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Compositions of epoxy resins; compositions of derivatives of epoxy resins (C08L63)

Epoxy binder for polymer composite materials

Invention relates to epoxy composite binders, used for production of composite materials, for instance fibreglass plastics and carbon-fibre-reinforced plastics, manufactured by methods of vacuum infusion and RTM, of wide spectrum of application, for instance in aviation, aerospace, ship-building, automobile and other branches of industry. Epoxy binder for polymer composite materials includes epoxy diane resin, diluents and hardener. As diluents used is furfural acetone resin, as hardener used is triethanolamine titanate, with the following ratio of binder components, wt.p.: epoxy diane resin - 100; furfural acetone resin- 5…50; triethanolamine titanate- 5…15.

Application of polymerised resins, characterised by low gas release in vacuum, for manufacturing composite materials, intended for application in space

Invention relates to composite materials, intended for application in space. Application of, at least, one polymerised resin R1, selected from the group, consisting of epoxidised polybutadiene resins and characterised in non-polymerised state: by value of general weight loss (GWL), lower than 10%, value of recovered weight loss (RWL), lower than 10%, and value of collected volatile condensable material (CVCM), lower than 1%, in accordance with determination according to standard ECSS-Q-70-02A of European Space Agency; epoxy equivalent weight (EEW) in the range from 100 to 600 g/mol; for manufacturing composite material, properties of which with respect to gas release and mechanical strength are acceptable for application in space, in particular, for application in web structure.

Method of obtaining nanomodified binding agent

Invention relates to the field of obtaining composite materials based on resins, dispersed by a nanomodifier - carbon nanotubes (CNT), which can be applied for introduction into highly viscous bases in obtaining polymer composite materials for wide spectrum of applications. A method of obtaining a binding agent includes introduction of the nanomodifier - carbon nanotubes - into a base with further ultrasonic dispersion of the nanomodifier in the base, with a furfural-acetone resin being used as the base; the carbon nanotubes are introduced in the base in an amount of 0.001-30 wt %. Before introduction the carbon nanotubes are dehydrated; the process of ultrasonic dispersion is carried out at room temperature in a time range from 5 minutes to 12 hours. The method realisation does not require application of a solvent.

Filling compound for fireproof glazing

Filling compound for fireproof glazing contains epoxy resin Epoxy-520, a plasticiser - tricresyl phosphate, a fire-retardant - triphenyl phosphate and a curing agent - triethylene tetramine.

Epoxy compound

Invention relates to compounds based on thermoreactive resins and can be used for soaking and sealing of condensers, windings of transistors, transformers in different branches of industry. An epoxy compound includes, wt. p.: an epoxy diane resin ED-20 - 100, a polyamide hardener PH-300 - 40, a modifier trichloroethylphosphate - 30, a structuring additive - potassium polytitanate K2O·nTiO2 at n=4, 5, 6 - 0.1-0.5.

Epoxy binding agent, based on it prepreg and product made of it

Invention relates to the field of creating epoxy binding agents for polymer composite materials (PCM) for construction purposes on the basis of carbon filling agents, which can be used in aviation, aerospace industry, radioelectronics and other fields of technology. An epoxy binding agent includes, wt %: an epoxy resin with three and more functional groups 39.70-45.00, based on an aromatic amine-4,4'-diaminodiphenylsulfone hardener 13.21-19.20, a catalyst of hardening - a complex compound of boron trifluoride with benzylamine 0.20-0.24, an organic solvent - 39.78-45.00. Claimed is prepreg, which includes the said epoxy binding agent and a fibrous filling agent - carbon braids, tapes, tissues with the following component ratio, wt p.: the said epoxy binding agent 25-50, the said fibrous filling agent 50-75. Claimed is a product, produced by moulding of the said prepreg. The invention makes it possible to create the epoxy binding agent and prepreg of higher viability and heat resistance, with reduced modes of hardening and thermal processing.

Composition for obtaining matrix with photocatalytic activity

Invention relates to hybrid organo-inorganic nanocomposite coatings. Composition for obtaining matrix with photocatalytic activity includes sol based on element organic compound and epoxy component, in which as element organic compound in composition used is titanium alkoxide with the following component ratio, wt %: titanium alkoxide 30-70, epoxy sol component 30-70, and as epoxy compounds composition contains diglycidyl ether of dicyclohexyl propane, and as titanium alkoxide - tetrabutoxytitanium.

Epoxy binder, prepreg based thereon and article made therefrom

Epoxy binder, prepreg based thereon and article made therefrom

Invention relates to preparation of epoxy binder for polymer composite building materials based on carbon fibre filler, which can be used in aviation, space, car and shipbuilding industries, as well as other industries. The epoxy binder contains, wt %: polyfunctional epoxy resin 10.0-50.0, diglycidyl ether of resorcinol hydroxyl groups 10.0-50.0, polyisocyanate 0.1-3.5, curing agent 4,4'-diaminodiphenylsulphone 17.0-30.0, polyarylsulphone 5.0-30.0. Disclosed is a prepreg containing said epoxy binder and fibre filler in the following ratio, wt %: epoxy binder 30.0-50.0, carbon fibre filler 50.0-70.0. Articles are made by moulding the prepreg.

Composition of epoxy resin, pre-preg and fibre-reinforced composite material

Composition of epoxy resin, pre-preg and fibre-reinforced composite material

Invention relates to epoxy resin compositions and can be applied as matrix resin of fibre-reinforced composite material. Composition contains epoxy resin [A], amine-based hardening agent [B] and block-copolymer [C]. Epoxy resin [A] contains components [Aa] - epoxy resin of biphenyl type, which has biphenyl structure and [Ab]. Component [Ab] contains components [Ab1'] - diglycidyl aniline derivative, [Ab2] - liquid epoxy resin of bisphenol type and [Ab3] - solid epoxy resin of bisphenol type. Component [B] is dicyandiamide. Block-copolymer [C], at least, one block-copolymer, selected from group consisting of S-B-M, B-M and M-B-M. Block M represents block, consisting of polymethyl methacrylate homopolymer, or copolymer, containing, at least, 50 wt % of methyl methacrylate. Block B represents block, which does not mix with block M and has temperature of vitrifying 20°C or lower. Block S represents block, which does not mix with blocks B and M and has temperature of vitrifying higher than temperature of vitrifying of block B.

Composition of resin with chain mechanism of hardening and composite material re-enforced with fibres

Composition of resin with chain mechanism of hardening and composite material re-enforced with fibres

Claimed invention relates to composition of resin with chain mechanism of hardening for composite material re-enforced with fibres. Described are versions of composition of resin with chain mechanism of hardening for obtaining composite material re-enforced with fibres, which contains: alicyclic epoxide compound (A), which contains two cyclohexene oxides in a molecule; and modified epoxy resin (B) of bisphenol type A, represented by formula (1) given below, where in modified epoxy resin (B) of bisphenol type A each R1 represents -CH(CH3)-, and R2 represents oxyalkylene group, and content of alicyclic epoxy compound (A) constitutes from 25 to 90 wt %, where total amount of component (A) and component (B) is taken as 100 wt %: [Chemical compound 1]

Semiconductor band with improved chemical resistance

Invention relates to production of semiconductive materials used for corona shielding of high-voltage windings of electrical machines. The invention suggests semiconductive band containing fibrous substrate with semiconductive compound applied on it including (wt %): chlorosulphonated polyethylene (6.5-12.0), epoxy resin (0.5-3.0), curing agent (0.01-0.2), current-carrying filler (6.0-40.0) and organic solvent (remains).

Semiconductor band with improved elasticity

Invention relates to production of semiconductive materials used for corona shielding of high-voltage windings of electrical machines. The invention suggests semiconductive band containing fibrous substrate with semiconductive compound applied on its top including current-conductive filler and polymer binding agent made of chlorosulphonated polyethylene mixed up with polyfucntional and multifunctional epoxy resins, anhydride and aerosil.

Composite reinforcements

Composite reinforcements

Invention relates to reinforcements, particularly, to alternate-profile reinforcements for production of articles from concrete and aerated concrete by hot moulding at simultaneous effects of aggressive media. Composite reinforcements comprise bar with winding composed by fibrous filler impregnated with epoxy resin-based polymer binder and hardener. Proposed composition contains the following substances, in wt %: fibrous hardener - 60-80 and binder - 20-40 where binder comprises the following components in wt %: epoxy resin - 50-60, amine hardener - 40-50. Said resin comprises the following components, in wt %: diane epoxy resin - 47-80, modifier based on polyesters including glycidyl groups - 10-25, component produced by epoxidation of hydroxyphenylene oligomer from alkyl resorcinol - 10-28%.

Vibration-absorbing epoxide composition

Vibration-absorbing epoxide composition

Invention relates to the mechanical engineering industry, particularly to vibration-absorbing compositions. The composition contains the following, wt %: epoxy diane resin - 17.0-30.0; monoglycidyl ether of butyl cellosolve - 10.0-17.0; talc - 22.0-40.0; graphite - 2.0-6.0; ferrite strontium powder - 7.0-20.0; micro-mica - 5.0-12.0; engineering clay based on enriched bentonites and sepiolites - 2.5-9.5; aminophenol curing agent - 7.0-11.0.

Polymer composition

Polymer composition

Invention relates to high-strength polymer compositions intended for making articles from composite materials, applying anticorrosive and decorative coatings with high resistance to weather and ultraviolet radiation. The polymer composition contains an adduct of amines with epoxy resins, an active diluent and a product of reacting di- or polyepoxy compounds with nitrogen-containing components, where the nitrogen-containing component used is a mixture consisting of a compound having in its structure one or more tertiary nitrogen atoms and simultaneously one or more functional groups -NCO, -OH, -CH2OH and a compound containing, along with a tertiary nitrogen atom, a primary or secondary amino group, and the reaction is carried out by mixing at temperature ranging from 40°C to 220°C in 10-150 minutes.

Method of producing epoxy resin curing agents

Method of producing epoxy resin curing agents

Invention relates to production of epoxy resin curing agents used to prepare epoxy compositions with improved processing properties and minimal toxicity, which enable to produce composite materials with high strength, thermophysical and dielectric properties. The method of producing epoxy resin curing agents involves reacting a liquid or molten aromatic, aliphatic, cycloaliphatic or alkylene aromatic di- or polyamine (B) with cycloaliphatic or aliphatic-cycloaliphatic dioxides (A) with excess amine, after which acrylate (V) and amino alcohol (G) are added to the obtained mixture and the reaction mixture is stirred for 20-180 minutes at T=30-180°C.

Polymer composition

Polymer composition

Present invention relates to production of polymer compositions based on epoxy resins and modified amine curing agents, intended for producing high-strength composite materials with high resistance to thermal deformation. Described is a polymer composition based on epoxy resin, active epoxy diluents and nitrogen-containing curing agents intended for producing high-strength composite materials with high resistance to thermal deformation, characterised by that the curing agent is a product of reaction of an amine component with monocarboxylic acids, using as the amine component a mixture consisting of a primary aromatic amine or a mixture of aromatic amines (A), a secondary aliphatic amino alcohol (B) and a tertiary aliphatic amino alcohol (C) in weight ratio A:B:C from 98:0.2:1.8 to 80:5:15, and a monocarboxylic acid (D) is added in form of a 25-80% solution to the monoatomic aliphatic or aromatic alcohol, or ester thereof with a mono- or dicarboxylic acid, in ratio (A+B+C):D from 90:10 to 60:40 per 100% acid, followed by reaction by mixing in a reactor at temperature ranging from 50 to 130°C for 20 to 120 minutes and mixer speed of 100 to 3000 rpm, and additionally contains a thickener, a pigment or a dye, wherein the composition contains the following in pts.wt: epoxy resin - 100, active epoxy diluent - 5-130, curing agent - 15-110, thickener - 5-50, pigment and dye - 0.5-25.

Epoxy binder for reinforced plastic

Epoxy binder for reinforced plastic

Binder contains the following, pts.wt: 70-90 polyglycidyl derivative of low-molecular weight phenol-formaldehyde novolac, 10-30 epoxy-diane resin, 3-6 boron trifluoride and benzylamine complex, 60-80 2,2'-bis-(3,5-di-bromo-4-hydroxyphenyl)-propane, 1-3 bis-[3-(3,5-di-tert-butyl-4-oxyphenyl) propyl]phthalate and 90-160 alcohol-acetone mixture with weight ratio of alcohol to acetone of 1:1.

Press material for sealing integrated microcircuits

Press material for sealing integrated microcircuits contains binder - o-cresol novolac epoxy resin with softening point of 50-65°C, a curing agent - cyan-acetic ester and diglycidyl ether of 1,4-butanediol, an accelerating atent - N1-(3,4-dichlorophenyl)-N,N-dimethylurea, filler - ground quartz, glycidyloxypropyltrimethoxy silane finishing agent, lubricant - oxidised polyethylene wax.

Method of making articles from composite

Proposed method comprises preparing binder directly before impregnation of fibrous filler. Epoxy-novolac binder with number-average molecular weight of 300 a.u. and weight fraction of epoxy groups of 8-11 are produced by loading 10-28 wt % of product into reactor, said product being obtained by epoxidation of hydroxyphenyl oligomer from alkyl resorcinol, 47-80 wt % of diane epoxy resin and 10-25 wt % of modifier, and by boiling at 60-250°C for 30-180 minutes. Article is shaped by drawing fibrous filler impregnated with binder and hardener via replacement die and helical winding on reinforcing bundle core.

Epoxy-phenol composition

Epoxy-phenol composition

Composition contains the following, wt %: epoxide oligomer - 31.32-33.81, butanolised phenol-formaldehyde oligomer - 8.45-10.89 o-phosphoric acid (88.5%) - 0.12-0.14, n-butanol - 5.63-7.26, rheologic additive - 0.43-4.17 ethyl cellosolve - the balance. The rheologic additive used is a mixture of compounds taken in equivalent ratio of general formula: and , where n=10-40 m=10-20; R is an alkyl radical, selected from the following series -CH3, -CH2-CH3, CH2-CH2-CH3, -CH2-CH2-CH2-CH3.

Thermosetting epoxy polymer, composite material, method of moulding article from composite material, mould and method of making mould

Thermosetting epoxy polymer, composite material, method of moulding article from composite material, mould and method of making mould

Composite material contains a matrix phase made of thermosetting epoxy polymer with magnetite particles and a reinforcing phase made of carbon fibre. The mould for moulding an article from composite material has a housing made of material which is substantially permeable for microwave radiation, with a surface or a back surface which is coated with a layer containing material which is substantially permeable for microwave radiation.

Foam compound composition

Composition contains the following (pts.wt): epoxy-diane resin ED-20 75-85, mixture of triglycidyl esters of polyoxypropylene triol Laproxide703 and Laproxide 301 in ratio 4:1 53-61, ethylene diaminomethyl phenol AF-2 25-27, foam regulator Penta-483 1.2-14, catalyst K-1 type A 1.5-1.7, ethylsilicate-40 3.5-4.0, oligomethyl hydride siloxane Penta-804 3.5-5.0 and acetone 0.15-0.17 and a titanium-silicon-organic oligomer - TMFT product 22-24.

Epoxy composition for anhydride curing using latent initiator i-120u

Epoxy composition for anhydride curing using latent initiator i-120u

Epoxy composition contains the following (pts.wt): epoxy-diane resin or epoxy-novolak resin 100, anhydride curing agent 75-100 and curing accelerator 4-4.4. The curing accelerator is a latent initiator I-120U, which is a complex of caprolactam with zinc chloride and water. The curing accelerator is obtained with the following ratio of components, pts.wt: ε-caprolactam 100, zinc chloride 90-100, water 20-25.

Polymer binder for composite reinforcement

Invention relates to epoxy binder for composite plastic and can be used in production of reinforcement with a composite periodic profile. The binder contains the following (pts. wt): epoxy-diane resin with weight ratio of epoxy groups of 20.0-24.0 - 100, aromatically conjugated hydroxy phenylene, combined with isomethyl tetrahydrophthalic anhydride in ratio of 9:1 - 85-90, diglycidyl ether of oligooxypropylene glycol with weight ratio of epoxy groups of 16-18% - 10-12, amine-type polymerisation accelerator - tridimethyl aminomethyl phenol or 2-methylimidazole or ethyl-2-methylimidazole - 0.3-3.0.

Thermosetting resin-based polymer composite material and fibre-filled material containing said resin

Thermosetting resin-based polymer composite material and fibre-filled material containing said resin

Invention relates to a thermosetting resin-based polymer composite material and fibre-filled material based thereon. The polymer composite material contains thermosetting resol phenol-formaldehyde resin and additionally thermosetting epoxy resin and a thermosetting polyester resin in the following ratio, wt %: thermosetting resol phenol-formaldehyde resin 48-83; thermosetting epoxy resin 3-13; thermosetting polyester resin 14-39. The fibre-filled material contains a thermosetting resin-based polymer composite material and fibre. The fibre used is polyacrylonitrile fibre or glass fibre in the following ratio, pts.wt: thermosetting resin-based polymer composite material 3.2-5.2; fibre 1.0.

Epoxy resins and composite materials exhibiting improved combustion properties

Epoxy resins and composite materials exhibiting improved combustion properties

Invention relates to epoxy resin-based composite materials. The epoxy resin-based composition contains: a) 50-70 wt % of a component which is an epoxy resin containing one or more epoxy resins; b) 15-35 wt % of a mixture of thermoplastic materials containing polyetherimide and polyamideimide, where the weight ratio of polyetherimide to polyamideimide ranges from 5:1 to 1:5; and c) 5-25 wt % of a component which is a curing agent, where the epoxy resin composition has sulphur dioxide release level below 100 ppm. Also disclosed is a method of preparing a composition, a component made from an uncured composite, a component made from the composite, where a matrix of the epoxy resin is cured, and a method of producing a prepreg.

Composition to reinforce building structures

Composition comprises glass or basalt roving in amount of 90-100 wt parts, impregnated with polymer binder based on epoxide-diane resin in the amount of 18÷20 wt parts. The polymer binder additionally contains a magnetic-susceptible metal-containing carbon nanostructure in the amount of 0.001÷1.5 wt parts.

Thermally hardened compositions based on epoxy resins, which contain non-aromatic ureas as accelerants

Thermally hardened compositions based on epoxy resins, which contain non-aromatic ureas as accelerants

Claimed invention relates to thermally hardened composition based on epoxy resins, which contains: (a) at least one epoxy resin A, which has on average more than one epoxy group per molecule; (b) at least one hardener B of opoxy resin, which is activated at increased temperature and represents amine, amide, anhydride of carboxylic acid or polyphenol; and (c) at least one accelerant C of formula (Ia) or (Ib), where R1 represents H or n-valent aliphatic, or araliphatic residue; R2 and R3 represent each independently on each other alkyl group; R1' represents n'-atom aliphatic residue; R2' represents alkyl group; R3' independently on each other represent H, or alkyl group, or aralkyl group; and n and n' - each has value from 1 to 4, in particular, 1 or 2; and d) at least one viscosity modifier D. Invention also relates to application of such composition in form of one-component thermally hardened glue, for obtaining coatings and for obtaining structural foam for reinforcement of cavities, as well as to method of gluing heat-resistant materials with application of composition by invention and to glued together/glued to product, thus obtained, and to vehicle or vehicle component, which contain such foamed product. Also described is application of accelerant of formula (Ia) or (Ib) for increasing viscosity of claimed compositions based on epoxy resins.

Nano-modified binder, method for production thereof and prepreg based thereon

Nano-modified binder, method for production thereof and prepreg based thereon

Invention includes, pts.wt: bisphenol A based epoxy resin 60-80, polyepoxy novolac resin 20-40, nanodiamond mixture 0.025-0.1 and a hardener 80-110. The method of producing the binder involves preparing a suspension of the diamond mixture in a portion of the hardener; preparing a mixture of polyepoxy novolac resin, bisphenol A based epoxy resin and the remaining hardener and then adding the obtained mixture to said suspension. Also disclosed is a prepreg which is prepared from the binder.

Epoxide composition for making articles from polymer composite materials by vacuum infusion

Invention relates to cold curing epoxide compositions and can be used in making structures, including large-sized structures, from polymer composite materials by vacuum infusion in engineering fields. The epoxide composition includes an epoxide base containing epoxy-diane resin, an active diluent and a curing system based on an amine curing agent and a surfactant, characterised by that the epoxy-diane resin used is a resin or a mixture of resins with molecular weight 340-430, the active diluent used has viscosity of up to 0.1 Pa·s, the amine curing agent is a mixture of a curing agent basedd on an aromatic amine and a cold curing catalyst, and the curing system further includes a heterocyclic imidazole-type compound and a nanomodifier. The technical result is preparation of a high-technology epoxy composition, curable without the need for additional heat and without a large exothermic effect, and characterised by improved physical and mechanical properties.

Method of producing curing agents of epoxy resins

Method of producing curing agents of epoxy resins

Invention relates to a method of producing curing agents for epoxy resins for making large articles, anticorrosion coatings and other purposes. The curing agents are obtained by mixing a eutectic mixture of aromatic amines with a product of reacting an acid of general formula R2R COOH, where R is an aliphatic, cycloaliphatic or aromatic hydrocarbon moiety, R2 is a substitute -Cl, -F, -NH2, -NH-, -OH, -CH=CH-, -CH=CH2 (A) with a di- or polyamine of an aliphatic, cycloaliphatic or aromatic type, (B) and a polyatomic alcohol with containing 2-6 hyroxyls per molecule, (C) with ratio A:B:C from 70:29:1 to 20:70:10 by mixing in a medium of an ether of a di- or tricarboxylic acid and a monoatomic alcohol at temperature of 20-80°C for 10-120 minutes, with the ratio of the reaction product to the eutectic mixture of aromatic amines from 5:95 to 95:5.

Low-flammable chemical-resistant polymer composition

Invention relates to chemical industry and the industry of structural materials, and specifically to production of chemical-resistant, low-flammable polymer compositions, which can be used in repairing and reconstructing building structures. The low-flammable chemical-resistant polymer composition contains, wt %: epoxy-diane resin 26.88-33.67, amine curing agent 2.53-3.90, mixture of butadiene-nitrile rubber or low molecular weight polybutadiene and trichlorodiphenyl in ratio of 1:1 10.12-15.28, mineral filler which is treated with low-temperature plasma 39.8-46.70, antimony trioxide 1.63-2.85, 1,1-dichloro-2,2-di(4-chlorophenyl)ethylene bromation product containing 50.44% bromine, 22.38% chlorine, 26.54% carbon and 0.64% hydrogen 5.19-8.55.

Method of producing antifriction materials for binary surfaces

Method of producing antifriction materials for binary surfaces

Invention involves preparing and packing a set of two components: a resinous part and a curable part. The resinous part consists of epoxy resin, an active epoxy diluent, a nontoxic aliphatic or aromatic oxyacid and a mixture of antifriction powdered and fibrous filler materials. The curable part consists of a nontoxic adduct obtained by reacting an aliphatic or aromatic di- or polyamine with an epoxy-diane resin and a nontoxic and nonvolatile di- or polyatomic alcohol. Both components are prepared in equal volume and weight with accuracy of up to 5% and are mixed immediately before application.

Improved epoxy systems for composite materials

Improved epoxy systems for composite materials

Composition contains a system of epoxy resin which includes a reaction product of epoxy resin and a curing agent. The curing agent contains a first compound with an amino group of formula R1R2R3N, where R1 and R2 are independently an aliphatic or cyclic organic functional group and R3 is an alkyl group with 2-18 carbon atoms in the backbone chain; and a second compound with an amino group, with one or more primary or secondary amino groups, with stoichiometric ratio of -NH bonds of the second compound with an amino group to epoxy groups of the epoxy resin component of about 1:20-19:20.

Hot-melt binder, method for production thereof, prepreg and honeycomb panel based thereon

Hot-melt binder, method for production thereof, prepreg and honeycomb panel based thereon

Invention relates to chemistry and the technology of producing semi-products from hot-melt compositions of epoxy resins, prepregs and laminates based thereon and can be used in making three-layer (sandwich) panels. The present invention can be used in aircraft floor panels which consist of composite cells and composite covers. The composition of hot-melt binder for a prepreg and a honeycomb panel based thereon contains epoxy-novolac resin, epoxy resin based on tetrabromodiane, epoxy-diane resin, high molecular weight epoxy resin, dicyandiamide, bis(N,N'-dimethyl carbamide)diphenyl methane and polysulphone. The method of making binder for prepregs involves mixing components with pre-dispersed dicyandiamide, bis(N,N'-dimethyl carbamide) in a portion of low molecular weight epoxy-diane resin, wherein high molecular weight epoxy resin and polysulphone are fused with the remaining portion of the low molecular weight epoxy-diane resin, the epoxy-novolac resin and the tetrabromodiane-based resin at temperature of 135-155°C, and then merged with the obtained dispersion at temperature of 55-65°C. The prepreg contains epoxy binder and fibre filler. A three-layer panel has a middle layer of a polymer honeycomb laminate and covers made from the prepreg.

High-porosity polymer abrasive composition

High-porosity polymer abrasive composition

Invention relates to polymer compositions intended for making porous high-elasticity abrasive and diamond tools for machining articles from steel and nonferrous metals. Proposed composition comprises epoxy-novolac block copolymer resin, butadiene-nitrile resin, gas forming agent, hardener, stearin, cryolite, silicon carbide or electrocorundum. Said epoxy-novolac block copolymer resin includes the product of copolymerisation of epoxy diane resin and phenol-formaldehyde resin with the products of alcoholysis of secondary PETF while gas-forming agent represents izoisobutyronitrile while tri-ethanolamine makes the hardener, at the following ratio of components in wt %: product of copolymerisation of epoxy diane resin and phenol-formaldehyde resin with the products of alcoholysis of secondary PETF - 100, butadiene-nitrile resin - 30-100, izoisobutyronitrile - 3-10, tri-ethanolamine - 0.3-0.7, stearin - 1-3, cryolite - 25-65, silicon carbide or electrocorundum - 300-700.

Primer compositions for adhesive binding systems and coatings

Primer compositions for adhesive binding systems and coatings

Present invention relates to an aqueous primer composition. The aqueous primer composition contains: a. at least one composition of a heat-curable self-emulsifying epoxy resin obtained by reacting (a) epoxy resin, (b) a polyatomic phenol and (c) an amine-epoxide adduct, where the amine-epoxide adduct is a product of reaction of an aromatic polyepoxide with polyoxyalkylene amine; b. at least one composition of a heat-curable non-self-emulsifying resin having an epoxide base which has epoxide functionality from 1.8 to 4 and epoxide equivalent weight from 100 to 200; c. water; and d. at least one curing agent. The invention also describes a method of producing the aqueous primer composition.

Anticorrosion protection of metal structures and large-size industrial equipment

Invention relates to methods of anti-corrosion protection of metal structures and large-size industrial equipment operating in atmospheric conditions by depositing a paint coat onto the surface of the equipment. Disclosed is an anti-corrosion protection method which involves depositing a prime coat onto the metal surface, followed by tack-free drying, and then depositing a top coat followed by drying until complete setting. The prime coat and the top coat are made from a composition which contains (wt %): silicone epoxy resin (32.0-52.0), nanodispersed fluoroplastic (2.0-4.0), aminosilane curing agent (8.0-12.8), target additives (1.84-2.32), pigments and filler materials (3.4-21.6), organic solvents - the balance.

Non-halogen benzoxazine-based curable compositions with high glass transition temperature

Non-halogen benzoxazine-based curable compositions with high glass transition temperature

Present invention relates to a non-halogen curable composition which contains a benzoxazine monomer (a) of formula

Composition of modified binder based on epoxy resins, method for production thereof and prepreg based thereon

Composition of modified binder based on epoxy resins, method for production thereof and prepreg based thereon

Binder contains the following (pts.wt): mixture of epoxy resins - 100, curing agent 30-40 and functionalised polyether sulphone 5-30. The composition of the mixture includes (pts.wt): bifunctional diane resin 40-60, epoxy-novolak resin 10-20 and tetrafunctional resin 30-40. The functionalised polyether sulphone is in form of an undissolved powder. Also disclosed is a method of producing said binder and a prepreg based thereon.

Cold curing epoxide composition

Epoxide composition can be used as a saturating composition and an adhesive composition and for protective coatings of metal and concrete surfaces. The cold curing epoxide composition contains an epoxide base which includes an epoxy-diane resin having molecular weight of 340-540, an epoxy-urethane resin and a curing system which contains an aromatic amine and an imidazole-type heterocyclic compound.

Polymer composition

Invention relates to polymer compositions based on epoxy resins and latent curing agents and can be used as epoxy filling compounds, binding materials for fibre-glass, adhesives, coatings and other purposes. The epoxy component used is a mixture of aromatic and aliphatic epoxy resins in ratio of 96:4 to 20:80. The latent curing agent used is polyisocyanate - a mixture of isomers 4,4'-2,2' and 4,2'-diphenyl methane diisocyanate and their homologues of tri- and tetraisocyanates, whose aromatic rings are bound by methylene bridges. The methylene bridges are blocked by a mixture which consists of ε-caprolactam (A), methylpyrazole (B) and benzyl alcohol (C) in ratio A:B:C from 90:9:1 to 10:80:10. Blocking is carried out by stirring the molten reaction mass at temperature of 60-140°C for 40-180 minutes with the ratio of the isocyanate and blocking components ranging from 76:24 to 60:40. The ratio of the epoxy and isocyanate components in the composition is as follows (pts.wt): mixture of epoxy resins - 100, curing agent - 10-50.

Polymer composition

Polymer composition

Invention relates to preparation of polymer compositions based on epoxy resins and cycloaliphatic dioxides, which are meant for making large-sized articles from composite materials. The composition is based on a mixture of epoxy resins and products of epoxidation of 2-4-atomic alcohols in ratio of 99:1 to 1:99. The curing agent is a product of reaction of an acid (A) - a compound of general formula R2-R1-COOH, where R1 is an aliphatic, cycloaliphatic, aromatic hydrocarbon or heterocyclic fragment, R2 is a substitute - Cl, -F, -NH2, -NH-, -OH, -CH=CH-, -CH=CH, amine (B) - di- or polyamine of an aliphatic, cycloaliphatic or aromatic type together with a polyatomic alcohol containing 2-6 hydroxyls in one molecule (C). Components in ratio A:B:C from 70:29:1 to 20:70:10 are mixed in a medium of a di- or tricarboxylic acid ether and a monoatomic alcohol at temperature of 20-80°C for 10-120 minutes. The obtained ternary reaction product is mixed with a eutectic mixture of aromatic amines in a ratio ranging from 5:95 to 95:5 and with lactone or lactam. The composition contains the following (pts.wt): resin part -100, curing agent - 20-100, lactone or lactam - 3-30.

Method of producing curing agents of epoxy resins

Method of producing curing agents of epoxy resins

Invention relates to a method of producing curing agents of epoxy resins and can be used to produce epoxide compositions with improved processing properties. The curing agents are obtained by reacting di- or polyepoxide compounds with nitrogen-containing compounds. The nitrogen-containing component used is a mixture which consists of one or two compounds having in their structure one or more tertiary nitrogen atoms and simultaneously one or more functional groups -NCO, -OH, -CH2OH (A) and compounds which contain, alongside the tertiary nitrogen atom, a primary or secondary amino group (B) in ratio A:B ranging from 99:1 to 70:30. Components react in the ratio of the epoxide compound to the nitrogen-containing component ranging from 90:10 to 50:50 while stirring at temperature of 40-220°C for 10-150 minutes.

Epoxide composition

Epoxide composition

Invention relates to preparation of epoxide compositions for making high-strength polymer materials. The composition is based on a mixture of di- and polyepoxy resins and modifiers. The modifiers are products of epoxidation of 2-4-atomic alcohols in a ratio from 99:1 to 1:99. The curing agent is a product of reaction of an acid (A) - a compound of general formula R2-R1-COOH, where R1 is an aliphatic, cycloaliphatic, aromatic hydrocarbon or heterocyclic fragment, R2 is a substitute - Cl, -F, -NH2, -NH-, -OH, -CH=CH-, -CH=CH, amine (B) - di- or polyamine of an aliphatic, cycloaliphatic or aromatic type together with a polyatomic alcohol containing 2-6 hydroxyls in one molecule (C). The ratio A:B:C ranges from 70:29:1 to 20:70:10. The components are mixed in a medium of a di- or tricarboxylic acid ether and a monoatomic alcohol at temperature of 20-80°C for 10-120 minutes. The obtained ternary reaction product is mixed with a eutectic mixture of aromatic amines with melting point from -10°C to 90°C with the ratio of the reaction product to the eutectic mixture of aromatic amines ranging from 5:95 to 95:5. The composition contains the following (pts.wt): resin part -100, curing agent - 20-100.

Curable resin composition

Invention relates to a curable sealing resin composition. The curable composition contains at least one anhydride-functionalised polymer in amount of 30-60 wt %, a polyol in amount of 10-25 wt %, an epoxide-functionalised polymer, oligomer or monomer in amount of 15-40 wt %, a urethane polyol-functionalised compound selected from a group consisting of urethane diol, polyurethane diol and combination thereof in amount of 5-15 wt % and a catalyst with respect to total weight of the resin. The resin composition can be cured at room temperature. Components used to prepare and cure the resin composition can be provided in form of two or more parts.

Benzoxazine siloxanes and heat-curable composition based thereon with epoxy resin

Benzoxazine siloxanes and heat-curable composition based thereon with epoxy resin

Invention relates to novel benzoxazine siloxanes of general formula , where R1 denotes trimethylsilyl, dimethylsilylpropyl-8-methoxy-N-R2-1,3-benzoxazine, pentamethylsiloxypropyl- N-1,3-benzoxazine; R2 denotes alkyl C1-C4, hydroxyethyl, phenyl; X denotes oxygen, methylene, isopropyl, hexafluoropropyl; m=0-8, n=0-32; at certain conditions, values of X, R1 and number links in benzoxazine siloxanes. Heat-curable compositions for heat-resistant adhesives, filling compounds and coatings are obtained from the benzoxazine siloxanes and epoxy resins. The composition contains (pts.wt) one or seven benzoxazine siloxane compounds in amount of 10-50; epoxy-diane or epoxy-phenol-formaldehyde resin in amount of 100-50; a curing agent - isomethyl tetrahydrophthalic anhydride in amount of 0-83; filler - boron or aluminium nitrides in amount of 0-15.

Polymer nanocomposites and method for production thereof

Polymer nanocomposites and method for production thereof

Carbon nanofiller - carbon nanofibres or globular nanocarbon - is added to a polymer nanocomposite based on bisphenol A polyhydroxy ether, with the following ratio of components: bisphenol A polyhydroxy ether - 99.975-99.5%, nanofiller - 0.025-0.5%. When producing the nanocomposites, the carbon nanofiller is pre-activated sulphuric acid solution with concentration of 20-60% while heating at temperature of 70-100°C for 45-60 minutes. The treated carbon nanofiller is added the polymer in situ.

Method and apparatus for purifying resorbable polyester

Method and apparatus for purifying resorbable polyester

Invention relates to a method of purifying resorbable polyester and an apparatus to this end. Purification of resorbable polyester involves dissolving polymer in a first solvent (12) and then bringing the polymer solution into close contact with a second solvent (41) under the action of high shearing forces in a turbulent shear field. The second solvent (41) is a nonsolvent for the resorbable polyester, infinitely miscible with the first solvent (12). The polymer suspension formed as a result of adding the second solvent (41) is then fed either into the revolving cylindrical sieve working member (71) of a drum sieve (70) operating with generation of a shearing force. The moist polymer mass is then removed from the sieve working member (71) of the drum sieve using one or more helically lying conveyor wheels and/or guide blades inside said revolving cylindrical sieve member and then dried.

Another patent 2513856.

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