RussianPatents.com
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Method of protecting polyimide materials during etching. RU patent 2447628. |
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FIELD: chemistry. SUBSTANCE: method of protecting polyimide materials during etching involves a process for etching parts of the polyimide material with alkaline solutions. Before the etching process, the polyimide material is covered with a mixture of epoxy-urethane varnish with an oligoester acrylate additive, with the following ratio of components, wt %: epoxy-urethane varnish 93.7-95.2, oligoester acrylate 4.8-6.3. The part of the polyimide material which is not supposed to be etched is then protected with an insulating layer. EFFECT: providing conditions for etching fully polymerised polyimide which ensure accuracy of the shape and dimensions of the etched areas. 3 ex
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Protective coat for printed circuit boards / 2377266 Proposed invention relates to p.c.b. protective coats produced by applying epoxy-urethane or epoxy lacquer or organic silicon compound-based lacquer on p.c.b. surface and drying it. It differs from known methods in that, to add biological resistance after heating, biocide additive Biocice T is introduced in lacquer composition in the ratio that follows, i.e. content of epoxy-urethane or epoxy lacquer or organic silicon compound-based lacquer makes (98.5 to 99.5) wt %, and biocide additive makes (0.5 to 1.5) wt %. |
Method of applying protective coating onto board with uncased electronic components mounted on it / 2346419 Invention refers to the sphere of electronic engineering immediately dealing with techniques of protecting board-mounted uncased electronic components against ambient factors. The effect desired is due to application of a protective coating onto each uncased board-mounted element beginning with the one ranking as the highest in terms of on-board installation level. The procedure is as follows: having applied onto the surface a drop of compound with a viscosity of (15-20)10-6 m2/s one slants the board in different directions for the compound to spread uniformly over both the uncased electronic elements and the board proper, its layer thickness being the minimum possible. After that the board is air dried, first - at a temperature of 20-25°C for 15-16 hours, then - at temperature of 60-70°C for 7-8 hours. |
Protective coating for printed circuit boards / 2329623 Suggested varnish coating protects printed circuit board and units of radio-electronic equipment, which are installed on it, against effect of different external factors that cause corrosion and against bacteria that cause fungi growth. Protective coating for printed circuit boards contains epoxy urethane varnish with hardener and biocide additive Traetex-243, with the following ratio of components, in %: epoxy urethane varnish with hardener - 99.00-99.75, biocide additive Traetex-243 - 0.25 - 1.00. |
Method for producing mask templates / 2305918 For increasing adhesion of photoresists to masking layers of chromium and iron oxide, 2-3% mass. Of leucoparafuchsin (amine derivative of tritane), which allows, after appropriate thermal processing, to improve precision of reproduction of critical elements of integration circuit, undercutting below resist film not exceeding 0,1 micrometers to the side. |
Protective cover for high frequency electronic boards / 2298301 In accordance to invention, biocide admixture Traetex-243 is introduced to silicon-organic composition with low tangent if angle of dielectric losses tg≤1·10-3, with following weight ratio of components in percents of mass: silicon-organic composition - 99,0-99,5, biocide admixture - 0,5-1,0. |
Method for making protective cover of electronic elements / 2296439 Location where elements are mounted on board is processed, then gap between mounted element and board is filled with glue with viscosity (15-20)·m2/s, then after glue solidifies first layer of special sealant is applied, after polymerization of which applied onto element is a layer of special compound, and then whole board is covered in a layer of protective lacquer. |
Method for manufacturing profiled circuit boards / 2280337 Method uses filling of porous structure of substrate of circuit board by acryl polymers, while aforementioned filling is performed prior to performing operation of forming of metallic conductors in grooves. Method makes it possible to increase production of valid circuit boards, to increase resistance level of isolation between disconnected circuits and to realize technology for manufacturing circuit boards of high precision class. |
Method for forming protective cover of electronic equipment / 2279193 Method includes preliminary processing of damaged portions of equipment by means of their cleaning, washing by 96% ethyl spirits with following application of polyurethane lacquer through stencil mask, while prior to application of protective cover accelerated drying of electronic equipment is performed by stream of air heated up to +40°C in upward direction and with simultaneous preparation of protective lacquer, which is also blown on by heated air and lead to consistence preventing free-flowing of lacquer, after that portions with applied lacquer are dried, blowing on them with air heated up to +40°C during time of no more than thirty minutes. Lacquer is prepared by means of its exposure during no more than five minutes on open air with winding by air heated IP to +40°C, while necessary amount of lacquer (1-10ml) is selected depending on area of surface to be covered. |
Method for producing photo-template bodies / 2269213 Method provides substantial savings of isopropyl spirits used as drying agent, by injecting methyl-ethyl-ketone into subject mixture. Method includes forming triple constantly boiling azeotropic mixture of isopropyl spirits, water and methyl-ethyl-ketone, to allow removal of constantly flowing water admixtures and, thus, prevention of spoiling of drying agent. |
Method for protecting electronic circuit boards from moisture / 2265976 To increase moisture resistance of circuit boards, porosity in volume of dielectric of board is filled, for filling, thermal-hardening polymerization-capable compositions are used based on glycol ethers of acryl acids and additional polymer covering layer is formed. Thermal processing is performed after applying polymer covering. |
Method of protecting polyimide materials during etching / 2447628 Method of protecting polyimide materials during etching involves a process for etching parts of the polyimide material with alkaline solutions. Before the etching process, the polyimide material is covered with a mixture of epoxy-urethane varnish with an oligoester acrylate additive, with the following ratio of components, wt %: epoxy-urethane varnish 93.7-95.2, oligoester acrylate 4.8-6.3. The part of the polyimide material which is not supposed to be etched is then protected with an insulating layer. |
Photoactivated composition for etching silicon nitride films / 2507219 Invention relates to production of integrated microcircuits and other electronic devices which use a plenary manufacturing technique based on photolithographic processes. The photoactivated composition contains a polymer base and a photosensitive component. The polymer base is polymethyl methacrylate and the photosensitive component is ammonium fluoride. The composition further contains a protophilic reagent - α-naphthylamine and solvents - acetone and trifluoroacetic acid. Components are in the following ratio, wt %: polymethyl methacrylate - 11.8; ammonium fluoride - 4.7-7.1; α-naphthylamine - 18.3; acetone - 8.3-10.7; trifluoroacetic acid - 54.5. Use of the composition simplifies the technological process of obtaining photoetched pattern in a silicon layer, while excluding development, baking and wet chemical etching steps. |
Semiconductor chemical etching method / 2524137 Chemical etching of a semiconductor surface is carried out in an etching agent consisting of the following components: hydrofluoric acid (HF), nitric acid (HNO3) and acetic acid (CH3COOH) in ratio of 1:6:3. |
Method for protecting electronic circuit boards from moisture / 2265975 Porosity in substrate and polymer covering is filled, filling is performed after forming output polymer covering. To fill pores fluid polymerization-capable compositions are used based on glycol ethers of acryl acids, hardened during thermal processing of electronic circuit boards. |
Method for protecting electronic circuit boards from moisture / 2265976 To increase moisture resistance of circuit boards, porosity in volume of dielectric of board is filled, for filling, thermal-hardening polymerization-capable compositions are used based on glycol ethers of acryl acids and additional polymer covering layer is formed. Thermal processing is performed after applying polymer covering. |
Method for producing photo-template bodies / 2269213 Method provides substantial savings of isopropyl spirits used as drying agent, by injecting methyl-ethyl-ketone into subject mixture. Method includes forming triple constantly boiling azeotropic mixture of isopropyl spirits, water and methyl-ethyl-ketone, to allow removal of constantly flowing water admixtures and, thus, prevention of spoiling of drying agent. |
Method for forming protective cover of electronic equipment / 2279193 Method includes preliminary processing of damaged portions of equipment by means of their cleaning, washing by 96% ethyl spirits with following application of polyurethane lacquer through stencil mask, while prior to application of protective cover accelerated drying of electronic equipment is performed by stream of air heated up to +40°C in upward direction and with simultaneous preparation of protective lacquer, which is also blown on by heated air and lead to consistence preventing free-flowing of lacquer, after that portions with applied lacquer are dried, blowing on them with air heated up to +40°C during time of no more than thirty minutes. Lacquer is prepared by means of its exposure during no more than five minutes on open air with winding by air heated IP to +40°C, while necessary amount of lacquer (1-10ml) is selected depending on area of surface to be covered. |
Method for manufacturing profiled circuit boards / 2280337 Method uses filling of porous structure of substrate of circuit board by acryl polymers, while aforementioned filling is performed prior to performing operation of forming of metallic conductors in grooves. Method makes it possible to increase production of valid circuit boards, to increase resistance level of isolation between disconnected circuits and to realize technology for manufacturing circuit boards of high precision class. |
Method for making protective cover of electronic elements / 2296439 Location where elements are mounted on board is processed, then gap between mounted element and board is filled with glue with viscosity (15-20)·m2/s, then after glue solidifies first layer of special sealant is applied, after polymerization of which applied onto element is a layer of special compound, and then whole board is covered in a layer of protective lacquer. |
Protective cover for high frequency electronic boards / 2298301 In accordance to invention, biocide admixture Traetex-243 is introduced to silicon-organic composition with low tangent if angle of dielectric losses tg≤1·10-3, with following weight ratio of components in percents of mass: silicon-organic composition - 99,0-99,5, biocide admixture - 0,5-1,0. |
Method for producing mask templates / 2305918 For increasing adhesion of photoresists to masking layers of chromium and iron oxide, 2-3% mass. Of leucoparafuchsin (amine derivative of tritane), which allows, after appropriate thermal processing, to improve precision of reproduction of critical elements of integration circuit, undercutting below resist film not exceeding 0,1 micrometers to the side. |
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