Liquid cooling system of electronic device

FIELD: machine building.

SUBSTANCE: unit is placed in a leakproof housing composed of two parts. The first (upper) part is a cover in the form of a hollow metal cylinder with semispherical end wall on the closed side and fitted by a flange - on the open side. The second (lower) part is a base on which all components of an electronic device are fixed. The electronic components are arranged inside the housing as follows: a group cooler on which the most heat releasing components are installed, is mounted on the base. Posts providing for fastening of a horizontal perforated shield above the said components are installed on the base, the remaining components with less heat release - printed circuit boards with radio elements - are mounted on the shield. The inlet hole provided in the cover is aimed at the supply of dielectric cooling liquid inside the housing, the liquid passes inside the housing and washes all electronic components cooling them, then it enters the channels present in the group cooler body providing for additional withdrawal of heat, afterwards it is drained through the outlet hole provided in the base. Internal channels increase the efficiency of heat transfer from the components installed on the group cooler. The cooling liquid is supplied to the housing under high pressure by means of an external pump and can be included in the common circulating flow of cooling agent of the whole spacecraft.

EFFECT: improved efficiency of cooling the devices comprising radio electronic components and power modules with different heat release levels, including those intended to be used in the state of weightlessness.

4 cl, 3 dwg

 

The technical field

The invention relates to a liquid cooling systems designed for cooling electronic devices on-Board equipment spacecraft.

The level of technology

There are several systems for cooling electronic devices.

Known systems using liquid (water, oil) or gaseous (air) refrigerant circulating in a natural way (convection), and do not use additional devices for forced circulation.

For example, the known two-phase systems (vapor - liquid)in which the refrigerant is a boiling liquid.

Systems that use liquid refrigerant and forced circulation of the refrigerant, are the most effective in conditions of high heat dissipation capacity and the need for a particularly effective cooling of some components of electronic devices. This system uses direct cooling of an electronic device cooling liquid (submerged in the coolant), have an advantage when the device is in space (zero gravity, vacuum).

Analog of the present invention is the device according to patent RU 2273970 C1. The device uses for cooling electronic devices, the heat sink base that hosts the electronic device. P and under seats installation of electronic modules are channels for the passage of a dielectric coolant, which are made in the form of a meander. The system of channels for the coolant is a parallel-serial circuit and arranged so that each electronic module cooling, respectively, of the power of his heat with regard to reducing the total hydraulic resistance.

The disadvantages of this scheme:

insufficient cooling efficiency and the absence of additional protection of electronic components from cosmic radiation in the case of use in space.

Another analog of the present invention is the device according to patent RU 2207746 C2. This device is an installation of air cooling of the power module container type. Additional interior wall divides the container into two volumes - the high-pressure and low-pressure areas. A high pressure region is created intake case fans. The pressure difference provides air circulation. The cooling of the air occurs in the space between the raised floor and cold floors.

The disadvantages of this scheme are:

the inability of an efficient cooling of the individual (e) components, is heated in varying degrees;

the inability to use the space flight.

Other the closest analogue, wybran the m for the prototype, is the device according to patent US 8,009,419 B2. The device consists of a cooled electronic device, placed in the tank and submerged in the dielectric cooling liquid in the tank. Dielectric coolant circulates through the input and output openings of the reservoir by a pump for circulation. Outside the tank, the liquid passes through a heat exchanger attached to the outer side of the tank. The heat exchanger is equipped with a fan designed for heat dissipation from the heat exchanger.

The disadvantages are the counterpart:

- insufficient cooling efficiency of the power blocks with different loads;

- the inability to work in conditions of weightlessness (partially used convection heated coolant and use an external fan for heat dissipation from the heat exchanger).

Disclosure of inventions

The aim of the invention is to improve the efficiency of cooling devices containing electronic components and power modules with different loads, including those designed for operation in conditions of weightlessness.

According to the proposed technical solution, all structural elements of the cooled electronic device are accommodated in a casing consisting of two parts. The first one (the upper) part is a hollow metal cylinder with a hemispherical end wall on one side and a flange on the other hand, which houses electronic components. She is the cover. The second ("bottom") part is a platform, on which is fixed group cooler with fuel power modules. It is the basis. Both parts are tightly interconnected. The cover has an inlet for feed inside the dielectric cooling fluid, which is flowing inside the body, washes all the electronic components, cooling them, and then enters the channels of the group cooler and exits through the outlet (drain) hole located at the base. The cooling fluid completely fills the cavity inside the housing, being in direct contact with all elements of the electronic device, which has the following advantages:

1) efficient cooling of all of the elements of the electronic device, the cooling liquid is supplied into the casing under high pressure by a pump that promotes efficient cooling, independent of the effects of convection, which is absent in conditions of weightlessness in space, the housing and the method of connection of its parts can withstand this high pressure);

2) the coolant is a dielectric that provides additional protection against short circuits in the chain;

3) coolant mo is no be an additional device protection from space radiation.

Components of the cooled device is placed in the case as follows: in the upper part of the body located on the electronic Board; in the lower part of the housing has the power modules and other components with large loads. Thus, the electronic Board, which is usually implemented by an electric circuit control device, are constantly in contact with the cold dielectric cooling fluid coming from the inlet. This provides the most efficient cooling of the electronic components of the control circuits, which is critical for stable operation of the device as a whole.

Power modules are mounted on group cooler in the lower part of the body. Group the cooler has an internal channels for the flow through him coolant, providing the primary heat removal from the power modules. Group cooler can be performed by teams consisting of individual chillers, each of which is a metal plate with a specific configuration. By connecting these plates are formed internal channels. The shape of the channel can be selected winding, for example in the form of a meander, with the aim of increasing the length of the channel. Due to the large channel length cooler more efficiently releases heat coolant (those whom loosely). Precast character group of the cooler allows you to find the right number of unit coolers, respectively, of the generated heat of the power module. Thus, the power modules are cooled in two ways: through direct contact with a dielectric cooling liquid, washing them, and through contact with the group cooler with internal channels through which coolant flows.

Such a system with a forced flow of cooling liquid under high pressure is directed first into components with negligible heat generation, and then the components with large loads, provides high cooling efficiency of the electronic device and allows its use in space flight.

At the top of the cover has a perforated screen on which are mounted electronic components. The openings in the screen are used for the passage of coolant in the lower part of the body. This reduction of the flow area of the channel increases significantly the speed of the flow, resulting in improved cooling efficiency.

In addition, the screen can serve as a protection against electromagnetic radiation power components.

Drawings

The figure 1 presents a General view of the construction in section, realize the overall cooling system of an electronic device (in this case, the high-frequency inverter).

Designation of positions:

1 - cover;

2 - base;

3 - connecting bolt;

4 - gasket;

5 - group cooler;

6 is a high-frequency transformer;

7 - condenser;

8 - hour;

9 is a screen perforated;

10 - e motherboard (system management);

11 - inlet fitting;

12 - output socket.

The figure 2 shows a diagram of the flow of the dielectric cooling liquid in the cooling system of an electronic device:

13 - inner channel group cooler;

14 - the collector.

The figure 3 presents a view of a group of cooler in the context of:

15 - unit cooler (metal plate).

The implementation of the invention

The implementation of the invention is illustrated on a concrete example of the construction of the high-frequency inverter, which is accommodated in the housing consisting of two parts: the cover 1 and base 2. Cover 1 is a hollow metal cylinder (e.g., titanium alloy)having a hemispherical end wall on one side and provided with a flange on the other. The base 2 on which is mounted the electronic device is a metal platform on which are mounted all of the elements of the inverter. The base 2 is hermetically coupled to the cover by means of bolts 3. In connection installed platitudinarian 4 of soft metal, for example, copper.

Elements of the inverter are mounted inside the enclosure as follows: on the basis of 2 fixed group cooler 5 hosting components with large thermal (power modules 4, a high-frequency transformer 6, the compensation capacitors 7). Also on the base 2 fixed vertical posts 8, support horizontal screen 9, is made in the form of a perforated disk on which the top is fixed electronic components with negligible heat generation, but demanding to temperature regimes - the electronic Board 10 of the control system. The screen 9 is structurally separates the housing of an electronic device into 2 parts: the top, containing the card with the electronic control system elements, and the lower part containing the power modules that are installed on the cooler group. This separation allows efficient cooling of the components of the two parts with different loads. In the cover upper part and the lower part is mounted fittings 11 and 12, respectively, for supplying and removing the cooling fluid.

The liquid cooling system of an electronic device is illustrated a diagram of the flow of the dielectric cooling liquid within the housing (Figure 2). After final Assembly of the body placed in it E. accronym device is filled with a dielectric coolant, for example of silicone fluid - tetramethoxysilane (CH3C6H4O)Si. The direction of flow of the coolant is set from the top of the case for better cooling of the circuit boards of the control system, because the cooling elements must be cooled to a lower temperature. In figure 2 the arrows indicate the passage of a cooling fluid inside the electronic device. In group cooler 5 has a channel 13, through which flows the coolant, providing more efficient heat dissipation from the power elements.

The coolant flows into the housing under pressure, using an external pump (not shown), ensuring the specified working pressure.

As the flow of cooling fluid around all the components of the electronic device is heat removal from fuel elements (for inverter - with PCB, then the windings and the magnetic core of the transformer, connecting buses and wires, with the outer surfaces of the power module and the capacitor) and the heat-release surface of the channel group of the cooler. The major part of the heat loss (about 70%) is discharged through the cooler group 5, which is fixed to the most fuel power electronic components the electronic device.

Then, the heated coolant is discharged into the common manifold 14 and is output through the output fitting 12 is on the outside, for example in an external loop with a common external heat exchanger (radiation fridge), after which it may again be supplied by the pump in the cooling system of the electronic device through the inlet fitting 11.

Group the cooler 5 can be performed by teams consisting of individual chillers 15 (3), each of which is a metal plate with a specific configuration, when connecting them to each other forms the inner channel 13 having, for example, the shape of the meander for a longer course it coolant.

The inverter is selected as an example of the liquid cooling system of an electronic device made in the form of a prototype and has the following parameters: working pressure coolant about 4 ATM, the consumed power of about 15 kW, dimensions 260 mm260 mm700 mm, weight about 30 kg

1. The liquid cooling system of an electronic device containing a sealed enclosure, inside of which is a heat-generating components of an electronic device in the form of radio, electronic circuit boards and power units having input and output openings for the inlet and exhaust dielectric ohla is giving liquid, characterized in that the housing consists of two parts - the cover is in the form of a hollow cylinder and the grounds on which the group has a cooler attached to it components with high heat dissipation, and this group cooler has in his body through internal channels filled with coolant circulating in the system, and the components with less dissipation placed in the upper part of the body on the mounting elements secured on the base, the opening for the supply of the coolant is located in the upper part of the cover and the hole to drain the coolant at the base.

2. The liquid cooling system of an electronic device according to claim 1, characterized in that the cylindrical cover with a closed side has the shape of a hemisphere, and with an open - has a flange with holes for fasteners.

3. The liquid cooling system of an electronic device according to claim 1, characterized in that the cooler group made teams, consisting of individual chillers, each of which is a metal plate with a specific configuration that provides for docking with the following plate formation of the inner channel.

4. The liquid cooling system of an electronic device according to claim 1, characterized in that the fastening elements DL the components with less heat dissipation include perforated screen of a magnetic material for electronic components, the orifices of the perforated screen is made certain value, allowing an unobstructed flow of cooling liquid from the upper part of the body at the bottom, and with high speed.



 

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