Radioelectronic unit. RU patent 2513038.
 Heat-to-cold conversion method (versions), device for its implementation (versions), and heat-to-cold conversion system / 2511333Group of inventions relates to heat exchange and can be used for cooling of air or equipment, as well as for waste heat utilisation. As per one of the versions, a heat-to-cold conversion device includes the first heat exchanger 2, steam generator 3, liquid heat carrier (cooling agent) 4, a thin plate with hole 5, condenser 6, grid 7, the second heat exchanger 8, overflow valve 9, vertical pipeline 10, counter pressure valve 11, dosing mechanism 12, turbine with magnetic coupling 13, fan 14, the second thin plate with hole 15, and solar collector 16. |
 Light-emitting diode module cooling system / 2510732Invention relates to radio electronics and can be used in designing efficient cooling systems of powerful LED modules. The LED module cooling system consists of a heat-removing base merged with a heatsink made of microporous material with microchannels and filled with a liquid coolant and LEDs mounted thereon. The microchannels are located in the heat-removing base under the LEDs perpendicular to the mounting plane of the LEDs, wherein their ends adjoining the LEDs form, in maximum proximity to the p-n junctions of the LEDs, a surface which intensifies boiling and evaporation due to a layer of microporous material deposited between each LED and the end of the adjoining microchannel, wherein the size of the pores of the microporous material is considerably smaller than that of pores of the material filling the heat-removing base of the LED module, wherein the size of the pores of the microporous material decreases towards the LED. The system requires one-time filling with liquid and is less sensitive to variations of the initial volume of the liquid. |
 Power converter module with cooled busbar arrangement / 2510604Invention relates to a power converter module with a at least one thermally active power semiconductor module (2, 4), mechanically connected to a liquid-cooled heat sink (6) and are electrically actively connected to leads of the power converter module by a busbar arrangement (8), having at least two power buses insulated from each other. The busbar arrangement (8) is connected via power and/or geometric closing with a second liquid-cooled heat sink (10). Between the top power bus of the busbar arrangement (8) and the second liquid-cooled heat sink there is a thermally active and electrically insulating layer (36). Additional power loss arising in the busbar arrangement (8) is removed through said second liquid-cooled heat sink (10), which is clamped to the surface of the busbar arrangement (8) of the power converter module using clamping elements. |
 Radiator / 2509970Radiator includes a wall and heat exchange elements forming external and internal finning. External finning consists of straight projections alternating with passes the cross sectional area of which in upper part of the wall is smaller than in its middle part, and internal finning consists of alternating passes separated with fins and having the cross sectional area of a constant value and passes with cross sectional area of a variable value, which are made as close as possible to outside surface of the straight projection. Straight projections are located opposite passes with cross sectional area of the variable value of the internal finning. In order to mix air and increase the area of the radiator heat-removing surface, there is at least one through hole in the projections. |
 Heat removal device / 2507614Heat removal device consists of a housing with a heat sink, elastic elements, which are arranged in it and installed between the heat sink and a heat-stressed electronic module, a heat-conducting structure located between the heat sink and the heat-stressed electronic module; the heat sink has finning and inclined surfaces and is installed by means of fastening assemblies in the housing wall; on outer and inner surfaces of the heat sink there are heat-conducting gaskets, and elastic elements are located between the heat sink and the housing. |
 Cascade light-emitting thermoelectric unit / 2507613Light-emitting thermomodules are used. A light-emitting thermomodule allows reducing parasite conductive transfer from the hot junction side, which is heated not as mush as that due to the fact that some part of energy is taken away in the form of an emission, and it is not converted to heat on the hot junction. Reduction of heat transfer by conduction between hot and cold junctions allows performing p-n-junctions and the junctions themselves in the form of thin films. Structure of the thermoelectric device represents a cascade (multilayer) thermomodule consisting of thermomodules, in which such materials of semiconductor branches of p-type 4 and n-type 5 are chosen that the flowing current on one of the junctions 2 will form emission, and not heating as in a common thermomodule; with that, in other junction 3 there will be absorption of heat energy in compliance with Peltier effect. Cascades are separated with electrically-insulating layers 1 with high transparency and heat conductivity. Direct current is fed from source 6. |
 Condensation thermoelectric cabinet / 2507612In a device consisting of a tightly packed sealed housing, two and more injectors serving for injection of a mixture to an internal cavity of the cabinet; a highly heat-conducting plate with an installed heat-emitting equipment; a thermoelectric unit; a pin fin heat sink; a fan unit; a control unit (CU); a condensate flowdown chute; a pump serving for supply of condensate to injectors; a temperature sensor; a protective casing, it is proposed to use an evaporation and condensation cooling principle. The temperature sensor supplies a signal to CU that includes a pump for liquid supply to injectors located on the cabinet ceiling. The mixture is injected to the internal cavity of the cabinet and deposited on heat-emitting elements; its evaporation process takes place, therefore, cooling of heat-emitting elements is achieved. When vapours of the mixture go upwards, they are condensed on the ceiling (upper part of the cabinet) that is technically inclined to the rear part of the cabinet for directed condensate flowdown onto a special chute located throughout the length of the rear wall. Then it enters CU, in which the pump is installed. The mixture is supplied again to the injections through liquid channels under action of the pump. In order to amplify condensation properties of the evaporated liquid, the thermoelectric units are used, the cold junctions of which are in close contact with the upper cover of the cabinet, and the installed pin fin heat sink that is in the same close contact with the junctions of the thermoelectric units, but is on the hot side, performs heat removal. The fan unit consisting of four fans is controlled by the control unit (CU) that provides the possibility of their paired actuation for the purpose of electric energy saving. |
 Building for computer centre equipped with efficient cooling devices / 2507560Computer centre intended for accommodating multiple communication racks (202), each of which provides storage space for computer hardware (101), a first cooling circuit (205) designed to supply at least some of the racks (202) with a coolant and the first cooling circuit (205) is also designed to remove the heated coolant from at least some of the racks (202), wherein said racks (202) have heat exchanger units (206, 207) designed transferring the generated heat to the coolant, and the dimensions of the heat exchanger units (206, 207) are selected such that it is possible to remove the amount of heat generated by computer hardware (101) through said units, such that during operation, hot air is not transferred from the multiple racks (202) in the building of the computer centre. |
 Semiconductor electric energy converter module / 2504864Semiconductor electric energy converter module contains power semiconductor modules (2, 4) which are connected mechanically to liquid heat sink (6) and by means of busbars (8) having busducts (26, 28; 28, 30) isolated from each other by insulating layer (32) are connected electrically to contacts (10, 12, 14) of semiconductor electric energy converter - insulating layer (32) has two isolating layers (36, 38), which are interconnected by material so that between these two isolating layers (36, 38) there is hollow space (40) of set shape which ends at input and output side at least at one lateral surface (48, 50) of this insulating layer (32); this hollow space (40) at input and output side is equipped with respective branch tubes (42), which are connected so that liquid can pass through liquid heat sink (6). |
 Cooling device with low noise level / 2501982Cooling device 1, using a pulsating fluid medium for object cooling, comprising the following: a converter 2, having a membrane made as capable of generation of pressure waves with working frequency fw; and a cavity 4, which holds the first side of the membrane. The cavity 4 has at least one hole 5, which is made as capable of emission of a pulsating flow of the fluid medium minus the losses to the specified object, at the same time the opening 5 communicates with the second side of the membrane. The cavity 4 is quite small to prevent action of the fluid medium in the specified cavity 4 as a spring in the resonating mass-spring system in the operating range. This is an advantage, since the volume speed u1 around the hole is substantially equal to the volume speed u1 near the second side of the membrane, excluding the minus sign. Thus, at the working frequency the pulsating fluid medium minus the losses may be to a considerable extent suppressed due to the antiphase of pressure waves at the second side of the membrane, causing as a result the volume speed close to zero in the remote area. |
 Housing cover for switching electromagnet / 2403693Cover consists of a component formed by pressure casting synthetic material, having closed lateral walls and a upper side which is integrally joined to the lateral walls. There is a mounting plate in the inner cavity of the upper side of the housing cover. On the upper side of the housing cover there are two holes for manual activation of switching pushers of electromagnets with a male connection at the centre between both holes. At the corners of the box of the housing cover there are holes under fastening screws for joining the housing cover to the housing of the switching magnet with installation of a seal plate. The lower side has stop lugs at the corners which are integrally moulded on the box of the housing cover. The stop lugs have continuing holes under the screws with pipe bushings. Between the bushings there are lateral edges of the lateral walls which are shifted backwards and which form clamping edges for the seal plate. |
 Electronic device / 2374676Electronic device includes a main cover (10), with a shape close to an elliptical cylinder and is placed such that, the longitudinal direction is approximately horizontal relative the surface of installation. The cover has openings (14, 26, 28 and 30) for inserting a carrier, into which is inserted a portable data carrier of the optical disc type, and a base (52) with a box shape, attached to the bottom part of the main cover (10). |
 Radio-electronic unit / 2366126Invention relates to radio electronics. The radio-electronic unit has housing, which consists of a front and two side panels, joined to top and bottom covers made from electrically conducting materials, as well as a board with electronic elements, joined to the bottom cover. The panels and covers have multilayer electrically conducting coating. The top and bottom covers have an inverted-L shape and joined to each other on the lateral edge which has a stepped projection. The side panels have bends on three sides, with the shape of a cylinder fragment, passing into a plane perpendicular to the plane of the panels. The corners of the side panels have the shape of a fragment of a sphere, which makes the structure strong. The inner side of the front panel has a two-step projection with threaded holes, through which the panel is joined to the side panels on the first projection, and to the cover on the second projection. Inside the housing there are several boards, where at least two boards, forming a packet structure, are electrically connected to each other through end-to-end connectors. Connection with other boards or external devices is achieved using connectors on a board, which are fixed by the inner side of at least one of the component parts of the housing. |
 Electronic device for connecting module of external memorizing device / 2313822Invention is based on a problem of creating an electronic device for connection of module of external memorizing device, and also of electronic module on basis of smart-card, chip-card and other modules, having possible minimal structural dimensions in terms of height, and with simpler construction compared to analogs, which ensures comfort of operation and maintenance due to decreased number of structural elements and absence of tilting lid. |
 Radio-electronic block / 2269879Radio-electronic block has frontal and back panels made of electro-conductive materials and upper and lower lids connected thereto, and also an electronic board, positioned in the inner space of radio-electronic block, carrying electronic nodes and connected to one of panels and lower lid. Upper and lower lids are made U-shaped and connected to each other through side engagement straps, made of electro-conductive material, in upper and lower grooves of which side edges of respectively upper and lower lids are held, and in side grooves - side edges of electronic board. End edges of lids and end shelves of engagement straps are positioned in grooves, made on inner side of frontal and back panels. Along bottom of aforementioned grooves and also along bottom of upper and lower grooves of side engagement straps, portions of electro-conductive elastic wire are positioned, providing for compensation of mechanical gaps and electric contact between lids, side engagement straps and panels at portions of their connection. Panels are held tight to side engagement straps by screw couplings, as which screws are used, inserted from external sides of both panels into threaded apertures, made on ends of both engagement straps. |
 Radio-electronic block / 2269878Radio-electronic block has frontal and back panels made of electro-conductive materials and upper and lower lids connected thereto, and also an electronic board, positioned in the inner space of radio-electronic block, carrying electronic nodes and connected to the frontal panel. Upper and lower lids are made U-shaped and connected to each other through side engagement straps, made of electro-conductive material, in upper and lower grooves of which side edges of respectively upper and lower lids are held, and in side grooves - side edges of electronic board. End edges of lids and end shelves of engagement straps are positioned in grooves, made on inner side along perimeter of frontal and back panels. Along bottom of aforementioned grooves and also along bottom of upper and lower grooves of side engagement straps, portions of electro-conductive elastic wire are positioned, providing for compensation of mechanical gaps and electric contact between lids, side engagement straps and panels at portions of their connection. Lids and side engagement straps are pressed tight between frontal and back panels force, provided by at least one screw coupling, drawing back panel to electronic board. As screw coupling, for example, screws are used, inserted from external sides of back panel into threaded aperture of abutment element, connected to electronic board. |
 Electronics' case / 2268559Electronics' case can be used for development of electron units of trips mounted in automatic switches, and housings of electric connectors. Case has sections connected together. The sections have fixing members and L-shaped holes. |
 Parts from composite electrical structural material / 2498927Invention relates to structure composed of parts from composite materials to be used for aircraft working structures to accommodate electrical circuitry in aircraft. Stiff structural part 1 from laminar composite includes at least two conductors, two structural layers 11, 12 including fibers retained by thermosetting or thermoplastic matrix. Note here that at least one conducting circuit layer 15 is arranged between at least two structural layers. At least one conducting circuit layer comprises circuit of electric conductors 151a-151c. Note here that electric conductors are arranged in one structural parts, regularly and electrically isolated from two structural layers by dielectric material 150. Structural part 1 comprises electrical connectors 18 to connect said conductors 151a-151c and at least one circuit layer 15 to make electric circuit by assembly of several structural elements. |
 Electric component containing thermomelting element / 2477028Invention relates to an electric component (1), comprising at least one cable element (2), at least one soldered joint (12), at least one thermomelting element (22) and at least one substrate element (8). The cable element (2) is connected with the substrate element (8) by means of the soldered joint (12). To increase speed of data transfer at least one soldered joint (12) has not been introduced into the thermomelting element (22). The soldered joint (12) preferably is not coated with the thermomelting material of the thermomelting element (22), at the same time the rear end (16) of the substrate element (8) is connected adhesively or cohesively with the thermomelting element (22), besides, the rear end (16) faces the cable element (22). |
 Integrated microwave circuit / 2474921In an integrated microwave circuit comprising a dielectric substrate, on the face side of which there are only passive elements arranged, or - passive elements, transmission lines, leads, active elements, at the same time elements are connected electrically, and the integrated circuit is grounded, the dielectric substrate is made from a diamond plate with thickness equal to (100-200)×10-6 m, which has a metallised coating, at the same time the metallised coating is arranged in the form of a solid layer on the reverse and end sides, and a local layer on the face side of the specified dielectric substrate, at the same time the specified layers are arranged with identical thickness, each equal to 3-7 depths of the skin layer, and grounding of the integrated circuit is made by means of the specified metallised coating. |
 Printed-board connector and hermetic electrical package integrating one such connector / 2433514Connector (1) is designed for connection with a border (20) of a printed board (2) with its first surface (2a) contacting to a support (3). The connector contains at least one metal plate (11) for contacting with an electrical conductor (21) arranged on a second surface (2b) of the printed board (2), and at least one fastener (12) designed for fastening the connector (1) on the border of the printed board (2). At least one said metal plate (11) is designed for applying retention force (Fp) to the printed board (2) for keeping the latter in contact with the support (3); connector and printed board (2) travel is constrained at least in one direction (Z) perpendicular to the surfaces (2a, 2b) of the printed board (2). |
FIELD: radio engineering, communication.
SUBSTANCE: invention relates to radioelectronics and can be used to solve problems of removing heat from heat-loaded radioelectronic components on printed-circuit boards. In the disclosed radioelectronic unit, a heat-loaded radioelectronic component 3 is mounted on the outermost printed-circuit board 2, where said component is fitted with a heat-conducting plate 4 with fins 5 and grooves 6 in which fins 7 and grooves 8 of a heat-conducting cover 1 are inserted, respectively, when assembling the radioelectronic unit, and gaps between the fins 5 and 7 are filled with heat-conducting material 9.
EFFECT: high efficiency of removing heat from heat-loaded radioelectronic components.
1 dwg
The invention relates to the electrical engineering and may be used for solving tasks of heat from placed on the printed-circuit heat-loaded electronic components.
Known electronic block [1], containing functional cell representing the heat sink base with glued to him circuit boards with mounted thermal loaded radio-electronic components, with the heat sink base of neighboring cells joined together to form the chassis wall.
The disadvantage of this device is quite low heat transfer through the circuit Board between thermal loaded radio-electronic components and the heat sink base.
Known electronic block [2]containing PCB installed on it electronic component of thermal loaded with planar conclusions, heat the base of which is sealed with heat-conducting the case of radio-electronic unit by means of the fastening sleeves through the PCB.
The disadvantage of this device is the design complexity and the use of heat only from electronic component with planar conclusions, as well as their custom moulding.
The task, which directed the invention is increasing the efficiency of heat from thermal loaded electronic components.
The task is due to the fact that electronic block that contains a heat conductive cover, package, circuit boards installed in the extreme PCB thermal loaded radio-electronic components, according to the invention on heat surfaces heat-loaded electronic components installed heat-conductive plate fitted with ribs and sharing their grooves, and the inner surface of heat-conductive lid is also provided with ribs included in the Assembly of electronic unit into the grooves between the ribs of the heat-conducting plates thermal loaded electronic components, ensuring mutual thermal contact, with the gap between the fins of the heat transfer plates and edges of heat-conductive lid is filled with heat-conducting material.
The essential features of the claimed device in comparison with the known (the closest analogue), is the orientation toward the heat sink surface thermal loaded electronic components thermally conductive plates fitted with ribs separated by grooves into which edges, which is provided with the inner surface of the heat sink covers.
The drawing shows the electronic unit in the section.
The drawing is a thermally conductive cover 1, circuit Board 2, thermal loaded electronic component 3, heat-conducting plate 4, 5 ribs, grooves 6, ribs 7 cover the slots 8 covers thermal interface material 9.
The proposed design of the electronic unit is made as follows.
In the extreme motherboard 2 installed thermal loaded electronic component 3, installed heat-conducting plate with 4 edges 5 and slots 6, which are respectively ribs 7 and 8 slots thermally conductive cover 1 in the Assembly of electronic block and the gap between the ribs 5 and 7 are filled with the heat-conducting material 9.
The Assembly of electronic unit do the following. In the frame of the unit is installed, the package of printed circuit boards, of at least 2 boards soldered heat-loaded radio-electronic components 3, which are heat-conductive plate with 4 edges 5 and slots 6. Then they turn the heat-conducting cover 1 with 5 ribs and slots 6 so that edges 5 in the keyway 8, and ribs 7 into the slots 6, pre-putting them on thermal interface material 9, after which the cover 1 screwed to the frame of the unit.
In the process, the heat from thermal loaded electronic component 3 is transmitted to the heat-conducting plate 4, and with her through the fins 5 and 7 heat-conductive cover 1 for dispersion into the environment.
The advantage of the proposed device is the ability to dissipate heat through each unit cover. If the unit is made in the form of a parallelepiped, the dissipation occurs through all 6 covers.
The proposed design of the electronic unit is used in onboard navigation equipment and provides the necessary temperature mode of heat-loaded electronic components.
Sources of information
1 Patent of the Russian Federation 2322776, IPC H05K 1/00, 2006
2 the Patent of the Russian Federation 2105441, IPC H05K 7/20, 1996 (the nearest equivalent).
Electronic block containing thermally conductive cover, package, circuit boards installed in the extreme PCB thermal loaded radio-electronic components, characterized in that the exposed paddle on the surfaces of heat-loaded radio-electronic components installed heat-conductive plate, provided with ribs and sharing their grooves, and the inner surface of heat-conductive lid is also provided with ribs included in the Assembly of electronic unit into the grooves between the ribs of the heat-conducting plates thermal loaded electronic components, ensuring mutual thermal contact, with the gap between the fins of the heat transfer plates and edges of heat-conductive lid is filled with heat-conducting material.