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Hybrid photosensitive circuit (hpc). RU patent 2504043. |
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IPC classes for russian patent Hybrid photosensitive circuit (hpc). RU patent 2504043. (RU 2504043):
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FIELD: electricity. SUBSTANCE: hybrid photosensitive circuit comprises: a diamond matrix photodetector (MPD), indium bars and silicon multiplexer sensitive sites. The structure of the MPD includes: an upper planar electrode, to which a bias voltage is applied, a diamond plate and lower electrodes of sensitive elements of the diamond MPD, from which the signal is picked. The lower electrodes are electrically connected through columns with indium arranged in a rectangular matrix with axes X and Y by sensitive elements of the silicon multiplexer. Number of indium columns on each X and Y axes must be at least two. In addition, the photodetector array of diamond in the X and Y has twice the pitch compared to the matrix of the silicon multiplexer, and lower electrodes of the diamond sensitive elements in the MPD are arranged in a staggered manner. The lower electrodes of the diamond sensitive elements of the MPD are connected electrically by indium bars only with odd or even sensitive sites of the silicon multiplexer, however, free sensitive sites of the silicon multiplexer may be used for recording visible and infrared radiations. EFFECT: expansion of the range of detected radiation, due to simultaneous recording of images in ultraviolet, visible and infrared spectra, longer life of HPC by eliminating ingress of hard UV radiation into a multiplexer. 4 dwg
The invention relates to the field of semiconductor electronics and may be used when creating a multi-spectral multielement photodetectors. Known multipart microelectronic devices, in which individual elements of the sensitive layer, receiving radiation in different working spectral ranges are alternately, in separate columns, which allows to solve the problem of expanding the program scope, by design complexity of the multiplexer. Signals from these elements come on amplifiers readout scheme, have different for the two types of receivers gains and capacity of the cells accumulation of charges of Long-wavelength 128 x 128 GaAs quantum well infarared photodetector arrays" - B.F. Levine et.al., Semicjnd,. Soi. Technol. 1991, v6. C. 114-C119). The disadvantage of this design is that for each of the two types of receivers have to produce a type of amplifier, with different coefficients of amplification and capacity of cells accumulation of charges that technically very difficult and significantly increases the cost of the end product. In addition, in this case remains unresolved the issue of protection of silicon multiplexer from the hard UV radiation, which leads to a significant decrease its reliability and lifetime. Also known decision taken as a prototype of the invention, when (Fig 1.) hybrid photosensitive circuit containing: diamond matrix photodetector (MFP), columns 4 and silicon multiplexer 6 with sensitive sites 5, and part of the MFP includes: upper flat electrode 1, which is served offset voltage, diamond plate 2 and bottom electrodes 3 sensitive elements of the diamond FPM, which removed the signal, and the bottom electrodes 3 galvanically connected through 4 bars placed in the form of a rectangular matrix with X and Y axes of sensitive elements 5 silicon multiplexer 6, and the number of indium columns on each of the axes X and Y not less than two. Matrix photodetector on the X and Y have the same steps (flip-chip-Assembly). (A.A. Altukhov, Feshchenko V.S. Mityagin A.Yu. et al. And a 128 x 128 Pixel Ultraviolet Photodetector Based on a Diamond Sensor // Radiotekhnika i elektronika. - 2010. - v.55. - №6, p.764-768). The disadvantage of this design is to limit the range program of UV radiation range of the spectrum due to the range of photosensitivity photodetector matrix. Signs of a prototype, coinciding with the features of the invention: the prototype of the invention consist of two main parts - an integrated circuit detection of UV radiation and silicon integrated circuit convert the received signal, in which the photodetector matrix electrically connected with the silicon matrix multiplexer through indium in columns (flip-chip-Assembly). The technical result of the invention is to expand the program range of radiation in UV spectral range, increase of term of service at the expense of exception of hit hard UV radiation on the multiplexer and the possibility of registration of images simultaneously and in ultraviolet, visible and infrared range of the spectrum. The invention is illustrated by drawings. Figure 1 shows the design of hybrid photosensitive scheme (GFS), where the introduced notations: 1 - the top electrode diamond MFP; 2 - diamond plate; 3 - bottom electrode sensing element diamond MFP; 4 - bars; 5 - sensitive pad silicon multiplexer; 6 - silicon multiplexer; 7 - incident radiation; 8 - filtered radiation. Figure 2 shows the location of sensitive sites 5 at the multiplex. Figure 3 shows the location of the bottom electrodes 3 on the MFP. Figure 4 shows the top-the platinum electrode 1 FPM, where the numbers in circles indicate: 1 - designated deposition of platinum, 2 - window in the electrode for the passage of visible and infrared radiation. The technical result of the invention is ensured by the fact that the diamond matrix photodetector has twice step X-axis and Y (Fig 2), than matrix silicon multiplexer 6, which allows not only register the UV radiation in photosensitive elements of the matrix photodetector 3 associated with silicon matrix multiplexer 5 columns 4 and visible light with infrared radiation, which, passing in between the bottom electrodes 3, reaches sensitive sites silicon multiplexer 5, have not been bars. The technical result of the invention is due to the fact that the hybrid photosensitive scheme (GFS) contains: diamond matrix photodetector (MFP), columns 4 and silicon multiplexer 6 with sensitive sites 5. In the composition of the MFP includes: upper flat electrode 1, diamond plate 2 and bottom electrodes 3 sensitive elements of the diamond MPF. Flat top electrode 1 diamond MFP serves for reception of the incident radiation, which is served bias voltage. On the top flat electrode 1 is a matrix strictly along the axes X, Y individual photodetectors, through the spraying of a transparent for UV-radiation layer of platinum diamond plate 2 (figure 2). Flat diamond plate 2 is intended for the detection of UV-radiation is produced by cutting of natural or synthetic diamond, or by growing diamond films by artificial means CVD method of methane gas phase 3% hydrogen 97%. Bottom electrodes 3 sensitive elements of the diamond MFP is used to gather the electrical signal resulting from the detection of UV radiation in each photodetector on the diamond plate, and is made by the deposition of metal, such as gold, diamond plate 2 with the size of the flat end column 4. column 4 is intended for transfer of electric signal with the bottom electrode 3 sensing element diamond MFP on the sensitive area 5 silicon multiplexer 6, which is made by applying India through a mask on the bottom electrode 3 sensing element diamond MFP and sensitive area 5 silicon multiplexer 6, followed by alloying halves during Assembly. The lower ends of indium columns 4 through sensitive areas 5, galvanically connected with the top plane of silicon multiplexer 6. The number of indium columns on each axis of not less than two. Matrix bottom electrode 3 diamond sensor on the X-axis and Y is twice step more than the matrix electrodes sensitive sites 5 silicon multiplexer 6. (Fig.3). bars, connecting the electrodes 3 diamond MFP with electrodes sensitive sites 5 silicon multiplexer, staggered matrix of electrodes 5 silicon multiplexer 6. So the bottom electrodes 3 sensitive elements of the diamond MFP galvanically connected with only the odd-or even-numbered sensitive areas 5 silicon multiplexer. Sensitive pad 5 with the size of the bottom flat butt column 4 are based on CMOS (complementary logic transistors metal-oxide-semiconductor) technology ( M.A. Photodetecting device and the CCD. The detection of weak optical signals. - M.: Radio and Communication, 1992. - 400 C: Il.) and intended for input of an electrical signal in case if they are connected with the diamond MFP column, in the multiplexer 6, and detection of video on the open areas of the multiplexer. Flat silicon multiplexer 6 strengthens, switching and signal processing, arriving at its sensitive pad 5, and generates an electrical signal on the information display system, it is made on the basis of CMOS technology ( M.A. Photodetecting device and the CCD. The detection of weak optical signals. - M: Radio and Communication, 1992. - 400 C: Il.). GFS operates as follows (Figure 1). When applying to the electrode 1 7 radiation, its UV component is absorbed and calls on the sensing elements of the diamond FPM (1, 2, 3) photocurrent, which through columns 4 arrives at silicon multiplexer 6 and is detected as ultraviolet signal. Visible light 8, without absorption takes place in the intervals between the sensitive elements of the diamond FPM and gets on sensitive pad silicon multiplexer 5, where is absorbed and is detected as video. These tasks, increase in service life at the expense of exception of hit hard UV radiation on the multiplexer and the possibility of registration of images simultaneously and in ultraviolet, visible and infrared range of the spectrum, are solved by matrix photodetector consists of diamond, which is a filter for hard UV radiation and has twice bigger step X-axis and Y than matrix silicon multiplexer that allows one hand not to get UV radiation on the multiplexer, and on the other hand pass through the diamond plate visible light and infrared radiation in the intervals between the bottom electrodes of the FPM. The use of the proposed GFS FPM-based diamond allows one hand detect UV radiation, and on the other hand filter to protect the silicon multiplexer. Doubling step MFP, based on diamond and location of the sensors UV-radiation in a checkerboard pattern allows visible radiation to pass through the diamond MFP and free-sensitive sites 5 silicon multiplexer 6. The principal difference of the proposed design is that on the one hand diamond FPM holds all the harsh UV radiation (UV radiation delays diamond and platinum partially transmit UV radiation, however, delays the IR radiation). On the other hand, the visible and infrared radiation easily passes through the FPM (through the Windows of the upper electrode (figure 4) and through the gaps between the bottom electrodes) and detected at free of sensitive sites 5 multiplexer. 6. Upper electrode 1 diamond MFP is made by deposition of platinum thickness 0,00004 mm, has dimensions of 4.2 x 4,2 mm and the form in figure 3. Diamond plate 2 from natural diamond type IIA and has a width and length equal to the size of the electrode 1, and the thickness is equal to 0,3 mm Bottom electrodes 3 are made by deposition of gold 0.001 mm thick and have dimensions: 0,02 x 0,02 mm columns 4 have dimensions: width 0,015 mm, length 0,015 mm and height 0,008 mm Sensitive pad 5 silicon multiplexer have dimensions: width x length x thickness = 0,015 x 0,015 x 0.02 mm Silicon multiplexer 6 has dimensions: 10,03 x 10,85 x 5 mm Technical characteristics of the prototype of GFS. Spectral sensitivity range, mkm UV channel 0,19-0,23 Visible and IR channel 0,4-0,9Threshold sensitivity, W/Hz ½ UV channel 9·10 -12 Visible and IR channel 6·10 -10 The technical result of the invention reach - extended detectable range of radiation due to simultaneous registration of images in the ultraviolet, visible and infrared spectrum. Increase the lifetime of GFS at the expense of exception of hit hard UV radiation on the multiplexer. Features of the invention Matrix diamond sensor on the X-axis and Y is step two times more than step matrix silicon multiplexer, and bottom electrodes 3 sensitive elements of the diamond FPMs are staggered, in addition, the underlying electrodes 3 sensitive elements of the diamond FPM galvanically connected with only the odd-or even-numbered sensitive areas 5 silicon multiplexer 6. Hybrid photosensitive circuit containing: diamond matrix photodetector (MFP), columns (4) and silicon multiplexer (6) sensitive areas (5), and part of the MFP includes: upper flat electrode (1), which is served offset voltage, diamond plate (2) and bottom electrodes (3) sensitive elements of the diamond FPM, which removed the signal, and the bottom electrodes (3) galvanically connected through columns (4) placed in the form of a rectangular matrix with X and Y axes of sensitive elements (5) silicon multiplexer (6), and the number of indium columns on each of the axes X and Y not less than two, wherein the matrix diamond sensor in X-and Y is step two times more than step matrix silicon multiplexer, and bottom electrodes (3) sensitive elements of the diamond FPMs are staggered, in addition, the underlying electrodes (3) sensitive elements of the diamond FPM galvanically connected with only the odd-or even-numbered sensitive areas (5) silicon multiplexer (6).
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