Radio-electronic unit. RU patent 2498544.
 Procedure for cooling of electronic equipment and system for implementation of this procedure / 2498427In the procedure for electric equipment cooling delivery of cooling air is made with use of cooling air ionisation, at that concentration and polarity of air ions is selected do that no static charge accumulation of triboelectric origin takes place at components of cooled electronic equipment. For the purpose of this procedure implementation the system is used which contains air duct (1) to generate a flow of cooling air through electronic equipment (2) and fan (3), cooler (4) and device (5) for cooling air humidity regulation which are installed in-series before the cooled equipment. At that the system is equipped with ioniser (6) to saturate cooling air with ions which is installed between device (5) for cooling air humidity regulation and cooled electronic equipment (2) and the device for cooling air humidity regulation is made as air drier. |
 Electronic unit with housing / 2498426Electronic unit (1) for use in an electric tool has a box-like element (6) with a bottom part and lateral parts (61), a flat-topped cooling element (5) with a closing part (51) and sidewalls (52) and a printed-circuit board located in the box-like element (6) and fixed on the cooling element (5) by a fastening element, wherein the flat-topped cooling element (5) is placed on the box-like element (6) such that a hole in the box-like element (6) situated opposite its bottom part is partially closed by the closing part (51) of the cooling element (5), with part of the hole in the box-like element (6) remaining open. |
 Heat-conducting installation element for attachment of printed-circuit board to radiator / 2495507Heat dissipation device for heat-radiating electric component (10) includes heat-radiating electric component (10) arranged on printed-circuit board (20) in thermal contact with heat-conducting layer (23) of printed-circuit board (PCB). Heat-conducting installation element (40) is attached to heat-conducting layer (23) by soldering and has connecting part (43) having the possibility of being engaged with cavity (31) in radiator (30); thus, providing attachment of PCB (20) to radiator (30); at that, thermal contact is provided from heat-radiating electric component (10) through heat-conducting layer (23) and installation element (40) to radiator (30). As a result of application of a heat-conducting installation element, there can be achieved heat dissipation with PCB equipped with one heat-conducting layer, and not multilayered PCB that is required in devices of previous level of technologies. |
 Electric power drives / 2494857Invention elates to electric power drives with output controlled by appropriate switches. Power drive comprises multiple switches to control motor output and wire-circuit board to carry said switches enclosed in metal case. Every said switch includes conducting part and insulated part coated by insulation cover layer. Every said conducting part of the switch stays in contact with said sire board. Every insulated part stays in contact with metal case via said insulation coat. Metal case is filled with insulating filling material for wire board to be embedded therein. |
 System and method for electronic display temperature control / 2493575One version comprises an insulated gas chamber of a closed loop, where the first chamber is in contact with the surface of the display and transfers heat between the insulated gas and the surface of the display. The second chamber is in gas communication with the first chamber and is capable of heating or cooling the insulated gas and re-feed insulated gas into the first chamber. Another version employs limited convection to simplify cooling the backlight assembly of the electronic display, an air screen for additional heating or cooling of the outer display surface, a linear polariser with an insulating gap for reducing solar load of the display packet, as well as a system with a fluid medium for contact of the fluid coolant with the surface of the display in order to cool said surface. |
 Air-cooled device housing / 2491662Air-cooled device housing has a cooling system formed by an inlet opening and outlet openings, a bottom cover, inner and outer left-side, right-side and rear walls, as well as a double top cover, forming closed inner and outer loops and adapted to allow passage of a cold air stream between the inner and outer walls, wherein lateral inner walls are in form of heat sinks. The outlet openings are made on the front panel and the inner top cover is in form of a heat sink. Double partition walls are mounted inside the housing such that a cooling air stream can pass between them and the partition walls are mounted so as to form at least two main compartments and one additional compartment. Inside each main compartment there is at least one functionally assembled heat-removing element which is made in form of an radioelectronic module with heat removal, mounted by heat removal contact surfaces on the inner lateral wall of the housing or partition wall and mounted tightly to inner surfaces thereof, and by the front contact surface to the surface of the inner top cover of the housing. At least one radioelectronic module is mounted in the additional compartment. |
 Hybrid microwave-frequency integrated circuit / 2489770In a hybrid microwave-frequency integrated circuit, at least one depression is made on the front face a dielectric substrate, the bottom of the depression having at least one through-hole filled with an electroconductive and heat-conducting material, wherein said depression is meant for accommodating at least one active heat-dissipating component, contact areas of which are connected to the topological pattern of a metallised coating on the front face of the substrate by wire connections, wherein the depth of the depression enables to place the front surfaces of the active heat-dissipating component and the dielectric substrate in the same plane. There is an additional heat-diffusing plate at the bottom of the depression, and the active heat-dissipating component lies on the front opposite face of the heat-diffusing plate; the through-hole is filled with an electroconductive and heat-conducting material and lies uniformly in the plan view; temperature drop Δt on the height from the active heat-dissipating component to the back side of a metal heat-removing base, thickness of the heat-diffusing plate h, the ratio of the area of the through-hole in the bottom of the depression to its entire area W, coefficient of heat conduction of the heat-diffusing plate λ, specific heat flux between the heat-diffusing plate and the back side of the metal heat-removing base q, area of the heat-diffusing plate S in the plan view are in a disclosed polynomial relationship. |
 Method of increasing heat dissipation and radiation protection of electronic components / 2488244Amorphous element placed in an elastic packet is placed between two printed-circuit boards; a double-sided compression force is applied onto the printed-circuit boards, enabling to form a "mirror" surface relief of the amorphous element, and then held for a given time until it hardens, wherein the amorphous element is obtained by mixing a hardener with metal-containing filler in ratio of 1:(1-3). |
 Personal computer system unit (two versions) / 2487399Personal computer system unit has a case in form of a parallelepiped with ventilation openings for inlet of external cold air into the case and removing hot air from the case, a central processing unit, a video card and an expansion board, mounted on a motherboard which has rectangular shape and is vertically mounted inside the case, a power supply unit, a hard disk drive, a DVD reading and writing device, air-coolers and fans, wherein the video card and the expansion board, the central processing unit, the power supply unit, the hard disk drive and the DVD reading and writing device are arranged in parallel planes, directed towards the vertical axis of the case, wherein the DVD reading and writing device lies over the motherboard, and the power supply unit and the hard disk drive lie under the motherboard, ventilation openings for removing hot air are made in the top wall of the case, ventilation openings for inlet of external cold air are made in the bottom part of the case below the power supply unit, and the fans are mounted higher than the ventilation openings for inlet of external cold air and are able to feed air from bottom up along the vertical axis of the case. |
 Method and device for cooling of electric and electronic structural elements and modular blocks built into instrument cabinets / 2481755In a system of pipelines and equipment (3, 4, 5) for a cooling fluid in a certain zone of low pressure a working pressure is pulled, which is lower than the pressure of atmospheric air. Working pressure may be, for instance, in the range from 20 to 900 mbar. The cooling device has a low pressure device (10) in the cooling fluid system with a vacuum pump (14) and a pneumatic circuit breaker (13), in particular, a double-stage differential pneumatic circuit breaker, which controls an electromagnetic valve at the side of vacuum (15) and an electromagnetic valve at the side of the fluid (16). |
 Thermal protection bag / 2246188Proposed thermal protection bag designed to accommodate stationary radio module of satellite telephone set of Globalstar system has heating element and shields and is made in the form of sandwich structure; heating element is made in the form of flexible fabric electric heater with double-layer shields disposed on its both ends incorporating heat-insulating fabric of different optical characteristics on inner and outer sides and heat-insulating material. Flexible fabric electric heater mounts thermal relay that operates at electric heater temperature of +160 + 2oC; in addition electric heater is switched over by means of control unit mounted on radio module case; electric heater turn-on temperature is set at -23 ± 1oC and its turn-off temperature is -17 ± 2oC. |
 Electronic module / 2246806Proposed horizontally mounted electronic module incorporating provision for temperature reduction in upper section relative to that in lower one has semiconducting case with upper and lower internal sections. Lower section accommodates heat-resistant electronic unit. Upper section houses heat-sensing electronic unit. Sections are isolated from one another by means of heat-conducting shields made in the form of two chassis plates disposed in a spaced relation one on top of other and being in thermal contact with case. Heat-resistant electronic unit installed in lower section is disposed in a spaced relation to lower surface of bottom chassis plate that functions to reflect thermal radiation. Electronic unit installed in upper section is disposed so that its thermal contact with top chassis plate is ensured. Part of case closing the upper section has perforated holes. |
 Electronic control block / 2248683Body of block has frame body part made in form of cast by molding under pressure, with open upper and lower sides, in material of which partially embedded are metallic plate conductors, formed by at least one punched grating, while frame body part on lower side is covered by metallic bottom element for draining heat, and on the upper side is covered by lid and between bottom element and electronic board powerful circuit elements are placed, contact outputs of which are electrically connected to board and/or to plated conductors and lower sides of which, formed by cooling plates and opposite relatively to board, are connected to said bottom element with sure heat-conductive contact. |
 Refrigerator connected to the internet / 2249164Refrigerator comprises basic printed circuit board provided with an assembly of integrated circuits, heat exchanging plate arranged in the vicinity of the surface of the basic printed circuit board and adopted for absorbing heat, which is generated by the integrated circuits, pipe provided with the inlet and outlet branch pipes, which are in communication with the inner space of the freezing chamber which is in a contact with a part of the bottom of the basic printed circuit board for permitting air to flow over it from the freezing chamber to the heat exchanging plate, temperature sensor mounted on the surface of the basic printed circuit board, and controllable valves mounted in the inlet and outlet branch pipes. The valves open the passage in pipes for flowing cold air from the freezing chamber, when the temperature measured by the sensor exceeds a given value, and close the passage in pipe, when the temperature underlies a given value. |
 Radiator and radiative cooler using such radiator / 2251827Proposed radiator is built of plurality of radiator fins and separate fins are joined together to ensure their development in radial direction thereby enlarging its surface area and increasing its heat-transfer efficiency. Radiator is installed within radiative cooler in air conduit, and fan feeds cold air to this air conduit thereby additionally raising heat-transfer efficiency. Radiator force of coupling with heat source can be elastically maintained which makes it possible to maintain its coupling with heat source even upon external impacts. In addition cutting out upper part of fin enables shortening of fold line so that heat-absorbing parts of radiator fins piled one on top of other can be tightly joined during radiator formation at lower force applied. Radiator obtained has depression in center of upper surface. Such mechanical design makes it possible for fan-forced cold air to reach radiator bottom center thereby additionally raising heat-transfer efficiency. In addition, noise and vibrations caused by cold air flow over heat-transfer parts of radiator are reduced. |
 Cooling apparatuses for components of electronic devices / 2255437Proposed cooling apparatus has heat sinks disposed on components of electronic devices being cooled down, remote radiative cooler, and heat pipe. Radiative cooler is placed above heat sinks. Heat pipe has four types of sections, that is, heated zones, intermediate zones carrying working medium in the form of steam, cooled zone , and intermediate zones carrying working medium in the form of liquid. Intermediate zones of heat pipe are made in the form of flexible hoses. Working medium of heat pipe is liquid whose boiling temperature at atmospheric pressure is higher than working temperature of electronic components being cooled down. |
 Heat transfer device (alternatives), power system incorporating heat transfer device (alternatives), heat transfer device manufacturing process (alternatives), and electrical component manufacturing process (alternatives) / 2256307Proposed heat transfer device depending for its operation on heat dissipation has anisotropic carbon enclosed in encapsulating material to enhance strength of device accommodating anisotropic carbon. Encapsulating material may be polyamide, or epoxy resin, or polyacrylate, or ester, or other suitable polymer. |
 Device for draining heat from radio-electronic equipment elements with short-time repeating heat exhausts / 2257691Device has thin-walled metallic container, filled with working substance, having stable melting temperature within limits 40÷65°C, on one of end surfaces of which with good heat contacts radio-electronic equipment element is mounted. Metallic container has shape of rectangular parallelepiped, two opposite sides of which are profiled with forming of planes, in operating state filled with water solution of salt with low cryohydrate temperature for 4/5 of volume. Into space, limited by hollows thin corrosion-resistant perforated plates are positioned, connected to each other outside hollows by metallic plates with forming of a likeness of two mirrored combs, where perforated plates are teeth of combs, and two metallic plates - bases of combs. Upper ends of two metallic plates are bent outwards at an angle 90° in direction from metallic container and are connected via flexible parts with heat insulation. Because of electro-magnets perforated plates perform oscillations. |
 Heat removing device / 2258181Invention is designed for use in ventilation with forced circulation of air, for instance, to cool heated elements of computer, in particular, microprocessor. Proposed device contains electric motor, axial-flow fan, ribbed radiator, and it is furnished additionally with axial-flow fan located on elongated axle under existing fan and fairing. Ribs of radiator are rectangular or cylindrical, or flat, or trapezium-like in form of truncated pyramid or truncated cone. Ribs in form of truncated cone are provided with thread. Ribs of radiator are provided with longitudinal slots in height. Blades of both axial-flow fans are made to turn through 180°. |
 Thermal-emitting radiator and method for thermal emission implementing said radiator / 2262815Device has main body and metallic covering layer with thickness not greater than 5 mcm, made of elements of group, containing copper, nickel cobalt, chrome, zinc, manganese or their alloys, while thermal capacity of aforementioned layer of metallic cover is less than thermal capacity of main body. Method for thermal emission using radiator includes feeding air environment to surface of device using ventilator mounted thereupon. |
FIELD: radio engineering, communication.
SUBSTANCE: radio-electronic unit has a housing and functional cells having printed-circuit boards with radio elements and heatsinks. According to the invention, the housing is made of dielectric material in form of a continuous structure with inner partition walls which form compartments accommodating the functional cells, wherein the central compartment of the housing accommodates a transformer board, having four paired pulse transformers with symmetrical arrangement of windings; at opposite sides of the transformer board there are four functional cells at each side, each placed in a separate compartment of the housing and representing a transistor unit, having two printed-circuit boards connected by insulating bars with threaded openings for mounting into the housing, wherein the first printed-circuit board has three clamp diodes and the second printed-circuit board has a high-voltage power transistor. The second printed-circuit board is double-sided and has areas with the same shape as the transistor housing on two sides and has metal-coated openings which the heatsink function as heat-removing pipes.
EFFECT: high efficiency of cooling powerful radio elements and reliability, improved weight and size characteristics.
2 dwg
The invention relates to the electronics and can be used in blocks of electronic equipment to increase the efficiency of cooling powerful radioelements.
Known electronic block [1], consisting of a body, made in the form of rectangular parallelepiped with the heating walls, subunits which are in the form of printed circuit boards with and with mates electrical connectors on one of the sides of the face, functional cells that are installed in the enclosure with the possibility of providing the contact pressure of the elements of the heat contact at least two other face parties of their PCB subunits with the relevant adjacent heat-exchange sides of the body and electrically connected to the panel of an enclosure with their mates. Heat transfer of a wall of the housing are made in the form of hollow cameras with internal partitions, communicating with their cavities with the cavity of the body through the ventilation holes. Each chamber with partitions formed shaped casing of sheet material. Contact elastic clamping elements are in the form of wedge-shaped spring thermal connectors curved plates, protruding parts which are located on the respective sides of the face PCB subunits, and the response to them nesting of the relevant adjacent to the frontal sides of the PCB on their internal surfaces of heat-exchange walls of the body. The panel has hinge with electrical connectors.
The disadvantages of this unit are small geometrical size of the thermal contact, due to their location at the ends, the complexity of thermal connector made in the form of wedge-shaped spring thermal connectors, poor thermal contact thermal connector due to the complex coupling angle surfaces, which affects the low efficiency of cooling.
Closest to the proposed technical solution is a radio-electronic block [2], which contains housing and functional cells, representing heat removal of the base with a glued to him circuit boards with . Each base is made with bottom and side , the base of each cell is additionally provided with a top , and the shell wall formed tightly pressed together and bonded between the end surfaces of the same name neighboring cells.
Disadvantages device prototype is a low reliability, large mass and volume of the electronic unit.
Objective of the invention is to enhance reliability, improved mass and dimensional parameters of radio-electronic block.
The task is achieved by the fact that in radio electronic box that contains a housing and functional cells containing PCB with radioelements and heatsinks, according to the invention, the casing is made from a dielectric material in the form of a solid design with internal walls, forming a cavity, in which are placed functional cells, and in the Central the cavity of the body there is a fee transformer, containing four coupled pulse transformer with symmetrical arrangement of the windings, from opposite sides of the Board of the transformer are four functional cells, each of which is placed in a separate space of the body and is the block of the transistor, which contains two circuit boards, United by insulating racks with threaded holes for fastening in the case, while the first printed circuit Board, the three restrictive diode and the second PCB powerful high-voltage transistors the second circuit Board made of the double-sided polygons, follow the form of the transistor package from two sides and contains about 100 plated holes, performing the function of a heat as heat-removing tubes.
Figure 1 shows the design of the proposed electronic unit, which includes a body 1 and functional cell 2, the cost of transformer 3, contains four coupled pulse transformer 4 with symmetrical arrangement of the windings. From opposite sides of the Board of transformer 3 on the perimeter of the housing 1 posted four functional cell 2, each of which contains two circuit boards connected through insulation racks 6 with threaded holes for fixing to the housing 1. On the first PCB 7 installed three restrictive diode 8, and the second PCB 9 powerful high-voltage transistor 10. The second circuit Board 9 is a two-sided polygons 11, follow the form of the transistor package from two sides and contains about 100 plated holes 12, performing the function of a heat as heat-removing tubes. Figure 2 presents the design of the block of the transistor.
The proposed device operates as follows. To ensure the electric strength of insulation over 10 kV design of the proposed electronic unit is made of modular way in a rectangular whole body 1, made of dielectric material with partitions, forming a cavity inside body 1. In the Central space of the body 1 there is a fee of transformer 3, which includes four coupled pulse transformer 4, performed with the symmetrical arrangement of the windings. Along the perimeter of the housing 1, from opposite sides of the Board of transformer 3, in a sort of cells formed cavities case 1, there are 8 blocks transistors, representing a functional cell 2. Electric potential between blocks of transistors is 1/8 part of the maximum value. This separation scheme 8-cell reduces operating voltage in one separate block of the transistor to the numbers that allow him to perform the basis of printed wiring.
Block transistor module represents (a bookcase), consisting from two printed circuit boards. Both the boards are connected to the unit through insulation racks 6 with threaded holes for fastening in chassis electronic block. On the first PCB 7 installed three restrictive diode 8, and the second 9 - powerful high-voltage transistor 10. The second double-sided printed circuit Board 9, which is a transistor, performed with polygons 11, follow the form of the transistor package 10 with two sides and has about 100 plated holes 12 as heat-removing tubes. The use of metallized holes allowed to refuse a metal radiator and considerably reduce the overall dimensions of the block. Electrical installation between the cards and between adjacent boxes transistors made of copper wire in the insulating sleeve of fluoropolymer. chain input and housing separated from each other at a distance, as are located on opposite sides of the body.
Sources of information
1. Patent №1512469 of the Russian Federation, 05 7/20, publ. 27.09.2000.
2. Patent №2322776 of the Russian Federation, 05 7/20, publ. 20.04.2008.
Radio-electronic block, contains a body, a cover and functional cells containing PCB with radioelements and heatsinks, characterized in that the body is made from a dielectric material in the form of a solid design with internal walls, forming a cavity, in which are placed functional cell moreover, in the Central cavity of the body there is a fee transformer, containing four coupled pulse transformer with symmetrical arrangement of the windings, from opposite sides of the Board of the transformer are four functional cells, each of which is placed in a separate the body cavity and represents a unit of the transistor, which contains two circuit boards, United by insulating racks with threaded holes for fastening in the case, while the first printed circuit Board, the three restrictive diode and the second PCB powerful high voltage transistor, the second circuit Board made of the double-sided polygons, follow the form of the transistor package from two sides and contains about 100 plated holes, performing the function of a heat as heat-removing tubes.