Aluminium brazing sheet

FIELD: metallurgy industry.

SUBSTANCE: invention relates to a brazing sheet of a laminated aluminium alloy and can be used in the manufacture of heat exchangers. The brazing sheet of the laminated aluminium alloy consisting of the material of the base layer, which on one or both sides has an intermediate layer composed of Al-Si brazing solder located between the base layer and a thin coating layer over the intermediate layer. And the material of the base layer and the coating layer has a higher melting point than the Al-Si brazing solder. The coating layer comprises, in weight %: Bi 0.01-1.00, Mg ≤ 0.05, Mn ≤ 1.0, Cu ≤ 1.2, Fe ≤ 1.0, Si ≤ 4.0, Ti ≤ 0.1, Zn ≤ 6, Sn ≤ 0.1, In ≤ 0.1, unavoidable impurities ≤0.05, Al - the rest.

EFFECT: brazing sheet can be soldered in an inert or reducing atmosphere without the need to use the flux that provides the strength of the brazed joint.

24 cl, 1 tbl, 7 ex

 

The technical field to which the invention relates

The present invention relates to improved multi-layer aluminum sheet solder containing core material coated with hard solder as intermediate layer and outer cover layer. The invention also relates to a heat exchanger containing the specified enhanced multilayer aluminum sheet solder.

The level of technology

The present invention relates to sheet materials for connection by brazing aluminum materials in inert or reducing atmospheres without the need to apply the flux, to destroy, to dissolve or remove the surface oxide layer.

A major challenge today is the manufacture of materials and components for manufacture of heat exchangers under the low end of the cost, and as far as possible high quality. One abderemane technology in the manufacture of heat exchangers is brazing in a controlled gas environment, usually consisting of nitrogen is so low oxidised impurities as possible. This process is known as soldering in a controlled atmosphere "CAB" and includes the application of Al-K-F based flux on the joint surfaces before soldering. Flux destroys or dissolves the surface is chestny oxide layer of filler metal, to facilitate the wetting between the stacked surfaces and to prevent the formation of new oxides for forming connections. However, flux residues after soldering increasingly considered in the damage of the heat exchanger, because they can detach from welded aluminum surfaces and clogging internal channels, thereby preventing the effective application of the heat exchanger. It is also assumed that the use of flux in some cases leads to corrosion and erosion and leads to a lower shelf-life of products, and in some extreme cases, premature failure of the product. Apart from pure functional dependencies related to the disadvantages of using a flux, is the heavy influence of the flux and fluxing, for example, operating environment, cost, investment in devices for soldering and maintenance, energy, and properties of the environment.

To be able to produce heat exchangers using CAB without using a flux, it is necessary to develop new materials, to make possible the formation of a solder joint without removal of the oxide layer on the surfaces of aluminum alloy.

All designations of alloying elements and alloys used hereinafter, refers to the designation of the Association's Aluminum Standards and Data, as well as Registratio the data Records in the version of the Aluminum Association from 2007

Patent EP 1306207 B1 describes a solid aluminum solder, suitable for soldering in an inert gas without using flux. This invention is based on the multi-layer sheet solder, where the outer material is a thin cover layer covering the alloy based on Al-Si containing from 0.1 Mg to 0.5% mass fraction (hereinafter wt. -%) and Bi from 0.01 to 0.5% of the mass. and the base material. During the stage of rise heat when soldering cycle intermediate Al-Si layer is first begins to melt and expand space, breaking a thin cover layer, which allows the liquid filler metal to seep through the cracks on the surface of the sheet of solder.

In WO 2008/155067A1 revealed similar method for soldering without fluxing. This method differs from the above-mentioned application of magnesium content in the solder alloy in the range from 0.01 to 0,09% of the mass. Moreover, low levels of magnesium in the material of the middle layer (preferably less than 0.015% wt.) is required for this invention.

The invention

Methods bezgolosovo soldering available in previous prior art, have the limitation that they require the presence of bismuth in the layer of brazing. Bismuth in many circumstances is considered as an impurity and may for this reason to create a problem in the processing of waste from the production process. Also eats the desire to improve the soldering process.

The present invention is to provide an aluminum alloy sheet of solder, which can be soldered in an inert or reducing atmosphere without using a flux, which leads to increased solder joints, and which gives rise to a cleaner waste, i.e., is a lesser burden of waste treatment.

The problem is solved by multi-layer aluminum sheet solder under item 1 of the claims. Options for implementation are defined by dependent claims.

Requirements are increasing, mainly in the automotive industry, relative to the number of flux residues that are permitted in the heat exchange system. It is difficult and costly to apply small and repetitive amount of flux on localized portions of the inner surfaces of the heat exchanger to manifold to form an internal connection, this invention provides a distinct advantage in this aspect of the manufacture of the heat exchanger. Since no flux is not presented on the outer surface of the heat exchanger, any difficulties in separating the residue of flux that can penetrate, for example, in the passenger compartment of the vehicle, are excluded.

Also there is a net economic benefit available when soldering heat exchange units without using a flux, that is how it addresses not only the value of the flux, but also shortens the preparation time of the heating chamber, reduces the labor cost and frees up production space at the plant, reduces maintenance requirements of the devices providing the solder connection, and reduces the requirements for maintaining cleanliness and order. Also important benefits available due to work best for people, the environment, less solid waste and waste water from the system for soldering, and fewer harmful evaporative from the soldering process wastewater.

Sheet solder aluminum alloy of the present invention consists of a base layer on an aluminum base coated on one or both sides of the Al-Si solder solid type as an intermediate layer, where specified intermediate layer is in turn covered with an outer layer consisting of a thin aluminum alloy basis, free of magnesium with the addition of bismuth. The temperature of the transition into the liquid phase intermediate Al-Si solder alloy is lower than the temperature of the transition to the solid state base layer and a thin cover layer, making it possible for the intermediate solder layer to destroy the covering layer during soldering due to its volume expansion, and also makes it possible leakage preheated filler metal through covering the Loy, wetting each opposite surface and forming a connection.

The invention is hereinafter described as a three-layer sheet solder aluminum alloy, where soldering is carried out on one side of a sheet. However, the invention can be applied to create the solder joints on the two sides of the base layer, in which case the sheet solder is represented by five layers. It can also be coated on one side with a layer of aluminum alloy with less potential corrosion than the material of the base layer. Can also be placed a layer of aluminum alloy located between the primary and unprofitable (solder) layer to provide a diffusion barrier to the elements of the alloy and mostly unprofitable layer and thus to reduce their mutual mixing. In this case, the sheet solder will contain six or seven layers, if diffusion layers required on one or both sides of the alloy of the base layer.

Detailed description of the present invention

The present invention provides the product of the aluminum alloy sheet of solder, comprising: base layer material coated with Al-Si alloy, an intermediate layer and a thin cover of aluminum alloy, which contains Bi, to enhance perform soldering, where the material of the base layer and the covering layer have the more you will fetter the melting temperature, than the intermediate solid solder.

The temperature of the transition into the liquid phase intermediate Al-Si solid solder is lower than the transition temperature in the solid phase medium layer and a thin covering layer, which makes it possible for the specified intermediate solder layer to destroy the covering layer during soldering due to volume expansion, and that makes it possible seepage of filling the molten metal through the covering layer and which forms a connection with closely spaced materials in contact with the surface of the specified coating layer.

Specified Al-Si solid solder contains from 0.01 to 5% by mass. Mg, preferably 0.05 to 2.5% wt. Mg. Most preferably, the Mg content in the amount of 0.1-2.0 wt. -%, to obtain the optimum strength of solid solder and alloy middle layer, and the content of Bi is less than 1.5 wt. -%, preferably less than 0.5% of the mass. Bi and most preferably less than 0.2% of the mass. Bi. A thin cover layer contains 0.01 to 1.0% of the mass. Bi, more preferably 0.05 to 0.7% of the mass. Bi. Most preferred the brazing alloy must contain 0.07 to 0.3% wt. Bi to get a good tin and avoid excessive costs.

Adding bismuth (Bi) in a thin outer layer according to the present invention enhances the formation of the compound so that the compound formed would be the tray and has a larger size. The presence of Bi in a thin covering layer also reduces the need to ship large quantities of Bi in the intermediate solid solder, and an intermediate solid Bi solder can be removed entirely. This provides a saving in using Bi and reduces the number of Bi-containing wastes. It also lowers the risk of intergranular corrosion due to the introduction of Bi in the alloy of the base layer along, for example, grain boundaries and in the process of manufacturing sheet solder, and also for his rations. As an additional benefit, casting of this alloy can be produced in a simple little stove that reduces the risk of cross-contamination bismuth (Bi). It is also important to maintain a low Mg content in the thin covering layer, in order to avoid the growth of oxide film on the surface of the heating process for soldering, preferably below 0.05% of the mass. and most preferably is the absence of Mg in a thin covering layer.

The amount of Si in the intermediate Al-Si solid solder can be chosen at will, to suit the specific soldering process, and is usually between 5 and 14% of the mass. Si, but preferably finds application 7-13% of the mass. Si, and even more preferably 10-12,5% of the mass. Si. The content of Si in the upper part of the Si interval will ensure the proper performance of the fluidity of the molten filler even after covering with the Oh melts and thus will lower the concentration of Si in the molten phase. The addition of Mg to Al-Si solid solder is crucial to break the surface of the oxide layer and provides wetting opposite sides, as well as adding Bi in a thin cover layer gives the best performance of brazing.

Al-Si solid solder thus contains:

Si 5-14 wt. -%, preferably 7-13 wt. -%, more preferably 10-12,5 wt. -%,

Mg 0.01 to 5 wt. -%, preferably of 0.05-2.5 wt. -%, more preferably of 0.1-2.0 wt. -%,

Bi ≤1.5% wt., preferably of 0.05-0.5 wt. -%, most preferably 0.07 to 0.2% wt.,

Fe ≤0.8% of the mass.,

Cu ≤0.3% mass.,

Mn ≤0,15% mass.,

Zn ≤4 wt. -%,

Sn ≤0.1% wt.,

In ≤0.1% of mass.,

Sr ≤0.05% mass. and

inevitable impurities each in an amount less than 0.05 wt. -%, and the total impurity content of less than 0.2 wt. -%, carrying the aluminum content.

Zn, Sn and In lower potential corrosion of aluminum alloys, Sr is a strong modifier to achieve the small grain size of Si. Al-Si solid solder can also be free from Bi, thus the total content of Bi in the alloy sheet solder will also decrease.

Sheet solder of the present invention can be used with any aluminum material of the base layer sheet solder. A suitable material of the base layer can be any serial AA3xxx alloy. In the framework of the present invention surprisingly found that the formation of compounds with solid meals worked well even with the added Mg in the alloy of the base layer, that, in turn, means that the material of the base layer does not require the need of having a low content of Mg.

Thus, the alloy of the base layer can contain:

Mn 0.5 to 2.0 wt. -%,

Cu ≤1,2% mass.,

Fe ≤1.0% wt.,

Si ≤1.0% wt.,

Ti ≤0,2% mass.,

Mg ≤2.5% wt., preferably of 0.03 to 2.0 wt. -%,

Zr, Cr, V and/or Sc ≤0,2% of the mass. and

inevitable impurities each in an amount less than 0.05 wt. -%, and the total impurity content of less than 0.2% of the mass. carrying the aluminum content.

A thin cover layer consists of aluminum alloy, having a melting point higher than the melting point of the intermediate Al-Si solder metal, you should be free from Mg to avoid the formation of magnesium oxide on the surface. A thin cover layer as a consequence, it is preferable to have the Mg content is lower than 0.05% of the mass. and more preferably lower than 0.01% of the mass. The most preferred case in which the Mg in the alloy is not specifically introduced at all.

The chemical composition of the thin covering material contains:

Bi of 0.01 to 1.0 wt. -%, preferably 0.05 to 0.7% of the mass. and more preferably 0.07 to 0.5% mass.,

Mg ≤0.05% wt., preferably ≤0.01% wt., more preferably 0%,

Mn ≤1.0% wt.,

Cu ≤1,2% mass.,

Fe ≤1.0% wt.,

Si ≤4,0% wt., preferably ≤2 wt. -%,

Ti ≤0.1% wt.,

Zn ≤6 wt. -%,

Sn≤0.1% wt.,

In ≤0.1% of the mass. and

inevitable impurities each in an amount less than 0.05 wt. -%, and the total impurity content of less than 0.2% of the mass. carrying the aluminum content.

Zn, Sn and In can be included to reduce potential corrosion of the alloy and to help create a suitable potential gradient of corrosion after brazing through the entire thickness of the sheet.

According to one variant of implementation, the chemical composition of the thin covering material contains:

Bi of 0.01 to 1.0 wt. -%, preferably 0.05 to 0.7% of the mass. and more preferably 0.07 to 0.5% mass.,

Mg ≤0.05% wt., preferably ≤0.01% wt., more preferably 0%,

Mn ≤1.0% wt.,

Cu ≤1,2% mass.,

Fe ≤1.0% wt.,

Si ≤1,9% wt., preferably ≤1,65% wt., more preferably ≤1.4% of the mass. and most preferably ≤0.9% mass.,

Ti ≤0.1% wt.,

Zn ≤6 wt. -%,

Sn ≤0.1% wt.,

In ≤0.1% of the mass. and

inevitable impurities each in an amount less than 0.05 wt. -%, and the total impurity content of less than 0.2 wt. -%, carrying the aluminum content.

The number Si of 1.9% of the mass. or less in a thin cover layer will contribute to a solid state coating layer, when the isolating layer melts, and thus will also facilitate the wetting and the formation of the compound. Pure aluminum can contain up to 1,65% Si in solid solution without melting at 577°C, i.e. when the melt n is malinee CAB filler alloys. The presence of Fe, Mn and other elements that can react with Si to form intermetallic compounds, will lower the amount of Si in solid solution and can thus increase the allowable level of Si in the covering layer to 1.9% up until you achieve the desired effect.

Supply of intermediate Al-Si layers of brazing and covering layers on both sides of the base layer sheet solder can be effectively span from two sides.

The total thickness of the aluminum sheet solder varies between 0.04 and 4 mm, which is suitable for the manufacture of heat exchangers. The thickness of the thin covering layer relative to the total thickness of the multilayer sheet solder is preferably 0.1-10%, in order to ensure effective in preventing the formation of oxide on the surface of the sheet of solder and also easy to break during soldering. The thickness of the covering layer may be between 0.4 and 160 μm. The intermediate layer preferably has a thickness of from 3 to 30% relative to the entire thickness of the multilayer sheet solder. The thickness of the thin coating is chosen such that Mg and Bi did not have time to diffuse through the cover layer to the outer surface in the process of this soldering, thereby minimizing the risk of oxidation and deterioration of wetting. The thickness of the thin coating layer on which the compared to the intermediate layer of hard solder is between 1 and 40%, more preferably between 1 and 30%, most preferably between 10 and 30%. Suitable temperature range, in which the brazing is carried out, is in the range from 560°C to 615°C and preferably 570°C to 610°C.

The invention further provides a heat exchanger containing sheet solder aluminum alloy as described above.

Manufacturer of sheet solder

Each of the above alloys can be cast using continuous casting in the mold (DC) or continuous twin roll casting or continuous casting in a conveyor of the filling machine. The choice of casting technology can be solved on the basis of technological, economic and reasons of functionality. The alloy of the base layer is molded as a sheet workpiece using a DC casting route, whereas the intermediate layer and the outer thin layer of casting with the use of DC casting or continuous casting techniques.

Casting a layer of brazing and casting for alloy external surfaces are cleaned and then heated in a furnace to a temperature between 350 and 550°C, and the duration of the exposure temperature of heating ranges from 0 to 20 hours. Both alloy is subjected to hot rolling to obtain a desired thickness and cut to fit. Plate solid solder then put on clean surface the casting of the base layer, and the plate is thin outer layer then put on the plate surface of the solid solder. Both alloy obtained roller welding along the seam along two opposite sides by MIG to create a managed molded packaging, which is placed in the oven pre-heating. The package is heated to a temperature of 350 and 550°C, and the duration of the temperature of heating ranges from 0 to 20 hours. After that covered with the package is subjected to hot rolling, cold rolling to final size, rolling for superior flatness and cutting up the supply width. Intermediate and final thermal treatment is performed, if necessary, for easier production and the desired structure of the supplied metal.

Examples

All the alloys were cast using laboratory foundry equipment in the so-called modular forms, producing slabs of small forms a length of 150 mm, a width of 90 mm and a thickness of 20 mm, the Chemical compositions of the alloys tested for solderability can be seen in table 1.

Each slab was cleaned, heated from room temperature to 450°C for 8 hours, maintained at 450°C for 2 hours and cooled in air to room temperature. Then the materials were laminated to a suitable thickness and exposed to soft annealing between the passages, when it was not bhodemon to facilitate rolling. Thus, the materials of the primary, intermediate, and outer layers were combined to create a three-layer clad packaging, in which the layers were attached to each other by cold rolling. The materials were laminated in a cold condition to a thickness of 0.4 mm, which provided a one-way covering 8% of the intermediate layer and 2% of the outer layer, with an intermediate mild heat treatment, if necessary, provide easy rolling and giving the final heat-treated to hardness after tempering H24 to provide large recrystallized grains in the core layer during the subsequent soldering procedure. Instead of softening annealing can be performed working heat treatment, for example, H12, H14 or H112 to get large recrystallized grains.

Brazing was performed in a glass-melting furnace laboratory in about 3 DM3the camera for soldering. The furnace was flushed during the entire cycle of soldering stream of nitrogen with low - 10 standard liters per minute. The soldering cycle was - linear heating from room temperature to 600°C for 10 minutes, 3-minute exposure at 600°C with subsequent cooling in air to room temperature. Sample installation was simple area on the sample for testing, where the clad material is used as a sample for testing, and non-clad material AA3003 size of 0.5 mm was used as the area. All soldering was performed without flux.

SPT*
Table 1
Chemical composition in % weight. shall be tested alloys based on optical emission spectrometer analysis of molten substance
The layer typeSiFeCuMnMgZrBi
Abase0,520,520,120,960,58<0,01<0,01
Bbase0,570,240,130,89of 2.51<0,01<0,01
Cbase0,630,560,14 1,170,49<0,01<0,01
Dbase0,050,180,81,71<0,010,13<0,01
Ebase0,050,20,281,30,22<0,01<0,01
Fbase0,530,390,121,11<0,01<0,01<0,01
GSPT*11,80,13<0,01<0,01<0,01<0,01<0,01
HSPT*12,1 0,14<0,01<0,01<0,01<0,010,05
ISPT*11,70,14<0,01<0,01<0,01<0,010,11
JSPT*the 11.60,14<0,01<0,010,10<0,010,11
KSPT*11,80,13<0,01<0,010,06<0,01<0,01
LSPT*11,90,14<0,01<0,010,05<0,010,05
M11,80,14<0,01<0,010,09<0,010,06
NSPT*11,90,13<0,01<0,010,09<0,01<0,01
OSPT*the 11.60,09<0,01<0,011,0<0,010,1
PSPT*11,80,20<0,010,024,25<0,010,1
QSPT*12,10,18<0,010,022,35<0,01 0,1
RExternal0,040,16<0,01<0,01<0,01<0,01<0,01
SExternal0,040,15<0,01<0,01<0,01<0,010,1
TExternal0,040,15<0,01<0,01<0,01<0,010,2
UExternal0,040,15<0,01<0,01<0,01<0,010,3
VExternal0,040,15<0,01 <0,01<0,01<0,010,4
SPT* Intermediate planirovanie floor

The above examples were examined by visual examination of the soldering connections, and below is just a sample of some of the results. All samples belonging to the invention, gave acceptable connections soldering and the rapid formation of the contact.

CommentBaseSPTThe covering layerResult
Example 1
(comparative
tion)
Standard type clad sheet without coating layerDG-No education soldering has not occurred between the coated sample and the uncovered area in the soldering process
Example 2
(comparative
tion)
Sample made in accordance with the prior art, described in WO 2008/155067 A1FM Education connection has occurred between the coated sample and the uncovered area in the soldering process
Example 3(comparative
tion)
Sample made in accordance with the prior art described in EP 1306207 B1FOREducation connection has occurred between the coated sample and the uncovered area in the soldering process
Example 4FMSThe connection between the coated sample and the uncovered area in the soldering process formed faster and increased to be larger than in comparative example 2
Example 5FOSThe connection between the coated sample and the uncovered area in the soldering process formed faster and increased to be larger than in comparative example 3
Example 6EN UEducation connection between the coated sample and the uncovered area in the soldering process, despite the absence of bismuth in the intermediate pinom coverage
Example 7DNTEducation connection between the coated sample and the uncovered area in the soldering process, despite the absence of bismuth in the intermediate pinom coverage

In examples 4 and 5 the formation of the compound is between lakirovannym sample and non-clad area during the soldering process. The connection is formed faster and grows up to be a little larger than in comparative examples 2 and 3. This is due to the presence of Bi in the outer layer according to the invention.

In examples 6 and 7, the formation of the compound is between lakirovannym sample and non-clad area in the soldering process, despite the lack of Bi in the intermediate blokirovannom the floor. This is due to the presence of Bi in the outer layer according to the invention.

1. Sheet solder from multi-layer aluminium alloy consisting of a material of the base layer on one or both sides has an intermediate layer consisting of Al-Si solid solder located between the primary is at the forefront and a thin cover layer over the intermediate layer, moreover, the material of the base layer and the covering layer has a higher melting point than Al-Si layer of brazing, and the covering layer consists of, in wt.%:
Bi 0,01-1,00,
Mg ≤0,05, preferably ≤0,01, most preferably 0,
Mn ≤1,0,
Cu ≤1,2,
Fe ≤1,0,
Si ≤4,0, preferably ≤2,0,
Ti ≤0,1,
Zn ≤6, Sn ≤0,1, In ≤0.1 and
the inevitable impurities in quantities smaller than 0,05, as well as the total impurity content of less than 0.2,
aluminum - rest.

2. Sheet solder aluminum alloy under item 1, in which the covering layer contains Bi in an amount of 0.05 to 0.7 wt.%.

3. Sheet solder aluminum alloy under item 1, in which the covering layer contains Bi in an amount of 0.07 to 0.5 wt.%.

4. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the covering layer contains Si in an amount ≤1.9 wt.%, preferably ≤of 1.65 wt.%, more preferably ≤1.4 wt.% and most preferably ≤0.9 wt.%.

5. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the Al-Si the brazing alloy consists of, in wt.%:
Si 5-14, preferably 7 to 13, more preferably 10-12,5,
Mg 0.01 to 5, preferably from 0.05 to 2.5, more preferably of 0.1-2.0,
Bi ≤1.5A, preferably of 0.05 to 0.5, more preferably 0.07 to 0.3, and
Fe ≤0,8,
Cu ≤0,3,
Mn ≤0,15,
Zn ≤4,0,
Sn ≤0,1,
In ≤0.1, the
Sr ≤0.05 and
inevitable impurities each in an amount of less than 0.05, and the total is the third impurity content of less than 0.2,
aluminum - rest.

6. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the Al-Si solid solder contains Bi.

7. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the main layer consists of, in wt.%:
Mn 0.5 to 2.0,
Cu ≤1,2,
Fe ≤1,0,
Si ≤1,0,
Ti ≤0,2,
Mg ≤2,5, preferably of 0.03 to 2.0,
Zr, Cr, V and/or Sc in General ≤0,2, and
inevitable impurities each in an amount of less than 0.05, and the total impurity content of less than 0.2,
aluminum - rest.

8. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the intermediate layer and the covering layer is present on both sides of the base layer.

9. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the covering layer has a thickness of between 0.4 and 160 ám.

10. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the total thickness of the aluminum sheet solder is between 0.04 and 4 mm.

11. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the thickness of the thin covering layer relative to the intermediate layer is between 1 and 40%, more preferably between 1 and 30%, most preferably between 10 and 30%.

12. Sheet solder aluminum alloy according to any one of paragraphs.1-3, in which the thickness of the intermediate layer relative to the thickness of the aluminum sheet solder is equal to 3-30%.

13. Sheet p is the IPA of aluminum alloy under item 4, in which Al-Si the brazing alloy consists of, in wt.%:
Si 5-14, preferably 7 to 13, more preferably 10-12,5,
Mg 0.01 to 5, preferably from 0.05 to 2.5, more preferably of 0.1-2.0,
Bi ≤1.5A, preferably of 0.05 to 0.5, more preferably 0.07 to 0.3, and
Fe ≤0,8,
Cu ≤0,3,
Mn ≤0,15,
Zn ≤4,0,
Sn ≤0,1,
In ≤0.1, the
Sr ≤0.05 and
inevitable impurities each in an amount of less than 0.05, and the total impurity content of less than 0.2,
aluminum - rest.

14. Sheet solder aluminum alloy under item 4, in which the Al-Si solid solder contains Bi.

15. Sheet solder aluminum alloy under item 4, in which the main layer consists of, in wt.%:
Mn 0.5 to 2.0,
Cu ≤1,2,
Fe ≤1,0,
Si ≤1,0,
Ti ≤0,2,
Mg ≤2,5, preferably of 0.03 to 2.0,
Zr, Cr, V and/or Sc in General ≤0.2 and
inevitable impurities each in an amount of less than 0.05, and the total impurity content of less than 0.2,
aluminum - rest.

16. Sheet solder aluminum alloy under item 5, in which the main layer consists of, in wt.%:
Mn 0.5 to 2.0,
Cu ≤1,2,
Fe ≤1,0,
Si ≤1,0,
Ti ≤0,2,
Mg ≤2,5, preferably of 0.03 to 2.0,
Zr, Cr, V and/or Sc in General ≤0.2 and
inevitable impurities each in an amount of less than 0.05, and the total impurity content of less than 0.2,
aluminum - rest.

17. Sheet solder aluminum alloy under item 4, in which the thickness of the thin covering layer relative to the intermediate layer is between 1 and 40%, more FAV is preferably between 1 and 30%, most preferably between 10 and 30%.

18. Sheet solder aluminum alloy under item 5, in which the thickness of the thin covering layer relative to the intermediate layer is between 1 and 40%, more preferably between 1 and 30%, most preferably between 10 and 30%.

19. Sheet solder aluminum alloy under item 4, in which the thickness of the intermediate layer relative to the thickness of the aluminum sheet solder is equal to 3-30%.

20. Sheet solder aluminum alloy under item 5, in which the thickness of the intermediate layer relative to the thickness of the aluminum sheet solder is equal to 3-30%.

21. Sheet solder aluminum alloy under item 6, in which the main layer consists of, in wt.%:
Mn 0.5 to 2.0,
Cu ≤1,2,
Fe ≤1,0,
Si ≤1,0,
Ti ≤0,2,
Mg ≤2,5, preferably of 0.03 to 2.0,
Zr, Cr, V and/or Sc in General ≤0.2 and
inevitable impurities each in an amount of less than 0.05, and the total impurity content of less than 0.2,
aluminum - rest.

22. Sheet solder aluminum alloy under item 6, in which the thickness of the thin covering layer relative to the intermediate layer is between 1 and 40%, more preferably between 1 and 30%, most preferably between 10 and 30%.

23. Sheet solder aluminum alloy under item 6, in which the thickness of the intermediate layer relative to the thickness of the aluminum sheet solder is equal to 3-30%.

24. The heat exchanger containing the earnest solder from multi-layer aluminium alloy according to any one of paragraphs.1-23.



 

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Cylindrical cooler // 2297584

FIELD: heat exchange.

SUBSTANCE: cylindrical cooler comprises solid radiator made of an alloy with shape memory effect. The radiator is shaped into a cylinder. The cylinder is preliminary rolled with respect to the axis of rotation in the thermoplastic region by an angle close to the limit one. At a critical temperature, the cylinder is unrolled. The cylindrical shape of the radiator is recovered under the action of thermoelastic force. When the temperature of the cylinder exceeds the critical temperature, the cylinder cools and absorbs the excess of heat.

EFFECT: enhanced efficiency.

The invention relates to the field of power engineering and can be used in the manufacture of air cooling units, mainly used in chemical and gas industry

The invention relates to heat engineering and can be used in the manufacture of heat exchangers

The invention relates to the field of heat transfer and can be used for space heating

The invention relates to a steel pipeline systems bimetallic heating radiators

The heat exchanger // 2141613
The invention relates to heat engineering, primarily for vehicles, namely, devices, providing comfortable conditions in the cabin of a vehicle, and air conditioning equipment
Aluminium alloy // 2536566

FIELD: metallurgy.

SUBSTANCE: invention relates to aluminium-based alloys, having high electroconductivity and heat conductivity, and may be used to produce parts by means of casting under pressure, for instance, radiators, used to protect electronics in cars. The alloy contains, wt %: from 8.0 to 9.0 of silicon, from 0.5 to 0.7 of iron, not more than 0.010 of copper, not more than 0.010 of magnesium, not more than 0.010 of manganese, not more than 0.001 of chrome, not more than 0.020 of titanium, not more than 0.020 of vanadium, not more than 0.05 of zinc, from 0.010 to 0.030 of strontium, the balance is aluminium and unavoidable mixtures of not more than 0.05 each, in total of not more than 0.2.

EFFECT: invention is aimed at improvement of electroconductivity and heat conductivity of an alloy produced by casting under pressure.

4 cl, 3 tbl

FIELD: metallurgy.

SUBSTANCE: invention relates to an extruded or rolled clad metal product and can be used in the transport industry, aerospace products and ships. The product includes a cladded metal layer and a cladding metal layer on at least one surface of the cladded layer; with that, the cladded and the cladding metal layers are made from aluminium alloys containing the following, wt %: 3 to 8 Mg and Sc in the range of 0.05 to 1; with that, the content of Sc in the alloy of the cladded layer is lower than its content in the alloy of the cladding layer by 0.02% or more. The invention also relates to a welded structure including such a metal product.

EFFECT: as a result of use of the invention, products are made from the aluminium alloy containing Sc with an improved strength and weldability balance.

14 cl, 1 ex

FIELD: process engineering.

SUBSTANCE: invention relates to powder metallurgy, particularly to production of light materials with low linear expansion factor and can be used as a structural material in production of aircraft control system high-performance controllers. Proposed composition contains the following substances, in wt %: silicon - 41-45, nickel - 3.9-5.6, iron - ≤0.48, aluminium oxide ≤2.8, aluminium making the rest. Proposed process comprises silicon powder grinding to required dispersity, magnetic separation of silicon powder, mixing of the latter with powder of aluminium alloy "CAC1-50", filling of produced mix in capsule, vacuum degassing, gas-static compaction of capsules and removal of aluminium shell.

EFFECT: nontoxic material that features stable-size, low specific weight, good machinability, low linear expansion factor, low magnetic susceptibility.

2 cl, 1 tbl

FIELD: chemistry.

SUBSTANCE: invention relates to components processed by precision turning, said components being obtained from extruded products of the rod, bar or even tube type made from a deformable aluminium alloy for precision turning. The alloy has the following composition, wt %: 0.8<Si<1.5, preferably 1.0≤Si<1.5; 1.0<Fe<1.8, preferably 1.0<Fe≤1.5; Cu <0.1; Mn <1, preferably <0.6; Mg 0.6-1,2, preferably 0.6-0.9; Ni <3.0%, preferably 1.0-2.0; Cr <0.25%; Ti <0.1%; other elements <0.05 each and 0.15 in total, aluminium - the balance. The subject of the invention is also a component made by precision turning of such an extruded product as defined above.

EFFECT: invention is aimed at improving cutting ability of aluminium-based alloys containing not more than 1,5% silicon.

7 cl, 3 ex, 3 tbl, 3 dwg

Powder composite // 2509817

FIELD: metallurgy.

SUBSTANCE: invention can be used as a structural material for parts operated at high mechanical and thermal loads, for example, pistons of augmented ICEs operated at 350°C and higher. Proposed composition contains the following substances, in wt %: silicon - 12.05…14.65, nickel - 2.80…3.40, iron - 1.50…1.70, aluminium oxide - 1.05…1.30, carbon - 1.35…1.65, aluminium making the rest.

EFFECT: lower thermal expansion factor, higher heat and wear resistance.

4 dwg, 3 tbl

FIELD: electricity.

SUBSTANCE: invention refers to active material of negative electrode for electric device containing an alloy with composition formula SixZnyAlz, where each of x, y and z is mass percentage meeting the following: (1) x+y+z=100, (2) 26≤x≤47, (3) 18≤y≤44 and (4) 22≤z≤46. Also invention refers to electrical device and negative electrode for it.

EFFECT: providing active material of negative electrode for electrical device such as lithium-ion accumulator battery providing well-balanced properties of high cycling conservation and high initial capacity.

4 cl, 2 tbl, 10 dwg, 2 ex

FIELD: metallurgy.

SUBSTANCE: method for obtaining material in the form of a cast section involves preparation of aluminium melt containing 1-2 wt % of iron and 0.2 - 0.6 wt % of silicon, introduction to the melt at the temperature of 900-1100°°C of boron in the form of boric acid and titanium in the form of chips in the ratio allowing to obtain in cast structure of titanium diboride particles in the amount of 4 to 8 wt %, and crystallisation by casting to a mould.

EFFECT: obtaining boron-containing composite material on aluminium basis, which has high level of absorption of neutron emission in combination with the best mechanical properties and processibility.

5 ex, 2 tbl, 1 dwg

FIELD: metallurgy.

SUBSTANCE: initial material consists of mixture of powders of aluminum silicate, crystals and dolomite at their weight ratio equal to 1: 0,06-0,45 : 0.08-0.24, supplied by flow of plasma-forming gas to reactor of gas-discharge plasma at temperature in reactor equal to 5000-6000°C, products of thermal decomposition: are cooled by inert gas and obtained powder of aluminium-silicon alloy is condensed in water-cooling receiving chamber.

EFFECT: invention allows obtainment of nanosized powders of aluminium-silicon alloys with alloy additives of calcium and magnesium thus conferring ductility and corrosive resistance to products made from these powders.

4 cl, 6 ex

FIELD: metallurgy.

SUBSTANCE: according to the proposed method, aluminium-silicon alloy is first subject to modification by supplying the mixture consisting of chloric and fluoric salts to the molten metal heel; then, after cleaning of molten metal heel from products of their interaction with liquid alloy, which is treated with direct current.

EFFECT: invention allows considerably increasing the duration of action of modification effect for maintaining high mechanical properties of castings.

2 cl, 1 dwg, 1 tbl

FIELD: metallurgy.

SUBSTANCE: aluminium-based alloy produced by the method of quick crystallisation contains the following components, wt %: silicon 16.0-19.5; copper 3.0-5.0; magnesium 0.7-1.2; manganese 0.3-0.7; iron 0.9-1.5; titanium 0.2-0.5; zirconium 0.15-0.4; aluminium oxide 0.01-0.3; cerium 0.001-0.005; nickel up to 1.3.

EFFECT: alloy designed for manufacturing of pistons has a high complex of physical-mechanical, operating and environmental characteristics.

2 tbl, 3 ex

FIELD: metallurgy.

SUBSTANCE: invention relates to production of laminar composite steel-aluminium materials. Steel sheets are pre-coated with flux water solution containing KF - 36-40%; AlF3 - 44-50%; K2TiF6 - 10-20%, water is removed to pile the sheets to be impregnated with aluminium melt with overheating temperature some 50-100°C higher than aluminium melt liquidus line.

EFFECT: better adhesion between aluminium and steel, titanium alloyed transition intermetallide ply their between.

1 ex

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