IPC classes for russian patent Casting compound. RU patent 2521440. (RU 2521440):
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Nonlinear dielectrics used as electric insulating material / 2468458
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Insulating material and method of producing said material / 2470396
Invention relates to insulating material, an insulating device, a method of producing the insulating material and an alveole for embedding into the insulating material. The alveole has supports with a size which enables a gas molecule to pass through the wall and prevents a polymer molecule from passing into the alveole from the outside. The insulating material contains multiple alveoli with rarefaction which is lower than a Paschen law minimum. The insulating material contains multiple alveoli with pressure which is higher than a Paschen law minimum.
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FIELD: chemistry.
SUBSTANCE: casting compound includes an epoxy diane resin ED-20 in an amount 100 wt. p., a hardener, a plastisiser - trichloroethylphosphate (TCEP) and a filling agent - crushed basalt with a particle size of 125-315 mcm, and as a hardener it contains polyethylenepolyamine PEPA with the following component ratio, wt. p.: epoxy diane resin ED-20 - 100, polyethylenepolyamine PEPA - 10-15; trichloroethylphosphate TCEP - 20-30; crushed basalt - 40-60.
EFFECT: reduced number of steps of the compound hardening.
1 tbl
The invention relates to the electrical insulation filling the compounds, which can be used, in particular, as a material for monolithic bases of radio engineering circuits.
Known epoxy molding compound on the basis of epoxy Dianov resin, polyethylenpolyamine or Polyoxypropylenediamine, ground talc, mica ground or aluminium hydroxide, pigment, dimethyltrimethylene [1].
However, this compound has a high absorption rate (1.3%), the lowest limit of the tensile strength at -60 degrees C and low oxygen index. To obtain coverage from this potting compound capacitors install form (rubber or plastic) and pour the prepared compound at room temperature, and then utverjdayut at the following mode: flash off at room temperature for at least 20 hours, then termootdelenii at 100 degrees C 8 hours
Also known dielectric filling compound, including epoxy Dianov resin, hardener amine type, active thinner, characterized in that it contains two active diluent: triglyceridemia aired polyoxypropylene and monoglycidyl ether n-butanol, as amine hardener type - a mixture of aliphatic amine and low-molecular polyamide resin [2].
The compound does not have sufficient elasticity.
These compounds are designed for electric insulation of electric connectors, sensors, controls electroradiator, chips in products that are experiencing high vibration and shock.
Close in composition to offer molding compound is the insulating compound assignment based on epoxy Dianov resin ED-20, polyamide hardener-300, modifier dibutilftalata following composition, mass[3]:
epoxy Dianov resin ED-20 - 100
polyamide hardener-300 - 30
the modifier dibutilftalata - 30.
The compound is prepared before use. In epoxy resin is injected modifier - dibutilftalata, the system homogenized mixing and a hardener in the stoichiometric ratio of the resin-hardener.
The curing process proceeds in the following mode:
"cold condensation" (20±2 degrees C), 24 h
dauvergne at 140 C to 5 h and 160 degrees C - 1,5 hours
This mode provides the degree of crosslinking to 94%.
The disadvantage of this compound is low oxygen index and impact strength, and high mass loss when ignited in the air.
The objective of the invention is to increase toughness, oxygen index and the decline of weight loss when ignited compound in the air.
The task is achieved by filling compound, including epoxy Dianov resin ED-20 in the amount of 100 mass and hardener, additionally contains a plasticizer - trichloroethylphosphate (TCHEPH) and a filler - crushed basalt with particle size 125-315 microns, as hardener contains polyethylenepolyamine PEPA in the following ratio of components, mass. including:
epoxy Dianov resin ED-20 - 100
the polyethylenepolyamine PEPA - 10-15
trichloroethylphosphate TCHEPH - 20-30
crushed basalt - 40-60.
New in this compound is used as a plasticizer - trichloroethylphosphate (TCHEPH), and as filler crushed rocks of basalt with particle size 125-315 microns.
The proposed compound is prepared before use. In epoxy resin is injected modifier - trichloroethylphosphate and filler - basalt, homogenized system mixing and a hardener in the stoichiometric ratio of the resin-hardener.
The curing process proceeds in the following mode:
"cold condensation" (20±2 degrees C), 24 h
dauvergne at 90 deg C 0,25 hours
This mode provides the degree of crosslinking to 94%.
The invention can be illustrated by the following examples.
Example 1. To obtain compound prepare the mixture in the following ratio of components, mass. including:
epoxy Dianov resin ED-20 - 100
the polyethylenepolyamine PEPA - 10
trichloroethylphosphate TCHEPH - 20
basalt with a particle size of 140 m - 40.
Example 2. To obtain compound prepare the mixture in the following ratio of components, mass. including:
epoxy Dianov resin ED-20 - 100
the polyethylenepolyamine PEPA - 15
trichloroethylphosphate TCHEPH - 30
basalt with a particle size of 140 m - 50.
Example 3. To obtain compound prepare the mixture in the following ratio of components, mass. including:
epoxy Dianov resin ED-20 - 100
the polyethylenepolyamine PEPA - 15
trichloroethylphosphate TCHEPH - 30
basalt with a particle size of 140 m - 60.
Example 4. To obtain compound prepare the mixture in the following ratio of components, mass. including:
epoxy Dianov resin ED-20 - 100
the polyethylenepolyamine PEPA - 15
trichloroethylphosphate TCHEPH - 30
basalt with a particle size of 125 microns - 50.
Example 5. To obtain compound prepare the mixture in the following ratio of components, mass. including:
epoxy Dianov resin ED-20 - 100
the polyethylenepolyamine PEPA - 15
trichloroethylphosphate TCHEPH - 30
basalt with particle size 315 mm - 50.
The number of hardener less than 10 mass will lead to insufficient cure songs, and more than 15 mass will lead to the over allocation hardener. All compounds containing 40 to 60 mass basalt with different size particles of high properties of the prototype. The highest physical-chemical and mechanical characteristics are observed in the introduction of 50 mass basalt with a particle size of 140 microns. Introduction of basalt in the amount of less than 30 mass does not achieve the desired properties: the material has a low impact strength, low oxygen index, high mass loss when ignited in the air. The increased concentration of basalt over 50 mass leads to the decrease of physical-mechanical properties. With the introduction of basalt with particle sizes 125-315 microns almost all physical-mechanical properties superior to the prototype property. The highest results are achieved when used in the compound of basalt with a particle size of 140 microns.
Table 1 presents the basic properties of the proposed filling compound and prototype.
The technical result of the invention is to reduce the number of steps of the curing compound from 3 to 2 and temperature curing with 140-160°C to 90 C, which is connected with the introduction into the composition of the filler - crushed basalt and plasticizer - trichloroethylphosphate, and reduced Flammability and weight loss when ignited in the air, increasing the impact strength as compared with the prototype.
Sources of information
1. Pat. 2039785 of the Russian Federation. Potting compound / Timberview, Tolkatchenko, Lonshakova etc. // www1.fips.ru.
2. Pat. 2343577 of the Russian Federation. Electric insulation of potting compound / Sniadeckich, Annaleena, Liyumba etc. // wwwl.fips.ru.
3. Pat. 2131895 of the Russian Federation. Modified epoxy compound insulating devices / Seeramesh, Lgeepa, Evelia etc. // wwwl.fips.ru.
Filling compound, including epoxy Dianov resin ED-20 in the amount of 100 mass and hardener, characterized in that it additionally contains a plasticizer - trichloroethylphosphate (TCHEPH) and a filler - crushed basalt with particle size 125-315 microns, and as a hardener contains polyethylenepolyamine PEPA in the following ratio of components, mass. PM: epoxy Dianov resin ED-20 - 100 polyethylenepolyamine PEPA - 10-15 trichloroethylphosphate TCHEPH - 20-30 crushed basalt - 40-60.
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