Method of cutting long-length printed cable
FIELD: printing industry.
SUBSTANCE: in the method of length cutting of the printed cable the preliminary roll preform is isolated, then in the interwire gap the process slot is formed, into which the cutting element is inserted. Then, power is supplied to it, bringing to the predetermined temperature regime, then the displacement of the heated cutting element is carried out along the longitudinal axis of the printed cable.
EFFECT: provision of quality longitudinal cut in the interwire gap without compromising the integrity of the side insulation on the cut printed cables, reduction of defects, complexity and cost of production.
The invention relates to the manufacture of printed long cables with thermoplastic lacquer or foil insulation, and more particularly to a cutting group of the workpiece on a separate printed circuit cables, which are by definition a special case of printed circuit boards.
For example, in GOST 23752-79 "PRINTED circuit BOARD. General technical conditions", the term "flexible printed cables (GIC)" is mentioned in almost all the standard sections, starting with the preamble.
Modern equipment photochemical processes the receipt of all Board elements both on hard and on a flexible basis occur in group the workpiece with a size of 400×400 mm group procurement is based on the reference holes, and the finished boards from felled by stamp.
However, this technology is unacceptable to raskryvanie group blanks printed long cables - the newly created passive electrobalance in the context of the objective process of miniaturization ERA. For group procurement of long flexible printed cable is a tape longer than 20 m, a width of the order of 100-200 mm and a thickness of 0.1-0.2 mm, and the pitch of the printed conductors in the most common version is 1.25 mm when the width of the printed wire 0.7 mm and, accordingly, the value bezprovodovogo gap is 0.5 mm.
Known RF patent№2342813 from 27.12.2008 G., in which the cutting group billet to a separate flexible printed circuit cables are carried out by a remote conductor. This operation is only possible on the printed cables with thermosetting varnish insulation.
Also known USSR author's certificate No. 911748, NC from 3/06 07.03.1982., which in the printed cables with thermoplastic adhesive film and insulated from the bulk material in front of its insulation removed individual printed conductors adjacent to future vykraivaem cable. This method creates quite a free zone longitudinal cutting of the workpiece on the individual cables. And cutting can be done manually with scissors with a low probability of damage (badly) side of the cable insulation. However, the process of removing (detaching) of the individual printed conductors of the galvanic copper with a thickness of about 50 μm, and even with local heating of a trace at the place of exfoliation, it is highly labour-intensive and, due to low mechanical strength of the individual conductor often leads to its breakage, which generally unacceptable for small-scale production. And device for its mechanization is very difficult and expensive.
Common features offered by the authors of the way of cutting long-length printed cable is the presence of thermoplastic insulation, local heating.
Unlike the prototype predlagaemom the authors way of a separate conduit, separating neighboring group in the procurement of cables is not removed, and its side edges serve as guides for movement of the cutting element, for example a wire.
Thus, the objective of this technical solution was the creation of the mechanized method of slitting printed long cables with thermoplastic insulation, allowing for high-quality longitudinal cut in besprovodnikovy the gap without compromising the integrity of the lateral isolation cut on the printed cables and to reduce spoilage, the complexity and cost of their manufacture.
This object is achieved in that the cutting process printed long cable with thermoplastic insulation containing parallel and rectilinear traces separated besprovodnikovy clearance, and interaction with the cutting element lies in the fact that the pre-blank printed circuit cable are isolated by forming printed conductors, then printed on the cable in besprovodnikovy the gap of technological form a slot into which enter the heating element, then served him the food, bringing the preset temperature, then carry out the movement of the heated cutting element along the longitudinal axis of the printing cable.
In particular cases, i.e. in concrete forms �of spalania, the invention is characterized by the following features:
- cutting element made in the form of wire,
- at least one of the mounts of the cutting element after its introduction in besprovodnikovy the clearance is extended to the side remove the printed guide,
- cutting exercise two cutting elements,
- both of the cutting element are located in the cross section cut printed cable,
- cutting elements during the cutting apart,
- cutting pressed the heated cutting element to a lateral edge to be deleted in the printed guide,
- the width of the cutting element is chosen smaller than the width bezprovodovogo gap
- temperature of the cutting element chosen between the points of flow and degradation of the insulating material.
It allows to make a conclusion about the causal connection between the set of essential features of the claimed technical solution and achievable technical results.
These features, distinct from the prototype and covered by the requested object of legal protection, in all cases sufficient.
When implementing the method of cutting long-length flexible printed cables new sequence of operations and their nature allows, in particular, due to the isolation of the printed circuit cable before cutting and use�ing deleted in the printed guide as guide supports for the heated cutting element to provide high-quality longitudinal cut in besprovodnikovy the gap without compromising the integrity of the lateral insulation of cut on printed cables and to reduce spoilage, the complexity and cost of their manufacture.
Special cases, i.e. specific forms of performance, allow:
- cutting element made in the form of wire, eliminating the need based heating element, for example in a flat performance, relative to the longitudinal axis of a flexible and elastic parts as a flexible printed cable. In addition, the heated wire having a much smaller mass in contrast to the more developed of the heating element has a lower thermal inertia. This allows you to localize the width of the cut, preventing melting in besprovodnikovy gap material, and the remaining insulating lateral surface of the outer conductor of the printed cable, i.e., to minimize the cutting width;
- at least one of the mounts of the cutting element after its introduction in besprovodnikovy the clearance is extended to the side remove the printed guide, it allows you to press the cutting element to remove the printed conductor;
- cutting uses two cutting elements, which allows to increase the productivity of the cutting process;
- both of the cutting element, located on the cross section cut printed cable, trim lateral components of the forces from every place of the cut in otdelno�and;
- cutting elements during the cutting apart, which allows to cover the arc cut both printed conductor;
- ensures the pressing of the cutting element to a lateral edge cut off in the printed guide, it allows you to save the width and electrical properties remaining in isolation besprovodnikovy the gap adjacent to the outermost side of the printed conductors cut cable;
- wire select less than the width bezprovodovogo gap, in case of extreme traces are workers, not technological;
- temperature of the heating element is selected between the points of flow and degradation of the insulating material, thus reducing the forces involved in the cutting area.
Thus, the new sequence of operations and their nature allows, in particular, due to the isolation of the printed circuit cable before cutting and use of cut off in the printed guide as a guide support for the cutting element to provide high-quality longitudinal cut in besprovodnikovy the gap without compromising the integrity of the lateral isolation cut on the printed cables and to reduce spoilage, the complexity and cost of their manufacture.
On the basis of the proposed method of thermal cutting printed long cable with thermoplas�base insulation developed manufacturing process for a printed circuit cables and put into mass production.
1. Method of cutting long-length printed cable with thermoplastic insulation containing parallel and rectilinear traces separated besprovodnikovy gap, by interaction with the cutting tool, characterized in that the pre-blank printed circuit cable are isolated by forming printed conductors, then in besprovodnikovy the gap of technological form a slot into which enter the cutting tool, removing one of his mounts in the direction of the cut in the printed guide, then on the cutting tool serving food, displaying at a given temperature, then carry out the movement of the heated cutting tool along the longitudinal axis of the printing cable.
2. A method according to claim 1, characterized in that the cutting tool is made in the form of wire.
3. A method according to claim 1, characterized in that when cutting heated cutting tool is pressed against a lateral edge to be deleted in the printed guide.
4. A method according to claim 1, characterized in that the temperature of heating of the cutting tool choosing between points of the flow and degradation of the insulating material.
SUBSTANCE: invention relates to application of conformal coating on electronic device and comprises the steps that follow. (A) Heating of conformal coating bond including parylene bond of conformal coating for components sensitive to moisture for formation of gaseous monomer of conformal coating compound. (B) Integration of boron nitride with gaseous monomers. (C) Brining the electronic device surface in contact with gaseous monomers and boron nitride at conditions whereat conformal coating is formed on, at least a part of the surface including the compound of conformal coating and nitride boron to add water resistance to said surface.
EFFECT: expanded applications.
7 cl, 3 dwg, 1 tbl
SUBSTANCE: invention relates to polymer coatings, namely, to a halogen-hydrocarbon polymer coating for electric devices. A printed circuit board (PCB) includes a substrate, including an insulation material. The PCB additionally includes multitudes of electroconductive printing paths, connected to at least one substrate surface. The PCB additionally includes a multi-layered coating, precipitated on at least one substrate surface. The multilayered coating covers at least a part of a multitude of the electroconductive paths and includes at least one layer of the halogen-hydrocarbon polymer. The PCB additionally includes at least one electric component, connected by a solder connection to at least one electroconductive printing path, with the solder connection being soldered through the multilayered coating in such a way that the connection adjoins the multilayered coating.
EFFECT: prevention of oxidation or corrosion of metal surfaces, capable of preventing the formation of strong solder connections or capable of reducing a service term of the said connections.
39 cl, 18 dwg
SUBSTANCE: conductors and outputs are shaped at dielectric base of the integrated circuit. The base is covered by protective layer from the side of conductors leaving the area for conductors and outputs free of this layer. Further they are connected to metal plate by means of soldering and thereafter the dielectric base is irradiated by laser. Then metal plate is separated from conductors and outputs of the integrated circuit, for example, by means of heated air directed flow.
EFFECT: possibility of dielectric removal from conductors and outputs in any place of the integrated circuit by laser radiation provided that their integrity is maintained and additional protective materials are not used; possibility to form with high accuracy of a free area with removed layer of dielectric with complicated geometry.
2 cl, 1 dwg
FIELD: information technology.
SUBSTANCE: electronic insert, consisting of a circuit board, having a top surface and a bottom surface, a group of electronic components mounted on the top surface of the circuit board, a lower covering sheet connected as one with the bottom surface of the circuit board while creating between the bottom cover sheet and the bottom surface of the circuit board a continuous common surface, a top cover sheet over the top surface of the circuit board, and a layer of injected thermosetting material lying between the bottom cover sheet and the top cover sheet.
EFFECT: easier manufacture of an electronic insert or smart card due to special arrangement of their structural components.
44 cl, 7 dwg
SUBSTANCE: method involves installation of card with prepared surface into flexible cartridge having the possibility of performing spatial movements, which is turned with mounting downwards, submerged to certain depth into the tank with silicon compound for 30-40 seconds, turned to initial state, and heating is performed at 40-50°C till complete curing of compound. Compound used in coating formation method has the following composition, wt %: low-molecular silicon rubber M 60000-100000 - 100, polyethylenepolyamine (PEPA) - 2-4, aerosil 175 - 5-10, titanium dioxide - 20-30, ethyl silicate -40 - 3-7, polyalkylsiloxane - up to 10, stannum diethyldicaprylate - up to 3.
EFFECT: improving coating properties.
4 cl, 2 tbl, 5 ex
SUBSTANCE: method of protecting polyimide materials during etching involves a process for etching parts of the polyimide material with alkaline solutions. Before the etching process, the polyimide material is covered with a mixture of epoxy-urethane varnish with an oligoester acrylate additive, with the following ratio of components, wt %: epoxy-urethane varnish 93.7-95.2, oligoester acrylate 4.8-6.3. The part of the polyimide material which is not supposed to be etched is then protected with an insulating layer.
EFFECT: providing conditions for etching fully polymerised polyimide which ensure accuracy of the shape and dimensions of the etched areas.
FIELD: process engineering.
SUBSTANCE: proposed invention relates to p.c.b. protective coats produced by applying epoxy-urethane or epoxy lacquer or organic silicon compound-based lacquer on p.c.b. surface and drying it. It differs from known methods in that, to add biological resistance after heating, biocide additive Biocice T is introduced in lacquer composition in the ratio that follows, i.e. content of epoxy-urethane or epoxy lacquer or organic silicon compound-based lacquer makes (98.5 to 99.5) wt %, and biocide additive makes (0.5 to 1.5) wt %.
EFFECT: improved operating performances.
1 cl, 2 ex
SUBSTANCE: invention refers to the sphere of electronic engineering immediately dealing with techniques of protecting board-mounted uncased electronic components against ambient factors. The effect desired is due to application of a protective coating onto each uncased board-mounted element beginning with the one ranking as the highest in terms of on-board installation level. The procedure is as follows: having applied onto the surface a drop of compound with a viscosity of (15-20)10-6 m2/s one slants the board in different directions for the compound to spread uniformly over both the uncased electronic elements and the board proper, its layer thickness being the minimum possible. After that the board is air dried, first - at a temperature of 20-25°C for 15-16 hours, then - at temperature of 60-70°C for 7-8 hours.
EFFECT: preventing disconnection of uncased electronic component outputs due to application of a protecting coating.
FIELD: electrical engineering.
SUBSTANCE: suggested varnish coating protects printed circuit board and units of radio-electronic equipment, which are installed on it, against effect of different external factors that cause corrosion and against bacteria that cause fungi growth. Protective coating for printed circuit boards contains epoxy urethane varnish with hardener and biocide additive Traetex-243, with the following ratio of components, in %: epoxy urethane varnish with hardener - 99.00-99.75, biocide additive Traetex-243 - 0.25 - 1.00.
EFFECT: increase of electric insulation properties and resistance to fungi growth.
FIELD: micro-electronics, in particular, method for producing mask templates.
SUBSTANCE: for increasing adhesion of photoresists to masking layers of chromium and iron oxide, 2-3% mass. Of leucoparafuchsin (amine derivative of tritane), which allows, after appropriate thermal processing, to improve precision of reproduction of critical elements of integration circuit, undercutting below resist film not exceeding 0,1 micrometers to the side.
EFFECT: increased efficiency.
2 cl, 1 tbl
SUBSTANCE: masking coating, and namely perfluoropolyether is applied onto a substrate. Then, a copper layer or an aluminium layer with surface resistance of about 90-110 Ohm/m2 is applied by means of a selective vacuum metallisation method; after that, a current-carrying layer of silver-containing paint with silver content in the amount of 70-90% is applied by means of a screen printing method. Surface resistance of the obtained current-carrying coating is measured by means of a four-probe control method. Sections of the substrate are rejected, which do not correspond to the required technical characteristics determined from the condition of allowable spread of surface resistance of not more than 15% in absolute units.
EFFECT: improving producibility; enlarging operating capabilities; reducing production costs; improving measurement accuracy.
2 cl, 1 tbl
FIELD: information technology.
SUBSTANCE: method of making a card with an electronic interface involves forming a pair of holes in a substrate layer, merging an antenna with the substrate layer such that opposite ends of the antenna end in the holes, placing a conductor in each of the holes, connecting the antenna to the conductor, forming a depression in the substrate layer, attaching continuous connecting wires to a plurality of microcircuit modules, attaching continuous connecting wires to a plurality of conductors on corresponding layers of a plurality of substrates, cutting the connecting wires so as to preserve their parts which connect each microcircuit module with the corresponding pair of conductors, and the microcircuit module is sealed in the depression. The system includes a means of forming a depression in the substrate layer, a means of attaching wires and a sealing device for sealing the microcircuit module in the depression. The system further includes a laminating device for laminating the substrate layer with the top and bottom layers.
EFFECT: higher degree of automatisation.
19 cl, 19 dwg
SUBSTANCE: invention relates to electric engineering, namely, to methods for connection of conductors, to designs of contact joints used to connect current leads of electrolytic cells, electric furnaces, etc. Method for connection of conductors, preferably from heterogeneous materials, includes preparation of connected conductors surface, their arrangement with an overlap, making holes in them, where rods are inserted from conductor material, and deforming force is applied to them. Each rod is arranged with a hole, through which deforming force is applied at the level of cold welding evenly along the whole length of rod with the help of puncheons or microexplosion.
EFFECT: invention makes it possible to simplify the method, to increase reliability of connection, expand spheres of its application and range of connected conductors.
7 cl, 3 dwg
SUBSTANCE: method includes manufacturing of grooves in tip, holes in tip and packages of strips, preparation of surface of joined conductors, makingup of tip and packages of strips together with, at least, one core and application of deforming effort to them, tip connection to the current feedthrough. By the first version, lateral edges of strip packages in tip have in one plane with the plane of tip converted to the current feedthrough, thus all grooves in a tip carry out through in width less or equal width of the strips package. By the second version, the packages of strips in tip have in section on delta circuit vertexes, thus lateral edges of two packages of the strips adjoining to the basis of the delta circuit, have in one plane with the plane of tip converted to the current feedthrough. The strips in packages carry out from aluminium or from aluminium alloy which can have protective or insulating cover.
EFFECT: decrease in losses, reduction of materials consumption and costs of linking of conductors.
9 cl, 7 dwg
FIELD: electrical engineering; repairs of primarily totally-enclosed electrical machines for heavy-freight motor vehicles.
SUBSTANCE: proposed device designed for repairing DC electrical machine commutators has base which is joined with bracket and carries loosely mounted carriage with at least one working tool secured thereon, as well as lead screw coupled with carriage; novelty is that base has inner space accommodating bearing-mounted lead screw with drive nut; working tool is mounted on carriage for displacement; DC motor is joined to base and communicates with lead screw by means of closed flexible joint. In addition, drive nut has hole to receive carriage-mounted bolt. Device is also provided with two adjustment screws of which one is mounted in carriage and is coupled with working tool; other one is installed in base and is coupled with bracket-mounted strip.
EFFECT: enhanced degree of uniformity throughout entire surface of commutator being treated.
3 cl, 2 dwg
FIELD: electrical engineering.
SUBSTANCE: device that can be used to make electric contact between conductors carrying low and high currents as well as between provisional ground connections, and also can be used for making electric contact between welded part ground and welding machine is proposed in two design alternates. Device of first design alternate has fastening member made in the form of one or more magnets 1 secured on flexible conducting bus 2 suited to fixing electrical conductor thereon. Device of second design alternate has fastening member in the form of one or more magnets 1 that can be connected to electrical conductor.
EFFECT: facilitated connection of electric contact to welded part of any shape and size.
2 cl, 2 dwg
FIELD: process engineering.
SUBSTANCE: invention relates to production of three-ply cellular panels with built-in heat pipes used in production of spacecraft. Assembly elements are connected by gluing with heat pipes, cellular filler and embedded elements. Said assembly is placed on process board via bed sheet and fitted in heat furnace. Prior to assembly, heat pipe profiled are projected with the help of laser projector to three-ply lining surface.
EFFECT: higher precision of arrangement of heat pipes, reliability and serviceability of spacecraft.