3d electronic module
 Device for heat removal from elements of radio-electronic equipment / 2335103Invention is related to radio-electronic engineering, in particular to cooling radio-electronic equipment (REE), and may be used for cooling REE elements operating under cyclical thermal effects. Technical result is achieved by intensifying cooling process and hardening fillers in time break between connection of REE elements. For that purpose, in metal reservoir divided into sections filled with appropriate fillers, a channel is installed for pumping coolant through it during break in operation of REE element. Channel is arranged in the form of pipeline from highly heat-conducting material installed so that to pass through every section with appropriate filler. |
 Cooler of radio electronic equipment / 2335102Invention is related to radio electronic equipment, in particular to cooling radio electronic equipment and may be used for cooling elements of radio electronic equipment operating under cyclical thermal influences. Technical result is achieved by intensifiying of cooling and hardening processes of melted fillers during interruption of radio element operation by means of application of thermal electric battery. Cooler of radio electronic equipment consists of thin-walled metal reservoir divided, by metal partitions installed parallel to plane of cooled radio elements location, into isolated sections filled with melted fillers with different melting temperatures that increase in direction to plane of cooled radio elements installation. Top section (having the largest area), whereon cooled radio element is installed, has, as a filler, substance with the lowest melting temperature, and every subsequent section is smaller than the previous one in area, and is filled with melted filler with melting temperature higher than that of the previous one. Thermal electric modules are adjacent as soldered joints to bottom surfaces of sections in part that protrudes above the following sections. Second soldered joints of thermoelectric module are installed on heat-absorbing soldered joint of the bottom basic cascade of thermoelectric battery, which is also thermally contacted with central area of metal reservoir surface opposite to installation of cooled radio elements. To heat-release soldered joint of basic thermoelectric battery radiator is connected. Thermoelectric battery is supplied by source of electric energy. |
 Cooler of radio-electronic equipment / 2334381Intensification of the process of cooling and hardening of the melting filters in the break of working of a radioelement by means of a cascade thermoelectric battery. The cooler of the radio-electronic equipment consists of a thin-walled metal container divided by metal partitions, located parallel to the plane of the arrangement of the cooled radio-elements, in isolated compartments filled with the melting filters with different melting points, increasing in the direction of the plane of installation of the cooled radio-elements. The partitions stick out of the lateral surfaces of the metal container and are connected to the thermal contact with cold junctions of thermoelectric modules forming the upper cascades of the battery. Thermoelectric modules also are placed on the cold junctions of the lower base cascade of the battery on the edges. Thus to the cold junction of the base thermoelectric battery is attached a radiator, and the feed of the thermoelectric battery is carried out by a source of the electric power. |
 Device for removal of heat from element of communication-electronic equipment / 2334380Elements of communication-electronic equipment are made on two opposite surfaces of the metallic container divided by partitions in the compartments with fillers, which have different melting points. Thus the number of compartments is odd, and the melting point of the fillers increases from the compartment located in the middle of the container, in the direction of the plane of installation of the cooled elements of the communication-electronic equipment. In contact with the first junctions of the thermoelectric battery the remaining surfaces of the metal container, free from the elements of the communication-electronic equipment is the result. |
 Thermal pipe with forced circulation of fluid / 2334379Between heat-releasing zone and fluid pipeline there is a check valve, partition made of finely porous material or capillary section of pipeline, fluid pipeline has tapping in the form of accumulation pipeline tightly sealed from one side, which is equipped with device of periodical heating up to temperature, which is higher than the temperature of heat-releasing section and periodical cooling down to the temperature, which is lower than the temperature of heat-releasing section. Shape and dimensions of section of fluid and accumulating pipelines provide the possibility to move steam and fluid mixture in the mode, in which portions of liquid are moved along pipeline together with the steam plugs without exfoliation into separate steam and fluid flows. |
 Device of cooling of elements of heat-removing electrical equipment / 2334378As the edges with intensifiers can be, for example, holes, ledges, etc. In the lower part of the edges one is established, at least one annular deflector which divides the flow of cooling air on two parts. Part of the air washes the basic surface of edges, and other part goes on the adjusting platform executed in the form of a truncated cone with the cooled device established inside. |
 Radiator device / 2333621Invention pertains to electronics and specifically to heat transfer and can be used in aircraft-borne equipment for increasing efficiency of heat transfer and protection from electromagnetic interference. The radiator device is in contact with a heat-loaded element and has several lamellar thermal plates, each of which has a heat absorption part, in contact with the surface of the heat loaded element, and a heat releasing surface, which is a continuation of the heat absorption part. The thermal plates are arranged in piles, in which the heat absorption part of the plates forms the centre of the pile of the thermal plates. The device also has a pair of squeezing blocks between the heat absorption parts of the pile of thermal plates and squeezing the heat absorption part of the plates. The heat releasing part of the plates is such that, after forming the plates, a structure is formed, in which the heat releasing parts of the plate are parallel to each other, and the heat absorption parts form a closed space on all sides, in which the heat loaded element is put. The plates have a current conducting coating. The radiator device has a ventilator, fitted such that, air streams pass through parallel thermal plates. Besides that, the radiator device is in electrical contact with the contact area of a printed circuit board, forming a single earthing contour. |
 Cooling device for electronic elements / 2332818Lowering of total thermal resistance due to using of wrap-around heat-transfer tube as thermal loop, which tube features local positioning of capillary structure in evaporator, is achieved by the fact, that the device consists of heat-transfer tube performed as loop containing flat evaporator with capillary structure, and cooling fan. Flat evaporator has steam and liquid frontal cameras communicating with each other by means of parallel tube bundle acting as condenser connected with external finning. Tube bundle can be connected with evaporator cameras directly or by means of tube collectors. Due to using of flat-shaped evaporator and increase of uniformity of radiator ribs heating by condenser performed according to collector scheme. |
 Cabinet for radioelectronic equipment / 2328842Casing of cabinet is separated by horizontal partitions into floors, on which demountable electric units with thermally loaded elements are installed. On the side wall of casing from the external side absorption-diffusion refrigerator machine is attached, which consists of evaporator, condenser, reflux cooler, absorber, generator. In interfloor partitions there are channels arranged, where evaporating sections of thermal pipes are installed. Condensation sections of thermal pipes are fixed with the help of split joints on the internal side of cabinet casing wall and are thermally connected to evaporator 6 of absorption-diffusion refrigerator machine. Evaporator is installed in heat insulated unit, which is fixed on internal side of cabinet wall with the help of split joints. |
 Air cooling system / 2327237Invention relates to temperature systems and can be used for air-cooling of equipment including electronics installed on mobile carriers. Air-cooling system includes plenum and exhaust fans with air ducts, airflow switch with two valves. Airflow switch connects exhaust fan outlet with cold vent by means of one valve. Plenum fan inlet is connected to cold vent be means of another valve. Besides, airflow switch includes housing with fastened valves attached to lever through elastic draft. Airflow switch is installed on the shaft. |
 Method for producing polymeric electronic module / 2314598Proposed method includes manufacture of integrated-circuit boards for polymeric electronic module in the form of embossed boards carrying sunk conductors which are actually completely disposed in boards. They have minimal possible width at equivalent size much greater than similar flat conductor which makes it possible to provide external width of, and space between, conductors not over those on chip. Heat-transfer method provides for effective heat release both directly from heating components and from conductors carrying heavy load current. |
 Three-dimensional electronic module with ball leads / 2312425Electronic module dimensions depend on dimensions of greatest-size shape-forming electronic components in combination with other components inserted in micro-boards. In the process use is made of both sides and entire space of components and micro-boards for disposing electronic components manufactured by using semiconductor, thin-film, and thick-film technologies. During oriented joining of all separate components and micro-boards into stack by adhesion conductors are deposited onto their end surfaces forming common plane to interconnect them and to form contact pads with external ball leads deposited onto the latter. Assembled module is enclosed in mechanically strong and electrically insulated sealing shell. All internal and external interconnections are made using highly reliable vacuum evaporation method. |
 Power semiconductor module / 2309482Proposed power semiconductor module has two main power leads disposed on opposite, actually parallel, main surfaces of module of which first one is made in the form of top electricity-conductive closing board, shielding package connected to top closing board, and at least two sub-modules inserted between both main leads of power semiconductor module; each sub-module has two main power leads and at least one semiconductor chip carrying main electrodes electrically connected to sub-module main leads. Sub-modules are disposed close to one another, bear compressive force, and are tightly fitted through one of two main surfaces to top electricity-conductive closing board. At least two sub-modules are electrically interconnected in series. Such series connection of sub-modules disposed close to one another doubles maximal closing voltage across module. |
 Semiconductor power module / 2302686Proposed semiconductor power module has module package incorporating current-carrying cover wafer and current-carrying base wafer disposed essentially in parallel with cover wafer, as well as package insulating wall disposed between cover wafer and base wafer; semiconductor power circuit disposed within module package that incorporates at least two power leads of which one is electrically connected to cover wafer and other one, to base wafer, and also at least two leads brought out of module package, one of them being electrically connected to cover wafer; essentially flat printed-circuit board with at least two layers that protrudes from module package; two leads of semiconductor power circuit are made in the form of printed-circuit conductors, one being control-lead conductor and other one, cover wafer conductor, both actually disposed in parallel with printed-circuit board base on opposite ends of board; the latter is mechanically secured on cover wafer by means of fastening member so that cover wafer lead conductor disposed on printed-circuit board end facing cover wafer is electrically connected to cover wafer. |
 Semiconductor power module / 2302685Proposed semiconductor power module has at least two current-carrying base wafers, plurality of semiconductor integrated circuits, and module package incorporating current-carrying cover and package stiff members; semiconductor integrated circuits are electrically connected by means of first main electrodes to at least two mentioned base wafers and by means of second main electrodes they are connected through flexible contact members to cover; the latter is joined with stiff members of module package and stiff members of the latter function to restrict compression of flexible contact members. Module has plurality of pre-assembled and fully checked submodules, each incorporating base wafer and at least one of mentioned semiconductor integrated circuits; semiconductor integrated circuits of each module are installed on base wafer of respective submodule; base wafer of each of many submodules is designed for displacement toward cover. |
 Microwave hybrid integrated circuit / 2302056Proposed microwave hybrid integrated circuit has insulating substrate bearing conductor pattern on its face side and grounding screen conductors, on its underside. Insulating substrate rear side is disposed on metal heat-transfer base and connected thereto; it also has hole accommodating heat-and-electricity conducting metal insert with semiconductor device chip disposed on its butt end at substrate face side and connected thereto; capacitor chips are mounted on two opposite ends of device at distance of maximum 0.5 mm from the latter. Height of metal-and-electricity conducting insert at location point of semiconductor device and capacitor chips is smaller than insulating substrate thickness by their respective height and clearance between substrate hole walls, and two other sides of semiconductor device chip is not over 0.2 mm. |
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Method for producing three-dimensional multichip micromodule / 2299497 Proposed method for producing three-dimensional hybrid integrated micromodule includes manufacture of flexible board in the form of strip carrying set of conductors for connection to IC contact pads and contact pads on one end of strip functioning as module lead, as well as projections arranged in staggered manner on two sides of strip and provided with seats to receive integrated circuits; projections carrying integrated circuits are bent onto strip at bending radius equal to conductor thickness as a minimum; strip is folded up and in zigzag manner in sequence affording coaxial disposition of integrated circuits one on top of other so that any risk of shorting out IC leads is eliminated and strip end carrying module leads is kept free; projections are glued to strip and to folded sections of strip, thickness of glue joint being not less than that of mentioned conductors. |
 Matrix electrical-energy converter / 2298858Proposed converter designed to convert electrical energy between voltage supply (supply mains) and at least one current supply, such as load, has switch matrix connecting voltage supply to current supply. This matrix converter is characterized in that each of mentioned switches has two contacts disposed in respective separate parallel planes and photoconductive diamond substrate placed between two mentioned contacts of switch. Each switch is controlled by light source irradiating diamond substrate disposed between two contacts. Light source of each respective switch is disposed so that it faces one of two contacts of switch which is provided with plurality of holes for passing light from mentioned source and substrate. |
 Module package and power semiconductor module / 2298857Proposed power semiconductor module package is assembled of two electrically insulated components attached to one another. First of mentioned package components has at least two holes to pass power leads and depression in the form of slit. At least two isolating walls between holes are provided on package surface perpendicular to the latter. One isolating wall is part of second package component out of mentioned ones; it is inserted into depression in first mentioned package component; at least one second wall out of mentioned isolating walls is part of first package component. Isolating walls placed between holes passing two power leads provide for compact arrangement of leads. |
 High-power hybrid microwave integrated circuit / 2298255Proposed device has transistors in the form of chips with flat heavy-current leads. Current-carrying metal base has projection aligned with insulating substrate hole and disposed in this hole, its height being such that its upper surface is flush with face side of insulating substrate. Depression provided on upper surface of projection is of through type on end of flat heavy-current leads of chip of one of transistors connected to metal coat of topological pattern. At least one contact pad provided with and connected to plate readily conducting heat and electricity is made on upper surface of heat-conducting metal base at least on one end of chip of one of transistors, its size being equal to or greater than 0.3 x 0.3 mm. This metal plate has at least one groove holding chip of other transistor; it is through groove on side of heavy-current leads connected to metal coat of topological pattern; it is of same size as the latter and its bottom thickness is 0.1-0.5 mm. Other flat heavy-current leads of transistor chips are connected to projection on heat-conducting metal base. |
 Device for cooling electronic blocks / 2319327Device is intended for cooling and stabilizing temperature of constantly operating radio-electronic equipment with high operation resource, which uses heat-exhausting elements in composition of structure (processor, video cards, power supply and the like). Device for cooling electronic blocks contains radiator and at least one thermo-electric cooling module, positioned between electronic blocks and radiator and connected to power supply, and also cooling heat exchange, which interacts with radiator through gas-regulated heat pipe. |
FIELD: electrical engineering.
SUBSTANCE: 3D electronic module incorporating standard encased components and/or PCBs with caseless active and passive components, an outer heat sink system and outer output terminals. Note that encased components and the aforesaid PCBs feature double-side outputs arrangement and are located between the printed switching PCBs arranged in parallel and furnished with plated holes. The connecting PCB abuts, with its end face surfaces, on the aforesaid plated holes, the said connecting PCB having an electrical and mechanical connection to the switching PCBs. The switching PCB and the connecting PCB accommodates the 3D connectors, the latter being interconnected to form a cubic and/or tubular 3D cell made up of a set of 3D cells forming a plug-and-socket connection. The active element heat sink system represents a tubular 3D cell furnished with coaxially-arranged heat-sink lines wherein the active elements are in thermal contact with the pipe walls.
EFFECT: multi-purpose design, higher-density module featuring higher reparability and heat-sink properties.
19 dwg
The invention relates to electronics and can be used in avionics aircraft when linking modules, containing a large number of electrical connections to join them, to solve problems create a reliable three-dimensional electronic module by increasing the versatility of the design and density of the modules, the efficiency of the heat sink while maintaining a high maintainability.
Known technical solution is a three - dimensional flexible electronic module (Patent RF № 2119276, NC 3/36, publ. 20.09.1998)consisting of planar electronic components, hull electronic components and blade with frameless active and passive electronic components. The module may include various sensors and systems transceiver. Unpackaged electronic components, housing electronic components and blade in addition to the internal connections are connected electrically between a flexible corrugated switching cards, having a variable cross-section. Each fuel component is supplied by a heat sink having a thermal contact with the outer flexible membrane module. The disadvantage of this technical solution is insufficient electrical integrity of the design and the inevitability of short circuits, which affects reliably the ti three-dimensional electronic module. Uneven placement of the components reduces the density of the layout of the entire device. As each fuel component is supplied by a heat sink having a thermal contact with the shell, then the length of the heat is sufficiently large, which reduces the efficiency of talotta. Flexible switching cards does not provide the flexibility and maintainability of the device due to insufficient dissemination of technology manufacturing flexible circuit boards and low mechanical stiffness, which reduces the reliability of three-dimensional electronic module as a whole.
The closest technical solution (prototype) is a three-dimensional electronic module (Patent RF №2176134, NC 7/02, publ. 20.11.2001)containing standard carbosilane components and/or of the blade with frameless active and passive components, external heat sink and external leads, and carbosilane components and these have double-sided blade pin and located between the parallel contains a printed circuit switching cards with metallized holes, between parallel contains a printed circuit switching cards end surfaces to him is the connecting Board having electrical and mechanical connection of printed circuit switching cards, introduced heat e is holding the comb partially covers the housing compositemanager component or the basis of the specified blade and contains, at least one projection or plane having thermal contact with an external heat sink, the housing compositemanager component and the basis of this blade is made of thermally conductive material. The disadvantage of the prototype is nereshennosti connection switching plates printed with connecting plates and, consequently, low flexibility and maintainability of the module. The following drawbacks is the low efficiency of heat dissipation to the external environment, which is the consequence of the increased path length for heat dissipation, and low density modules and low reliability of the device.
The technical result of the invention is to provide a reliable three-dimensional electronic module, which is achieved by increasing the versatility of the design, the more dense placement of modules with high maintainability, efficiency of the heat sink.
The technical result is achieved by the fact that the three-dimensional electronic module containing standard carbosilane components and/or of the blade with frameless active and passive components, external heat sink and external leads, and carbosilane components and these have double-sided blade pin and located between parallel o f the tion printed patch cards with metallized holes, between parallel contains a printed circuit switching cards, the end surfaces to him is the connecting Board having electrical and mechanical connection of printed circuit switching cards, printed on the switching Board and the connecting Board formed three-dimensional electrical connector, with three-dimensional electrical connectors of the switching circuits and the connecting circuit boards are connected with the formation of cubic and/or three-dimensional tubular cells, forming from a variety of three-dimensional three-dimensional cells detachable electrical connection, an external heat sink system of active elements is provided by a tubular three-dimensional cell, equipped with coaxial spaced heat pipes, where the active elements are in thermal contact with the pipe walls.
The invention consists in that, in the proposed three-dimensional electronic module connection switching circuit Board and the connecting Board detachable, which allows for high flexibility and maintainability of the device. The module contains standard carbosilane components and/or of the blade with frameless active and passive components, and carbosilane components and these have double-sided blade pin and located between the pair is placed parallel to the printed patch cards with metallized holes. Between parallel contains a printed circuit switching cards end surfaces to him is a connection fee, which is with electrical and mechanical connection on circuit switching Board and the connecting Board formed three-dimensional electrical connector, and three-dimensional electrical connectors of the switching circuits and the connecting circuit boards are connected with the formation of cubic and/or three-dimensional tubular cells, and many three-dimensional cell forms a three-dimensional detachable electrical connection. This design decision allows to increase the density of the modules in the device. Three-dimensional electronic connector has, in comparison with the prototype, reduced the length of the heat sink, in which the external heat sink system of active elements provided by the fact that three-dimensional tubular cell is provided with a coaxially spaced heat pipes, where the active elements are in thermal contact with the pipe wall, which provides high heat dissipation and reliability of the device as a whole.
The invention is illustrated by drawings, where:
figure 1 - switching charges at ISO;
figure 2 - the spatial arrangement of the connectors in the ISO (printed circuit Board is conventionally not shown);
figure 3 - connection charges in isomer and;
4 is a cubic three-dimensional module in ISO;
figure 5 - connection of the first Board with the second Board;
6 connection of the third circuit Board with the second Board;
7 connection of the fourth Board with the first and third plates;
Fig connection of the fifth Board with the first and third plates;
Fig.9 connection of the sixth Board with the first and third plates;
figure 10 - connection of the first cubic cell with a second cubic cell;
11 connection of the first and second cubic cells with the third and fourth cubic cells;
Fig connection of the first, second, third, fourth cubic cells with the fifth, sixth, seventh, eighth cubic cells;
Fig first three-dimensional tubular cell;
Fig connection of the first tubular cells from the second tubular cell;
Fig connection of the first, second tubular cells from the third, fourth tubular cells;
Fig connection of the first, second, third, fourth tubular cells with the fifth, sixth, seventh, eighth tubular cells;
Fig - dimensional electronic tubular module with a local enlarged view (case conventionally not shown);
Fig - General view of the three-dimensional tubular module in ISO;
Fig - cross section of a three-dimensional tubular module with a local enlarged view.
In the drawings, the following designation is Oia:
1 is a three - dimensional electronic module;
2 - standard carbosilane elements;
3 - blade;
4 - open the active components (fuel elements);
5 is a planar passive components;
6 is an external heat sink;
7 - external leads;
8 is a printed - circuit switching fee;
8-1 is the first card in the cell - to-Board switching;
8-3 - third card in the cell - to-Board switching;
9 - plated holes;
10 - end surface of the connecting Board;
11 - backplane;
11-2 - second charge in the cell - to-Board connection;
11-4 is the fourth card in the cell - to-Board connection;
11-5 is the fifth card in the cell - to-Board connection;
11-6 is the sixth card in the cell - to-Board connection;
12 - electrical and mechanical connection fees connection with the card switching;
13 is a three - dimensional electrical connector;
14 is a multilayer Board;
15 is a structurally integral connector;
16 - slot structurally integral connector;
17 - plug structurally integral connector;
18 - the first connector breakout Board;
19 - one of the layers of the multilayer Board;
20 - the second connector breakout Board;
21 - the third connector breakout Board;
22 - the fourth connector breakout Board;
23 - the fifth connector breakout Board;
24 - the sixth connector breakout Board;
25 - plane switching Board;
26 - end surface of the switching Board;
27 is an electrical connection between the electrical connectors inside the patch and inside wiring Board;
28 is a three - dimensional electrical connector formed on the connecting Board;
29 - two-sided card;
30 - electrical connector on backplane;
31 - the opposite side of the card;
32 - plane wiring Board;
33 - cubic three-dimensional cell;
33-1 - the first three-dimensional cubic cell;
33-2 - second three-dimensional cubic cell;
33-3 - third of a cubic three-dimensional cell;
33-4 - fourth cubic three-dimensional cell;
33-5 - fifth of a cubic three-dimensional cell;
33-6 - sixth of a cubic three-dimensional cell;
33-7 - seventh cubic three-dimensional cell;
33-8 - eighth of a cubic three-dimensional cell;
34 is a three-dimensional tubular cell;
34-1 - the first three-dimensional tubular cell;
34-2 - second three-dimensional tubular cell;
34-3 - third tubular three-dimensional cell;
34-4 - fourth three-dimensional tubular cell;
35 - set of three-dimensional cells;
36 - electrical connection of a variety of three-dimensional cells;
37 - coaxial raspriedieliajutsia pipe;
38 - heat pipe;
39 - thermal contact with the wall of the heat pipe;
40 - wall heat pipes;
41 - G-shaped design;
42 - S-shaped design;
43 is a tubular structure;
44 - Cup design;
45 - the case of the cubic three-dimensional cells;
46 is a heat pipe.
Three-dimensional electronic module 1 (figure 4, 16-19) contains the standard carbosilane components 2 (1, 3, 4) and of the blade 3 with planar active 4 (1, 3, 4, 17) and passive components 5 (1, 3, 4). Module 1 (figure 4, 16-19) contains the external heat sink 6 (Fig) and external leads 7, and carbosilane components 2 (1, 3, 4) and the specified blade 3 have double-sided pin and located between the parallel contains a printed circuit switching plates 8 (Fig 1, 4) with metallized holes 9 (Fig 3). Between parallel contains a printed circuit switching plates 8 (Fig 1, 4) end surfaces 10 (figure 3) is the connection card 11 (Fig 3, 4), with electrical and mechanical connection 12 (5 to 9) printed circuit switching plates 8 (Fig 1, 4). On circuit switching Board 8 formed three-dimensional electrical connector 13, consisting of a multilayer circuit Board 14 (Fig 1) and structurally integral connector 15 (Fig 1, 2, 4), is the CSOs in three mutually perpendicular directions. Moreover, structurally integral connector 15 that is located on the switching Board 8, (1, 4) consists of electrically and mechanically interconnected parts of the socket 16 (Fig 1, 2) and the plug 17. On the switching Board 8 (Fig 1, 4) one connector 18 (Fig 1, 2) formed in one of the layers 19 (1) of the multilayer circuit Board 14, the second 20 (1, 2) is perpendicular to the first connector 18 is also formed in one of the layers 19 (1) of the multilayer circuit Board 14, and the electrical connectors 15 (1, 2, 4) intersect at different layers 19 (1) Board 8 (Fig 1, 4). Third 21 (1, 2), 22 fourth, fifth, 23, 24 sixth connectors on the breakout Board 8 (Fig 1, 4) are perpendicular to the plane 25 (Fig 1) Board 8 (Fig 1, 4) switching and are located in four places symmetrically socket 16 (Fig 1, 2) - on the one hand, and the plug 17 with the other hand. The first 18 and second 20 connectors on the breakout Board 8 (Fig 1, 4) are arranged so that one end 26 (Fig 1) Board 8 (Fig 1, 4) formed socket 16 (Fig 1, 2) electrical connector 15 (Fig 1, 2,4), with the other end 26 (Fig 1) male 17 (Fig 1, 2). Electrical connection 27 (figure 2) between the electrical connectors 15 (1, 2, 4) in the switching Board 8 (Fig 1, 4) is carried out depending on the circuit design. On a bilateral 29 (3) of the connecting Board 11 (Fig 3, 4) formed three-dimensional electrical connect the ü 28 (3), where there are two connector 30 into plated holes 9 on opposite sides of the Board 31 27 (2) connective perpendicular to the plane 32 (Fig 3) Board 11 (Fig 3, 4), where on one side there is a slot 16 (Fig 1, 2) structurally integral connector 15 (Fig 1, 2, 4), and on the other hand - a plug 17 (Fig 1, 2). Electrical connection between the electrical connectors 15 (1, 2, 4) inside wiring Board 11 (Fig 3, 4) is carried out depending on the circuit design. Three-dimensional electrical connectors 13 (1, 4) are connected with three-dimensional electrical connector 28 (Fig 3) with the formation of cubic 33 (4, 9) and/or tube 34 (Fig, 16, 17) three-dimensional cell that forms from a variety of three-dimensional cells 35 (4) three-dimensional detachable electrical connection 36 (figure 10, 11). The external heat sink 6 (Fig) active elements 4 (Fig 1, 3, 4, 17) is provided so that the tube 34 (Fig, 16, 17) three-dimensional cell is equipped with coaxial 37 (Fig) spaced heat pipes 38, where the active elements are thermal contact 39 with the walls 40 of the heat pipe 38.
The Assembly of three-dimensional electronic module 1 (figure 4, 16-19) is performed in the following sequence:
- Assembly of the switching plates 8 (Fig 1,4) forming a three-dimensional electrical connector 13 with the installation of the connector 15 (Fig 1, 2, 4) on asnyk layer 19 (Fig 1) and perpendicular to the plane 25 of the Board 8 (Fig 1,4) in three directions with the standard installation of housed components 2 (figure 1, 3, 4) and/or blade 3 with planar active 4 (1, 3, 4, 17) and passive 5 (1, 3, 4) components depending on technical solutions;
the Assembly wiring Board 11 (Fig 3, 4) with the formation of one-dimensional electrical connector 28 (Fig 3) with the installation of the connector 15 (Fig 1, 2, 4) in two opposite end sides 26 (1) perpendicular to the plane 32 (Fig 3) cards with a standard installation of housed components 2 (1, 3, 4) and/or blade 3 with planar active 4 (1, 3, 4, 17) and passive 5 (1, 3, 4) components depending on technical solutions;
- Assembly of three-dimensional cubic electronic module 1 (figure 4, 16-19). Fee 11-2 (figure 5-9, 13) connection is established to the Board 8-1 switching with the formation of the G-shaped structures 41 (figure 5). To the Board 11-2 (figure 5-9, 13) connecting set switching fee 8-3 (6-9, 13) forming a C-shaped design 42 (6). To the Board 8-1 (figure 5-9, 13) switching and the card 8-3 (6-9, 13) switching card installed 11-5 (Fig, 9) connection in the form of tube-like structures 43 (7, 16, 17) with the formation of tubular cells 34 (Fig, 16, 17). To the Board 8-1 (figure 5-9, 13) switching and the card 8-3 (6-9, 13) switching card installed 11-5 (Fig, 9) connection with the formation of Cup-shaped structures 44 (Fig). To the Board 8-1 (figure 5-9, 13) to the mutation and the card 8-3 (Fig.6-9, 13) switching card installed 11-6 (Fig.9) connection with the formation of the structure of the cubic cell 33 (4, 9) functionally complete site. Cubic cell 33-1 (figure 10-12) is connected with the following cubic cell 33-2. Two cubic cells 33-1, 33-2 are connected with the following two cubic cells 33-3 (11, 12), 33-4. Four cubic cell 33-1 (figure 10-12), 33-2, 33-3 (11, 12), 33-4 are connected with the four following cubic cells 33-5 (Fig), 33-6, 33-7, 33-8.
If necessary, heat is applied tubular e-cell 34 (Fig, 16, 17). The assembling of three-dimensional tubular e-cell 34 by analogy with cubic electronic cell 33 (4, 9) (the first three connections).
- Assembly of two three-dimensional tubular e-cells 34-1 (Fig, 15), 34-2, and then build four three-dimensional tubular e-cells 34-1, 34-2, 34-3 (Fig), 34-4.
- Assembly of three-dimensional tubular electronic module 1 (figure 4, 16-19) without housing and Assembly of three-dimensional tubular electronic module 1 with the housing 45 (Fig, 19) and with heat pipe 46.
The above design decision allows, firstly, a more tightly to place modules, secondly, to ensure its high maintainability, thirdly, to improve the efficiency of the heat sink, fourthly, to improve design flexibility and to obtain reliable Proc. of the dimensional electronic module.
Thus considered, it follows that the claimed invention is industrially applicable and solves the technical problem.
Three-dimensional electronic module containing standard carbosilane components and/or of the blade with frameless active and passive components, external heat sink and external leads, and carbosilane components and these have double-sided blade pin and located between the parallel contains a printed circuit switching cards with metallized holes, between parallel contains a printed circuit switching cards end surfaces to him is the connecting Board having electrical and mechanical connection of printed circuit switching cards, characterized in that on the circuit switching Board and the connecting Board formed three-dimensional electrical connector, with three-dimensional electrical connectors of the switching circuits and the connecting circuit boards are connected together with the formation of cubic and/or three-dimensional tubular cells, forming from a variety of three-dimensional three-dimensional cells detachable electrical connection, an external heat sink system of active elements is provided by a tubular three-dimensional cell, equipped with a coaxial arrangement is nymi heat pipes, where the active elements are in thermal contact with the pipe walls.