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Casting resin system for insulators with higher heat resistance Claimed invention relates to the field of casting resins for switching devices. Described is a solid resin system for insulating materials in the switching devices, which contains a solid bisphenol A-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.3, and a liquid bisphenol F-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.4 to ≤0.63, where a part of the liquid bisphenol F-based resin, measured as a weight to the total weight of the resin, constitutes from ≥5% to ≤60%, with the solid resin system before hardening having an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.55, and the solid resin system includes as resins only the said resins themselves. Also described is application of the said solid resin system as an insulating material in electric switching devices. |
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Water-soluble systems based on epoxy resins Invention relates to water-soluble systems based on epoxy resins. Claimed are two-component compositions for coating, including epoxy resins B, which contain at least one epoxy group per molecule, and adducts A of epoxy resins A1, containing at least one epoxy group per molecule, and multifunctional A2 acids, containing at least two hydrogen-containing acid groups per molecule, in which multifunctional acids A2 represent additional products of phosphoric acid and epoxyfunctional compounds A21, which contain at least one epoxy group per molecule, where epoxy resins A1 and epoxy resins A21 represent bisphenol A derivatives, as well as method of their obtaining and method of their application in substrate coating. |
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Composition of epoxy resin, pre-preg and fibre-reinforced composite material Invention relates to epoxy resin compositions and can be applied as matrix resin of fibre-reinforced composite material. Composition contains epoxy resin [A], amine-based hardening agent [B] and block-copolymer [C]. Epoxy resin [A] contains components [Aa] - epoxy resin of biphenyl type, which has biphenyl structure and [Ab]. Component [Ab] contains components [Ab1'] - diglycidyl aniline derivative, [Ab2] - liquid epoxy resin of bisphenol type and [Ab3] - solid epoxy resin of bisphenol type. Component [B] is dicyandiamide. Block-copolymer [C], at least, one block-copolymer, selected from group consisting of S-B-M, B-M and M-B-M. Block M represents block, consisting of polymethyl methacrylate homopolymer, or copolymer, containing, at least, 50 wt % of methyl methacrylate. Block B represents block, which does not mix with block M and has temperature of vitrifying 20°C or lower. Block S represents block, which does not mix with blocks B and M and has temperature of vitrifying higher than temperature of vitrifying of block B. |
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Claimed invention relates to composition of resin with chain mechanism of hardening for composite material re-enforced with fibres. Described are versions of composition of resin with chain mechanism of hardening for obtaining composite material re-enforced with fibres, which contains: alicyclic epoxide compound (A), which contains two cyclohexene oxides in a molecule; and modified epoxy resin (B) of bisphenol type A, represented by formula (1) given below, where in modified epoxy resin (B) of bisphenol type A each R1 represents -CH(CH3)-, and R2 represents oxyalkylene group, and content of alicyclic epoxy compound (A) constitutes from 25 to 90 wt %, where total amount of component (A) and component (B) is taken as 100 wt %: [Chemical compound 1] |
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Method of producing curing agent for medium-molecular weight epoxy resins Invention relates to curing agents for epoxy resins and compositions based thereon. Disclosed is a method of producing an organosilicon curing agent for medium-molecular weight epoxy resins by reacting, for 2-3 hours at temperature of 80-100°C in the presence of an alkaline catalyst, an amine-containing organosilicon compound (I), an organosilicon compound with a phenyl group at the silicon atom (II) and an organosilicon compound containing two methyl groups at the silicon atom (III) with molar ratio of components I:II:III = 1.0:(0.5-1.0):(0.5-2.0) and total content of alkoxy groups to the total number of silicon atoms of 1-1.5. |
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Invention relates to high-strength polymer compositions intended for making articles from composite materials, applying anticorrosive and decorative coatings with high resistance to weather and ultraviolet radiation. The polymer composition contains an adduct of amines with epoxy resins, an active diluent and a product of reacting di- or polyepoxy compounds with nitrogen-containing components, where the nitrogen-containing component used is a mixture consisting of a compound having in its structure one or more tertiary nitrogen atoms and simultaneously one or more functional groups -NCO, -OH, -CH2OH and a compound containing, along with a tertiary nitrogen atom, a primary or secondary amino group, and the reaction is carried out by mixing at temperature ranging from 40°C to 220°C in 10-150 minutes. |
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Present invention relates to production of polymer compositions based on epoxy resins and modified amine curing agents, intended for producing high-strength composite materials with high resistance to thermal deformation. Described is a polymer composition based on epoxy resin, active epoxy diluents and nitrogen-containing curing agents intended for producing high-strength composite materials with high resistance to thermal deformation, characterised by that the curing agent is a product of reaction of an amine component with monocarboxylic acids, using as the amine component a mixture consisting of a primary aromatic amine or a mixture of aromatic amines (A), a secondary aliphatic amino alcohol (B) and a tertiary aliphatic amino alcohol (C) in weight ratio A:B:C from 98:0.2:1.8 to 80:5:15, and a monocarboxylic acid (D) is added in form of a 25-80% solution to the monoatomic aliphatic or aromatic alcohol, or ester thereof with a mono- or dicarboxylic acid, in ratio (A+B+C):D from 90:10 to 60:40 per 100% acid, followed by reaction by mixing in a reactor at temperature ranging from 50 to 130°C for 20 to 120 minutes and mixer speed of 100 to 3000 rpm, and additionally contains a thickener, a pigment or a dye, wherein the composition contains the following in pts.wt: epoxy resin - 100, active epoxy diluent - 5-130, curing agent - 15-110, thickener - 5-50, pigment and dye - 0.5-25. |
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Impregnating resin system for sealing materials in distribution devices Resin contains methyl nadic anhydride and/or hydrogenated methyl nadic anhydride and imidazole of formula , where R1, R2, R3 and R4 are given in claim 1. |
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Thermosetting resin-based polymer composite material and fibre-filled material containing said resin Invention relates to a thermosetting resin-based polymer composite material and fibre-filled material based thereon. The polymer composite material contains thermosetting resol phenol-formaldehyde resin and additionally thermosetting epoxy resin and a thermosetting polyester resin in the following ratio, wt %: thermosetting resol phenol-formaldehyde resin 48-83; thermosetting epoxy resin 3-13; thermosetting polyester resin 14-39. The fibre-filled material contains a thermosetting resin-based polymer composite material and fibre. The fibre used is polyacrylonitrile fibre or glass fibre in the following ratio, pts.wt: thermosetting resin-based polymer composite material 3.2-5.2; fibre 1.0. |
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Claimed invention relates to thermally hardened composition based on epoxy resins, which contains: (a) at least one epoxy resin A, which has on average more than one epoxy group per molecule; (b) at least one hardener B of opoxy resin, which is activated at increased temperature and represents amine, amide, anhydride of carboxylic acid or polyphenol; and (c) at least one accelerant C of formula (Ia) or (Ib), where R1 represents H or n-valent aliphatic, or araliphatic residue; R2 and R3 represent each independently on each other alkyl group; R1' represents n'-atom aliphatic residue; R2' represents alkyl group; R3' independently on each other represent H, or alkyl group, or aralkyl group; and n and n' - each has value from 1 to 4, in particular, 1 or 2; and d) at least one viscosity modifier D. Invention also relates to application of such composition in form of one-component thermally hardened glue, for obtaining coatings and for obtaining structural foam for reinforcement of cavities, as well as to method of gluing heat-resistant materials with application of composition by invention and to glued together/glued to product, thus obtained, and to vehicle or vehicle component, which contain such foamed product. Also described is application of accelerant of formula (Ia) or (Ib) for increasing viscosity of claimed compositions based on epoxy resins. |
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Invention relates to a polyisocyanate composition which is suitable for producing material which contains polyisocyanurate, a method of producing such a composition, a curable composition containing such a polyisocyanate composition and epoxy resin, and polyisocyanurate material. The polyisocyanate composition contains polyisocyanate, a lithium halide and a urea compound. The urea compound has average molecular weight of 500-15000 and optionally contains biurat groups. The number of lithium halide moles per equivalent isocyanate is in the range of 0.0001-0.04. The number of equivalents (urea+biuret) per equivalent isocyanate is in the range of 0.0001-0.4. |
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Double-package composition for protective and decorative floor coating Invention may be used for protection, without preliminary impregnation and pore filling of floors, floor covers of decorative paths and pavements, different rooms operated under extreme conditions of simultaneous effect of intensive dynamic and static loads, aggressive media and media that carry electrostatic danger. The double-package composition for a protective and decorative floor cover comprising a base of epoxide resins and a hardener, the base is epoxide oligomer with mass of not more than 370, phenoxy resin of equivalent mass of at least 3000, epoxidized vegetable oil, polymethyl diphenyl siloxane, monoethylene ether of ethylene glycol, nanoshell titanium dioxide, dry aluminium oxide, micronised specularite, nanostructured technical carbon, nanostructured graphite and hardener - modified polyamide. |
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Method of producing curing agents of epoxy resins Invention relates to a method of producing curing agents for epoxy resins for making large articles, anticorrosion coatings and other purposes. The curing agents are obtained by mixing a eutectic mixture of aromatic amines with a product of reacting an acid of general formula R2R COOH, where R is an aliphatic, cycloaliphatic or aromatic hydrocarbon moiety, R2 is a substitute -Cl, -F, -NH2, -NH-, -OH, -CH=CH-, -CH=CH2 (A) with a di- or polyamine of an aliphatic, cycloaliphatic or aromatic type, (B) and a polyatomic alcohol with containing 2-6 hyroxyls per molecule, (C) with ratio A:B:C from 70:29:1 to 20:70:10 by mixing in a medium of an ether of a di- or tricarboxylic acid and a monoatomic alcohol at temperature of 20-80°C for 10-120 minutes, with the ratio of the reaction product to the eutectic mixture of aromatic amines from 5:95 to 95:5. |
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Curable composition having thermolatent base Present invention relates to curable compositions containing a compound of formula where R1, R2, R3, R4 and R5, L are as disclosed in claim 1, n equals 1, p equals 1 or 2, and an organic material which is capable of polymerisation or cross-linking with a base or a nucleophilic catalyst. |
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Improved epoxy systems for composite materials Composition contains a system of epoxy resin which includes a reaction product of epoxy resin and a curing agent. The curing agent contains a first compound with an amino group of formula R1R2R3N, where R1 and R2 are independently an aliphatic or cyclic organic functional group and R3 is an alkyl group with 2-18 carbon atoms in the backbone chain; and a second compound with an amino group, with one or more primary or secondary amino groups, with stoichiometric ratio of -NH bonds of the second compound with an amino group to epoxy groups of the epoxy resin component of about 1:20-19:20. |
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Phosphorus-containing silsesquioxane derivatives used as flame retardants Present invention relates to a flame retardant - silsesquioxane of formula: [R1 3SiO1/2]m[R2SiO3/2]n[R3SiO3/2]p[(R4O)2PO(CH2)xSiO3/2]q), where R1, R2, R3 and R4 are hydrocarbon groups; x is an integer from 1 to 8; m is a positive number less than 1.5; n and q are positive numbers greater than 0 and less than 1; and p is a number greater than or equal to 0 and less than 1, where (n+p)/q ranges from 0.5 to 99, and additionally where (n+p+q)=1, as well as compositions which contain said silsesquioxane and epoxy resins. |
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Primer compositions for adhesive binding systems and coatings Present invention relates to an aqueous primer composition. The aqueous primer composition contains: a. at least one composition of a heat-curable self-emulsifying epoxy resin obtained by reacting (a) epoxy resin, (b) a polyatomic phenol and (c) an amine-epoxide adduct, where the amine-epoxide adduct is a product of reaction of an aromatic polyepoxide with polyoxyalkylene amine; b. at least one composition of a heat-curable non-self-emulsifying resin having an epoxide base which has epoxide functionality from 1.8 to 4 and epoxide equivalent weight from 100 to 200; c. water; and d. at least one curing agent. The invention also describes a method of producing the aqueous primer composition. |
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Cold curing epoxide composition Epoxide composition can be used as a saturating composition and an adhesive composition and for protective coatings of metal and concrete surfaces. The cold curing epoxide composition contains an epoxide base which includes an epoxy-diane resin having molecular weight of 340-540, an epoxy-urethane resin and a curing system which contains an aromatic amine and an imidazole-type heterocyclic compound. |
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Invention relates to polymer compositions based on epoxy resins and latent curing agents and can be used as epoxy filling compounds, binding materials for fibre-glass, adhesives, coatings and other purposes. The epoxy component used is a mixture of aromatic and aliphatic epoxy resins in ratio of 96:4 to 20:80. The latent curing agent used is polyisocyanate - a mixture of isomers 4,4'-2,2' and 4,2'-diphenyl methane diisocyanate and their homologues of tri- and tetraisocyanates, whose aromatic rings are bound by methylene bridges. The methylene bridges are blocked by a mixture which consists of ε-caprolactam (A), methylpyrazole (B) and benzyl alcohol (C) in ratio A:B:C from 90:9:1 to 10:80:10. Blocking is carried out by stirring the molten reaction mass at temperature of 60-140°C for 40-180 minutes with the ratio of the isocyanate and blocking components ranging from 76:24 to 60:40. The ratio of the epoxy and isocyanate components in the composition is as follows (pts.wt): mixture of epoxy resins - 100, curing agent - 10-50. |
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Invention relates to preparation of polymer compositions based on epoxy resins and cycloaliphatic dioxides, which are meant for making large-sized articles from composite materials. The composition is based on a mixture of epoxy resins and products of epoxidation of 2-4-atomic alcohols in ratio of 99:1 to 1:99. The curing agent is a product of reaction of an acid (A) - a compound of general formula R2-R1-COOH, where R1 is an aliphatic, cycloaliphatic, aromatic hydrocarbon or heterocyclic fragment, R2 is a substitute - Cl, -F, -NH2, -NH-, -OH, -CH=CH-, -CH=CH, amine (B) - di- or polyamine of an aliphatic, cycloaliphatic or aromatic type together with a polyatomic alcohol containing 2-6 hydroxyls in one molecule (C). Components in ratio A:B:C from 70:29:1 to 20:70:10 are mixed in a medium of a di- or tricarboxylic acid ether and a monoatomic alcohol at temperature of 20-80°C for 10-120 minutes. The obtained ternary reaction product is mixed with a eutectic mixture of aromatic amines in a ratio ranging from 5:95 to 95:5 and with lactone or lactam. The composition contains the following (pts.wt): resin part -100, curing agent - 20-100, lactone or lactam - 3-30. |
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Method of producing curing agents of epoxy resins Invention relates to a method of producing curing agents of epoxy resins and can be used to produce epoxide compositions with improved processing properties. The curing agents are obtained by reacting di- or polyepoxide compounds with nitrogen-containing compounds. The nitrogen-containing component used is a mixture which consists of one or two compounds having in their structure one or more tertiary nitrogen atoms and simultaneously one or more functional groups -NCO, -OH, -CH2OH (A) and compounds which contain, alongside the tertiary nitrogen atom, a primary or secondary amino group (B) in ratio A:B ranging from 99:1 to 70:30. Components react in the ratio of the epoxide compound to the nitrogen-containing component ranging from 90:10 to 50:50 while stirring at temperature of 40-220°C for 10-150 minutes. |
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Invention relates to preparation of epoxide compositions for making high-strength polymer materials. The composition is based on a mixture of di- and polyepoxy resins and modifiers. The modifiers are products of epoxidation of 2-4-atomic alcohols in a ratio from 99:1 to 1:99. The curing agent is a product of reaction of an acid (A) - a compound of general formula R2-R1-COOH, where R1 is an aliphatic, cycloaliphatic, aromatic hydrocarbon or heterocyclic fragment, R2 is a substitute - Cl, -F, -NH2, -NH-, -OH, -CH=CH-, -CH=CH, amine (B) - di- or polyamine of an aliphatic, cycloaliphatic or aromatic type together with a polyatomic alcohol containing 2-6 hydroxyls in one molecule (C). The ratio A:B:C ranges from 70:29:1 to 20:70:10. The components are mixed in a medium of a di- or tricarboxylic acid ether and a monoatomic alcohol at temperature of 20-80°C for 10-120 minutes. The obtained ternary reaction product is mixed with a eutectic mixture of aromatic amines with melting point from -10°C to 90°C with the ratio of the reaction product to the eutectic mixture of aromatic amines ranging from 5:95 to 95:5. The composition contains the following (pts.wt): resin part -100, curing agent - 20-100. |
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Invention relates to a curable sealing resin composition. The curable composition contains at least one anhydride-functionalised polymer in amount of 30-60 wt %, a polyol in amount of 10-25 wt %, an epoxide-functionalised polymer, oligomer or monomer in amount of 15-40 wt %, a urethane polyol-functionalised compound selected from a group consisting of urethane diol, polyurethane diol and combination thereof in amount of 5-15 wt % and a catalyst with respect to total weight of the resin. The resin composition can be cured at room temperature. Components used to prepare and cure the resin composition can be provided in form of two or more parts. |
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Method of producing curing agents of epoxy resins Invention relates to a method of producing curing agents of epoxy resins involving an operation for reacting amines with monocarboxylic acids. The method is characterised by that the amine component used is a mixture consisting of a primary aromatic amine or a mixture of aromatic amines (A), a secondary aliphatic amino alcohol (B) and a tertiary aliphatic amino alcohol (C) in weight ratio A:B:C from 98:0.2:1.8 to 80:5:15. The monocarboxylic acid (D) is used in form of a 25-80% solution in a monoatomic aliphatic or aromatic alcohol, or ester thereof with a mono- or dicarboxylic acid, in ratio (A+B+C):D from 90:10 to 60:40 per 100% acid. The reaction process is then carried out by mixing in a reactor at temperature ranging from 50 to 130°C for 20 to 120 minutes and speed of the mixer of 100 to 3000 rpm. |
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Epoxy binder for composite materials Invention relates to epoxy binder for articles made from composite materials produced primarily by wet (thread, bundle) winding. The epoxy binder for composite materials contains triglycidyl derivative of para-aminophenol, a diluent - epoxy-aniline resin, a technical mixture of polysulphides based on o-tertbutyl phenol, an amine curing agent - mixture of 2- and 4-aminobenzyl anilines, 4,4'-diaminodipheny methane and higher polyaminobenzyl anilines. |
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Disclosed enamel contains the following (pts.wt): semi-finished enamel from epoxy resin-base - 100, an accelerator - 0.1-3.0 and a hardener - 50-90. The semi-finished enamel contains a film-forming diane resin-base which contains 48-72% diane epoxy resin, 10-25% modifier, 10-30% catalyst obtained by epoxidation of a hydroxyphenylene oligomer from alkyl resorcinol with degree of polycondensation n=0-2 at temperature of 180-250°C, pigments, filler and a rheological agent. Components of the semi-finished enamel are in the following ratio, wt %: film-forming diane epoxy resin-base - 88-92; pigments, filler, rheological agent - 8-12. |
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Described is use of 1,3-substituted imidazole salts of formula I wherein R1 and R3 independently denote a methyl, ethyl, n-propyl, isopropyl, n-butyl, dibutyl or tertbutyl group, R2, R4 and R5 independently denote a hydrogen atom or an alkyl group with 1-8 carbon atoms, wherein R4 and R5 can also form an aliphatic or aromatic ring, X is an anion selected from: cyanide, cyanate, anions of phthalic acid, isophthalic acid, oxalic acid, malonic acid, amber acid, glutaric acid, adipic acid, benzoic acid, phenylacetic acid, formic acid, acetic acid, acetoacetic acid, lactic acid, glycolic acid, glyoxalic acid and methyl mercaptoacetic acid, and n equals 1, 2 or 3. 1-ethyl-2,3-dimethyl imidazolium acetate and a complex of acetic acid with 1-ethyl-2,3-dimethyl imidazolium acetate as imidazolium salts are excluded, at temperatures below 175°C as latent catalysts for curing compositions containing epoxy compounds. Described is a curable composition which contains epoxy compounds and a latent catalyst of formula I, as described above, except 1-ethyl-2,3-dimethyl imidazolium acetate. The composition is cured at temperature below 175°C. Described is use of said curable composition as means of coating or saturating, as an adhesive, composite material, for producing moulded articles or as an injection compound for filling, joining or reinforcing moulded articles. Described is use of said curable composition to produce composite materials by curing pre-impregnated fibres or fibrous fabric or by extrusion, drawing, winding, and a technique for moulding by resin impregnation and a resin infusion technique. |
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Binder for prepregs and method of producing said binder Invention relates to production of polymer materials meant for producing prepregs. The binder contains epoxy triphenol resin - triglycidyl ether 1,1,3-tri(oxyphenyl)propane, epoxy-diane resin, thermoplastic polyester with molecular weight of 30000 and a hardener. The hardener is a product of reacting diglycidyl ether of diethylene glycol and a boron trifluoride complex with benzyl amine in ratio of (2.5:1). The method involves the following steps: obtaining a product of reacting diglycidyl ether of diethylene glycol and a boron trifluoride complex with benzyl amine by gradually adding the complex to the resin heated to (50-55)°C in ratio of (1:2.5) for 1 hour; mixing for 1 hour; adding the obtained product to a prepared melt of epoxy resins in a mixture with polyester. |
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Method of obtaining polyalkyleneglycol esters of α-tocoferol Invention relates to method of obtaining polyalkyleneglycol esters of α-tocoferol, applied in cosmetology, medicine and food industry. Method lies in interaction of α-tocoferol acetate with alkali, ethylene oxide or propylene oxide at temperature 100-175°C and pressure 1-5 atm. Process is carried out in two stages. At the first stage interaction of α-tocoferol with alkali and ethylene oxide or propylene oxide is performed. Oxide is used in amount 2-10 moles per a mole of α-tocoferol acetate. Obtained product is separated. At the second stage selected intermediate product is oxyakylated with ethylene and/or propylene oxide on presence of alkali. |
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Polymer composition and articles moulded therefrom Polymer composition contains a first basic polymer (A) containing at least a thermoplastic polymer; a second basic polymer (B) containing at least a thermoplastic polymer and which is incompatible with the first basic polymer (A); and an additive (C) containing at least a substance which is incompatible with any of the first basic polymer (A) and the second basic polymer (B). The additive (C) is a liquid or suspension at temperature lower than the pyrolysis temperature of the first basic polymer (A) and the pyrolysis temperature of the second basic polymer (B). Components (A), (B) and (C) are separated from each other by a phase, and boundary surfaces, each lying between two phases (A), (B) and (C), are in contact with each other, forming spatially continuous parallel boundary surfaces. A moulded product, for example, is a filter or a spacer for refrigerators or capacitors. The polymer composition is used to produce an adhesive, ink, paint, films and fibre for a powdered catalyst. |
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Method of producing hardener for low-molecular weight epoxy resins Disclosed is a method of producing a hardener by reacting, while heating to temperature 80-100°C, aminoalkyl alkoxysilane or siloxane of general formula [RSi(OR')aO(3-a)/2]n (I), where R is 3-aminopropyl or N-(2-aminoethyl)-3-aminopropyl, R' is methyl or ethyl; a=1.0-3.0, n=1-9, with methyl phenyl cyclosiloxane, methyl phenyl dialkoxy-silane or methyl phenyl alkoxysiloxane of general formula [(CH3)(C6H5)Si(OR')bO(2-b)/2]n (II), where R' is methyl or ethyl; b=0-2.0, n=1-5, with molar ratio of components I:II=1:(1-2.5) and total content of alkoxy groups in the starting components of 1-1.5 with respect to the number of silicon atoms. Synthesis is carried out in the presence of alkaline catalysts. |
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Thermosetting resin containing exposed thermoplastic agent for increasing impact strength Invention relates to an uncured polymer composition for use in prepregs; a prepreg containing said composition; a polymer product containing said uncurred polymer composition; a composite product containing said prepreg; a method of producing said composition; a method of producing said prepreg; a method of producing the polymer product and composite product, as well as a method of producing a reinforced thermosetting polymer composition. The uncured polymer composition contains a thermosetting polymer component selected from a group comprising epoxy resins, cyanate ester-based resins and bismaleimide resins; a thermoplastic agent for increasing impact strength which is exposed to gamma rays or an electron beam with a minimum dose of 50 kGy, preferably more than 100 kGy, and selected from a group comprising polyether sulphone, polyether ethersulphone, polyether imide, polyphenyl sulphone and copolymers thereof; and a hardener. |
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Electrodeposited coatings for use on aluminium substrates Invention relates to a method of coating aluminium substrates through anionic electrodeposition of phosphated epoxy resin. The method of coating an aluminium substrate is realised by passing electric current between the substrate, which acts as the anode, and a cathode which is in electric contact with an electrodeposition bath containing an aqueous dispersion a base-neutralised resin composition containing a phosphated epoxy resin which does not form gel and which contains a mixture of a product of reaction of one or more polymer epoxy-compounds with phosphoric acid and with organophosphonic acid and/or organophosphinic acid, wherein the aqueous dispersion contains a curing agent. Also disclosed is an aqueous resin dispersion for coating a substrate, containig: (a) a base-neutralised resin composition containing a phosphated epoxy resin which does not form gel and which contains a mixture of a product of reaction of one or more polymer epoxy-compounds with phosphoric acid and with organophosphonic acid and/or organophosphinic acid, and (b) azole containing a sulphur atom. |
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Method of producing ortho-cresol novolac epoxy resin and polymer composition based thereon Invention relates to a method of producing ortho-cresol novolac epoxy resin and a polymer composition for sealing semiconductor devices which contains said resin. The method of producing ortho-cresol novolac epoxy resin involves polycondensation of ortho-cresol and formaldehyde in equimolar ratio while heating in the presence of an acid catalyst in the medium of n-butanol, reaction of the obtained product with excess epichlorohydrin while heating in the presence of an alkaline catalyst, distillation of epichlorohydrin and extracting the end product. Formaldehyde is used in form of para-formaldehyde. Polycondensation of ortho-cresol and para-formaldehyde is carried out at 115±2°C, first in the presence of 6-8 pts.wt oxalic acid until achieving 35-45% conversion, and then in the presence of 3-5 pts.wt pair-toluene sulphonic acid until complete extraction of the calculated amount of water, n-butanol is then distilled, the reaction mass is neutralised, after which 350-400 pts.wt epichlorohydrin is added and then crushed sodium hydroxide in portions for 1.5-2.0 hours while maintaining temperature in the range of 65-70°C, subsequently holding the reaction mass for 1.0-2.0 hours, distillation of excess epichlorohydrin and n-butanol, washing the resin with chloroform and water and extracting the end product from the chloroform solution by distilling off the chloroform. The polymer composition for sealing semiconductor devices contains ortho-cresol novolac epoxy resin as binder, phenol novolac resin as hardener, quartz filler, glycidyl oxypropyl trimethoxysilane as a finishing agent, triphenyl phosphine as an accelerator, wax and soot. |
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Epoxy composition for polymerisation and sealing compound containing said composition Epoxy composition for polymerisation contains (A2) a fluorene epoxy compound of formula |
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Apparatus for vectorial polymerisation Polymers are grown through a directed chemical reaction in a gradient temperature field on the boundary between a liquid mixture of initial components and a solid polymer. The apparatus has a sealed container with the mixture of initial components, a multi-section heater for creating a gradient temperature field, apparatus for moving the container parallel to the axis of the multi-section heater, a thermocouple and a temperature control device. |
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Modified amine hardener of epoxy resins Disclosed is an amine hardener of epoxy resins which is a solution of polyaniline in form of an emaraldine base in 2-methylpentamethylene-1,5-diamine. Content of polyaniline ranges from 0.5 to 10%. |
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Method of producing activated polyethylene oxide Method involves oxidation of polethylene oxide with 2% potassium permanganate solution in amount ranging from 1.6 to 20% of the volume of the polyethylene oxide solution at temperature 80-100°C in the presence of an organic or inorganic acid, followed by removal of products of unreacted oxidising agent. |
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Polythioether based amine resins and compositions containing said resins Resin contains 5-90 wt % polythioether based epoxy resin and 10-95 wt % epoxy resin. 10-40% of epoxy group equivalents are quaternised and 10-90% of non-quaternised epoxy group equivalents are reacted with amine. |
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Method of sealing, shielding and hardening self-propelled vehicle section Proposed method comprises producing activated material containing (in wt %) epoxy resin (7-18), epoxy/elastomer adduct (10-30), polymer shock resistance modifier of core/shell type (10-30) and hardener, placing activated material on or nearby nearest surface of any element of self-propelled vehicle so that activated material is located on bearing element and inside cavity formed by vehicle element, and activating said material on bearing element to joint said activated material to vehicle element surface. Polymer shock resistance modifier of core/shell type comprises core from first polymer material and shell of second polymer material wherein second polymer material is grafted to first polymer material to encapsulate it. Activated material features post activation degree of hardness conservation at strain of 30% equal to at least 0.8. |
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Cationic resin for pigment dispersion and electrodeposition paint composition containing said resin Cationic resin for pigment dispersion, such as polyepoxide amino resin containing an acid-neutralised amine group. Resin is obtained from a monoepoxide amine compound formed during reaction of monoepoxide and amine, having three or more active hydrogen atoms, and a quaternary ammonium salt group in the middle of its chain. |
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Method of producing curing agent Invention relates to curing agents used in epoxide composite materials for acid curing. Disclosed is a method of producing a curing agent by reacting epoxide compounds with anhydrous orthophosphoric acid in molar ratio 3:1-9:1 mole of epoxide groups per mole of acid, in which a reactive solvent is added to both the epoxide compound and acid, where he said solvent is selected from ketones, dimethyl formamide or dimethyl sulphoxide, in amount of 0.2-0.5 pts.wt per 1 pts.wt of reagents. The acid solution is then heated to temperature 50-70°C and the epoxide compound is proportionally added. The orthophosphoric acid used is obtained by reacting aqueous sulphuric acid solution with phosphorus pentoxide, and the epoxide compounds used are selected from phenylglycidal or butylglycidal ether, epichlorohydrin, diane epoxide oligomers or mixtures thereof with aliphatic epoxide oligomers. |
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Epoxy resins containing cycloaliphatic diamine based curing agent Invention relates to curing compositions for epoxy resin based systems. The invention discloses a curing composition for epoxy resins, containing a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane, a prepolymer curing composition for epoxy resins, containing a product of reacting epoxide with a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane, as well as a method of preparing the prepolymer curing composition, a method of gluing two substrates, an aqueous epoxy resin and versions of curing compositions and methods of applying a coating on a substrate. |
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Composition contains 30-80 pts. wt resin which contains a product of reaction of a sulphur compound with an epoxy compound, a product of reaction of an amine compound and an epoxy compound and 20-70 pts. wt cross-linking agent. |
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Halogenated epoxy polymer reacts with methacrylic acid. Binder based on a halogenated epoxy acrylate polymer is diluted with a reactive monomer. |
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Invention relates to polymeric binding material for composite materials mainly made through wet winding or prepreg technique. Invention can be used as an impregnating compound, sealant, adhesive or coating. A 4,4'-bis-(glycidylamino)-3,3'-dichlorodiphenylmethane oligomer of formula C19H14N2O2 and binder based on said oligomer is obtained, including with addition of an organic solvent or active diluent (25-35%), and a curing agent ((0.5-1.1 pts. wt): 100 pts. wt composition).The disclosed oligomer hardens without using curing agents under the effect of high temperature. |
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Powder coating composition for coating pipes Composition contains a homogeneous mixture consisting of at least one bromine-functionalised epoxy resin, at least one epoxy curing agent and at least one pigment, filler and/or coating additive. Content of bromine in the bromine-functionalised epoxy resin is equal to 5-60%. The composition also contains alkanol amine and at least one zinc borate compound. Alkanol amine is selected from a group consisting of diethanol amine and tris(hydroxymethyl)aminomethane. The method of preparing the composition involves mixing components, heating to melting point of the mixture, extrusion of the molten mixture, cooling, crushing and grinding to powder. The composition provides a coating with high glass transition temperature and acceptable flexibility when depositing the coating onto a metallic or plastic base, in particular metallic and plastic pipes. |
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Invention relates to a film-forming composition capable of electrodeposition. The film-forming composition is a product of reacting a) a polyamine which contains a primary amine group and a secondary amine group and b) an acyclic carbonate. The polyamine does not contain a polyfunctional amine which contains at least one primary or secondary amine group another functional group containing active hydrogen. The polyamine contains diethylene triamine, dipropylene triamine and/or bis-hexamethylene triamine. The acyclic carbonate contains dimethylcarbonate, diethylcarbonate, methylethylcarbonate, dipropylcarbonate, methylpropylcarbonate and/or dibutylcarbonate. The film-forming composition also contains an acrylic polymer. The acrylic polymer is obtained from ethylene-unsaturated monomers containing an epoxy group, and/or grafted copolymers of acrylic polymers and polyepoxides. Described also is a method of preparing a film-forming composition and a metal substrate partially coated with the film-forming composition. The method of preparing the film-forming composition involves mixing polyamine which contains a primary amine group and a secondary amine group and an acyclic carbonate. Mixing is done at temperature between 22°C and 100°C. |
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Invention relates to hair conditioning and fabric softening aqueous compositions which contain an effective amount of an oligomeric amidoamine and water, wherein the oligomeric amidoamine contains a reaction product (A), (B) and (C), where (A) is alkylene polyamine having formula: , where R1, R2, and R3 independently denote H or -R5-N(R4)2, where not all of R1, R2 and R3 denote H; R4 denotes H or -R5-N(R8)2; R8 independently denotes H or R5; and R5 denotes (i) a C1-C23 alkylene or alkenyl group which is optionally substituted or branched; or (ii) an aryl group; (B) is a dicarboxylic acid or reactive derivative of such an acid, having formula HOOC-R5-COOH, where R5 is as defined above; and (C) is (i) a fatty acid having formula R6-COOH, where R6 denotes a straight or branched C6-C23 alkyl or alkenyl group; and/or (ii) alkyl ether or fatty glyceride (i), a salt of oligomeric amidoamine and/or oligomeric amido-quaternary oligomeric amidoamine. The invention also relates to fabric softening and hair conditioning methods, involving contact between hair and fabric and a sufficient amount of said compositions. |
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Epoxide compound contains at least one epoxydiane resin or mixture thereof with other resins, an anhydride hardener and a hardening catalyst - an organic cation of a quaternary ammonium salt immobilised by a layered aluminium silicate of the montmorillonite group, where the said organic cation has the formula: |
Another patent 2513082.