Method for connecting an optical component to optical-electronic modules

FIELD: electronics, optics.

SUBSTANCE: optical connection module for connecting an optical component to substrate contains substrate; auxiliary support, connected to aforementioned substrate, containing heat-isolating material; optical component, adjusted relatively to the first laser and soldered to aforementioned auxiliary support with usage of heat from the second laser; contact area, located between aforementioned heat-isolating material and aforementioned optical component; laser auxiliary support, connected to aforementioned substrate; and a first laser, connected to aforementioned laser auxiliary support. Optical component is an optical fiber, while aforementioned optical connection module is a module for connecting the first laser to the optical fiber. Aforementioned contact area and aforementioned heat-isolating material ensure local transfer of heat during soldering for even melting of solder alloy and for limiting transfer of heat into aforementioned substrate. Aforementioned optical component is picked from a group which includes optical fiber, mirrors, lenses, detectors, micro-electro-mechanical devices and isolators. Method for manufacturing an integration optical connection module includes creating a substrate, applying a pattern and etching first zone of aforementioned substrate, creating a heat-isolating material in aforementioned first zone of aforementioned substrate, polishing aforementioned heat-isolating material and aforementioned substrate for creation of a flat surface, including a part of substrate and the heat-isolating part, connection of contact area, including at least one metallic layer, to aforementioned heat-isolating part, positioning of first laser on aforementioned part of substrate and adjustment and connection of optical component to aforementioned contact area. Aforementioned optical component is connected to aforementioned contact area with usage of solder alloy, which is heated using the second laser.

EFFECT: increased efficiency, ensured operation of high power laser.

2 cl, 11 dwg

The technical field to which the invention relates.

This invention relates to optical fibers, and in particular to the attachment of optical components to the substrate and the optical alignment of the laser component.

The level of technology

In the optoelectronic industry has a significant and growing demand for inexpensive United fiber laser modules with high reliability. United fiber laser modules include optical fiber, which is easily adjusted with the laser on the substrate and attached to the substrate. Single-mode fiber devices need to be connected by fiber laser modules. For example, the United fiber laser modules are used as a pumping device for fiber amplifiers, sources with seal wavelength, high-speed and high-power lasers with distributed feedback semiconductor optical amplifiers.

Typically, the laser and the optical fiber is made or mounted on the substrate. To ensure acceptable performance of the optical fiber must be precisely easily adjusted with the laser. After aligning the optical fiber must be securely attached to the substrate without disturbing the alignment, damage to the laser or optical fiber, or turn off the laser. Proper alignment ensures very the high efficiency single-mode optical connection interface. The connection between the optical fiber and the substrate must also be able to withstand environmental conditions, such as changes to operating temperature, vibration, dust, etc. are Other important characteristics include a relatively high thermal conductivity between the laser and the substrate to provide a laser with high power.

High thermal conductivity between the laser and the substrate can cause problems when connecting the optical fiber to the substrate using methods of joining, using heat. Soldering involves heating the metal parts to be connected to each other, and use solder to connect the parts with each other. Often use an integrated resistor that is configured to exchange heat with solder, as a heat source to melt the solder.

As shown in figure 1, connected by fiber laser module 10 according to the prior art, includes a laser 12 and the optical fiber 14, which is attached to the substrate 16. Heat (indicated by arrows 18) is generated at the time of attaching the optical fiber to the substrate 16. Most heat 18 of the soldering operation usually passes down through the substrate 16 to the radiator (not illustrated), such as a thermoelectric cooler. Due to the relatively high thermal conductivity path between the laser 12 and the substrate 16 a is number of heat 18' also passes to the laser 12. Heat 18' may damage the diode or to melt the solder that connects the laser 12 to the substrate 16, which reduces the reliability of the laser 12 and increases the reduction in the connection settings solder. Heat 18' may also lead to incorrect alignment of the laser 12 and/or off the laser 12 during alignment.

The invention

The optical module of the compounds according to the invention, attaches the optical component to the substrate and justorum optical component with a laser. The optical module connection includes fiber auxiliary support, which is attached to the substrate, and a heat insulating material having a thickness of more than 20 microns. Optical element soldered to the fiber supporting the support by application of heat from a laser. Laser auxiliary bearing is attached to the substrate. The laser is attached to the laser auxiliary support.

According to other features of the invention, the optical component is selected from the active and passive optical components such as optical fibers, lenses, mirrors, filters, detectors, isolators and microelectromechanical devices.

According to another characteristic of the invention, between the solder and insulating material is placed fiber pad. Fiber pad has the characteristics of a lateral flow of heat is a, significantly more characteristics of the vertical heat flux. Fiber contact pad is placed between the insulating material and the optical fiber. Fiber pad and a heat insulating material to provide local and lateral passage of heat during laser soldering for uniform melting of the solder. Heat insulating material and a fiber pad limit the heat transfer to the substrate during the soldering process. Fiber pad also provides a safe place for connection of the optical component. The thickness of the fiber pads also contributes to lateral heat dissipation. Fiber pad also provides a barrier to solder.

According to other features of the invention, the fiber pad comprises multiple layers. One layer is made of gold, and the other layers are selected from the group consisting of Nickel, chromium, titanium and chromium oxide. Additional layers may be made of titanium and platinum.

According to another characteristic of the invention, integral and directly connected to the fiber laser module for aligning and attaching optical fibers to the substrate includes a heat insulating material made as a unit with the substrate and having a thickness of more than 20 microns. Fiber pad includes, what about the least one metal layer attached to the heat insulating material. The optical fiber is soldered laser to the fiber pad.

According to another characteristic of the invention, the integrated heat insulating material formed through hydrolysis in the flames or by using anodic welding.

Other applications of the present invention follow from the following detailed description. It should be noted that the detailed description and specific examples, though, and indicate the preferred embodiments of the invention, serve only for illustration and should not limit the scope of the invention.

List of figures

For a better understanding of the present invention below is a detailed description with reference to the accompanying drawings, which depict:

figure 1 - connected fiber laser module with laser and an optical fiber, which asterousia and attached to the substrate, according to the prior art;

figure 2 - module optical coupling with the laser and optical component, such as an optical fiber, which is attached to the substrate, according to this invention;

figure 3 - section fiber pads, which is located between the optical component and the insulating fiber auxiliary support;

4 is a part of the fiber contact area and in the top view;

5 is a section of the solder and the parts fiber pads;

figa and 6B module optical connections according to figure 2, an example system for laser soldering;

figa and 7B - integral optical coupling with the laser and optical component, such as an optical fiber, according to this invention;

figa-8C - first embodiment of the integrated optical module connections, according to Fig.7;

figa-9C - use of solder glasses in the side gaps of the first variant implementation of the integrated optical module connections, according to Fig.7;

figa-10D - first embodiment of the integrated optical module connections, according to Fig.7;

11 - system alignment of the optical element according to this invention.

Information confirming the possibility of carrying out the invention

The subsequent description of preferred embodiments given only as an example and in no way intended to limit the invention, its application or use.

This invention discloses a device and an improved method of attaching the optical element to the substrate with the alignment of the optical element relative to a laser. For specialists in the art will understand that the invention can be applied for connection of active and passive is s optical elements, such as optical fiber, mirrors, lenses, detectors, MEMS devices, insulators and other optical devices to the substrate without damage due to laser heating.

Below is a description of the present invention as applied to the module 30 of the optical connection to the optical fiber with reference to figure 2. For specialists in the art will understand that the invention is applicable for connection and alignment of other active and passive optical components. The laser 32 is attached to the laser supporting leg 38 of the contact area 40. Laser auxiliary bearing 38 is connected to the substrate 42 of the contact area 44. The optical fiber 34 is attached to the fiber pad 50 by solder 52. Fiber pad 50 may include one or more layers. At least one of the layers is preferably metal.

The optical fiber 34 preferably has a metal outer layer 53 on the part of the optical fiber 34 for connection with the solder 52. As an alternative solution, you can abandon a metallic outer layer 53, and the solder can completely wrap around the optical fiber 34 to attach the optical fiber 34 to the fiber pad 50. Suitable metal outer layers 53 m which may be a layer of NiAu, and other similar metal layers. One end of the optical fiber 34 may contain a lens surface 54 to increase the efficiency of the optical fiber 34. Fiber pad 50 is attached to the fiber supporting leg 55. Fiber auxiliary bearing 50 is attached the contact area 56 to the substrate 42.

Solder 52 preferably has a relatively high melting temperature, such as 250°C or higher. The solder is preferably eutectic and solid with minimal creep at room temperature. Creep is a function of the activation energy, which usually depends on the melting temperature of the solder. In other words, the high melting point usually corresponds to a high activation energy. The minimum creep helps to preserve the existing alignment. For example, the solder may be AuSn and to have a melting point of 284°C. Percentage composition is 80% Au and 20% Sn (as well as other formulations. Other suitable materials include solder PbSn and AuGe. Fiber auxiliary bearing 55 is preferably made of heat insulating material. For example, the insulating material may be glass (silicon dioxide (SiO₂)), ceramics such as Minor, zirconium dioxide, or other similar insulating materials.

The path between the laser 32 and the substrate 42 Ave is doctitle has a relatively high thermal conductivity. In other words, the laser auxiliary bearing 38 and the contact area 40 and 44 have a relatively high thermal conductivity to minimize the junction temperature of the laser during operation and improve the capacity, efficiency and reliability. For example, laser auxiliary bearing 38 is preferably made of CuW, AlN, SiC, BeO, Si, TcBN, or diamond. Surface area 40 and 44 preferably include a solder such as AuSn with 80% Au and 20% Sn (other compositions and percentages are also possible).

Figure 3 shows in more detail a preferred embodiment of a fiber pads 50 and fiber auxiliary bearing 55. Fiber pad 50 includes one or more layers and provides lateral conductivity for adequate posting of heat to the solder 52 during laser soldering. Fiber auxiliary bearing 55 limits the vertical distribution of heat to eliminate the heat flow through the fiber contact pad 50 and the fiber supporting bearing 55 in the substrate 42 and the laser 32. Fiber pad 50 also provides a partition of the solder absorbs laser light, increases the strength of the zone of connection and/or contributes to the lateral thermal conductivity.

In one embodiment, the fiber pad 50 includes layers 60A-60h. Layer 60A provides SMAC the layer of solder, and preferably made of Au or other similar materials. Layer 60b provides a barrier to solder and preferably made of Pt or other similar materials. Layer 60C provides mechanical support and is preferably made of Ni or other similar materials. Layer 60d provides adhesion between layers 60C and ' 60s and is preferably made of Ti or other similar materials. The 60s layer provides absorption of the incident laser light and is preferably made of Ti or other similar materials. Layer 60f provides lateral conductivity and is preferably made of Ni or other similar materials. Layer 60g provides adhesion between layers 60f and 60h and preferably made of Ti or other similar materials. Layer 60h provides lateral conductivity and adhesion to the fiber supporting pillar and preferably made of Ni-ceramic composite material or other similar materials.

Fiber pad 50 provides a strong point of joining fiber support and a barrier to solder. Fiber pad 50 also must ensure that lateral heat conduction through the thickness of the layers provided on the fiber pad 50. You can see that for specialists in the art may be many variations, including the removal of one or more layers, add the group of other layers and/or replacement of the layers on layers with similar properties.

As shown in figa, the solder 52 is preferably melts during the process of alignment and attach using the heat produced by the laser. For clarity, the item numbers from figure 2 are used to figa to denote the same elements. The laser 70 is connected with the optical fiber 74. Beam 76 light exits the optical fiber 74. Beam 76 light collyriums collimator lens 78 focuses the focusing lens 80 on the solder 52. Required for laser 70 power preferably small, for example, is usually sufficient 1-3 W, when the solder 52 AuSn is used. Originally Ousterhout laser 32 and the optical fiber 34. Beam 76 light heats the solder 52, causing the melting of the solder 52. Beam 76 light off or sent away from the solder 52. Solder 52 cools, hardens and fixes the position of the optical fiber 34 relative to the laser 32. As shown in figv, several lasers 82-1 and 82-2 are connected by optical fibers 84-1 and 84-2 system 86 submission-rays. System 86 submission rays directs rays 88 light on the solder 52 during alignment and attachment. The process of alignment can be repeated one or more times to ensure alignment. It is clear that if desired, you can use more than two lasers.

On figa and 7B shows the integral module 90 optical connections. Integrated module 90 optical what about the connection includes a substrate 90 and a heat insulating material 94, which is integrated directly into the substrate 92. The substrate 92 is preferably made of silicon, InP, GaAs, or other suitable materials. A heat insulating material 94 is preferably glass, ceramic or other suitable insulating material. A heat insulating material 94 is flat. Fiber pad 96 is attached to the upper surface of insulating material 94. Fiber pad 96 is preferably similar in structure to the fiber pad 50. Laser 95 fabricated directly on the substrate 92 or attached using the contact surfaces (not shown). Solder 100 attaches the optical fiber 102 to the fiber pad 96. Maybe not necessarily, used metal outer layer 104 (as indicated above). The laser heats the solder 102 and/or heats the fiber contact pad 96. 7 single beam 106 laser heats the solder 100. On FIGU few rays 107 and 108 of the laser heated fiber contact pad 96.

On figa, 8B and 8C shows a method of making a relatively thick insulating material 94 on the substrate 92. The substrate 92 and a heat insulating material 94 supply pattern and pickle. The smoothness of the contact surfaces of the substrate 94 and insulating material 94 d which should be about the same. The material used to obtain the substrate 92, and a heat insulating material preferably have approximately the same coefficients of thermal expansion. The substrate 92 and the insulating material is initially brought into contact at an elevated temperature in the presence of an electric field. Formed by anodic welding between the substrate 92 and the insulating material 94 at the atomic level. As shown in figs, then the substrate 92 and a heat insulating material 94 is polished. It is clear that this method enables the integration of a relatively thick insulating material 94 and the substrate 92.

On figa, 9B and 9C shows the additional stages of fabrication of a thick insulating material 94 in the substrate 92. A heat insulating material 94 and the substrate 92 are etched topological elements or side clearances between the edges 112 of insulating material 94 and the edges 114 of the substrate 92. The gap 100 is filled with glass adhesive 116 in the form of a powder, as shown in figv. After high-temperature annealing of the glass adhesive 116 is solidified in glass. The top surface 118 is polished to provide a flat, smooth surface, as shown in figs. Annealing is carried out at temperatures above 300°C.

On figa, 10B, 10C and 10D shows a second method of manufacturing integrated, connected by fiber laser module cak shown in figa, the substrate 92 provided with a pattern using the mask 120. As shown in figv, the substrate 92 is etched in areas 93. Use preferably reactive ion etching, chemical etching or other suitable methods of etching. As shown in figs, the mask 120 is removed to form a heat insulating material 122 using one or more nails through hydrolysis in the flame. Usually each extension adds a layer of 10-30 microns.

As shown in fig.10D, then do the polishing for the opening of the substrate 92 in areas closed before this mask 120, to obtain a flat, smooth upper surface 124. The materials selected for the substrate 92 and a heat insulating material 94, preferably have coefficients of thermal expansion that is the same. The creation of insulating material 94 using hydrolysis in the flame provides free of voids grip glass substrate 92. Additionally, the integrated module 90 optical connection has excellent playmost.

The thickness of the insulating material 90 is preferably between 20 and 300 microns. Modules optical connection according to this invention, have a high thermal conductivity between the laser and the substrate to provide high capacity. Modules optical connections have so the e high thermal isolation between the area of joining of the optical fiber and the laser to minimize raise the temperature of the laser during the joining solder optical fiber. Modules optical connections have a relatively high thermal conductivity in the zone of attaching the fiber to minimize the required heat. Additionally, modules, optical connections are mechanically stable at the operating temperatures and temperature treatment. Integrated modules for the optical connections are flat and relatively cheap to manufacture.

Figure 11 shows a system 150 alignment of optical components, which includes computer 152, a positioning device 154 and the measuring device 150. The system 150 of the alignment of the optical elements shown in connection with a variant of execution, according figa. For specialists in the art will understand that the system 150 alignment of optical elements can be used with other options open run.

Laser 160 generates one or more beams 162 of laser light that are directed at the solder 100 and/or fiber contact pad 96 for heating the solder. The computer 152 includes a laser 95. The measuring unit 158 generates an output signal corresponding to the output signal of the optical fiber 102 or other optical component, and generates an output signal to the computer 152. The computer 152 calculates the signals of the regulatory provisions that are used to align the position of the optical the CSOs fiber 102. Perform one or more iterations until the correct alignment of the optical fiber 102 relative to a laser 95.

From the above description for specialists in the art it is clear that capacious idea of the present invention can be implemented in various ways. Therefore, although this invention has been described with reference to particular examples, the true scope of the invention should not they be limited as to specialists in the art will become apparent other modifications after studying the drawings, the description and the following claims.

1. The optical module connection for attaching an optical component to the substrate, contains

substrate;

auxiliary support attached to the said substrate, comprising a heat insulating material;

optical component, easily adjusted relative to the first laser and soldered to the specified auxiliary support using the heat from the second laser;

contact pad located between the said insulating material and the specified optical component;

laser auxiliary support attached to the said substrate; and

the first laser attached to the specified laser auxiliary support.

2. Module optical connection according to claim 1, in which the om optical component is an optical fiber, as specified module optical connection is a module connection of the first laser with optical fiber.

3. Module optical connection according to claim 1, in which the specified contact area and the specified heat insulating material to provide a local passage of heat during the soldering for uniform melting of the solder and limitations of heat transfer in the specified base.

4. Module optical connection according to claim 3, in which the specified pad provides at least the barrier of the solder, the absorption of laser light, the side passage of the heat and increase the strength of the connection between the specified optical component and the substrate.

5. Module optical connection according to claim 4, in which the specified pad contains multiple layers, including

the first layer of gold;

the second layer is selected from the group consisting of Nickel, chromium, titanium and chromium oxide;

the third layer of titanium; and

the fourth layer of platinum.

6. Module optical connection according to claim 1, in which

specified heat insulating material selected from the group consisting of glass and ceramics;

the specified solder selected from the group consisting of AuSn, PbSn, and AuGe; and

the specified laser auxiliary bearing selected from the group consisting of A1N, AINi, SiC, BeO, TcBN, diamond and S.

7. Module optical connection according to claim 1, wherein said optical component is selected from a group comprising optical fibers, mirrors, lenses, detectors, MEMS devices and insulators.

8. A method of manufacturing an integrated optical module compounds containing

creating a substrate;

patterning and etching the first zone of the specified substrate;

the creation of heat insulating material in the first specified area specified substrate;

polishing the specified heat insulating material and the substrate to create a flat surface which includes a portion of the substrate and a heat insulating part;

connection pads, comprising at least one metal layer to the specified insulating part;

the location of the first laser beam on a specified portion of the substrate; and

the aligning and attaching an optical component to the specified pad.

9. The method of claim 8, wherein said heat insulating material is created by using anodic welding.

10. The method according to claim 9, in which at least one side of the gap formed between the said substrate and the specified insulating material, optionally containing stages:

fill the specified gap glass adhesive;

annealing of the decree is Noah substrate, specified heat insulating material and the specified glass adhesive; and

polishing the upper surface of the specified substrate, the specified heat insulating material and the specified solder glasses.

11. The method of claim 8, wherein said heat insulating material is created with the help of hydrolysis in the flame in the first specified area.

12. The method of claim 8, wherein said optical component is attached to this pad using solder, which is heated by the second laser.