IPC classes for russian patent Power converter module with cooled busbar arrangement. RU patent 2510604. (RU 2510604):
Another patents in same IPC classes:
Radiator / 2509970
Radiator includes a wall and heat exchange elements forming external and internal finning. External finning consists of straight projections alternating with passes the cross sectional area of which in upper part of the wall is smaller than in its middle part, and internal finning consists of alternating passes separated with fins and having the cross sectional area of a constant value and passes with cross sectional area of a variable value, which are made as close as possible to outside surface of the straight projection. Straight projections are located opposite passes with cross sectional area of the variable value of the internal finning. In order to mix air and increase the area of the radiator heat-removing surface, there is at least one through hole in the projections. |
Heat removal device / 2507614
Heat removal device consists of a housing with a heat sink, elastic elements, which are arranged in it and installed between the heat sink and a heat-stressed electronic module, a heat-conducting structure located between the heat sink and the heat-stressed electronic module; the heat sink has finning and inclined surfaces and is installed by means of fastening assemblies in the housing wall; on outer and inner surfaces of the heat sink there are heat-conducting gaskets, and elastic elements are located between the heat sink and the housing. |
Cascade light-emitting thermoelectric unit / 2507613
Light-emitting thermomodules are used. A light-emitting thermomodule allows reducing parasite conductive transfer from the hot junction side, which is heated not as mush as that due to the fact that some part of energy is taken away in the form of an emission, and it is not converted to heat on the hot junction. Reduction of heat transfer by conduction between hot and cold junctions allows performing p-n-junctions and the junctions themselves in the form of thin films. Structure of the thermoelectric device represents a cascade (multilayer) thermomodule consisting of thermomodules, in which such materials of semiconductor branches of p-type 4 and n-type 5 are chosen that the flowing current on one of the junctions 2 will form emission, and not heating as in a common thermomodule; with that, in other junction 3 there will be absorption of heat energy in compliance with Peltier effect. Cascades are separated with electrically-insulating layers 1 with high transparency and heat conductivity. Direct current is fed from source 6. |
Condensation thermoelectric cabinet / 2507612
In a device consisting of a tightly packed sealed housing, two and more injectors serving for injection of a mixture to an internal cavity of the cabinet; a highly heat-conducting plate with an installed heat-emitting equipment; a thermoelectric unit; a pin fin heat sink; a fan unit; a control unit (CU); a condensate flowdown chute; a pump serving for supply of condensate to injectors; a temperature sensor; a protective casing, it is proposed to use an evaporation and condensation cooling principle. The temperature sensor supplies a signal to CU that includes a pump for liquid supply to injectors located on the cabinet ceiling. The mixture is injected to the internal cavity of the cabinet and deposited on heat-emitting elements; its evaporation process takes place, therefore, cooling of heat-emitting elements is achieved. When vapours of the mixture go upwards, they are condensed on the ceiling (upper part of the cabinet) that is technically inclined to the rear part of the cabinet for directed condensate flowdown onto a special chute located throughout the length of the rear wall. Then it enters CU, in which the pump is installed. The mixture is supplied again to the injections through liquid channels under action of the pump. In order to amplify condensation properties of the evaporated liquid, the thermoelectric units are used, the cold junctions of which are in close contact with the upper cover of the cabinet, and the installed pin fin heat sink that is in the same close contact with the junctions of the thermoelectric units, but is on the hot side, performs heat removal. The fan unit consisting of four fans is controlled by the control unit (CU) that provides the possibility of their paired actuation for the purpose of electric energy saving. |
Building for computer centre equipped with efficient cooling devices / 2507560
Computer centre intended for accommodating multiple communication racks (202), each of which provides storage space for computer hardware (101), a first cooling circuit (205) designed to supply at least some of the racks (202) with a coolant and the first cooling circuit (205) is also designed to remove the heated coolant from at least some of the racks (202), wherein said racks (202) have heat exchanger units (206, 207) designed transferring the generated heat to the coolant, and the dimensions of the heat exchanger units (206, 207) are selected such that it is possible to remove the amount of heat generated by computer hardware (101) through said units, such that during operation, hot air is not transferred from the multiple racks (202) in the building of the computer centre. |
Semiconductor electric energy converter module / 2504864
Semiconductor electric energy converter module contains power semiconductor modules (2, 4) which are connected mechanically to liquid heat sink (6) and by means of busbars (8) having busducts (26, 28; 28, 30) isolated from each other by insulating layer (32) are connected electrically to contacts (10, 12, 14) of semiconductor electric energy converter - insulating layer (32) has two isolating layers (36, 38), which are interconnected by material so that between these two isolating layers (36, 38) there is hollow space (40) of set shape which ends at input and output side at least at one lateral surface (48, 50) of this insulating layer (32); this hollow space (40) at input and output side is equipped with respective branch tubes (42), which are connected so that liquid can pass through liquid heat sink (6). |
Cooling device with low noise level / 2501982
Cooling device 1, using a pulsating fluid medium for object cooling, comprising the following: a converter 2, having a membrane made as capable of generation of pressure waves with working frequency fw; and a cavity 4, which holds the first side of the membrane. The cavity 4 has at least one hole 5, which is made as capable of emission of a pulsating flow of the fluid medium minus the losses to the specified object, at the same time the opening 5 communicates with the second side of the membrane. The cavity 4 is quite small to prevent action of the fluid medium in the specified cavity 4 as a spring in the resonating mass-spring system in the operating range. This is an advantage, since the volume speed u1 around the hole is substantially equal to the volume speed u1 near the second side of the membrane, excluding the minus sign. Thus, at the working frequency the pulsating fluid medium minus the losses may be to a considerable extent suppressed due to the antiphase of pressure waves at the second side of the membrane, causing as a result the volume speed close to zero in the remote area. |
Radio-electronic unit / 2498544
Radio-electronic unit has a housing and functional cells having printed-circuit boards with radio elements and heatsinks. According to the invention, the housing is made of dielectric material in form of a continuous structure with inner partition walls which form compartments accommodating the functional cells, wherein the central compartment of the housing accommodates a transformer board, having four paired pulse transformers with symmetrical arrangement of windings; at opposite sides of the transformer board there are four functional cells at each side, each placed in a separate compartment of the housing and representing a transistor unit, having two printed-circuit boards connected by insulating bars with threaded openings for mounting into the housing, wherein the first printed-circuit board has three clamp diodes and the second printed-circuit board has a high-voltage power transistor. The second printed-circuit board is double-sided and has areas with the same shape as the transistor housing on two sides and has metal-coated openings which the heatsink function as heat-removing pipes. |
Procedure for cooling of electronic equipment and system for implementation of this procedure / 2498427
In the procedure for electric equipment cooling delivery of cooling air is made with use of cooling air ionisation, at that concentration and polarity of air ions is selected do that no static charge accumulation of triboelectric origin takes place at components of cooled electronic equipment. For the purpose of this procedure implementation the system is used which contains air duct (1) to generate a flow of cooling air through electronic equipment (2) and fan (3), cooler (4) and device (5) for cooling air humidity regulation which are installed in-series before the cooled equipment. At that the system is equipped with ioniser (6) to saturate cooling air with ions which is installed between device (5) for cooling air humidity regulation and cooled electronic equipment (2) and the device for cooling air humidity regulation is made as air drier. |
Electronic unit with housing / 2498426
Electronic unit (1) for use in an electric tool has a box-like element (6) with a bottom part and lateral parts (61), a flat-topped cooling element (5) with a closing part (51) and sidewalls (52) and a printed-circuit board located in the box-like element (6) and fixed on the cooling element (5) by a fastening element, wherein the flat-topped cooling element (5) is placed on the box-like element (6) such that a hole in the box-like element (6) situated opposite its bottom part is partially closed by the closing part (51) of the cooling element (5), with part of the hole in the box-like element (6) remaining open. |
Thermal protection bag / 2246188
Proposed thermal protection bag designed to accommodate stationary radio module of satellite telephone set of Globalstar system has heating element and shields and is made in the form of sandwich structure; heating element is made in the form of flexible fabric electric heater with double-layer shields disposed on its both ends incorporating heat-insulating fabric of different optical characteristics on inner and outer sides and heat-insulating material. Flexible fabric electric heater mounts thermal relay that operates at electric heater temperature of +160 + 2oC; in addition electric heater is switched over by means of control unit mounted on radio module case; electric heater turn-on temperature is set at -23 ± 1oC and its turn-off temperature is -17 ± 2oC. |
Electronic module / 2246806
Proposed horizontally mounted electronic module incorporating provision for temperature reduction in upper section relative to that in lower one has semiconducting case with upper and lower internal sections. Lower section accommodates heat-resistant electronic unit. Upper section houses heat-sensing electronic unit. Sections are isolated from one another by means of heat-conducting shields made in the form of two chassis plates disposed in a spaced relation one on top of other and being in thermal contact with case. Heat-resistant electronic unit installed in lower section is disposed in a spaced relation to lower surface of bottom chassis plate that functions to reflect thermal radiation. Electronic unit installed in upper section is disposed so that its thermal contact with top chassis plate is ensured. Part of case closing the upper section has perforated holes. |
Electronic control block / 2248683
Body of block has frame body part made in form of cast by molding under pressure, with open upper and lower sides, in material of which partially embedded are metallic plate conductors, formed by at least one punched grating, while frame body part on lower side is covered by metallic bottom element for draining heat, and on the upper side is covered by lid and between bottom element and electronic board powerful circuit elements are placed, contact outputs of which are electrically connected to board and/or to plated conductors and lower sides of which, formed by cooling plates and opposite relatively to board, are connected to said bottom element with sure heat-conductive contact. |
Refrigerator connected to the internet / 2249164
Refrigerator comprises basic printed circuit board provided with an assembly of integrated circuits, heat exchanging plate arranged in the vicinity of the surface of the basic printed circuit board and adopted for absorbing heat, which is generated by the integrated circuits, pipe provided with the inlet and outlet branch pipes, which are in communication with the inner space of the freezing chamber which is in a contact with a part of the bottom of the basic printed circuit board for permitting air to flow over it from the freezing chamber to the heat exchanging plate, temperature sensor mounted on the surface of the basic printed circuit board, and controllable valves mounted in the inlet and outlet branch pipes. The valves open the passage in pipes for flowing cold air from the freezing chamber, when the temperature measured by the sensor exceeds a given value, and close the passage in pipe, when the temperature underlies a given value. |
Radiator and radiative cooler using such radiator / 2251827
Proposed radiator is built of plurality of radiator fins and separate fins are joined together to ensure their development in radial direction thereby enlarging its surface area and increasing its heat-transfer efficiency. Radiator is installed within radiative cooler in air conduit, and fan feeds cold air to this air conduit thereby additionally raising heat-transfer efficiency. Radiator force of coupling with heat source can be elastically maintained which makes it possible to maintain its coupling with heat source even upon external impacts. In addition cutting out upper part of fin enables shortening of fold line so that heat-absorbing parts of radiator fins piled one on top of other can be tightly joined during radiator formation at lower force applied. Radiator obtained has depression in center of upper surface. Such mechanical design makes it possible for fan-forced cold air to reach radiator bottom center thereby additionally raising heat-transfer efficiency. In addition, noise and vibrations caused by cold air flow over heat-transfer parts of radiator are reduced. |
Cooling apparatuses for components of electronic devices / 2255437
Proposed cooling apparatus has heat sinks disposed on components of electronic devices being cooled down, remote radiative cooler, and heat pipe. Radiative cooler is placed above heat sinks. Heat pipe has four types of sections, that is, heated zones, intermediate zones carrying working medium in the form of steam, cooled zone , and intermediate zones carrying working medium in the form of liquid. Intermediate zones of heat pipe are made in the form of flexible hoses. Working medium of heat pipe is liquid whose boiling temperature at atmospheric pressure is higher than working temperature of electronic components being cooled down. |
Device for draining heat from radio-electronic equipment elements with short-time repeating heat exhausts / 2257691
Device has thin-walled metallic container, filled with working substance, having stable melting temperature within limits 40÷65°C, on one of end surfaces of which with good heat contacts radio-electronic equipment element is mounted. Metallic container has shape of rectangular parallelepiped, two opposite sides of which are profiled with forming of planes, in operating state filled with water solution of salt with low cryohydrate temperature for 4/5 of volume. Into space, limited by hollows thin corrosion-resistant perforated plates are positioned, connected to each other outside hollows by metallic plates with forming of a likeness of two mirrored combs, where perforated plates are teeth of combs, and two metallic plates - bases of combs. Upper ends of two metallic plates are bent outwards at an angle 90° in direction from metallic container and are connected via flexible parts with heat insulation. Because of electro-magnets perforated plates perform oscillations. |
Heat removing device / 2258181
Invention is designed for use in ventilation with forced circulation of air, for instance, to cool heated elements of computer, in particular, microprocessor. Proposed device contains electric motor, axial-flow fan, ribbed radiator, and it is furnished additionally with axial-flow fan located on elongated axle under existing fan and fairing. Ribs of radiator are rectangular or cylindrical, or flat, or trapezium-like in form of truncated pyramid or truncated cone. Ribs in form of truncated cone are provided with thread. Ribs of radiator are provided with longitudinal slots in height. Blades of both axial-flow fans are made to turn through 180°. |
Thermal-emitting radiator and method for thermal emission implementing said radiator / 2262815
Device has main body and metallic covering layer with thickness not greater than 5 mcm, made of elements of group, containing copper, nickel cobalt, chrome, zinc, manganese or their alloys, while thermal capacity of aforementioned layer of metallic cover is less than thermal capacity of main body. Method for thermal emission using radiator includes feeding air environment to surface of device using ventilator mounted thereupon. |
|
FIELD: electricity.
SUBSTANCE: invention relates to a power converter module with a at least one thermally active power semiconductor module (2, 4), mechanically connected to a liquid-cooled heat sink (6) and are electrically actively connected to leads of the power converter module by a busbar arrangement (8), having at least two power buses insulated from each other. The busbar arrangement (8) is connected via power and/or geometric closing with a second liquid-cooled heat sink (10). Between the top power bus of the busbar arrangement (8) and the second liquid-cooled heat sink there is a thermally active and electrically insulating layer (36). Additional power loss arising in the busbar arrangement (8) is removed through said second liquid-cooled heat sink (10), which is clamped to the surface of the busbar arrangement (8) of the power converter module using clamping elements.
EFFECT: designing a power converter module, the laminated set of buses of which allows efficient removal of heat using simple means.
10 cl, 3 dwg
The invention relates to the power of Converter module, according to the restrictive part of paragraph 1 of the claims.
Power conversion modules, in particular, high voltage, in question, are commercially available. In power conversion modules of this type are appropriate power semiconductor modules, in particular, disable power semiconductor modules, disconducive connected tires with the conclusions of the power Converter unit. This is due to the fact that used the power bus is planar and imposed one on another batch of tyres. Accordingly between two flat power tires is made of flat insulation layer. These insulating layers are for flat power bus, so you may be provided with limit values for air gap and track moving discharge (Luft-und Kriechstrecken). Thus such misconducting busbars contains at least two power bus and at least one of insulation layer. To provide the most compact tires used for power semiconductor modules of Converter module this package tire laminate. Thanks used laminating material laminated this leads has temperature border, for example, 105°C.
As in commercially available power semiconductor modules, in particular, turn off the power semiconductor modules, for example, a bipolar transistor with insulated gate (Insulated-Gate Bipolar-Transistor IGBT), constantly increasing allowable load current, it increases the current density in force tire laminated bus-power Converter unit. This leads to the square losses increase in laminated busbars, so also increases the temperature of the laminated bus. The temperature limit of this laminated bus determine the materials used for insulation layers and laminating material. Preferably currently in power conversion modules are used tires, laminated insulating foil. Here the temperature limit sets laminating material laminated bus. For target use of converters that means the capacity limit, which is not determined already used power semiconductor modules, and the maximum temperature of the corresponding laminating material busbars.
The next solution to this problem consists, on the one hand, to increase cross-section of each power bus laminated package and, on the other hand, to cool the laminated leads, for example, own convection. By improving cross-sectional power bus laminated package such busbars get not only more expensive, but also more wordy. In order laminated busbars cooling at the expense of own convection, it should be placed in power conversion device so that the flow of cooling air can flow around the laminated bus.
From the international publication WO 2005/109505 A1-known power semiconductor scheme, which leads cooled. In this power semiconductor scheme, at least one module soldered from the outside on which serves as a positive or a negative plate plate power bus. Positive or negative rail usually positioned as a top or bottom plate plate package of tyres. This top bus which is connected to the module, directly cooled cooling unit, and this cooling device is made as of air or liquid cooling. This cooling device is located in structure of type "sandwich" between top bus and lower insulation gasket another, located in parallel to the plane of the plate power bus. Further, under padding another insulating layer, there is power bus from the bottom side. These power bus form together with the cooling device is very compact layout. The elements of this package tire lamination is interconnected. As this power semiconductor scheme talking about inverter, this package tires are two capacitor DC link that bolts attached to the upper or lower power bus.
Of the patent document DE 10 2007 003 875 A1 known energy Converter module at least two power semiconductor modules, which are thermally active (thermally conductive way) mechanically connected with the cooler and through laminated package tyres are electrically connected with each other. At least one power bus laminated this package tire thermally actively connected to the cooler through at least one electrically insulating and thermally active support element. Through these supporting elements, at least one power bus laminated package tire thermally connected with the cooler. The amount of exhaust heat determines the number of thermally active support elements. Through these supporting elements laminated tyre also rely in the marginal zones. Through these thermally active support elements is limited to the amount withdrawn from the laminated tyre heat.
The objective of the invention is to offer energy Converter module, laminated package tyres which allows extraction of heat using simple tools, and this energy Converter module does not need to parse (entflechten) or re-designing.
This task is solved by the distinguishing signs of paragraph 1 of the claims. Because the second liquid cooler, thermally active, but electrically solonoise connected with power and/or flush with busbar power Converter unit, the heat can be dissipated with a large surface of these tyres. If the main surface of the second liquid cooler to be insufficient, optionally can be increased fluid flow. How good thermal connection of buses and second liquid cooler, depends on the efforts to which this second liquid cooler pressed to connecting buses. To this end, the energy Converter module according to the invention, contains at least one clamping element.
In the preferred form of carrying out power Converter unit, the second liquid coolers and liquid chiller energy Converter unit hydraulically connected. This means that the second liquid cooler fueled by liquid circuit of power Converter unit, which is also called the primary circuit. This has the advantage that the power Converter module remains its connections.
Other preferred form of exercising power Converter unit, according to the invention presented in the dependent paragraphs 4-10 claims.
For a more detailed explanation of the invention refers to a drawing that shows schematically the form of the invention.
Fig. 1 offers a preferred form of carrying out power Converter unit,
Fig. 2 represents the first form of exercise is mounted power Converter unit, according to Fig. 1, and
Fig. 3 shows partially the second form of implementation of hook item power Converter unit, according to Fig. 1.
In Fig. 1, which is the front view power Converter unit, according to the invention, items 2 and 4 are marked accordingly power semiconductor modules, in particular, disable power semiconductor modules, for example, bipolar transistor with insulated gate (IGBT), position 6 - liquid cooler, a position 8 - busbars, item 10 - second liquid cooling, item 12 - bracket, items 14 and 16, respectively protracted and bolt position 18 - supporting elements. In addition, in this image items 20 and 22 designated device inlet and outlet coolant.
Both power semiconductor module 2 and 4 mechanical rezhimno connected with liquid cooler 6. Busbars 8, which, in particular, laminated, may contain two power bus for example, one positive power bus and one load power bus, or one-load power bus and one negative power bus, or three power bus, for example, positive, stress and negative power bus. The number of power bus bus-8 depends on the electrical connection of both power semiconductor modules 2 and 4. When these two power semiconductor modules 2 and 4 are electrically connected in parallel, this leads 8 contains only two power bus. If, on the contrary, these two power semiconductor modules 2 and 4 electrically connected in series and form a phase Converter module, this leads 8 contains three power bus. If the Converter module is used as a phase module, then three power bus provided busbars 8 are positive, stress and negative power bus. These power bus are located one above another, and respectively between the two power tyres is the insulating layer, and in particular they are sealed.
This leads 8 are joined with the electrical conclusions of each of the power semiconductor modules 2 and 4, with both the power semiconductor modules 2 and 4 depict accordingly, only one electric outlet 24 1 1 and 26 . These electric conclusions 24 1 and 26 may 1 be a contact pins for soldering or screw-bolts. Starting from a certain power power semiconductor module 2, 4, power semiconductor modules of 2, 4 are as electrical terminals 24 and 26 only the threaded bolts. In accordance with the connection of both power semiconductor modules of 2, 4, their conclusions 24, 26 electrically actively connected respectively with one specific power bus bus-8. This leads 8 relies not only on the conclusions of 24, 26 power semiconductor modules of 2, 4, but also on a set of reference items 18. They are located along one of the longitudinal sides of the power Converter unit.
Because as the cooler this energy Converter module provides a liquid cooler 6, it enables the device supply 20 coolant and removal device 22 coolant. Through these devices supply and removal 20 and 22 of coolant in energy Converter module is hydraulically connected with the fluid circuit. As the coolant can be used any liquid, preferably water mixed with glycol.
Because it is constantly increasing allowable load current used in power conversion module power semiconductor modules of 2, 4, it increases the current in the power of the tyres of the bus-8. This leads to the square losses increase in busbars 8. As a consequence, increases the temperature in the busbars 8. How high could be the limiting temperature on the busbars 8, depends on the insulation material. This means that in laminated busbars 8 temperature limit sets laminating material of this bus-8. For target use of converters that means the capacity limit, which is not defined already used power semiconductor modules and specific limit temperature of the insulation material.
To take arising in busbars 8 power loss, this leads 8 comes with a second liquid chiller 10. Device inlet and outlet 28 and 30 of this second liquid cooler through the connecting sleeves 32 and 34, respectively connected with hydraulic cooling environment with fluid circuit liquid cooler 6. Liquid loop liquid cooler 6 designated as the primary circuit, and liquid loop second liquid cooler 10 - as the secondary circuit. Primary and secondary circuits can be hydraulically connected in parallel or in series. This second liquid chiller 10 in contrast image can cover approximately entire surface of the bus-8. To this second liquid chiller 10 electrically isolate from the bus-8, provides an insulating layer 36, which should be, however, good thermal conductivity. The insulation layer 36 in the simplest variant can be made by heat-conducting paste. To heat transfer has been effective, the second liquid chiller 10 connected to the bus with 8 power and/or flush.
For making connections to bus 8 with power and/or flush, you must have at least one clamping element. If there are multiple clamping elements, they come with the distribution in the longitudinal direction of the second liquid cooler 10. In depicts the form of realization as the clamping element is provided bracket 12 (Fig. 2) with two long screws 14 and 16. This bracket Fig. 2 has done according to the size of the second liquid cooler deepening 38. To adjust the pressures of the second liquid cooler 10 on the bus-bar 8, bracket 12 has at least two clamping element 40. Due to turn these clamping elements 40 increases the pressure on the second liquid chiller 10 and at the same time, on the corresponding surface of the bus-8.
Alternative forms of implementation of the clamping elements is a spring leaf or a bracket 42 with elastic intermediate part (Fig. 3). Bracket with 12 Fig. 2, besides the deepening of 38 for the second liquid cooler 10, has another deepening 46, so as to fit it in the form of a laminated surface of the bus-8. If bracket 12 are not used for more pressing items 40, deepening 38 should be made so that when it is mounted bracket 12 were paid a certain pressures along the second liquid cooler 10. According to the form of realization bracket with 42 Fig. 3, this bracket is in the middle of elastic intermediate element 44, which in assembled condition bracket 42 exerts pressures on the second liquid chiller 10.
1. Energy Converter module at least one power semiconductor modules (2, 4), thermally actively connected mechanically with liquid cooler (6) and by bus (8)that contain at least two separate one from another power bus is electrically active connection with the conclusions of the power Converter unit, wherein the busbars (8) connected with power and/or flush with the second liquid cooler (10), while between the upper power bus bus (8) and the second liquid cooler is thermally active and electrically insulating layer (36).
2. Energy Converter module according to claim 1, wherein the connection for the power and/or flush between the wheels (8) and second liquid cooler (10) has at least one clamping element.
3. Energy Converter module according to claim 1 or 2, wherein the second liquid cooler (10) hydraulically connected with liquid cooler (6).
4. Energy Converter module according to claim 1, wherein the second liquid cooler (10) the surface covers at least approximately the greater part of the surface of the bus (8).
5. Energy Converter module according to claim 2, characterized in that, as the clamping element is provided spring sheet with two long screws (14, 16).
6. Energy Converter module according to claim 2, characterized in that, as the clamping element is provided executed flush bracket (12) with two long screws (14, 16).
7. Energy Converter module of claim 6, wherein is made with a positive locking bracket (12) in the zone of the second liquid cooler (10) equipped with a flexible item (44).
8. Energy Converter module according to claim 1, characterized in that the insulation layer (36) made with thermally active front-end materials.
9. Energy Converter module according to claim 1, characterized in that the insulation layer (36) made with thermally active and interface electrically insulating materials.
10. Energy Converter module according to claim 1, characterized in that isolated power bus a bus (8) and insulation (36) laminated to each other.
|