Casting resin system for insulators with higher heat resistance

FIELD: chemistry.

SUBSTANCE: claimed invention relates to the field of casting resins for switching devices. Described is a solid resin system for insulating materials in the switching devices, which contains a solid bisphenol A-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.3, and a liquid bisphenol F-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.4 to ≤0.63, where a part of the liquid bisphenol F-based resin, measured as a weight to the total weight of the resin, constitutes from ≥5% to ≤60%, with the solid resin system before hardening having an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.55, and the solid resin system includes as resins only the said resins themselves. Also described is application of the said solid resin system as an insulating material in electric switching devices.

EFFECT: obtaining the solid resin system, possessing low susceptibility to cracking and high resistance to bursting.

7 cl, 1 ex

 

The present invention relates to the field of injection molding resins for switching devices.

In electrical switching devices, in particular, in a compact design plays an important role insulating material.

When this applies, among others, the so-called solid resins. They are the so-called advanced process by which a liquid resin result in a reaction with a suitable source component, mainly bisphenol A, and a catalyst.

Because this process is ectothermic, systems based on solid resins develop favorable esotericist during curing. In addition, these systems due to the lengthening of the chains are more flexible than liquid resin system.

The advantage of these resins is a high glass transition temperature, but often are also high demands for favourable mechanical properties, such as low susceptibility to cracking and high resistance to bursting.

The challenge therefore is an alternative to the existing solutions to develop a solid resin system for a switching device that combines high glass transition temperature with simultaneously good or even improved other properties.

This problem is solved by a solid resin system according to paragraph 1 of this application. In accordance with the tvii it is proposed that the solid resin system for insulating materials in the switching devices, formed from a source material containing a solid resin based on bisphenol A and a liquid resin based on bisphenol F.

Unexpectedly discovered that when applying liquid epoxy resins based on bisphenol F can significantly improve some mechanical and/or electrical properties of the resin systems. This includes, depending on the application, among others:

the best values of the resistance to bursting,

best behavior when the temperature changes,

- increased the glass transition temperature.

In the spirit of the present invention, the term "on the basis of X includes and/or covers, in particular, that as the source component, in particular a main component, the connection is used X. the additives can be applied to all known in the prior art other substances.

In the spirit of the present invention, "bisphenol F" refers to a chemical compound 4,4'-dihydroxydiphenylmethane, which has the following structure:

In the spirit of the present invention under the "bisphenol A" refers to a chemical compound 2,2'-bis(4-hydroxyphenyl)propane, which has the following structure:

In the spirit of the present invention, the term "hard resin", "liquid resin", and "solid resin system includes and/or covers, cha is in the surrounding area, epoxy resin formed from the initial components containing epichlorohydrin (or other suitable epoxy original components) and bisphenol.

In the spirit of the present invention, the term "switching device" includes and/or covers, in particular, devices for low, medium and high voltage.

In the spirit of the present invention, the expression "formed from the source component(s)" means and/or includes, in particular, that the solid resin system received from this/these components.

According to one preferred form of implementation of the present composition, the solid resin system before curing epoxy has a number (DIN ISO 16945) ≥0.2 to ≤0,55, preferably ≥0.35 to ≤0.5, and even more preferably from ≥0.4 to ≤0,45. It has proved favorable in practice.

Preferably, the share of liquid resin based on bisphenol F in the solid resin system (measured as weight to the weight of the entire resin) is ≥5% and ≤60%, even more preferably from ≥10% to ≤50%.

According to one preferred form of implementation of the present composition, a liquid resin based on bisphenol F epoxy has a number (DIN ISO 16945) ≥0.4 to ≤0,63, preferably ≥0.45 to ≤0,6, even more preferably from ≥0.5 to ≤0,59. It has proved favorable in practice.

Preferably, the liquid resin on the core is ve bisphenol F is mixed with a solid resin based on bisphenol A (and optionally fused or prepared for mixing with other appropriate methods) before what happens cure.

According to one preferred form of implementation of the present compounds, solid resin based on bisphenol a has an epoxy number (DIN ISO 16945) ≥0.2 to ≤0.3, and preferably from ≥0.22 to ≤0,28, even more preferably from ≥0.24 to ≤0,26. It has proved favorable in practice.

According to one preferred form of implementation of the present invention, the starting materials from which are formed of hard resin system containing a solid component.

While it is preferable that the solid component is selected from the group consisting of phthalic anhydride, tetrahydrophthalic anhydride, methylenedi-anhydride, hydrogenated methylenedi-anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and derivatives thereof, and mixtures thereof. Particularly preferred mixtures of phthalic anhydride and tetrahydrophthalic anhydride.

According to one preferred form of implementation of the present invention, the starting materials from which are formed of hard resin system, containing accelerator component.

When the accelerator component is preferably selected from the group consisting of tertiary amines, Quaternary ammonium compounds, phosphines, phosphonium compounds of the complexes of BCl3-amines, imidazoles and their proizvodnye mixtures thereof.

According to a further preferred form of implementation of the present invention, the accelerator component selected from the group consisting of 1-Mei, 1-ethylimidazole, 1-propylimidazol, 1-isopropylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-ethylimidazole, imidazole, 1-benzyl-2-phenylimidazole, 1-vinylimidazole, 2-Mei, the 2-getdelimiter, and mixtures thereof.

According to one preferred form of implementation of the present invention, the starting materials from which are formed of hard resin system contains a filler.

When the filler is preferably selected from the group consisting of SiO2dolomite, Al2O3, CaCO3, TiO2and their derivatives and mixtures.

Especially preferred Al2O3and especially Al2O3with d50from ≥2 µm to ≤6 μm. It has proven itself in practice as it is often possible to increase further the resistance to punching shear. Even more preferably, d50≥2.5 µm to ≤5 μm, more preferably from ≥3 µm to ≤3.5 µm.

According to one preferred form of implementation of the present invention, the proportion of filler in the system liquid resin (weight by weight of the whole mixture) is ≥50% to ≤75%. The preferred proportion of ≥60% and ≤70%, more preferably ≥65% to ≤68%.

According to one preferred form implemented the I of the present invention, solid resin system get in the curing process, comprising the step of curing at a temperature ≥140°C, preferably ≥150°C and duration of curing ≥12 h, preferably ≥14 h, and most preferably ≥16 PM

According to one preferred form of implementation of the present invention, the solid resin system produced by the method containing the steps:

a) preparation of a solid resin based on bisphenol A,

b) a mixture of this solid resin with a liquid resin based on bisphenol F, if necessary with heating, or other suitable means,

c) curing the mixture of solid and liquid resins, optionally with the addition of at least one curing agent, accelerator and/or filler, at least one step of curing at a temperature ≥140°C, preferably ≥150°C and duration of curing ≥12 h, preferably ≥14 h, and most preferably ≥16 PM

The shading is carried out preferably in a vacuum.

The present invention relates, in addition to insulating the part containing the insulating resin of the present invention. Preferably, the insulating part is part of the GIS-installations (gas-insulated switchgear - gas-insulated switchgear).

The present invention relates also to the use of solid resin system containing tordu the resin based on bisphenol A, and a liquid resin based on bisphenol F as source material for the insulation system for switching devices.

The above, as well as claimed and described in the embodiments used according to the invention the parts do not have any special exceptions with respect to their size, design, material selection and technical conception, so that they can freely be used are known in the field of application of the selection criteria.

The following details, features and advantages of the subject invention emerge from the dependent claims and from the following description of the respective examples.

Example I

The present invention, a purely illustrative and without limitation, tested on the following example I according to the invention.

In this first preparing a mixture of a solid resin based on bisphenol A and liquid resins based on bisphenol F, mixing solid resin based on bisphenol A with an epoxy number of 0.26 and a liquid resin based on bisphenol F epoxy number of 0.58 thus, to obtain a resin with an epoxy number 0,42.

Then the resin is mixed with other components according to the following recipe, and utverjdayut:

ComponentRelative weight content
resin100
tetrahydrophthalic anhydride44
phthalic anhydride22
aluminum oxide (d50: 3,3 µm)352
2-Mei0,015

Formed solid resin system utverjdayut 3h at 130°C, and then finally utverjdayut 16 h at 150°C.

In addition, there was prepared a comparative resin system (not of the invention).

Comparative example I

In comparative example I a liquid resin based on bisphenol F was replaced with a liquid resin based on bisphenol A. In the rest of the conditions for receipt have been the same.

Each resin blends were cast samples for testing in the form of a rod and insulators. The trial was established, firstly, ultimate tensile strength [ISO 527-4], a flash point according to Martens, as well as the punching shear resistance after thermal cycles (test pressure of water).

The resin systemTensile strength tensileFlash point according to Martens °C) Resistance to punching shear
Comparative example I70 kN/mm2143The nominal value is not observed
Example I90 kN/mm2133The nominal value of the observed

Thus, visible advantageous properties of solid resin system according to the invention.

1. Solid resin system for insulating materials in the switching device containing a solid resin based on bisphenol A, which has an epoxy number (DIN ISO 16945) ≥0.2 to ≤0,3, and a liquid resin based on bisphenol F, which has an epoxy number (DIN ISO 16945) ≥0.4 to ≤0,63, where the share of liquid resin based on bisphenol F resin, as measured by mass to the total mass of the resin is ≥5% and ≤60%, and the solid resin system before curing epoxy has a number (DIN 16945 ISO) ≥0.2 to ≤0,55, and the solid resin system as resins includes only directly mentioned resin.

2. Solid resin system according to claim 1, where the original matter of which is formed of hard resin, contain an accelerator selected from the group consisting of tertiary amines, Quaternary compounds and mania, phosphines, phosphonium compounds of the complexes of BCl3-amines, imidazoles and their derivatives, and mixtures thereof.

3. Solid resin system according to claim 1, where the accelerator is selected from the group consisting of 1-Mei, 1-ethylimidazole, 1-propylimidazol, 1-isopropylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-ethylimidazole, imidazole, 1-benzyl-2-phenylimidazole, 1-vinylimidazole, 2-Mei, the 2-getdelimiter, 2-vinylimidazole, and mixtures thereof.

4. Solid resin system according to claim 1, where the original matter of which is formed of hard resin, contain an accelerator selected from the group consisting of phthalic anhydride, tetrahydrophthalic anhydride, methylenedi-anhydride, hydrogenated methylenedi-anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and derivatives thereof, and mixtures thereof.

5. Solid resin system according to claim 1, where the original matter of which is formed of hard resin contains a filler selected from the group consisting of SiO2dolomite, Al2O3, CaCO3, TiO2and their derivatives and mixtures.

6. Solid resin system according to claim 1, where the original matter of which is formed of hard resin, contain Al2O3with d50from ≥2 µm to ≤6 ám.

7. The use of solid resin system formed from the initial components containing solid smo is on the basis of bisphenol A, which has an epoxy number (DIN ISO 16945) ≥0.2 to ≤0,3, and a liquid resin based on bisphenol F, which has an epoxy number (DIN ISO 16945) ≥0.4 to ≤0,63, where the share of liquid resin based on bisphenol F resin, as measured by mass to the total mass of the resin is ≥5% and ≤60%, and the solid resin system before curing epoxy has a number (DIN ISO 16945) ≥0.2 to ≤0,55, and the solid resin system as resins includes only directly these resin as an insulating material in electrical switching devices.



 

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18 cl, 2 ex, 4 tbl

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1 tbl

Insulating enamel // 2342723

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2 tbl, 7 ex

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3 tbl

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4 cl, 4 tbl, 16 ex

FIELD: chemistry.

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25 cl, 3 dwg, 17 ex

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25 cl, 3 dwg, 17 ex

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1 tbl, 12 ex

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10 cl, 1 tbl, 4 ex

FIELD: physicochemical analytical methods.

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EFFECT: enabled chromatogram with sharp picks for polycyclic aromatic compounds.

10 cl, 1 tbl, 4 ex

FIELD: chemistry.

SUBSTANCE: present invention pertains to use of Oxylin-5 resin as a modifier for increasing heat resistance of epoxy compounds. The modifier is added to epoxy compounds for anhydride solidification in quantity of 8-15 pts. wt. The invention increases heat resistance (as per Vic) of compounds, based on "ЭД-20" resin to 135°C, to 340°C for compounds based on "ЭХД" resin, and 190°C for compounds based on "УП-610" resin, with retention of deformation-strength properties of the solidified compound.

EFFECT: invention can be used as sealing and potting materials when making objects for different purposes, particularly organo- and glass-fibre reinforced plastics, in construction, aviation, automobile, aerospace and other industries.

1 tbl, 12 ex

FIELD: chemistry.

SUBSTANCE: epoxy composition for polymerisation contains (A2) a fluorene epoxy compound of formula

,

(A3) an epoxy compound with softening point of 30°C or lower, and (B) a thiol compound containing two or more thiol groups per molecule. As one version, the composition contains a curing accelerator or a curing accelerator and a silane modifier. The group of inventions also includes a transparent resin for optical materials (versions), a sealing compound (versions), a hardened article (versions), a method of producing the epoxy composition for polymerisation, an optical device and an organic EL display.

EFFECT: article made from the composition has high refraction index and high heat-resistance; by sealing an optical device with the epoxy composition for polymerisation, light-harvesting efficiency can be improved and moisture penetration into the device can be prevented.

25 cl, 3 dwg, 17 ex

FIELD: chemistry.

SUBSTANCE: claimed invention relates to the field of casting resins for switching devices. Described is a solid resin system for insulating materials in the switching devices, which contains a solid bisphenol A-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.3, and a liquid bisphenol F-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.4 to ≤0.63, where a part of the liquid bisphenol F-based resin, measured as a weight to the total weight of the resin, constitutes from ≥5% to ≤60%, with the solid resin system before hardening having an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.55, and the solid resin system includes as resins only the said resins themselves. Also described is application of the said solid resin system as an insulating material in electric switching devices.

EFFECT: obtaining the solid resin system, possessing low susceptibility to cracking and high resistance to bursting.

7 cl, 1 ex

FIELD: chemistry.

SUBSTANCE: claimed invention relates to the field of casting resins for switching devices. Described is a solid resin system for insulating materials in the switching devices, which contains a solid bisphenol A-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.3, and a liquid bisphenol F-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.4 to ≤0.63, where a part of the liquid bisphenol F-based resin, measured as a weight to the total weight of the resin, constitutes from ≥5% to ≤60%, with the solid resin system before hardening having an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.55, and the solid resin system includes as resins only the said resins themselves. Also described is application of the said solid resin system as an insulating material in electric switching devices.

EFFECT: obtaining the solid resin system, possessing low susceptibility to cracking and high resistance to bursting.

7 cl, 1 ex

FIELD: physics.

SUBSTANCE: present invention relates to curable compositions. Described is curable epoxy resin composition for producing thermosets or cured products containing divinyl aren dioxide, including (a) stoichiometric excess equivalent of at least one divinyl aren dioxide, (b) co-reacting curing agent, which is phenol novolac resin, bisphenol A novolac resins, dicyclopentadiene phenol novolac resins, cresol novolac resins or their combination, and (c) catalyst, which is tertiary amine, imidazoles, quaternary ammonium salt, quaternary phosphonium salt, Lewis acid - Lewis base complexes or mixture thereof, for interaction of excess epoxide, in which said divinyl aren dioxide concentration varies within range of stoichiometric ratio of epoxy groups to number of groups co-reacting curing agent approximately of 1.05-10. Invention also describes method of producing said curable composition and method for production of hardened thermoreactoplast. Described is product from hardened thermoreactoplast.

EFFECT: obtaining curable composition containing divinyl aren dioxide, with increased storage life up to hardening and improved heat resistance after hardening.

12 cl, 5 tbl, 18 ex

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