of the spectrum of infrared radiation, and even light bulbs.
For the most efficient use of soldering equipment aperture and walls reflecting element is made of a material with a maximum reflection coefficient in the range of infrared waves emitted IR heater.
The concrete sizes of holes diaphragm, height and/or angle of the reflecting element selected calculation or experimentally of the conditions for obtaining the necessary heating parameters depending on the construction and properties of brazed elements.
1. Device for soldering and tap a chip on the PCB, including case with mounted it an infrared heater, installed with the possibility of its positioning on the desktop to the circuit Board on the regulated distance, while in the lower part of the body is placed aperture with a hole, limiting the zone the brazed heat chips, wherein mentioned aperture contains the hub of infrared radiation, located on a path to aperture and made as reflecting element, vertical or inclined in the direction from infrared heater, or in the form paired inclined and vertical parts, the ratio of the size of the pupil, height and/or angle of the reflecting of the item selected from the condition of given sizes heating zones and specific power of infrared radiation in the zone brazed or otdavaema chips.
2. The device of claim 1, characterized in that reflect the element or part have a flat reflective surface.
3. The device of claim 1, characterized in that reflect the element or part have curved reflecting surface, for example, parabolic or hyperbolic form.
4. The device of claim 1, characterized in that reflect an item or its part is made with the possibility of changing the angle of inclination and/or height.
5. The device of claim 1, characterized in that reflect the element is made with walls of different height and/or with different angles.
6. The device of claim 1, wherein the aperture and the hub of infrared radiation is made in the form of a single structural element.
7. The device of claim 1, wherein the aperture and the hub of infrared radiation is made in the form of separate constructive elements.