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Method to produce interconnections in high-density electronic modules. RU patent 2504046.

IPC classes for russian patent Method to produce interconnections in high-density electronic modules. RU patent 2504046. (RU 2504046):

H01L25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (devices consisting of a plurality of solid state components formed in or on a common substrate H01L0027000000; assemblies of photoelectronic cells H01L0031042000)

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FIELD: instrument making.

SUBSTANCE: in the initial stock they open windows in a layer of polymer, they fill these windows with a conducting material, they open windows in the conducting layer, they fill these windows with a polymer, after filling of the windows in the conducting layer with the polymer they separate the stock into separate parts, lay them in series into a packet and connect layers of the packet with the bearing substrate.

EFFECT: expanded arsenal of methods to reduce cost of manufacturing and accelerate the process of creation of high-density electronic modules.

29 dwg

The invention relates to the electronics microelectronics.

An important stage in the production of high-density electronic modules is the formation of interconnects. The technical result of the invention is an expansion of the ways to reduce the cost of manufacturing of high-density electronic modules. In this case, this result is achieved at the stage of forming interconnects.

Consider analogs.

According to the Russian patent 2133522 offers a way of manufacturing and control of electronic components, that is, «that many crystals have in the press-form, focusing on the pads of crystals and basic elements of the mold, isolate all the unprotected surface of the crystals, except pads. The specificity of the method consists in that the location of the press-form crystals fixed among themselves with the formation of a group of media, providing the location of the front surfaces of crystals in the same plane with one surface of the media group, while on the plane put together all of conductors required to and control, as well as the external connector of the carrier. Simultaneously with crystals in the press-form is put group metal frame, which is fixed simultaneously with crystals. Group media can be established to the flexible circuit Board, which is connected with a rigid Foundation. The technical result of the invention is cheaper processes and finishing control, reduction of technological process of assemblage and control of electronic components.»

There is a method of manufacturing of three-dimensional multicomponent electron module on the Russian patent 2193260:

«The essence of the invention: open frame components are placed in the Windows group ceramic pieces with a focus on a circuit, and with the observance of a single plane of the location of the active zones components and front surface of the workpiece. Components are fixed in such a situation, and electrically isolate unprotected zones components on their face. Further put mainly by the method of vacuum spraying conductors on the front and back side of the workpiece and components, while forming the connector and wires required for and control. Fit the blade cut out from a group procurement and collect the package, connecting them to each other capillary cable. To one of the edges of the package to external outputs and seal made module. The technical result is to obtain three-dimensional modules with high packing density, with effective heat sink and low cost».

These methods did not differ versatility. The universal way of reducing the cost of manufacturing of high-density electronic modules. It consists in the following.

Known stages of obtaining interconnects in multilayer printed circuit boards, which can be referred to high-density electronic modules (V.A. Ilyin Technology for manufacture of PCB. HP, 1984) and which can be summarized as follows (the example is given in figure 1-22):

1. Initial billet: polymer film 2 coated with a layer of conductive material (copper) 1, hereinafter called foil-clad material (figure 1), divided into parts (figure 2; 3 - layer 1, 4 - layer 2, 5 - layer 3, 6 - layer 4).

2. Open the window in the polymer film layer 1 (figure 3).

3. Fill the window in the polymer film layer 1 conductive material (figure 4).

4. Paste layer 1 on the bearing substrate 7 (figure 5).

5. Open the window in the conductive material layer 1 (Fig.6).

6. Fill the window in the conductive material layer 1 polymer (Fig.7).

7. Paste layer 2 foil-material (Fig.8).

8. Reveal transient window conductive layer 2 (Fig.9).

9. Fill conductive material transitional window conductive layer 2 (figure 10).

10. Open the window in the conductive layer 2 (figure 11).

11. Fill the window in the conductive layer 2 polymer (fig.12).

12. Paste layer 3 foil material (fig.13).

13. Reveal transient window conductive layer 3 (figure 14).

14. Fill conductive material transitional window conductive layer 3 (fig.15).

15. Open the window in the conductive layer 3 (fig.16).

16. Fill the window in the conductive layer 3 polymer (fig.17).

17. Paste layer 4 foil material (fig.18).

18. Reveal transient window conductive layer 4 (fig.19).

19. Fill conductive material transitional window conductive layer 4 (fig.20).

20. Open the window in the conductive layer 4 (fig.21).

21. Fill the window in the conductive layer 4 polymer (fig.22).

This method is the prototype.

To expedite the process of creating high-density electronic modules and reduce costs divide it into separate parts after filling out the Windows in the conductive layer polymer. Then they consistently placed in a bag and spliced layers of package together with the bearing substrate. Then the formation of high density interconnects in electronic modules is carried out sequentially as follows (the example is given on fig.23-29):

1. In the original procurement, representing a polymer film 2 coated with a layer of conductive material (copper) 1 (fig.23), opened the window in a layer of polymer (fig.24).

2. Fill the window in a layer of polymer conductive material (fig.25).

3. Open the window in the conductive layer (fig.26).

4. Fill the window in the conductive layer polymer (fig.27).

5. Divide it into separate parts (fig.28).

6. Consistently stack part of the procurement package and spliced layers package with carrier substrate 7 (fig.29).

Figure 1-22 illustrate the prototype method, and fig.23-29 - the proposed method.

Comparison of the prototype and the proposed method shows that the invention can speed up the process of obtaining high density interconnects in electronic modules and make it cheaper.

The method of obtaining high density interconnects in electronic modules, which consists in the fact that in the original procurement reveal the window in a layer of polymer, fill this window conductive material, opened the window in the conductive layer fill the window polymer is characterized in that after filling out the Windows in the conductive layer polymer divide it into separate parts, consistently placed them in a bag and spliced layers of package together with the bearing substrate.