IPC classes for russian patent Semiconductor band with improved elasticity. RU patent 2510648. (RU 2510648):
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Semiconductive band with adhered layer / 2510645
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Conductive pastes / 2509789
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Polymer composition / 2506291
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Epoxy resins and composite materials exhibiting improved combustion properties / 2494126
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Method of producing thermoplastic elastomer composition / 2497844
Invention relates to a method of producing a thermoplastic elastomer composition based on polyethylene and chlorosulphonated polyethylene for making various elastic industrial rubber articles by extrusion, pressure moulding and blow moulding. The method is realised by dynamic mixing of polyethylene with chlorosulphonated polyethylene in the presence of a vulcanising system which contains magnesium oxide, a mixture of organic acids and a mixture of sulphur vulcanisation accelerators of a group of thiazoles. At the step of dynamic mixing of polymers, magnesium oxide is added first, followed addition of a mixture of organic acids in a combination with a mixture of sulphur vulcanisation accelerators to carry out dynamic vulcanisation. |
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FIELD: electricity.
SUBSTANCE: invention relates to production of semiconductive materials used for corona shielding of high-voltage windings of electrical machines. The invention suggests semiconductive band containing fibrous substrate with semiconductive compound applied on its top including current-conductive filler and polymer binding agent made of chlorosulphonated polyethylene mixed up with polyfucntional and multifunctional epoxy resins, anhydride and aerosil.
EFFECT: suggested semiconductive band has improved elasticity allowing its application without folds along the whole length of rods of high-voltage electrical machines.
1 tbl
The invention relates to the electrical engineering, in particular to the production of semi-conducting materials used for protivokariosnoe protection of high-voltage windings of electrical machines.
The efficiency of semi-conductive coating of high-voltage windings of electrical machines largely determined by the quality of its application to the terminals. To prevent the concentration of the electric field strength of semi-conductive surface must be flat, without wrinkles, especially on nonlinear parts rods. This can be achieved by increasing the elasticity of semi-conductive tape, allowing to apply the tape without folds along the length of the rods of high-voltage electrical machines.
The closest solution of similar tasks is a semi-conducting tape for protivokariosnoe protection of high-voltage windings of electrical machines, containing fiber substrate, impregnated binder based on butadiene-nitrile rubber, catalysts knitting and conductive fillers (Patent RU №2150760 from 10.11.1998,, CL NV 1/00; NV 1/24; NC 3/40). The tape does not have sufficient chemical resistance to boxinginsider the compound, and not elastic enough to ensure dense and uniform contact with the winding insulation.
The present invention is development of semi-conductive tape with a rated electrical resistance of high elasticity.
To solve this problem it is offered semi-conducting tape containing fibrous substrate glass thickness of 30-200 mm with a deposited semiconductor composition, comprising a binder - chlorosulphurized polyethylene (molecular weight 20-40 thousand), monofunctional epoxy resin (monoglycidyl ether n-butanol, butylalcohol, 2-ethylhexanol, alkylphenol, tertbutylphenyl), multifunctional epoxy resin (Dianov, Apoksiomen, nitrogen-containing, cycloaliphatic epoxy number 15-30), anhydride (isomethyltetrahydrophthalic, andilly, methylenedioxy, phthalic, hexahydrophthalic), amine catalyst type, organic solvent, conductive fillers (carbon black, graphite, silicon carbide) in the following ratio, mass%:
Chlorosulphurized polyethylene 1-5
Monofunctional epoxy resin 5-20
Multifunctional epoxy resin 0,1-1,0
Anhydride 3-10
The catalyst
0,01-0,1
Conductive filler 15-50 Aerosil 0,1-2,0
Organic solvent 30-60
When the content of components in semi-conducting tape,% Mas.:
Semi-conducting composition 15-35
Substrate 65-85
To obtain semi-conducting tape, according to the invention, first prepare semi-conducting a composition based on the above ratio of ingredients in it. As conductive filler serve as carbon black, graphite, silicon carbide or their mixtures. The dissolution of monofunctional epoxide, anhydride, chlorosulfonated polyethylene, epoxy resin, catalyst spend in the amalgamator at room temperature. Solid components fray in the obtained solution of the bead or ball mill to the dispersity of 5-15 micron.
Song put on tape by passing through the bath impregnating machines with subsequent drying at the temperature 70-160 OC for 2-10 minutes.
The invention is illustrated by the examples given in the table. Table No.
Material name, the standard indicators
Option 1
Option 2 PPL-1 p/p 1.
Chlorosulphurized polyethylene 1,8 1,5 9,7 2.
Monoglycidyl ether n-butanol 9,0 - -
Monoglycidyl ether alkylphenol - 8,6 3.
Methylenedioxy anhydride 3,9 - -
Isomethyltetrahydrophthalic anhydride - 3,7 4.
Epoxy resin ED-20 0,4 - 1,9
Epoxy up-643 - 0,3 5.
Catalyst 0,01 0,02 0,03 6. Aerosil 0,4 1,3 - 7.
Technical carbon 10,5 2,6 7,6 8.
Silicon carbide - 32,3 9. Solvent else else else 10.
Bending stiffness, N 0,25 0,50 1,5 11.
Specific surface electrical resistance, Ohm 3·10 3 4·10 8 4·10 3
According to the invention of semi-conductive tape has the increased elasticity options for low impedance and high impedance execution.
Semi-conductive tape for protivokariosnoe protection of high-voltage windings of electrical machines, containing fibrous substrate coated with semi-conducting composition, including conductive fillers and polymer binder, notable as a polymer binder is used chlorosulphurized polyethylene mixed with poly-and mono-functional epoxy resins anhydride and catalyst in the following ratio of ingredients in the composition,% Mas.:
Chlorosulphurized polyethylene - 1-5
Monofunctional epoxy resin - 5-20
Multifunctional epoxy resin
- 0,1-1,0
Anhydride - 3-10
The catalyst
- 0,01-0,1
Conductive filler - 15-50 Aerosil
- 0,1-2,0
Organic solvent - 30-60
when the content of components in semi-conducting tape,% Mas.:
Semi-conducting composition - 15-35
Substrate - 65-85
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