The method of production of diffracting optical elements
 Optically changing protective device / 2431571Produced device id formed as follows. Photo resistive undeveloped layer is produced on electrically conducting layer. First diffraction mask is made on undeveloped photo resistive layer with the help of optical interferometry. Second diffraction mask is made on undeveloped photo resistive layer with the help of electron-ray lithography. Photo resistive layer is developed. |
 Lithography method and device exploiting radiation far-uv region / 2359303Proposed method serves to plot images on an object (OBJ) and comprises a flat surface arranged perpendicular to radiation a light sensitive zone (PR). Aforesaid object may move crosswise relative to this radiation. The radiation intended for photo lithography comprises, at least, one line in the far-UV range and consists of N consecutive running pulses, their FUV-radiation surface power being measured after this radiation passed through radiating window. The FUV-radiation pulses are produced by exciting an appropriate target with the help of, at least, two laser beams running out from pulsed laser sources selected from a set. Each laser set radiates, on every switching on, a laser pulse with energy (Q) and preset duration (Δt), the laser sources being focused at the same point on target. The proposed method comprises the following reiterative stages within the limits of one n-th repetition: a) integrating the surface power of FUV-radiation that passed through radiating window in n-1 of the last pulses; b) translational movement of the light sensitive object at the distance equal to 1/N-th fraction of radiating window width (L) along the translation axis; c) subtracting the integral obtained at the stage (a) from the amount of power (Wtot) required for photo lithography; d) determining the amount of power to be generated to produce (Wtot); e) computing the number of laser pulses to be generated to n-th running pulse; f) determining the appropriate number of laser sources intended for switching on and selecting the laser sources in the amount equal to integer of the said number; g) synchronous switching on of laser sources selected at the stage (e) and reiterating stages (a) to (f) for the nest running point. |
 Station for exposure of sheet material / 2355008Proposed station has one or more radiation sources for exposing of sheet material, tape for masking with regions with different optical properties, two or more guide apparatus for guiding the masking tape and/or sheet material such that, the masking tape moves in the exposure region between the radiation sources and the sheet material, and a coupling device for moving the masking tape through the exposure region at the same speed as the sheet of material. The masking tape and the sheet material move in the exposure region at a distance from each other. The masking tape has a carrier layer, made from material permeable to the radiation of one or more radiation sources and has regions with different optical refraction indices, and/or different polarisation properties, and/or different reflection properties. |
 Method of producing exposed substrate / 2344455Proposed invention describes the method of producing a resistive matrix furnished with at least two areas with different images thereon. The said method uses at least two photoresistor matching the images being generated. Note here that diffraction structures are made or written in the layer of the first and/or second photoresistor by means of exposure. |
 Method of resist substrate manufacturing / 2334261Resist layer within at least separate areas is adjoined by conductor layer which when resist is electron ray exposed, scatter primary electrons and/or emits secondary electrons. During method realisation resist layer material and conductor layer material, as well as exposure parameters are matched so that resist layer is exposed out of electronic beam exposure area as well, thus relief pattern produced in such a way has relief elements with inclined side ends. |
 Device and method for producing flexographic printing forms for printing newspapers by applying digital optical images / 2294553Invention includes applying digital optical images, and also recording of layer recorded by digital method in accordance to image to create mask of flexographic printing element and exposure of flexographic printing element, performed in exposure unit, by letting photo-actinic light through the created mask. |
 Method for producing image on material, sensitive to used type of emission, method for producing binary hologram (variants) and method for producing image with use of hologram / 2262126Method includes production of image in form of multiple added zones of overlapping of illuminated areas, in which dose of emission equals to or exceeds the threshold value. During exposure matrix of emitters or/and sensitive material is moved for distance, not exceeding maximal characteristic size d of illumination areas, altering size of area of overlapping with discrete value, determined by shift step, selected from range from 0,01 nm to d. during production of binary holograms on surface of film of non-transparent material sensitive material is positioned, and after production of image on it by said means or by means of emitters matrix, made in form of sources of corpuscular particles beams, moved with step, selected from range from 0,01 nm to d2, where d2 - maximal characteristic size of formed gating areas, in the film multiple gating areas are formed. Binary hologram is used during production of image, it is positioned with possible step-wise movement in direction, perpendicular to surface of material sensitive to used emission with step from 0,01 nm to Δs, where Δs is value of change of distance between material sensitive to used type of emission and binary hologram, at which resolution of image, formed by hologram, decreases by 20%. |
 Device for forming images / 2257603Device has source for producing electromagnetic radiation in range of wave length 100 nm and below, space modulator, having multiple pixels, electronic system for processing and transferring data, receiving digital description of drawing, subject to being drawn, separating from it a series of partial drawings, forming said partial drawings as modulator signals and sending said signals into modulator, and precision mechanical system for moving said block and/or projection circuit relatively one another. Device also has electronic control system coordinating movement of block, sending signals into modulator and intensiveness of radiation, so that said drawing was sewn together of partial images, formed by series of partial drawings. |
 Method and device for producing image / 2251133Spots of exposure are created onto surface of material being sensitive to the radiation used by means of array or composed irradiation array. Number of arrays is N, where N≥2. Sizes of array or composed array of radiators are equal or exceed sizes of preset image. Diameter d of radiation flux at output of any radiator is lees than 100 nm. Preset image is got by means of step-by-step motion of array and/or material being sensitive to used radiation for distances, which do not exceed maximal sizes between axes of adjacent radiators having step being shorter than d but with step being equal to 0,01 nm to 1 nm. Light-guide array can be used as array of radiators, which light-guides are connected with source or sources of radiation and made of fiber-optic light-guides having ends being thinned or made in form of microscopic cones of material being transparent for used radiation. Array can also be made in form of autoemission elements array. |
 Device for receiving image / 2251132Device has light-guides connected with radiation source. Light-guides are made of fiber-optic material and have ends thinned or cone-shaped. Diameters of thinned ends fiber-optic light-guides or edge radiuses at tops of microscopic cones equal 10 to 50 nm. Distance z between light-guides and photoresistor equals to 1 to 2000 nm. The other variant of device has at least one autoemission emitter connected with light source and substrate with photoresistor which both are disposed in magnetic field directed along longitudinal axis of sharp edge of any autoemission emitters. Light-guides or emitters and/or substrate with photoresistor are mounted for replacement relatively each other by means of XYZ-positioner to have discrete step up to 0,01 nm. Diffraction distortions are absent when working at near field conditions. Preset precision can be achieved depending on distance to photoresistor and image can be received in form of, for example, line without moving photoresistor and/or light-guides along the direction being perpendicular to the line. |
 Multipoint ophthalmological laser probe / 2435544Group of inventions relates to medical equipment, namely, to laser probes and their combinations, applied in ophthalmology. Probe contains irradiating optic fibre for light beam irradiation, optic system, located on the irradiation side of irradiating optic fibre, and two or more receiving optic fibres, located opposite to irradiating optic fibre. Optic system contains diffractive surface. Light beam, irradiated by irradiating optic fibre, is diffracted into two or more diffracted light beams, focused in plane, parallel to diffraction surface. Receiving ends of each of two or more receiving optic fibres, are intended for reception of light beam, diffracted by optic system, are located in plane, parallel to diffraction surface. Another version of implementation is ophthalmologic laser probe, containing irradiating optic fibre and optic system, located on irradiation side of irradiating optic fibre. Optic system is made in the same way as in the previous version. Connection for laser probe contains case, optic system, located in case, first connecting link, located on one side of optic system; and second connecting link, located on the other side of optic system. Optic system contains diffraction surface, each of two or more diffracted light beams is focused in plane, parallel to said surface. |
 Method of fabricating spiral long-period fibre lattice / 2426158Proposed method consists in winding polymer fibre, turn-by-turn, onto optical fibre parison from glass to clip the ends of wound fibre. |
 Latticed image and method of obtaining said image / 2422863Latticed image includes latticed patterns defined by a lattice constant and angular orientation, and/or at least partially includes latticed patterns which form a lustreless pattern. The latticed patterns which contain a latticed drawing, consisting of a plurality of lattice lines arranged in a certain manner and acting on electromagnetic radiation, form a flat region of a half-tone image with constant level of brightness when illuminated. |
 Marking articles / 2413962Article in form of a solid pharmaceutical product which is not in powdered form has a diffraction microstructure formed on its surface which enables its identification and authentication. The solid pharmaceutical product is prepared by pressing powdered or granular material. The pharmaceutical product or its surface is not completely transparent but absorbs and scatters. The method of making the said article involves formation of a diffraction microstructure on the surface of the pharmaceutical product during the pressing step by placing the original negative onto a die mould. |
 Method to produce diffraction grating / 2393512Proposed method consists in preliminary treatment of initial plate in degreasing solution to form grating surface and preset structure elements thereon with the help of photolithography processes, and fixation of preset structure on carrier. Note here that said initial plate is made from molybdenum-rhenium alloy with thickness not over 0.035 mcm. After said preliminary treatment by degreasing solution, it is additionally subjected to treatment by solution of the following composition, wt %: hydrogen nitrate - 35-40, hydrogen dioxide - 30-35, ferric chloride - (111) 10-15, water making the rest. Treatment is effected at room temperature for 0.1-0.2 minutes with subsequent annealing in hydrogen atmosphere at 980-1000°C for 25-30 minutes in mandrel made from molybdenum. Formation of diffraction grating preset structure elements by photolithography processes is performed at other claimed conditions of said processes. |
 Multilayer body and method of making multilayer body / 2390808Method of making a multilayer body (100), which is a protective element with a partially moulded first layer (3 m) and a multilayer body made using the said method are proposed. A diffraction first relief structure (4) is formed in the first region of a replicative layer (3) of the multilayer body such that the first layer (3 m) is deposited on the replicative layer (3) in the first region and in the second region in which the relief structure in the replicative layer (3) is not moulded. A photosensitive layer or a photosensitive wash-up mask as a replicative layer is deposited on the first layer (3 m). The photosensitive layer or the washing mask is exposed through the first layer (3 m) such that the photosensitive layer or washing mask is differently exposed in the first and in the second regions through the first relief structure. The first layer (3 m) is removed using the exposed photosensitive layer or washing mask as a masking layer in the first region, but not in the second region, or in the second region and not in the first region. |
 Method for production of difraction grating on sheet material from single crystals of metals, their alloys, semiconductors and device for its realisation / 2389048Method for production of diffraction grating on sheet material from single crystals of metals, their alloys, semiconductors consists in the fact that solution of crystallised materials salt is applied onto sheet material, sheet material is impregnated with this solution, and this material is exposed to pulses of laser radiation, while interference pattern of lines is created on sheet material. At the same time signal crystals are grown along these lines, and a diffraction grating is produced from their combination. Besides in device that realises this method, diffraction grating is created from signal crystals of metals, their alloys, semiconductors, on sheet material placed into natural medium. |
 Device for optical recording diffraction structures / 2377615Invention relates to optical instrument making, and specifically to making diffraction optical structures and elements. The device for optical recording diffraction structures includes a base plate with an opening in which is fitted a spindle unit with a workpiece, at least two guides, a movable table with at least two sliders, fitted with aerostatic bearings and rigidly connected to each other using a connector assembly, a recording head, a radiation source, a control unit, a reflecting element, a laser interferometre unit, which is connected by a light beam with the reflecting element and radiation source, and electrically connected to the control unit, a linear motor unit, which is electrically connected to the control unit and kinematically connected to the movable table. |
 Optical component of safety / 2366986Optical component of safety for authentication of document or product has plastic transparent film, which has at least one diffraction lattice. Embossed surface is at least partially coated with layer of dielectric material with high index of refraction, which creates effect of colouring into the first colour for the first orientation of component and into the second other colour for orientation that is perpendicular to the first orientation. Layer of dielectric material is coated from the side, which is opposite to direction of surveillance, by layer with low index of refraction, and then by contrast coloured layer having transparent zones and coloured zones, to increase differences of colouring in case of orientation variations. |
 Method of diffraction gratings manufacturing by means of magnetic liquid / 2351966Method of diffraction gratings manufacturing includes application of thin layer of magnetic liquid on substrate and influence with magnetic field on it. Thus for obtaining of hexagonal structure, thin layer of magnetic liquid on substrate is applied in the field of homogeneous constant magnetic field guided perpendicularly the plane of glass plate, forming system of identical drops. For obtaining of band structure use the nonuniform magnetic field guided under an acute angle to the glass plate plane. Magnetic liquid having highly volatile basis is used in the method. |
 Method of making composite lens panel for nano-heterostructure based concentrator photoelectric transducers / 2422860Method involves making negative matrices of Fresnel lenses with a square aperture from metallic workpieces coated with a layer of electrolytic copper with thickness of 0.5-3.0 mm via diamond turning of the copper coating. A 0.02-0.1 mcm thick chromium layer is deposited on the working surface of the inverse matrices and the matrices are joined by their ends into an assembly which is in form of a panel. An intermediate positive copy of the panel of Fresnel lenses is made via cathodic electrodeposition of nickel onto the working surface of the assembly. A 0.02-0.1 mcm thick chromium layer is deposited on the working surface of the intermediate positive copy of the panel. A negative copy of the panel is made through cathodic electrodeposition of nickel onto the working surface of the intermediate positive copy. A two-component silicon compound is poured between the working surface of the negative copy of the panel and the surface of silicate glass. The compound is polymerised at temperature defined by the relationship given in the formula of invention. The silicate glass with the composite lens panel is separated from the negative copy of the panel. |
FIELD: optics.
SUBSTANCE: invented method can be used for creation of complex diffracting optical elements (DOE) - Fresnel lens, kinoforms, focusers, correctors and others; the method includes coating of photoresist layer on the substrate, drying operation, exposure process, film development, thermohardening and reactive or plasma etch chemistry of the substrate by the mixture of gasses through the masking layer of the photoresist thermohardened layer; the thermoresistant photosensitive composition of poly (o-hydroxyamid) on the basis of 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and iso-phthaloylchloridum with photosensitive derivatives of 1,2-naphthoquinone diazides can be used as photoresists; the substrate warmed up to 80-90°С is coated with the photoresist; drying is executed at 90±10°С during 30-40 minutes; thermohardening is performed in vacuum ((2-4)х10-5 mm hg) with smooth increase of the temperature from 200 to 370°С within 10-15 minutes with a sequent exposure to the temperature of 370°С for 30 minutes; ionic and reactive plasma etch chemistry is executed by the mixture of gases: SiCl4+Ar, freon 12 + oxygen.
EFFECT: enhancement of accuracy of manufacturing of micro-relief on the boundaries of discontinuity of the phase function of any configuration and widening of technological capabilities.
3 cl, 1 tbl.
The invention relates to the optical instrument and is intended to create complex diffractive optical elements (DOE) - Fresnel lenses, kinoforms, pokushalov, proofreaders and other devices.
A known method of manufacturing the optical structures on the application of EN No. 95109839 from 12.04.95 (BI No. 34, 1996), in which in a single operation masking and subsequent etching operation on the surface of the substrate is formed stepwise, optically effective, basic structure, which then during the operation of melting is heated by an electron beam in a vacuum chamber and is aligned with the capillary surface forces.
The disadvantages of this method are the low fidelity of optical structures by protravlivanija, and the complexity and high cost of the process.
Closest to the proposed technical solution is the invention according to US patent No. 5815327 from 29.09.98, IPC G02B 3/08. In this invention a method of manufacturing the Fresnel lens based on the formation of many ring-shaped structures by photolithography.
The disadvantage of this invention, as in the previous method, is the low precision of the microrelief on the outer edges of the rings (at the boundaries of the gap function)associated with uncontrollability applying photoresist on the outer side of Alec, as well as the possibility of making only a ring-shaped structures.
Technical challenge and a positive result of the proposed method of fabrication of diffractive optical elements is used, depending on the type of the substrate, the masking layer by plasma-chemical etching of the substrate of one of the two new resistant thermosealable photoresists, which allow high-temperature controlled reactive plasma etching of the substrate SiCl4+Ar freon 12, and by a mixture of freon 12 and oxygen with high precision micro-relief on the borders of the gap functions of any configuration.
The main distinguishing features of the claimed invention is that the composition used in the formation of the mask microrelief-resistant photoresist - heat-resistant photosensitive composition included heat-resistant poly(o-hydroxyamide) based on 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and isophthalonitrile and a mixture of 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and bis-(3-aminopropyl)-dimethyl-siloxane and isophthalonitrile with photosensitive derivative of 1,2-nattokinase, application of the photoresist is carried out on the substrate heated to 80-90°C, followed by drying photoresistor layer at 90±10°C within 30-40 is in and thermosublimation formed by photolithographic method of the microrelief in vacuum(2-4)×10 -5mm Hg) at a smooth temperature increase from 200 to 370°C for 10-15 min, followed by exposure at 370°C for 30 min, and the use of gases in ionic and reactive plasma-chemical etching of the substrate freon 12 and a mixture of freon 12 and oxygen are taken in the ratio of oxygen - 25%: freon 12-75%.
Since poly(o-hydroxyamide) after heat treatment at 370°C becomes resistant polybenzoxazole, the film formed from the photoresist on its basis, subject to thermosublimation at 370°C, can withstand temperatures up to 400°C in air and 450°C in an inert atmosphere up to 1 h, with a mass loss not greater than 5%, and the effects of a mixture of gases at elevated temperatures. By changing the ratio of initial reagents in the synthesis of poly(o-hydroxyamide) it is possible to vary the molecular weight of the polymer and, consequently, the viscosity of the polymer solution, which enables to obtain a film of a certain predetermined thickness. Unlike films obtained from nezabvennogo poly(o-hydroxyamide), high temperature resistance and chemical resistance of polybenzoxazole formed during thermal zdublowany poly(o-hydroxyamide), allow you to vary the composition of the plasma, which greatly expands the field of application of the coating as a mask during plasma trawley the substrates of different chemical nature.
Example 1. a) Obtaining poly(o-hydroxyamide) (I): 1 g-mol of 3,3'-dihydroxy-4,4'-diaminodiphenylmethane dissolved in 11.2 g-mol dimethylacetamide, containing not more than 0.035% of moisture at room temperature. The solution is cooled to 0-(-5°C) and to the cooled solution with stirring for 5-7 minutes add 1.06 g-mol carefully crushed isophthalic acid dichloride (II), such a rate that the temperature of the reaction mixture did not rise above 40°C. after the addition the mixture is stirred for 90-120 min, removing the cooled, then added 0.06 g-mol of o-aminophenol. After adding the total number of o-aminophenol reaction mass is again cooled to 0-(-5°C) and added dropwise over 15-20 min add 2 g-mol of freshly epichlorohydrin, and then stirred solution at room temperature for 60 minutes Obtained viscous polymer solution was diluted with twice the volume number of dimethylacetamide, dimethylformamide or N-methyl-α-pyrrolidone and pinned cooled to 0-(-5°C.) mixture of solvents: chloroform-diethyl ether, taken up in a volume ratio of 5:1. The precipitation of poly(o-hydroxyamide) is filtered off, dried at 70°C for 5 h, then at 40°C. in a vacuum drying Cabinet 3 hours quantitative Output, the viscosity of 0.5%solution in concentrated sulfuric acid 0.89 DL/g
b) Receiving the Si content is asego poly(o-hydroxyamide) (II). 0.6 g-mol of 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and 0.4 g-mol of bis-(3-aminopropyl) dimethyl-siloxane dissolved in 11.2 g-mol dimethylacetamide, containing not more than 0.035% moisture, at room temperature. The mixture is stirred at room temperature for 1 h, then cooled to 0-(-5°C) and to the cooled solution with stirring for 5-7 minutes add 1.06 g-mol carefully crushed isophthalic acid dichloride, with such speed that the temperature of the reaction mixture did not rise above 40°C. after the addition of isophthalic acid dichloride, the reaction mass is stirred for 4 h at room temperature, then to it was added 0.06 g-mole o-aminophenol, stirred 1 h, then cooled to 0-(-5°C), dropwise in for 30 min add 2 g-mol of freshly epichlorohydrin and stirred polymer solution at room temperature for 2 h Shows the viscosity of 0.5%solution of silicon-containing poly(o-hydroxyamide) when the ratio of amine components in the concentrated sulfuric acid is 0.5-0.6 DL/g
C) obtaining a photoresist (A) of poly(o-hydroxyamide (I) 23 concerns (19.96 wt.%) the obtained dry poly(o-hydroxyamide) is mixed with 61.9 concerns (53.7 wt.%) dimethylacetamide and leave to swell for 12 to 16 h, then stirred at room temperature for 5-6 hours To the resulting solution was added a solution of 4. concerns (3.99 wt.%) β,β-bis-nattokinase-(1,2)-5-sulfoethyl-(4-hydroxyphenyl)propane in 25.7 concerns (22.3 wt.%) dimethylacetamide and the mixture is stirred for 5-6 h to complete the registration and dissolution of the components. Directly before use, the composition is filtered through a 1 μm filter (Millipor) and centrifuging applied on a silicon substrate (substrate) with a metal coating. Deposited film is subjected to drying in a horizontal position at 95°C for 15 min (the film thickness of 1.7-1.8 µm), exhibiting mercury lamp DRSH-250 12-15 C, under illumination of the working surface is not less than 50000 Lux, show a 0.3%solution of sodium hydroxide or 2%solution of trisodium phosphate. The minimum size of the opened Windows of 1 μm. The resulting relief is subjected to a stepwise zdublowany 30 min at 150°C, then 30 min at 350°C. the film Thickness after termozapressovany reduced to 1.3 μm due to the removal of water by cyclodehydration and decomposition products of the light-sensitive component. The resistance zagubinoga elevation is 450°C in an inert atmosphere.
g) obtaining a photoresist (B) of poly(o-hydroxyamide) (II)). To 425 concerns the reaction of the polymer solution (II) is added with stirring 18 concerns β,β-bis-nattokinase-(1,2)-5-sulfoethyl-(4-hydroxyphenyl)propane 43 concerns dimethylacetamide. The solution is stirred, protected from the ETA, at room temperature for 4 h Immediately before use of the composition is filtered through a 1 μm filter (Millipor).
Example 2. Obtaining a masking film comprising a photoresist. The resulting photoresist by centrifuging applied to the substrate (GaAs, InP, glass K-8), heated to 80-90°C. the Deposited film is subjected to drying in a horizontal position at 90±10°C for 30-40 min, exhibiting mercury lamp DRSH-250 with 30-35 through the template, when the illumination of the working surface is not less than 30000 Lux, show a 0.3-0.4%aqueous solution of sodium hydroxide. The resulting relief is subjected to a stepwise thermosublimation in vacuum(2-4)×10-3mm Hg) at a smooth temperature increase from 200 to 370°C for 10-15 min, followed by exposure at 370°C for 30 min Resistance zagubinoga elevation is 400°C in air and 450°C in an inert atmosphere.
Example 3. Plasma etching of the substrate through the mask layer thermostabling photoresist. As gases using SiCl4+Ar freon 12 and a mixture of freon 12 - oxygen taken in the ratio of oxygen - 25%, freon 12-75%. While etching is 60-300 sec depending on specified depth stain. Since the mask layer of heat-resistant photoresist can withstand temperatures of 400°C, conduct etching of the substrate, heated to 280-320°C. This enables to perform this operation is the situation for more than a short time with high precision of the playing surface without the formation of defects in the mask surface.
Thus, the proposed method of manufacturing the diffraction grating allows to increase the precision of the microrelief on the borders of the gap phase function of any configuration and to expand its technological capabilities. This conclusion is supported by the table, which shows the comparative data for the etching of substrates of different chemical nature, using as a mask zagubinoga heat-resistant photoresist.
| Table | ||||||
| № p/p | Substrate type | The mask type | Type plasma | The film thickness before etching, mcm | The time of etching, the | The film thickness after etching, mcm | Care film thickness, microns |
| 1 | GaAs | Zagubiony heat-resistant photoresist (A) | SiCl4+Ar | 1.9 | 300 | 1.46 | 0.44 |
| 2 | GaAs | Nezadelannyh heat-resistant photoresist ( | SiCl4+Ar | 2.4 | 300 | 1.83 | 0.57 |
| 3 | GaAs | Zagubiony heat-resistant photoresist | SiCl4+Ar | 1.3 | 600 | 0.98 | 0.32 |
| 4 | GaAs | Nezadelannyh heat-resistant photoresist (A) | SiCl4+Ar | 1.9 | 600 | 1.2 | 0.70 |
| 5 | InP | Zagubiony heat-resistant photoresist (A) | SiCl4+Ar | 2.0 | 300 | 1.9 | 0.1 |
| 6 | InP | Nezadelannyh heat-resistant photoresist (A) | SiCl4+Ar | 1.6 | 300 | 0.96 | 0.64 |
| 7 | InP | Zagubiony heat-resistant photoresist (A) | SiCl4+Ar | 0.7 | 600 | 0.54 | 0.16 |
| 8 | InP | Nezadelannyh heat-resistant photoresist (relief) (A) | SiCl4+Ar | 1.6 | 600 | 1.15 | 0.45 |
| 9 | Glass | Zagubiony heat-resistant photoresist (relief) (B) | Freon 12 | 2.75 | 300 | 2.2 | 0.55 |
| 10 | Glass | Standard photoresist AZ 1350 (relief) | Freon 12 | 1.33 | 300 | Full drain |
| 11 | Glass | The chromium is + zagubiony heat-resistant photoresist (B) (relief) | Freon 12 (75%) + oxygen (25%) | 2.75 | 60 | 1.0 | 1.75 Relief protrails to the desired depth, the lacquer film is partially left |
| 12 | Glass | The chromium is + zagubiony heat-resistant photoresist | Oxygen | 2.7 | 300 | Full drain |
| 13 | Glass | The chromium is + zagubiony (B) | Freon 12 (66%) + oxygen (33%) | 2.7 | 120 | 0.05 | 2.65 |
| 14 | Glass | The chromium is + zagubiony (B) | Freon 12 (66%) + oxygen (33%), | 2.75 | 60 | Partial etching |
1. A method of manufacturing a diffractive optical elements on a substrate, comprising applying photoresistor layer on the substrate, drying, exposure, have the ing films their thermosublimation and jet or plasma etching of the substrate with a mixture of gases through a mask layer thermostabling photoresist, characterized in that the photoresist using heat-resistant photosensitive composition of poly(o-hydroxyamide) based on 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and isophthalonitrile with photosensitive derivative of 1,2-nattokinase, the application of the photoresist is carried out on the substrate heated to 80-90°C, drying photoresistor layer is carried out at (90±10)°C for 30-40 min, thermosublimation carried out in vacuum(2-4)×10-5mm Hg) at a smooth temperature increase from 200 to 370°C for 10-15 min, followed by exposure at 370°C for 30 min, and reactive ion plasma etching is performed with the mixture of gases SiCl4+Ar freon 12 + oxygen.
2. The method according to claim 1, characterized in that the ratio of gases in a mixture of freon 12: oxygen 75%:25%.
3. The method according to claim 1, characterized in that the substrate using GaAs, InP, glass (brand K8).
4. The method according to claim 1, wherein the plasma etching is carried out at a temperature of the substrate 280-320°C.