IPC classes for russian patent Semiconductor band with improved chemical resistance. RU patent 2510649. (RU 2510649):
Another patents in same IPC classes:
Semiconductor band with improved elasticity / 2510648
Invention relates to production of semiconductive materials used for corona shielding of high-voltage windings of electrical machines. The invention suggests semiconductive band containing fibrous substrate with semiconductive compound applied on its top including current-conductive filler and polymer binding agent made of chlorosulphonated polyethylene mixed up with polyfucntional and multifunctional epoxy resins, anhydride and aerosil. |
Semiconductive band with adhered layer / 2510645
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Semiconductor band with improved elasticity / 2510648
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Polymer composition / 2506291
Present invention relates to production of polymer compositions based on epoxy resins and modified amine curing agents, intended for producing high-strength composite materials with high resistance to thermal deformation. Described is a polymer composition based on epoxy resin, active epoxy diluents and nitrogen-containing curing agents intended for producing high-strength composite materials with high resistance to thermal deformation, characterised by that the curing agent is a product of reaction of an amine component with monocarboxylic acids, using as the amine component a mixture consisting of a primary aromatic amine or a mixture of aromatic amines (A), a secondary aliphatic amino alcohol (B) and a tertiary aliphatic amino alcohol (C) in weight ratio A:B:C from 98:0.2:1.8 to 80:5:15, and a monocarboxylic acid (D) is added in form of a 25-80% solution to the monoatomic aliphatic or aromatic alcohol, or ester thereof with a mono- or dicarboxylic acid, in ratio (A+B+C):D from 90:10 to 60:40 per 100% acid, followed by reaction by mixing in a reactor at temperature ranging from 50 to 130°C for 20 to 120 minutes and mixer speed of 100 to 3000 rpm, and additionally contains a thickener, a pigment or a dye, wherein the composition contains the following in pts.wt: epoxy resin - 100, active epoxy diluent - 5-130, curing agent - 15-110, thickener - 5-50, pigment and dye - 0.5-25. |
Epoxy binder for reinforced plastic / 2505568
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Press material for sealing integrated microcircuits / 2505567
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Method of making articles from composite / 2505403
Proposed method comprises preparing binder directly before impregnation of fibrous filler. Epoxy-novolac binder with number-average molecular weight of 300 a.u. and weight fraction of epoxy groups of 8-11 are produced by loading 10-28 wt % of product into reactor, said product being obtained by epoxidation of hydroxyphenyl oligomer from alkyl resorcinol, 47-80 wt % of diane epoxy resin and 10-25 wt % of modifier, and by boiling at 60-250°C for 30-180 minutes. Article is shaped by drawing fibrous filler impregnated with binder and hardener via replacement die and helical winding on reinforcing bundle core. |
Thermosetting resin-based polymer composite material and fibre-filled material containing said resin / 2495056
Invention relates to a thermosetting resin-based polymer composite material and fibre-filled material based thereon. The polymer composite material contains thermosetting resol phenol-formaldehyde resin and additionally thermosetting epoxy resin and a thermosetting polyester resin in the following ratio, wt %: thermosetting resol phenol-formaldehyde resin 48-83; thermosetting epoxy resin 3-13; thermosetting polyester resin 14-39. The fibre-filled material contains a thermosetting resin-based polymer composite material and fibre. The fibre used is polyacrylonitrile fibre or glass fibre in the following ratio, pts.wt: thermosetting resin-based polymer composite material 3.2-5.2; fibre 1.0. |
Semiconductor band with improved elasticity / 2510648
Invention relates to production of semiconductive materials used for corona shielding of high-voltage windings of electrical machines. The invention suggests semiconductive band containing fibrous substrate with semiconductive compound applied on its top including current-conductive filler and polymer binding agent made of chlorosulphonated polyethylene mixed up with polyfucntional and multifunctional epoxy resins, anhydride and aerosil. |
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FIELD: electricity.
SUBSTANCE: invention relates to production of semiconductive materials used for corona shielding of high-voltage windings of electrical machines. The invention suggests semiconductive band containing fibrous substrate with semiconductive compound applied on it including (wt %): chlorosulphonated polyethylene (6.5-12.0), epoxy resin (0.5-3.0), curing agent (0.01-0.2), current-carrying filler (6.0-40.0) and organic solvent (remains).
EFFECT: semiconductive band has chemical resistance to epoxy-anhydride compound and does not practically change its electrical performance after band saturation as per vacuum forcing method accepted in the industry.
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The invention relates to the electrical engineering, in particular to the production of semi-conducting materials used for protivokariosnoe protection of high-voltage windings of electrical machines.
Very often the high-voltage winding coated with semiconducting coating are vakuumanlagen impregnation epoxyurethane compound. The characteristics of semi-conducting coating can vary a lot and it (semi-conducting coating) ceases to carry out its purpose.
Famous semi-conducting tape BOB-400 (TU 1915-043-50157126-2006) production ELINAR holding company, which changes the resistance after impregnation epoxyurethane compound three orders of magnitude increase.
Famous semi-conducting tape PPL-R-1 (2, 3,)B (TU 3491-038-31885305-2006) production of CJSC "Dielectric"that change the resistance after impregnation epoxyurethane compound of three to five orders of magnitude increase.
Known conductive polyester tape 215.51, 215.55, 215.63 production Von Roll Isola that change the resistance after impregnation epoxyurethane compound for three to four orders of magnitude increase.
The closest solution of similar tasks is a semi-conducting tape for protivokariosnoe protection of high-voltage windings of electrical machines, containing fiber substrate, impregnated binder based on butadiene-nitrile rubber, catalysts knitting and conductive fillers (Patent RU №2150760 from 10.11.98, CL H01B 1/24; H02K 3/40; H01B 1/00).
The present invention is development of semi-conductive tape with a rated electrical resistance, minimally changing after vakuumanlagen impregnation epoxyurethane compound.
To solve this problem it is offered semi-conducting tape containing a substrate of glass or polyester or aramid, or polyetheramines paper thickness 30-200 mm with a deposited semiconductor composition, comprising a binder - chlorosulphurized polyethylene (molecular weight 20-40 thousand), epoxy resin (Dianov, Apoksiomen, nitrogen-containing, cycloaliphatic epoxy number 15-30), amine catalyst type, organic solvent, conductive fillers (carbon black, graphite, silicon carbide) in the following ratio of components, semi-conducting composition,% Mas.:
Chlorosulphurized polyethylene
6,5-12,0
Epoxy resin 0,5-3,0
The catalyst
0,01 -0,2
Conductive filler
6,0-40,0
Organic solvent Else
When the content of components in semi-conducting tape,% Mas.:
Semi-conducting composition 15-35
Substrate 65-85
To obtain semi-conducting tape, according to the invention first prepare semi-conducting composition, based on the above ratio of ingredients. As conductive filler serve as carbon black, graphite, silicon carbide or their mixtures. Dissolution of chlorosulfonated polyethylene, epoxy resin, catalyst spend in the amalgamator at room temperature. Solid components fray in the obtained solution of the bead or ball mill to the dispersity of 5-15 micron.
Song put on tape by passing it through the bath impregnating machines with subsequent drying at the temperature 80-180'c for 2-10 minutes.
The invention is illustrated by the examples given in the table: Table No. p/p
Material name, the standard indicators
Option 1
Option 2
Option 3 1.
Chlorosulphurized polyethylene 9,7 7,8 8,0 2.
Epoxy resin ED-20 1,9 0,8 0,9 3.
Catalyst 0,01 0,02 0,02 4.
Technical carbon 7,6 1,8 0,9 5.
Silicon carbide - 33,9 34,5 6. Solvent else else else 7.
Specific surface electrical resistance, Ohm
1,5·10 3 6·10 7 2·10 8 8.
Specific surface electrical resistance after impregnation epoxyurethane compound, Om 4·10 3 9·10 7 5·10 8
According to the invention of semi-conductive tape has a chemical firmness to boxinginsider the compound and practically does not alter the electrical characteristics after impregnation them tapes on vakuumanlagen method adopted in industry.
Semi-conductive tape for protivokariosnoe protection of high-voltage windings of electrical machines, containing fibrous substrate coated with semi-conducting composition, including conductive fillers and polymer binder, notable as a polymer binder is used chlorosulphurized polyethylene mixed with epoxy resin and catalyst in the following ratio of ingredients in semi-conducting composition,% Mas.:
Chlorosulphurized polyethylene
- 6,5-12,0
Epoxy resin
- 0,5-3,0
The catalyst
- 0,01 -0,2
Conductive filler
- 6,0-40,0
Organic solvent
- the rest
When the content of components in semi-conducting tape,% Mas.:
Semi-conducting composition - 15-35
Substrate - 65-85
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