Lighting device, display device and television receiver

FIELD: electricity.

SUBSTANCE: lighting device includes multiple LED 16, circuit board 17S LED, chassis 14, connection component 60 and reflecting plate 21. LED 16 are installed on circuit board 17S LED. Both plates 17S and 17C LED are attached to chassis 14. Connection component 60 is electrically connects circuit boards 17S and 17C LED between each other. Reflecting plate 21 is put on surface 17A of light sources installation. In the lighting device, connection component 60 is located on surface 17B of attachment of connection component of circuit board 17S LED. Surface 17B of attachment of connection device is opposite to the surface, on which reflecting plate 21 is put.

EFFECT: increasing brightness of reflected light.

23 cl, 22 dwg

 

The technical FIELD TO WHICH the INVENTION RELATES.

The present invention relates to a lighting device, display device and television receiver.

The LEVEL of TECHNOLOGY

In recent years, the components of the display devices display images, including television receivers, changing with the traditional cathode ray tubes on the thin display elements such as liquid crystal panel and a plasma display panel, and applied to the thin display devices. Thus, it is possible refinement of the display devices. The liquid crystal display device additionally requires a lighting device (backlight unit), since the liquid crystal panel used in it, no light is emitted. Examples of the backlight unit will be described in Patent documents 1 and 2. The backlight unit described in Patent document 1 has a configuration according to which the linking multiple cards, each of which has an LED (light sources)that are implemented on it. The backlight unit described in Patent document 2 has a configuration in which: a white or silver reflective sheet is located in the housing configured to accommodate the light source; and the light from the light source reflected by this reflecting sheet, and napravlyaet the LCD panel.

Patent document 1: unexamined publication No. 2007-317423 Japan patent

Patent document 2: Unexamined publication No. 2008-304839 Japan patent

The PROBLEM addressed by the INVENTION

In order to increase the brightness of the reflected light, it is preferable that the reflecting sheet, as described above, was almost entirely located on the inner surface of the backlight unit. Therefore, the reflecting sheet is located so as to overlap with the cards. However, boards are connecting components (e.g. connectors)used for electrical connections between the boards. Therefore, the overlap of the reflective sheet of cards is accompanied by the risk that this will cause a local rise and deformation of the reflective sheet in the regions containing coupling components and, as a result, the formation of uneven brightness.

DISCLOSURE of INVENTIONS

The present invention was created based on the above situation and aims at providing a lighting device, based on the suppression of uneven brightness. The present invention also aims at providing a display device and television receiver, each of which includes a lighting device.

A MEANS FOR SOLVING PROBLEMS

The lighting device is in accordance with the present invention includes multiple light sources, first charge of the light sources, a different card, different from the first circuit Board of the light sources, the element mounting boards, the connecting component and a reflecting sheet. Light sources mounted on the first circuit Board of the light sources. Both of the first Board of lights and other fees attached to the element mounting boards. The connecting component electrically connects the first charge of the light sources and a different card to each other. Reflective sheet placed on the mounting surface of the first Board of the light sources. The light sources are installed on the installation surface. In the lighting device, the connecting component is located on the mounting surface of the connecting component first Board of the light source opposite to the surface on which is superimposed the reflecting sheet.

The first Board of light sources, interference between the reflecting sheet and the connecting component is prevented by applying the configuration in which the coupling component is provided on the installation surface of the connecting component opposite to the surface on which the superimposed reflective sheet (i.e. an installation surface on which the light sources). As a result, the local deformation of the reflective sheet can be suppressed, and can be suppressed unevenness of brightness. About the metim, in another way, to avoid interference between the reflecting sheet and the connecting component is considered a configuration in which, after reflecting sheet are formed through holes of the reflecting sheet is positioned so that the connecting components are inserted into the through hole. However, in the case of forming the reflecting sheet through holes, connecting the components will be exposed in places where the formed through holes. The opening affects the uniformity of the optical reflectivity. As a result, this may cause uneven brightness. In this regard, the configuration according to the present invention is not accompanied by the formation of through holes used to insert them in connecting components, and therefore, preserves the uniformity of the optical reflectivity, thereby eliminating the risk of uneven brightness. Therefore, this configuration is suitable.

The following configuration is preferred as the embodiments of the present invention.

(1) the connection component may include installed on Board connectors and relay component. Installed on-Board connectors are mounted on the first circuit Board of the light sources and on the other Board, appropriate to estwenno. The relay component is electrically connected with the established on-Board connectors. This configuration provides superior performance by providing opportunities to electrically connect the first charge of the light sources and a different card to each other, and by mounting the relay components installed on the motherboard connectors.

(2) relay component can be located on the element mounting boards so as to be converted to the installed on-Board connector. Installed on-Board connectors and relay component can be connected with each other along with fixing the first Board of the light sources to the element mounting boards. It provides excellent performance, as installed on Board connectors and relay components are connected with each other along with fixing the first Board of the light sources to the element mounting boards.

(3) the Element mounting boards may be provided with a hole for inserting in its lower part, opposite to the connector installed on the circuit Board, through which the relay component or mounted on the card connector, and a part of the relay component or part is installed on the motherboard connector is inserted into it. In the present invention, the connecting component is on the surface, protivopolojna the second surface, on which the light sources. This may impair the operability of attaching the relay component installed on-Board connectors from the side of the mounting surface after attaching cards installed in the card connector. To avoid this problem, the configuration is applied, according to which hole to insert are formed in the lower portion of the element mounting boards. This configuration gives the relay component can be fixed to the installed on-Board connectors through the hole to insert on the outside (surface mount coupling component) element mounting boards. Attaching the relay component mounted on the circuit Board connectors is facilitated by attaching the boards to the element mounting boards.

(4) Each opening for the insertion may be essentially square shape in the top view.

(5) the Hole for the insert may be essentially circular shape in the top view.

(6) Hole for insertion can be essentially triangular shape in the top view.

(7) a relay component can be placed in recess to the relay component formed by pressing the outer surface of the lower portion of the element mounting boards. This configuration provides, under the above configuration (3), the relay component the ability o f the s in the part of the recess to the relay component, when the relay component is mounted on the outside of the element mounting boards. Relay component, thus, can be protected.

(8) a relay component may include an electric wire, and the relay connectors are connected to ends of electric wires, respectively, and adjusted to the appropriate installed on-Board connectors. Since the corresponding relay connectors are connected with extremely flexible electric wire, adjustment of the relay connector to the installed on-Board connectors easier.

(9) the First charge of the light sources may include a first wiring, a second wiring and the third wiring. The first wiring may be located on the surface, on which the light sources, and may be electrically connected c light sources. The second wiring may be located on the mounting surfaces of the connecting component and may be electrically connected to the connecting component. The third wiring may electrically connect the first wiring and the second wiring to each other. The heat from the posting can be stimulated by posting location on the surface (the surface having the light source mounted thereon, and mounting surfaces of the connecting component) on both sides of the first light sources. More precisely, t is how to surface mount the connecting component is a surface, facing the element mounting boards, heat can efficiently be emitted in the direction of the element mounting boards. For example, thus can be suppressed heat of the light sources, thereby, the service life of the light source can be prolonged.

(10) Reflective sheet may have a through hole for light sources, through which can pass light sources. Through holes for light sources can be formed in locations corresponding to the respective light sources in the top view. This configuration makes it possible, without causing interference between the reflecting sheet and the light sources, to impose a reflective sheet on the surface, on which the light sources. The combination of this configuration and the above-described configuration, having a connecting component, located on the mounting surfaces of the connecting component, allows higher reliability to suppress the bending of the reflecting sheet.

(11) Other fees may be second - light sources, which can be installed light sources.

(12) Other fees may be Board power supply used to supply power to the light sources.

(13) the light Sources may be light emitting diodes. This configuration can reduce the power consumption.

(14) Each of the light is sluchayah diodes may include a blue light emitting chip and a fluorescent material, having a peak light emission in the yellow region, and can be configured for the emission of white light.

(15) Each of the light emitting diodes may include a blue light emitting chip and a fluorescent material having light emission peaks in the green and red areas, and can be configured for the emission of white light.

(16) Each of the light emitting diodes may include a blue light-emitting chip, a red light-emitting chip and a fluorescent material having a peak of light emission in the green region, and can be configured for the emission of white light.

(17) Each of the light emitting diodes may include a blue light-emitting chip, a red light-emitting chip and the green light-emitting chip, and can be configured for the emission of white light.

(18) Each of the light emitting diodes may include ultraviolet light-emitting chip and a fluorescent material, and may be configured to emit white light.

(19) Each of the light emitting diodes may include ultraviolet light-emitting chip and a fluorescent material having light emission peaks in the blue, green and red areas, and can be configured for the emission of white light.

Further, in order to solve the above samples is him, the display device according to the present invention includes the above-described lighting device and a display panel configured to perform display using light emitted from the lighting device. Moreover, the television receiver according to the present invention includes the above display device.

In the display device, a liquid crystal panel using liquid crystals, can be presented as an example of the display panel. A display device configured as described above, can be used as a liquid crystal display device for various applications, for example, as a television display and display PC (personal computer PC). These display devices are particularly suitable for large screens.

A USEFUL RESULT of INVENTIONS

According to the present invention, may be proposed lighting device configured to suppress uneven brightness. Additionally, there may be proposed a display device and television receiver, each of which includes such a lighting device.

BRIEF DESCRIPTION of DRAWINGS

Fig. 1 - exploded view in perspective showing a schematic configuration of a televised message is sent to the steering receiver according to the first variant implementation of the present invention;

Fig. 2 - exploded view in perspective showing a schematic configuration of a liquid crystal display device;

Fig. 3 is a top view of the backlight unit;

Fig. 4 is a view in transverse section taken along the line A-A in Fig. 3.

Fig. 5 is a top view showing the structure for connecting mutually adjacent circuit boards to each other;

Fig. 6 is a view in transverse section taken along the line B-B in Fig. 5.

Fig. 7 is a view in transverse section showing the electrical connection between the LED and the connector;

Fig. 8 is a view in transverse section showing a comparative example of the LED Board;

Fig. 9 is a view in cross section showing the structure for connecting circuit boards to each other according to the second variant of implementation of the present invention;

Fig. 10 is a exploded view showing the corresponding components in Fig. 9 in a disassembled state;

Fig. 11 is a view in cross section showing the structure for connecting circuit boards to each other according to a third variant of implementation of the present invention;

Fig. 12 is a view in cross section showing the structure for connecting circuit boards according to the fourth variant of implementation of the present invention;

Fig. 13 is a view in cross section showing the structure for connecting circuit boards according to the fifth variant implementation of the ia of the present invention with each other;

Fig. 14 is a view in transverse section showing the procedure for connecting circuit boards to each other;

Fig. 15 is a view in transverse section showing the electrical connection, according to the sixth variant of implementation of the present invention, between the LED and the connector;

Fig. 16 is an enlarged view in cross section of the environment LED according to a seventh variant of implementation of the present invention;

Fig. 17 is a view in transverse section showing other embodiments of;

Fig. 18 is a top view showing the backlight unit according to the eighth variant of implementation of the present invention;

Fig. 19 is a view in cross section showing the structure for connecting with each other Board and LED Board power;

Fig. 20 is a top view, from the back side of the chassis having a rectangular through hole formed therein;

Fig. 21 is a top view, from the rear of the chassis, having a round through hole formed therein; and

Fig. 22 is a top view, from the rear of the chassis, with a triangular through holes formed in it.

The IMPLEMENTATION of the INVENTION

<First an implementation option>

The first variant of implementation of the present invention will be described with reference to Fig. 1 through 8. Note that each of the drawings in the present embodiment, has a part, showing the Y. the X-axis, the Y-axis and Z-axis, and illustrated so that the directions shown on it, comply with the directions of the respective axes. Additionally, the upper side is shown in Fig. 4 is the front side and the lower side is the rear side.

The television receiver TV (TV) according to the present variant implementation, as shown in Fig. 1, includes a liquid crystal device 10 of the display (display device), front and rear compartments Ca and Cb, the source of P supply and tuner T. the Front and rear compartments Ca and Cb surround with front and rear sides, and, thus, comprise a liquid crystal device 10 of the display. The television receiver TV is supported by the stand S, so that its display surface can be carried out along the vertical direction (Y axis direction). The liquid crystal device 10 display generally has a horizontally elongated rectangular shape. The liquid crystal device 10 of the display, as shown in Fig. 2, includes: a block 12 of the backlight (lighting device), which is an external light source; and a liquid crystal panel 11 (a display panel)configured to perform display using light emitted from the block 12 of the backlight. These elements, together, are held with the form is the AMA frame 13.

Next will be described a liquid crystal panel 11 and block 12 of the backlight included in the liquid crystal device 10 of the display. Among these elements, the liquid crystal panel 11 is rectangular in the top view. And the liquid crystal panel 11 has a pair of glass substrates connected to each other with a predetermined gap introduced between them, and has a liquid crystal that is attached between the glass substrates. On one of the glass substrates is provided for switching components (for example, TFT (thin film transistors)), United with stokovye lines and gate lines, which are perpendicular to each other, pixel electrodes connected to the switching components, and the alignment film, and the like. On the other glass substrate is provided by the color filters having color sections such as the color sections R (red), G (green) and B (blue), arranged according to a predefined scheme, protivoelektrodom and the alignment film, and the like. Glass substrates have polarizing plates on their outer surface.

Next, will be described in detail block 12 of the backlight. As shown in Fig. 2 and 3, block 12 of the backlight includes essentially having the shape of a box chassis 14, open at the front end, set the STV blocks 40 of the light sources, attached to the chassis 14, the reflecting sheet 21 located along the inner surface of the chassis 14, the diffuser 15a located so as to cover the opening of the chassis 14, and the optical sheet 15b, laminated on the front side of the diffuser 15a.

The chassis 14 (the element mounting boards), for example, made of metal, such as one based on aluminum material, and in General, is essentially rectangular in the top view. As shown in Fig. 3 and 4, the chassis 14 includes a bottom plate 14a, which is rectangular, as in the case of the liquid crystal panel 11, side plates 14b, rising from the outer edges of each side of the bottom plate 14a, and the receiving plates 14d, protruding from the rising edges of the side plates 14b. Additionally, the chassis 14 is located in the direction along the longer sides aligned with the horizontal direction (X direction)and the direction along the short sides coinciding with the vertical direction (Y axis direction).

Each of the blocks 40 of the light sources includes: LED 16 (light emitting diodes), which are the light sources; and a circuit Board 17 LED, each of which has multiple (five in this embodiment) LED 16 installed on it. On the bottom plate 14a of the chassis 14, fifteen LED 16 are arranged in the array in the direction of the X-axis, e is the first building in a number of multiple (three) blocks 40 of the light sources in the direction of the axis X. Many groups of blocks 40 of the light sources located in Lenigrad thus, in the direction of the axis X, are the numerous (nine in this embodiment) lines in the direction along the short sides of the chassis 14 (the Y axis direction) with a constant distance between the mutually adjacent groups. Thus, numerous blocks 40 of the light sources, and thus, numerous LED 16 are in the form of a two-dimensional array within a front surface of the bottom plate 14a of the chassis 14.

LED 16 are so-called type surface fitting and mounted on the surface (the surface having the light source mounted therein, indicated by reference as surface 17A of the installation of lights) on the front side of each of the boards 17 LED. The optical axis LA of each of the LED 16 is coaxial with the axis Z. in Addition, the LED 16 are aligned in the direction along the long side (X axis direction) of the card 17 LED. Step layout of the LED 16 is approximately constant and, in other words, the LED 16 is arranged with uniform intervals on the Board 17 LED. Each of the LED 16 includes a monochrome chip 16A LED, which emits only blue light, and a bridging portion 16B configured to seal chip LED 16A, as shown in Fig. 6. Bridging portion 16B has a flat hemispherical shape and, for example, formed the and of optically transparent material, such as epoxy resin. Additionally, a fluorescent material that glows when receiving light emitted from the chip 16A LED, mixed in the seal portion 16B. As examples of this fluorescent material, can be described fluorescent material having a peak of light emission in the yellow region, and the fluorescent material having light emission peaks in the green and red areas. This configuration gives the LED 16 can emit white light.

Fee 17 LED is, for example, from metal, such as one based on aluminum material, and has an elongated shape that is elongated in the direction along the long sides (the X direction) of the chassis 14. As shown in Fig. 5 and 7, circuit 19A of the transaction, for example, formed of copper foil formed on the surface 17A of the installation of the light source Board 17 LED. Each of the circuits 19A posting is extended in the direction along the long sides of the Board 17 LED, so that two lines are parallel to each other. Each of the circuits 19A wiring is soldered and, due to this, electrically connected with the conclusions (of the respective anode and cathode), not illustrated, are provided on respective chips 16A LED described above. For each of the circuit boards 17 LED arranged in a line in the direction of the axis X, the card 17 LED, which are adjacent to each other, are electrically connected to each other is d through the connecting component 60. This connecting component 60 will be described later in detail. Note that, between the circuit 19A wiring Board 17 LED, formed an insulating layer, thereby, the circuit 19A wiring electrically isolated from the circuit Board 17 LED. In addition, the insulating layer is also formed on the front surface of the circuit 19A of the transaction. Note that only the circuit 19A transactions are illustrated in Fig. 5 and 7, and that the illustration of the respective insulating layers are omitted.

Next will be described a construction for attaching the circuit Board 17 LED to the chassis 14. As shown in Fig. 4, the openings 17a of the attachment formed in predetermined positions on the circuit Board 17 LED to permeate cost 17 LED in the direction from front to back (the Z axis direction). The latch 23, which is used for fixing Board 17 LED to the chassis 14, is inserted through each of the holes 17a of the attachment. In the chassis 14, the holes 14e mounting having the same diameter as the holes 17a of the attachment formed in positions corresponding to the hole 17a of the attachment. The latch 23, for example, is made from a synthetic polymer. As shown in Fig. 4, the latch 23 includes a plate 23a of the mounting, running parallel with the plate 17 LED and having a circular shape in the top view, and part 23b to insert, protruding from the plate 23a of the mounting in the direction of the chassis 14 along the z axis direction.

While the party founded the I part 23b to insert has a diameter, set slightly smaller than the openings 17a of the mounting, the upper end face has a diameter set larger than the openings 17a of the attachment. Additionally, a portion 23d of the recess having a shape that is concave toward the front side, is formed in the upper end portion 23b to be inserted. Thus, the upper end part 23b to insert is made elastically deformable. According to the above configuration, the upper end side portion 23b to insert secured to the rear side of the chassis 14 when the part 23b to insert retainer 23 is inserted into the hole 17a and attachment hole 14e fastening. Thus, the fee 17 LED clamped plates 23a mounting retainer 23 and the chassis 14, through which is formed a structure in which charge 17 LED attached to the chassis 14. More precisely, while the lower part 21B of the reflection sheet 21 is located between the plate 23a of the mounting of the latch 23 and the printed circuit Board 17 of the LED Board 17 LED is pressed to the plate 23a of the mounting through the lower part 21B of the reflecting sheet 21 from the front side.

In addition, as shown in Fig. 3 and 4, essentially round tapered bearing dowel 27 is provided on the front surface, so that it protrudes from the surface of the retainer 23, which is located relatively close to the center of the chassis 14. The height of the protrusion supporting studs 27 is set to the height that it allows the upper end to adjacent (or close) to the surface of the rear side of the diffuser 15a. Thus, the supporting studs 27 performs the function of supporting the diffuser 15a with its rear side and, thus, suppress bending of the diffuser 15a.

Next will be described the reflecting sheet 21. The reflecting sheet 21, for example, is made from a synthetic polymer, and its surface is set with white color, which has excellent reflectivity. The reflecting sheet 21 is laid on the inner surface of the bottom plate 14a and the side plate 14b of the chassis 14, so as to cover most of these inner surfaces. This reflective sheet 21 provides the possibility of reflection, in the direction of the diffuser 15a, a certain amount of light (for example, light from the LED 16, which is not directly on the diffuser 15a and the light reflected by the diffuser 15a)emitted from LED 16 blocks 40 of the light sources, and therefore, can increase the brightness of the block 12 of the backlight. The reflecting sheet 21 includes: the lower part 21B, which is located along the forming plane directions (directions of X-axis and Y-axis) of the chassis 14; and the beveled portion 21D extending from the boundary of the site and the lower part 21B. The beveled portion 21D has a slope to the bottom plate 14a of the chassis 14, such that it approaches the center of the liquid crystal display devices 10. In addition, the boundary areas beveled portion 21D supported group is the respective rotary receiving plates 14d of the chassis 14, as shown in Fig. 4.

As shown in Fig. 6, the lower part 21B of the reflection sheet 21 is placed on top surface 17A of the installation of the light source Board 17 LED. Additionally, in the lower part 21B, through holes 21A for light sources that are configured to allow the LED 16 through them, formed at positions corresponding to the LED 16. Each of the through holes 21A for light sources has a round shape in the top view, and its outer diameter is defined larger than the outer diameter of each of the LED 16 (more precisely, to seal parts 16B). Thus, the LED 16 can pass through the through hole 21A for light sources and to act on the front side of the reflection sheet 21, which is formed design, which gives the LED 16 can emit light to the diffuser 15a without blocking the reflecting sheet 21. Additionally, interference between the reflecting sheet 21 and the LED 16 is prevented due to the fact that the LED 16 pass through the through holes 21A for light sources. In addition, for example, even if there is an error in the size or position of the formation, this inaccuracy is acceptable, since the outer diameter of the through hole 21A of the light source is larger than the outer diameter of the LED 16, as described above. Therefore, the LED 16 can be inserted into the through-hole 21A of the light source. Note that naru is hydrated diameter of the through hole 21A of the light source can be almost equal to the outside diameter of the LED 16. In addition, the hole 21E to insert the retainer, through which may be inserted portion 23b to insert the above-described latch 23 formed in the lower part 21B of the reflecting sheet 21.

The diffuser 15a is configured to have a structure which provides a large number of scattering particles by dispersion within the framework of a substrate having a predetermined thickness and made of a transparent polymer. The diffuser 15a has the function of scattering light passing through the diffuser 15a. The Board thickness of the optical sheet 15b is set thinner than that of the diffuser 15a. As the optical sheet 15b, may be used any of the sheet diffuser sheet of the lenses of the lens, the polarization reflecting sheet type, and the like, and may be selected as needed.

The boundary area of the diffuser 15a is placed on top of the edge area of the reflecting sheet 21. Additionally, the frame 20 is placed on the receiving plates 14d in the chassis 14 from the front side, and is screwed and fastened to them. Is formed a protrusion 20a, which acts on the inner side of the chassis 14, which leads to designs where the protrusion 20a presses the edge region of the optical sheet 15b from the front side. Due to the above configuration, the reflecting sheet 21, the diffuser 15a and the optical sheet 15b clamp the Xia receiving plates 14d of the chassis 14 and the projections 20a of the frame 20. In addition, the boundary area of liquid crystal panel 11 is placed on the front side of the frame 20, which provides the possibility of clamping the liquid crystal panel 11 between the frame 20 and the frame 13, which is located on the front side.

Next will be described the connecting component 60, which electrically connects the mutually adjacent Board 17 LED to each other between the plates 17 LED, which are arranged in line in the direction of the axis X. As shown in Fig. 5 and 6, the connecting component 60 includes installed on the Board connector 61 is mounted on each of the circuit boards 17 LED; and a relay component 63, which electrically connects the installed on-Board connectors 61.

Mounted on circuit Board connector 61 is rectangular in the top view, and two of the installed on-Board connectors 61 are mounted on both edges of the circuit Board 17 LED in the direction of the long sides (refer to Fig. 3). Mounted on circuit Board connector 61 includes a body 61D, made from a synthetic polymer, having insulating properties, and metal reinforcement 62 conclusions held by the body 61D (Fig. 7). In addition, mounted on the card connector 61 is mounted on the surface (hereinafter, indicated by reference as surface 17B of the mounting of the connecting component), the opposite surface 17A set the key light sources. In other words, the fee 17 LED is formed as a so-called double-sided Board of adjustment, which has components (LED 16 and mounted on the circuit Board connectors 61), which must be installed installed on both sides.

Due to the layout of the installed on-Board connectors 61 on the surface 17B of the mounting of the connecting component, the surface 17A of the installation of the light sources does not have the connecting component 60, and have only installed it LED 16. Thus, the surface 17A of the installation of the light source is a surface which is flat for the most part, except for locations where installed LED 16. When this configuration is obtained by the location of the installed on-Board connectors 61 (as a result, the connecting component 60) on the side surface 17B of the mounting of the connecting component, and the above-described configuration is obtained by forming through holes 21A to sources of light in the reflecting sheet 21, are applied together, the reflecting sheet 21 can be placed along the forming plane directions (directions of X axis and Y axis) on the surface 17A of the installation of the light sources without any bend in it.

Next will be described a structure for electrical connection between installed on PLA the e connector 61 and the LED 16. As shown in Fig. 7, a through hole 17D is formed in the circuit Board 17 is LED to pass through in the direction from front to back, the portion on which is mounted on circuit Board connector 61. The inner circular surface of this through hole 17D is covered with a metal coating 18 (e.g., copper plating). Part of the armature 62 pins, protruding from the body 61D elements mounted on the circuit Board connector 61 is inserted into the through hole 17D and soldered, and thus electrically connects to the metal coating 18. Additionally, as shown in Fig. 5, mounted on circuit Board connector 61 is set to the length, which provides a set on the Board connector 61 a possibility to overcome two lines 19A posting in the direction of the y axis Due to the above configuration, mounted on circuit Board connector 61 and the circuit 19A wiring electrically connected to each other through the metallic coating 18, which, it turns out configuration, which is mounted on circuit Board connector 61 and each of the chips 16A LED electrically connected to each other. Mounted on circuit Board connector 61 is located on the circuit Board 17 LED to him landing face 61A through which is mounted on the circuit Board 61 of the connector fitted to the relay connector 65 which will be described below, I have suwasa facing to the rear (to the bottom plate 14a of the chassis 14). Note that, in Fig. 7, the reflecting sheet 21 is omitted.

As shown in Fig. 6, the relay component 63 includes: electrical wire 64, each of which is obtained, for example, by coating a conductive wire with a flexible coating material, such as polyvinyl chloride, and the conductive wire is made of metal material, such as copper; and relay connectors 65, each of which is connected with both ends of the electric wires 64. Mounted on circuit Board connector 61 and each of the relay connector 65 is configured to be fitted to each other, due to which, when installed on the appropriate Board connectors 61 are fitted to the respective relay connectors 65, the result is a configuration in which each of the chips 16A LED installed on mutually adjacent boards number of boards 17 LED electrically connected to each other through the relay components 63.

Note that, as shown in Fig. 3, each of the two most extreme (the first circuit Board of the light sources specified number 17S links) of the three cards 17 LED arranged in a line in the X direction, configured to be adjacent to the other (second - light sources, the specified number 17C links) of the circuit Board 17 LED on one side only, facing the Central Board from amongst the three cards 17 LED. In each of these extreme cards 7S, LED the scheme of excitation control, not illustrated, is connected with the installed on-Board connector 61 (indicated by the number 61B reference to Fig. 3), located on its front side (one side at which the fee 17S LED adjacent to the card LED 17C). Thus, the power required for illumination of the LED 16, arranged in a line side by side in the direction of the axis X, is fed through circuit 19A wiring from control circuit excitation. In addition, control of excitation LED 16 arranged in a line side by side in the direction of the axis X, may be carried out together.

As shown in Fig. 6, on the inner surface of the bottom plate 14a (lower part) of the chassis 14, the portion that is directed to the connecting components, pressed, and formed part 50 of the recess configured for placement inside the connecting component 60. As a result, while it applies the configuration in which the connecting component 60 is located on the surface 17B of the mounting of the connecting component (surface, which is facing toward the bottom plate 14a of the chassis 14) of the card 17 LED Board 17 LED can be mounted on the bottom plate 14a, without causing interference between the connecting component 60 and the bottom plate 14a.

Moreover, in the Z axis direction, the size of Z2 the depth of the portion 50 of the recess is set larger than the size of the Z1 ledge soy is intellego component 60 of the circuit Board 17 LED. Thus, between the lower outer surface 50A of the part 50 of the recess and a position in which ends of the protrusion of the connecting component 60 (relay connector 65) is formed in the space S1. Even when the chassis 14 applies an external force, the connecting component 60 can be protected, as thus formed, the space S1 is configured to prevent direct transmission of such external forces with the bottom plate 14a on the connecting component 60. Additionally, even when there are some errors in the dimensions of the part 50 of the recess and the connecting component 60, the interference between the connecting component 60 and the bottom plate 14a can be prevented with greater reliability, as thus formed, the space S1 is configured to absorb such errors.

This version of the implementation is configured as described above, as will be described further on his work. First of all, will be described the procedure for installing cards 17 LED and the reflective sheet 21 on the chassis 14. In the beginning, before fees 17 LED attached to the chassis 14, the corresponding installed on the motherboard connectors 61, mounted on the mutually adjacent two circuit boards of the circuit Board 17 LED, adjusted to the relay connectors 65 relay component 63 so that the two boards 17 LED electrically connected to each other is d through the relay component 63. Further, each of the circuit boards 17 LED (block 40 of the light sources) is installed on the bottom plate 14a. With this setting, when the connecting component 60 is placed in the part 50 of the recess, the space S1 is provided between each of the relay connectors 65 and the lower outer surface 50A of the part 50 of the recess, allowing you to avoid the interference between the connecting component 60 and the bottom plate 14a.

Further, the reflecting sheet 21 is laid on the inner surface of the chassis 14. More precisely, the reflecting sheet 21 is housed in the chassis 14, while its corresponding through hole 21A for light sources are aligned with the corresponding LED 16. Therefore, while the corresponding LED 16 are passed through the corresponding through holes 21A for light sources, the lower part 21B of the reflection sheet 21 is superimposed on the surface 17A of the installation of the light sources of the respective boards 17 LED. In the present embodiment, each of the surfaces 17A installation of the light sources has a surface which is flat for the most part, because there are no plots, acting up, other than the parts where you installed the LED 16. Therefore, the lower part 21B of the reflection sheet 21 is applied, without any of his bending, forming along the plane of the directions (directions of X axis and Y axis) on the surface of the s 17A installation of light sources (refer to Fig. 6). In other words, the reflecting sheet 21 is placed on top surfaces 17A installation of light sources, however, there remains a high degree of flatness. Additionally, the boundary area of the reflecting sheet 21 is placed on the receiving plates 14d of the chassis 14 at the same time as the above steps. After imposed reflective sheet 21, part 23b to insert each of the latches 23 are inserted in numerical order through the hole 21E to insert retainer reflective sheet 21, the hole 17a of the mounting Board 17 and LED the opening 14e of the mounting chassis 14. Both of the lower part 21B of the reflection sheet 21 and the circuit Board 17 LED, therefore, are clamped between the plate 23a of the mounting of the latch 23 and the bottom plate 14a of the chassis 14 (see Fig. 4). Installing cards 17 LED and the reflective sheet 21 in the chassis 14 is completed in the above procedure.

Next will be described operation, when the LED 16 are driven. Chips 16A LED on each Board 17 LED electrically connected to each other through the circuit 19A of the transaction, and the Board 17 LED, located in line in the X direction are electrically connected to each other through the connecting components. Therefore, the control circuit excitation can be used for joint excitation LED 16 arranged in a line in the direction of the axis X. LED 16 begin to glow, when the excitation power is supplied to these LED 16 from the circuit pack is Alenia excitation. A predetermined image is displayed on the surface of the liquid crystal display panel 11 through the supply image signals to the liquid crystal panel 11 simultaneously with the illumination of the LED 16. Some part of the light emitted when the LED 16 glow reflected on the diffuser 15a reflective sheet 21. The unevenness is less likely to have formed in the light reflected reflective sheet, as described above, the reflecting sheet 21 is applied without any bend in it, along forming plane directions (directions of X axis and Y axis), together with maintaining a high level of flatness.

Comparative example of a case where there is some bending of the reflecting sheet 21 will be described with reference to Fig. 8. As shown in Fig. 8, in the case of a configuration in which the connecting components 60 are installed on the surfaces 17A installation of light sources, a reflecting sheet 21 sits on top of the connecting components 60 and, in this regard, bent. When in the reflective sheet 21 occurs bend, unevenness is formed in the light reflected reflective sheet 21, which may be non-uniform brightness of the outgoing light emitted from the block 12 of the backlight. In this respect, this version of the implementation makes it possible to prevent such Nera the number brightness, and therefore, makes it possible to provide a favorable display quality in relation to liquid crystal display devices 10 or television receiver TV.

As described above, the block 12 of the backlight according to the present variant implementation is configured so that each Board 17 LED, the connecting component 60 was located on the surface (surface 17B of the mounting of the connecting component), the opposite surfaces 17A installation of light sources, on top of which is placed reflective sheet 21. The configuration for this option implementation makes it possible to avoid interference between the connecting component 60 and the reflecting sheet 21. As a result, bending of the reflecting sheet 21 can be suppressed, which can be suppressed uneven brightness caused by bending. Note that, in order to avoid interference between the reflecting sheet 21 and each of the connecting component 60 also potentially possible configuration, in which through holes are formed at locations on the reflective sheet 21, which correspond to the connecting component 60; and a reflecting sheet is positioned so that the connecting components 60 are passed through these through holes. However, the formation of such through holes in the reflecting sheet 21 leads to the ISM is in light reflectivity in places in which is formed a through hole, which may cause uneven brightness. In this regard, the configuration according to the present variant implementation does not require the formation of through holes used to insert the connecting components, and therefore, negates the possibility of the formation of uneven brightness, being, thus, advantageous.

Additionally, each of the connecting component 60 includes installed on Board connectors 61 and relay components 63. This design provides superior performance, since the electrical connection between the plates 17 of the LED can be mounted by attaching the relay component 63 to the installed on-Board connectors 61. More precisely, it is extremely flexible electric wire 64, is included in the relay component 63, further facilitate the connection of the relay component 63 are installed on the circuit Board connectors 61.

In addition, in the reflective sheet 21, the through holes 21A for light sources that are configured to pass through them LED 16 are formed at the locations corresponding to the respective LED 16 in the top view. This gives you the opportunity to place the reflective sheet 21 over surfaces 17A installation of light sources, not causing interference with the LED 16. Com is inacia this configuration and the above-described configuration, in which the connecting components 60 are located on the surface 17B of the mounting of the connecting component, allows higher reliability to suppress the bending of the reflecting sheet 21.

<the Second is an implementation option>

Next, a second variant implementation of the present invention will be described with reference to Fig. 9, 10, and 20. In the second embodiment described in the materials of the present application, the structure for fixing between the installed on-Board connector and relay component, different from the first version of the implementation. Note that in the second embodiment described in materials of this application, identical symbols are used to denote parts having the same names as in the first embodiment described above, and redundant explanation of the constructions, operations and results omitted.

This version of the implementation applies the configuration, which makes it possible to attach the relay component 163 installed in the card connector 161 outside the bottom plate 14a of the chassis 14. The specific configuration will be described below. On the inner (anterior) surface of the bottom plate 14a of the chassis 14, the part corresponding to the installed on-Board connectors 161, pressed down toward the rear side, which formed part 114A new is OK for connectors. Additionally, on the outer (rear) surface of the bottom plate 14a of the chassis 14, the part corresponding to the part 114A of the recess of the connector is pressed in the forward direction, which formed part 114B of slots for relay components, which can accommodate relay components 163. In other words, the bottom plate 14a, the side facing the connecting components 160, formed in the form of thin sections 114, having a thickness that is set lower than the other parts.

As shown in Fig. 10, each of the thin sections 114, holes 114D to insert passing through from the front side to the rear side, is formed in areas facing to the installed on-Board connectors 161, the upper end portions 161A (part connectors) installed on the respective Board connector 161 is possible to insert into these holes 114D to insert.

As shown in Fig. 20, each of the holes 114D to insert is rectangular in shape, larger than the shape (square shape) of each of the upper end portions 161A, in the top view. Note that, in the top view, the shape of the opening 114D to insert may be essentially the same as that of the upper end portion 161A. In addition, the hole 114D to insert can be formed with a size that enables insertion hole in the tie 114D to insert not only the upper end portion 161A is installed on the motherboard connector 161, but also installed on Board connector 161 entirely.

Electrical connection between adjacent boards of the number of cards 17 LED is created in the above configuration using the following procedure. First of all, the card 17 LED placed in the chassis 14. At this time, the upper end portion 161A installed on Board connectors 161 are inserted into the holes 114D to insert (arrows in Fig. 10). The upper end portion 161A, thus, are arranged so as to protrude from the rear side of the thin section 114, and landing face 161B respective installed on Board connectors 161, thus, are located near the rear side of the chassis 14. Additionally, the fee 17 LED is positioned relative to the forming plane directions (directions of X-axis and Y-axis), by inserting the upper end portions 161A in holes 114D to insert. Subsequently, the fee 17 LED is attached using clamps 23. At the same time, work on fixing Board 17 LED using clamps 23, lightweight, as has already been positioning Board 17 LED towards forming plane directions (X direction and the Y-axis). After payment 17 LED attached to the chassis 14, the relay connectors 165 relay component 163 is adjusted to the respective upper end portions 161A from the back side (outside) of the chassis 14. Board 17S ED, thus, the electrically connect to each other. Additionally, in a state where the relay component 163 is adjusted to the installed on-Board connectors 161, relay component 163 is in part 114B of the recess to the relay component and is protected from the protrusion on the outer surface of the bottom plate 14a of the chassis 14.

This version of the implementation applies the configuration, which makes it possible to attach the relay components 163 to the installed on-Board connectors 161 outside the chassis 14 with the formation of holes 114D to insert in the chassis 14. This configuration gives the possibility to apply a configuration in which the installed on-Board connectors 161 are mounted on the surfaces 17B of the mounting of the connecting components (surfaces facing the bottom plate 14a of the chassis 14), and attach the relay component 163 after Board 17 LED were attached to the chassis 14. Therefore, not necessary to connect the circuit Board 17 LED each other through the relay components 63 to attach the circuit Board 17 LED to the chassis 14, as in the case of the first variant of implementation (refer to Fig. 6). Therefore, the Board 17 LED can be attached to the chassis 14 separately, thereby, easier maintenance (transportation) boards 17 LED, resulting in improved performance.

Additionally, the relay component 163 sconfig the new, to be accommodated in the portion 114B of the recess to the relay component, and therefore, does not act outside of the chassis 14. Thus, relay components can be protected.

<a Third option exercise>

Next will be described a third option of implementing the present invention with reference to Fig. 11. Note that in the third embodiment described in materials of this application, identical symbols are used to denote parts having the same names as in the above embodiments, implementation, and redundant explanation of the constructions, operations and results omitted.

In the second embodiment described above, the parts 161A of the upper ends mounted on the circuit Board connectors 161, given the possibility of inserting into the holes 114D to insert formed in the chassis 14. In contrast, this version of the implementation applies the configuration in which, as shown in Fig. 11, the upper end portion 265A (part of the relay component), protruding toward the front side, is formed on the relay connector 265 and inserted into holes 114D to insert. This configuration enables you to attach the relay component 263 to the installed on-Board connectors 261 by inserting the upper end portions 265A relay component 263 in the open what I 114D to insert on the outside of the chassis 14, after attaching the circuit Board 17 LED to the chassis 14. In addition, in the configuration used in the present embodiment, mounted on Board connectors 261 does not protrude from the chassis 14 to the outside, and placed inside. This configuration enables secure installed on Board connectors 261 even during the operation for mounting the circuit Board 17 LED to the chassis 14 with the use of clamps 23.

<Fourth an implementation option>

Next will be described a fourth variant of implementation of the present invention with reference to Fig. 12. Note that in the fourth embodiment described in materials of this application, identical symbols are used to denote parts having the same names as in the above embodiments, implementation, and redundant explanation of the constructions, operations and results omitted.

In the present embodiment, the relay component 623 is located on the bottom plate 14a of the chassis 14. More precisely, on the bottom plate 14a of the chassis 14, the part facing to the installed on-Board connectors 161, pressed, which formed part 350 of the recess to the connecting component. Relay connectors 265 are mounted on the lower front surface 350A part 350 of the recess to the connecting component. Relay connectors 265, hosted in part 350 of the recess to match the nutrient component, supported by the bottom plate 14a of the back. Landing face 265B of the respective relay connectors 265 are positioned to be adjacent to the landing faces 161B respective installed on Board connectors 161. Additionally, in the direction of the axis Z, the depth Z4 part 350 of the recess to the connecting component is set essentially equal to the value (value obtained by adding the height of Z5 and height Z6 in Fig. 12), obtained by summing the heights of the relay connector 265 and installed on Board connector 161 in a state where these two parts are fitted to each other. Due to this configuration, the attaching boards 17S and 17C LED to the chassis 14 leads to the adjustment of each of the relay connectors 265 and the corresponding one of the installed on-Board connectors 161 to each other. In other words, performance is excellent, since the work of attaching boards 17 LED to the chassis 14 and the electrical contact between the mutually adjacent boards of the number of cards 17 LED to each other are carried out simultaneously.

<Fifth an implementation option>

Next will be described a fifth variant of implementation of the present invention with reference to Fig. 13 and 14. Note that in the fifth embodiment, as described in materials of this application, identical symbols are used to denote parts having the General of the same name, as in the above embodiments, implementation, and redundant explanation of the constructions, operations and results are omitted. Each of the above embodiments employs a configuration in which the card 17 LED connected to each other through the relay components. In contrast, this variant implementation eliminates relay components and applies the configuration in which the electrical connection between the plates 17 LED creates a direct fit to each other are installed on Board connectors 461L and 461R installed on the surfaces 17A installation of the light source circuit Board 17 LED. That is, only two components, which are mounted on circuit Board connector 461L and mounted on circuit Board connector 461R, constitute each of the connecting component. This enables to reduce the number of components of the connecting component and, thus, to reduce the cost. Note that, in the following description, the fee 17C and LED Board 17S LED is taken as an example of mutually adjacent boards of the number of cards 17 LED.

As shown in Fig. 13, mounted on circuit Board connector 461R, mounted on Board 17C LED, is positioned so that its top end portion of the spoke to the Board 17S LED in the direction of the axis X. the Boarding portion 462 obtained as the L-shaped cutout formed (illustrated punchin the th line) on the upper end part of the installed on-Board connector 461R so, in order to comply with the form prescribed by the Board connector 461L Board 17S LED. Additionally, on the bottom plate 14a of the chassis 14, the portion conforming to the on-Board connectors 461L and 461R depressed, thereby, the portion 450 of the recess to the connecting component, which can accommodate the installed on-Board connectors 461L and 461R. Note that, in the Z axis direction, depth Z7 part 450 of the recess to the connecting component is set essentially equal to the height Z8 installed on Board connector 461R. Therefore, the result is a configuration in which, when the Board 17C LED attached to the chassis 14, a rear surface mounted on the circuit Board connector 461R adjacent and supported by the lower outer surface 450A part 450 recesses for connecting the component.

In the above configuration, the electrical connection between the Board 17S and LED Board LED 17C is performed in the following procedure. First of all, the fee 17C LED is attached to the chassis 14. At this time, mounted on circuit Board connector 461R Board 17C LED has a housing portion 462, which is toward the front, and is in a condition ready to fit to the installed on-Board connector 461L. Further, the fee 17S LED is attached to the chassis 14. To move the Board 17S LED, when the Board 17S LED is mounted, mounted on circuit Board connector 461L fit the is to the landing portion 462 is installed on the motherboard connector 461R, which is the host response part. Board 17S and 17C LED due to this are electrically connected. Due to the elimination of the relay components, as described above, the connectors are fitted to each other in only one location in each of the connecting components, which present an implementation option provides better performance than each of the above embodiments, includes relay components. Note that, when installed on Board connectors 461L and 461R adjusted to each other, mounted on circuit Board connector 461R pressed against the rear side mounted on the circuit Board connector 461L. At this time, though the force working in a direction that seeks to remove installed on the Board connector 461R of the Board 17C LED operates because of the fixed Board connector 461L, this version of the implementation enables the lower front surface 450A part 450 recesses for connecting the component to take the above effect, as mounted on circuit Board connector 461R built bottom outer surface 450A. Thus, it is possible to avoid a situation where the installed on-Board connector 461R is separated from the Board 17C LED, which can achieve a high reliability of connection.

<Sixth option implemented the I>

Next will be described a sixth variant of implementation of the present invention with reference to Fig. 15. Note that in the sixth embodiment described in materials of this application, identical symbols are used to denote parts having the same names as in the above embodiments, implementation, and redundant explanation of the constructions, operations and results are omitted. In each of the above embodiments, the circuit 19A transactions connected with chips LED 16A is formed on the surface 17A of the installation of the light sources of each of the circuit boards 17 LED, as shown in Fig. 7. In contrast, this version of the implementation applies the configuration in which the scheme 519B wiring (second wiring)connected with chips LED 16A formed on each surface 517B fastening the connecting component.

As shown in Fig. 15, on the surface 517A installation of light sources, the scheme 519A wiring (first wiring) formed in the part corresponding to each of the chips 16A LED, with an insulating layer inserted between them. Each of the chips 16A and LED scheme 519A wiring electrically connected to each other, for example by soldering. Scheme 519B wiring (second wiring) is stretched on the surface 517B fastening the connecting component in the direction of the axis X with the insulating layer, stable the tion between them, and electrically connected at its opposite ends with the corresponding installed on Board connectors 61. Additionally, the insulating layers are also formed on the rear surfaces of the schemes 519B transaction, due to which, this configuration is used for electrical isolation of the chassis 14 and each of the schemes 519B Postings from each other when the card 17 LED mounted on the bottom plate 14a of the chassis 14. Note that the illustration of the insulating layers provided on the schemes 519A and 519B posting, omitted.

In addition, through holes 517D, passing through the charge 517 LED in the direction from front to back, are formed on the circuit Board 517 LED to match the locations where the generated schema 519A transaction. For example, a conductive paste 518 (third wiring) is inserted into the through hole 517D. Thanks a conductive paste 518, each schema 519A wiring and diagrams 519B posting on the surface 517B fastening the connecting component electrically connected with each other.

Due to the above configuration, this version of the implementation is configured so that electric connection is performed from chips 16A LED to the schemes 519A wiring, a conductive paste 518, schemes 519B transaction, and further to set the on-Board connector 61. Note that the present invention can be applied to a configuration where each SK is m 519A wiring and diagrams 519B wiring electrically connected to each other through the metallic coating of the inner surface of the corresponding one of the through holes 517D (through holes with metal coating) instead of using the conductive paste 518.

In the present embodiment, the schema 519A and 519B wiring formed on two opposite surfaces (517A installation of light sources and surfaces 517B fastening the connecting component) of each of the boards 517 LED. The heat generated from the wiring diagrams, thus, can be increased as compared with the configuration in which the wiring is formed only on one surface. As a result, the chips 16A LED can be protected from heat when excited, thereby, the lifetime can be prolonged.

Schema 519B Postings are located near the bottom plate 14a of the chassis 14. In other words, schema 519B posting are closer to the bottom plate 14a, than schemes 519A transaction. Therefore, schemes 519B posting provides better heat dissipation than the schema-519A wiring due to heat dissipation through the bottom plate 14a. Therefore, the definition of the area of schema 519B posting greater than the area of the scheme 519A posting is more effective. In addition, the chassis 14 is made of metal, and therefore, a higher thermal conductivity than synthetic polymers, or the like. Therefore, heat can be more efficiently emitted outward from the block 12 of the backlight through the scheme 519B wiring and the chassis 14.

<Seventh variant of the implementation of the governance>

Next will be described a seventh variant of implementation of the present invention with reference to Fig. 16. Note that in the seventh embodiment described in materials of this application, identical symbols are used to denote parts having the same names as in the above embodiments, implementation, and redundant explanation of the constructions, operations and results are omitted. In each of the above embodiments, part 50 of the recess configured to accommodate the connecting component 60, formed by the indentation of the bottom plate 14a of the chassis 14. In contrast, this version of the implementation applies the configuration in which the bottom plate 614a, part 650 notch, dent in rear side formed by applying the process of pulling to the side, which is facing to the connecting component 60. As each of the above embodiments has the configuration obtained by determining the dents on the bottom plate 14a, the depth of 50 parts of the grooves is limited by the thickness of the bottom plate 14a. In this respect, the present an implementation option allows you to set the depth part 650 excavation regardless of the thickness of the bottom plate 614a, as part of the notches 50 are formed by applying pulled the I to the bottom plate 14a. Additionally, this version of the implementation has the advantage in terms of cost of manufacture of the chassis 14.

In addition, in the present embodiment, the configuration of each of the LED and configuration of peripheral components (reflecting sheet and the lenses of the lens, which will be described below) LED are different from those in each of the above embodiments. Configuration LED and peripheral component LED will be described below. Each LED 616 in the present embodiment, includes a portion 616b of the base and the upper end portion 616a, which has a hemispherical shape. LED 616 is configured to emit white light by using a combination of LED chip that emits blue light of a single color, and fluorescent material. In addition, the back surface of the base end portion 616b LED 616 soldered to the circuit 19A of the transaction (the illustration of which is omitted in Fig. 16)formed on the circuit Board 17 LED.

Lens 620 diffuser located on the front surfaces of the respective LED 616. Each of the lenses 620 diffuser formed from a transparent element (for example, acrylic or polycarbonate)having a refractive index higher than air. Lens 620 diffuser functions to refraction and, thus, scattering of the light emitted from the LED 616. Lisa diffuser has a circular shape in the top view, and LED 6161 placed in its center. Lens 620 diffuser provided on the circuit Board 17 LED so as to cover the front side of the LED 616. Lens 620 diffuser includes a base portion 620A having the form of a flat plate which is circular in the top view, and a PLANO-spherical portion 620B having flat hemispherical shape. With the periphery of the base portion 620A in the top view, provided by the rack portion 628, such that to speak to the back. Lens 620 diffuser is attached to the circuit Board 17 LED by connecting this rack part 628 Board 17 LED, for example, through the use of adhesives or thermosetting resin.

Lens 620 of the lens has a concave part 620D, having an essentially conical shape, formed on its lower surface, the indentation space located directly above the LED 616, to the front side (upper side in Fig. 16). Lens 620 diffuser also has a concave part 620E, with essentially similar to the stupa shape formed in its upper part. The inner circular surface of the concave part 620E has an arcuate shape in cross section. Due to the above configuration, the light from the LED 616 is reflected at the boundary between the lens 620 diffuser and air with a large angle and scatters around the circumference of the LED 616 (arrow L1 in Fig. 16). Additionally, some hours the b light is reflected at the boundary between the lens 620 diffuser and the air in the concave part 620E (arrow L2 in Fig. 16). The emergence of phenomena, where the top of the head lens 620 diffuser becomes brighter than the surrounding area, thus, can be prevented, thereby suppress the uneven brightness. The light emitted from the LED 616, thus dissipating lens 620 diffuser, thereby hypothetically asking more distance between mutually adjacent LED of the LED 616, decreases the probability of recognition region between adjacent LED as a dark area. Therefore, the total number of LED 616 located on the inner surface of the chassis 14 can be smaller, and you can snizit energy consumption and cost components associated with the LED 616.

In the present embodiment, the reflecting sheet 621 includes a first reflective sheet 622, which almost completely covers the inner surface of the bottom plate 14a and the side plate 14b of the chassis 14, and the second reflective sheet 623, which separately cover the relevant Board 17 LED. The first reflective sheet 622 and the second reflective sheet 623, for example, made of a synthetic polymer, and their surfaces are set with white color, which has excellent reflectivity. This version of the implementation employs a configuration in which, after the second reflecting sheet 623 placed on top surfaces 17A setup and light source circuit Board 17 LED, the first reflective sheet 622 is placed on top of the second reflective sheet 623 from the front side. In the first reflecting sheet 622, while the holes 622A to insert the lens, the diameter of each of which is defined in such a way that allows insertion of the lens 620 diffuser in it, formed at the locations corresponding to the respective lenses 620 diffuser in the top view, part of the second reflective sheet 623 are arranged so as to overlap with the holes 622A to insert the lens in the top view. Additionally, the through-hole 623A for light sources and holes 623b to insert a rack portion formed in the second reflective sheet 623, and each of the through-hole 623A for light sources configured to LED 616 is inserted into it, and each of the holes 623b to insert configured to rack part 628 lens 620 diffuser inserted in it. In addition, in the present embodiment, the connecting components 60 are mounted on the surfaces 17B of the mounting of the connecting component, which provides the possibility to cover the first reflective sheet 622 and the second reflective sheet 623, without causing any bending due to connective components 60.

Next will be described the results obtained by the inclusion in the composition per the CSO reflecting sheet 622 and the second reflecting sheet 623. In the present embodiment, a lens 620 diffuser attached to cards 17 LED, and holes 622A for insertion of the lens used for inserting them in lenses 620 diffuser formed in the first reflective sheet 622. This allows, when the lens 620 diffuser is inserted into the hole 622A to insert the lens, place the lens 620 diffuser in the state of protrusion from the front side of the first reflecting sheet 622, and, at the same time, covering the first reflective sheet 622. In addition, this version of the implementation applies the configuration in which the second reflective sheet 623 is located in areas overlapping with holes 622A to insert the lens in the top view. The adoption of this configuration makes it possible, as to have a configuration that includes a lens 620 of the lens, and having formed holes 622A to insert the lens, and when the light entered in the field corresponding to the holes 622A to insert the lens to reflect the light to the second reflective sheet 623 toward the front side (in particular, the lens 620 diffuser). Therefore, the brightness can be increased in comparison with a configuration that includes only the first reflective sheet 622.

<Eighth an implementation option>

Next will be described an eighth variant of implementation of the present invention with reference to Fig. 18 and 19. About the metim, in the eighth embodiment described in materials of this application, identical symbols are used to denote parts having the same names as in the above embodiments, implementation, and redundant explanation of the constructions, operations and results are omitted. In each of the above embodiments, the charge LED 17C (the second charge of the light sources) is given as an example of "other fees", which electrically connect with - 17S LED (first - light sources), as well as the example shows a configuration in which the connecting component 60 that is configured for electrical connection of these two boards 17 LED to each other, located on the surfaces 17B of the mounting of the connecting component. In contrast, as an example of "the other Board" in the present embodiment, the above fee 717 power. In addition, this version of the implementation applies the configuration in which the connecting component 760 is located on the surfaces 17B of the mounting of the connecting component boards 17 LED, and the connecting component 760 is configured to electrically connect with each other charge 17S LED and charge 717 power.

As shown in Fig. 18, in block 712 illumination in the present embodiment, each of the boards 717 Pete is tion has the form, elongated in the direction of the Y axis, and the corresponding fees 717 power attached to opposite edges of the inner surface of the chassis 14 in the direction of the axis X. the Configuration here is that, by using a power supply, not illustrated, mounted on the respective boards 717 supply, power is supplied to the LED 16 on the boards 17 LED by what power supply are electrically connected through the connecting components 760 boards 17S LED (top circuit Board of the light sources)that are located on respective sides in the direction of the x axis.

As shown in Fig. 19, the connecting component 760 includes installed on the Board connector 61B mounted on the surface 17B of the mounting of the connecting component Board 17S LED mounted on a circuit Board connector 761 mounted on the rear surface 717B Board 717 power, and relay component 763 for the electrical connections installed on Board connector 761 and installed on Board connector 61B each other. Relay component 763 includes electrical wires 764 and relay connectors 765 and 766. Each of the electric wires 764, for example, obtained by coating a conductive wire made of a metal material, such as copper, flexible coating material, such as polyvinyl chloride. Relay connectors 765 and 766 are connected with Jimi ends of the electric wire 764. While mounted on circuit Board connector 61B and the relay connector 766 can be adjusted to each other, can also be adjusted to each other mounted on circuit Board connector 761 and relay connector 765. This leads to a configuration in which the electrical connection between the Board 717 and power - 17S LED is created by fitting installed on Board connectors 61B and 761 of the respective relay connectors 765 and 766.

As shown in Fig. 19, part 750 recess configured to accommodate the connecting component 760, formed by pressing into place on the inner surface of the bottom plate 14a (lower part) of the chassis 14, which is directed to the connecting component 760. In this configuration, while the connecting component 760 is located on the surface 17B of the mounting of the connecting component (surface, which is facing toward the bottom plate 14a of the chassis 14) of the card 17S LED Board 17S LED and charge 717 supply can be installed on the bottom plate 14a, without causing interference between the connecting component 760 and the bottom plate 14a. In the present embodiment, the lower part 21B of the reflection sheet 21 is positioned to fit over surfaces 17A installation of the light source circuit boards 17S LED and parts of the front surface of the circuit Board 717 power.

As described to enter the, in the present embodiment, a part of the connecting component 760 (installed on Board connector 61B) for electrical connection between the card 17S and LED Board 717 power with each other, is located on the surface 17B of the mounting of the connecting component Board 17S LED, and the connecting component 760 is located on the side surface 17B of the mounting of the connecting component. The surface on which is deposited a reflective sheet 21, therefore, forms a flat surface on the periphery of the location, which are connected to each other fee 17S LED and charge 717 power. The reflecting sheet 21 thus can be protected from bending at the location, which are connected to each other fee 17S LED and charge 717 power, which can be prevented uneven brightness caused by the bend.

Note that any of these configurations (such as configuration, with part of the relay component passing through the opening for insertion and configuration, from which the relay component excluded), as described in the second through sixth embodiments, the implementation of the above can also be applied to the connecting component 760, shown as an example in the present embodiment, which connects with each other charge 17S LED and charge 717 power. Since the work and the results in case the application of this configuration are the same as in the case of a connecting component that connects with each other LED Board, their explanation is omitted.

<Other embodiments of>

The present invention is not limited to the implementation described in the above description and figures, and, for example, the following implementation options are also included in the technical scope of the present invention.

(1) Although each of the relay components in the above embodiments, the implementation includes electrical wires and relay connectors, the present invention is not limited to this configuration. Apply any relay component for electrical connection of the installed on-Board connectors with each other.

(2) Although each of the connecting component 60 in the above embodiments, the implement is configured for connecting circuit boards 17 LED, which are mutually adjacent in the X direction, the present invention is not limited to this configuration. The connecting component 60 can be configured to connect circuit boards 17 LED, which are mutually adjacent in the direction of the axis Y. alternatively, the connecting component 60 can be configured to connect LED boards that are mutually adjacent on the chassis 14.

(3) the Second and third embodiments of adopt a configuration in Kotor is th after as holes 114D to insert formed in positions corresponding to the installed on-Board connectors 161 or relay connectors 265, connections are made between the installed on-Board connectors and relay connectors. However, for example, can be applied to another configuration in which the insert aperture 70 formed on the bottom plate 14a of the chassis 14 at a location corresponding to each of the connecting components 160 in General, as shown in Fig. 17.

(4) the Above embodiments of adopt a configuration in which only the blocks 40 of the light source, which has five LED 16 installed in them, are used in combination for forming the LED array 16. However, for example, another possible configuration in which the blocks of the source light of two or more different types, which differ by the number of LED 16 installed in them, can be used in combination.

(5) Although the LED 16 that includes a blue light-emitting chip 16A LED and a fluorescent material, is shown as an example in the above embodiments, the implementation, the present invention is not limited to this. For example, the LED 16 can be LED that emits white light by including in its composition a blue light emitting LED chip, a red light emitting LED chip and a fluorescent material that has a peak Svetova what about the radiation in the green region. In the alternative, the LED 16 can be configured to emit white light by including in its composition a blue light-emitting chip, a red light-emitting chip and the green light-emitting chip. Alternatively, the LED can be configured to include ultraviolet (UV, UV) light-emitting LED chip and a fluorescent material. As an example, a fluorescent material, in this case, can be described fluorescent material that has a light emission peaks in the blue, green and red areas. Alternatively, the LED can be configured to include LED three kinds in combination, each of which emits light of a single color of R (red), G (green) and B (blue).

(6) Configuration that is applied to the diffuser 15a and the optical sheet 15b, may be different from those described in the above embodiments, and can be modified if necessary. More precisely, the number of diffusers 15a and the number of optical sheets 15b, as well as their types, if necessary, can be modified. Can be used a plurality of optical sheets 15b of the same species.

(7) Although the configuration with LED 16, arranged in the form of a two-dimensional array inside the chassis 14, is shown as an example in the above is the variants of implementation, may be applied a configuration in which the LED 16 are arranged in a line. More accurately, another configuration that has LED to 16, located in a line only in the vertical direction or arranged in line in the horizontal direction only, included in the present invention.

(8) Although the configuration in which the LED 16 are used as light sources, shown as an example in the above embodiments, implementation, can be applied to another configuration, which uses a light source that is different from the LED.

(9) a Configuration in which the chassis 14 is located with the direction along the short sides are aligned with the vertical direction is shown as an example in the above-described variants of implementation. However, can be applied to another configuration, in which the chassis 14 is located with the direction along its long sides are aligned with the vertical direction.

(10) Although the shape of the through hole 21A for light sources is set to all in the top view in the above embodiments, the implementation, the present invention is not limited to this. The shape of the through hole 21A for light sources can be of any shape as long as she provides the LED 16 can pass through the hole, and may have a non-circular shape that matches the shape of the ED 16. For example, when the LED 16 has a rectangular shape in the top view, the through hole 21A for light sources, respectively, may have a rectangular shape in the top view.

(11) the First version of the implementation described above employs a configuration in which, after the through hole 17D is formed in the circuit Board 17 LED, the electrical connection between the connector 61 on the side of the Board and circuit 19A wiring is installed through the metal coating 18 by applying metal coating 18 on this through hole 17D. Can be used and an alternative configuration in which the electrical connection between the connector 61 on the side of the Board and circuit 19A of the transaction is set via a conductive paste, as shown in the sixth embodiment, moreover, this conductive paste is inserted into the through hole 17D instead of the metallic coating 18.

(12) the Seventh variant of the implementation described above employs a configuration in which part 650 excavation, embedded in the rear side, is formed on the bottom plate 614a chassis 14 by applying a pull to the location in it, facing to the connecting component 60. This configuration is also applicable to the bottom plate 14a in the first to sixth embodiments, the implementation described above.

(13) Configuration that includes a lens 620 RA is saivites, covers LED 616, shown as an example in the seventh embodiment described above. Each of the first to sixth embodiments and the eighth variant implementation, described above, may also be configured to have a lens 620 diffuser so that they cover the LED 16. In addition, the reflecting sheet 621 configured to include two reflective sheet 622 and 623 by the inclusion in the composition of the lens 620 diffuser. This configuration is also applicable to the first to the sixth variation of the implementation and the eighth variant of the implementation described above.

(14) Although the TFT used as a switching component liquid crystal display device in the above embodiments, the implementation, the present invention is also applicable to the liquid crystal display device using switching components (for example, a thin-film diode (TFD)), which differs from the TFT, and also the invention is applicable to a liquid crystal display device is not suitable for a color display, such as liquid crystal display, which displays a monochrome image.

(15) Although the chassis 14 is made of metal in the above-described variants of implementation, the chassis 14, for example, can be made from a synthetic polymer. So the m way the chassis 14 can be made lighter in weight and less costly.

(16) Although the LCD device 10 of the display using the liquid crystal panel 11 described as an example of a component displayed in the above embodiments, the implementation, the present invention is also applicable to a display device using the display component of another type.

(17) Although the television receiver TV including a TV tuner, is given as an example in the above embodiments, the implementation, the present invention is also applicable to the display device, which does not include a tuner.

(18) In the second embodiment described above, in an example configuration in which the hole 114D to insert configured for insertion therein of the upper end portion 161A is installed on the motherboard connector 161 has an essentially square shape in the top view. The shape of the opening 114D to insert can be any form as long as she allows to insert the top end portion 161A of the connector. For example, as shown in Fig. 21, each through hole (through hole 214D) may have an essentially circular shape in the top view. Alternatively, as shown in Fig. 22, each through hole (through hole 314D) may have the ü essentially triangular shape in the top view.

(19) Although this Board 17C LED or pay-717 power is given as an example of "the other Board", which is different from the first circuit Board of the light sources in the above-described variants of implementation, the present invention is not limited to this. Any fee that has electrically connected with the first - light sources through the connecting component, applicable as other fees.

LEGEND

10: Liquid crystal display device (display device)

11: Liquid crystal panel (display panel)

12: backlight Unit (lighting device)

14: Chassis (element mounting boards)

14a: the bottom plate (the bottom portion of the element mounting boards)

16: LED (light source)

17, 17S, 517: Charge LED (the first charge of the light sources)

17C: Charge LED (the second charge of the light sources, other fees)

17A, 517A: the mounting Surface of the light sources (the surface having the light sources installed on it)

17B, 517B: Surface mount connection of the component

21: Reflective sheet

60: connecting the component

61, 161, 261, 461: Mounted on circuit Board connector

63, 163, 263: relay component

70, 114D, 214D, 314D: Hole insertion

114B: part of the recess to the relay component

161A: the Upper end part (part of connector)

265A: the Upper end part (the part is unctuous component)

518: Conductive paste (third post)

519A: wiring (first wiring)

519B: drawing wiring (second wiring)

717: Board power supply (other fees)

TV: Television receiver

1. Lighting device containing
many sources of light,
first charge of the light sources, which is equipped with light sources,
another card,
the element mounting boards, is attached to both of the first Board of the light sources and the other card
the connecting component electrically connecting the first charge of the light sources and a different card to each other, and
reflective sheet placed on the installation surface of the first Board of light sources, which is an installation surface on which the light sources
in this case coupling component attached to the mounting surfaces of the connecting component first Board of the light source opposite to the surface on which the superimposed reflective sheet.

2. The lighting device according to claim 1, in which the connecting component includes
installed on-Board connectors mounted on the first circuit Board of the light sources and the other Board, respectively, and
relay component, electrically connected with the corresponding installed on-Board connectors.

3. The lighting device according to claim 2, inwhich
the relay component is located on the element mounting boards so as to be converted to the installed on-Board connectors, and
when installed on Board connectors and relay components are connected with each other along with fixing the first Board of the light sources to the element mounting boards.

4. The lighting device according to any one of claim 2 and 3, in which the fastening element circuit Board has a hole for inserting in its lower part, the opposite is installed on the motherboard connector, through which the relay component or mounted on circuit Board connector and a part of the relay component or part is installed on the motherboard connector is inserted into it.

5. The lighting device according to claim 4, in which the hole for the insert has an essentially square shape in the top view.

6. The lighting device according to claim 4, in which the hole for the insert has an essentially circular shape in the top view.

7. The lighting device according to claim 4, in which the hole for the insert has an essentially triangular shape in the top view.

8. The lighting device according to claim 4, in which the relay component is placed in recess to the relay component formed by pressing the outer surface of the lower portion of the element mounting boards.

9. The lighting device according to any one of claim 2, 3, 5, 6, 7 and 8, in which Rel is any component includes an electric wire and relay connectors, connected to ends of electric wires, respectively, and adjusted to the appropriate installed on-Board connectors.

10. The lighting device according to any one of claims 1, 2, 3, 5, 6, 7 and 8, in which the first charge of the light sources includes
the first wiring located on the surface, on which the light sources, and electrically connected to the light sources,
a second wiring that is located on the mounting surfaces of the connecting component and electrically connected to the connecting component, and
a third wiring electrically connecting the first wiring and the second wiring to each other.

11. The lighting device according to any one of claims 1, 2, 3, 5, 6, 7 and 8, in which the reflecting sheet has a through hole for light sources, through which the respective light sources, and through holes for light sources are formed at the locations corresponding to the respective light sources in the top view.

12. The lighting device according to any one of claims 1, 2, 3, 5, 6, 7 and 8, in which another fee is the second - light sources, on which the light sources.

13. The lighting device according to any one of claims 1, 2, 3, 5, 6, 7 and 8, in which another fee is a payment power supply used to supply power to the light sources.

14. Light up is a recreational device according to any one of claims 1, 2, 3, 5, 6, 7 and 8, in which the light sources are light emitting diodes.

15. The lighting device 14, in which each of the light emitting diode includes a blue light emitting chip and a fluorescent material having a peak of light emission in the yellow region, and configured to emit white light.

16. The lighting device 14, in which each of the light emitting diode includes a blue light emitting chip and a fluorescent material having a peak of light emission in the green and red regions, and configured to emit white light.

17. The lighting device 14, in which each of the light emitting diode includes a blue light-emitting chip, a red light-emitting chip and a fluorescent material having a peak of light emission in the green region, and configured to emit white light.

18. The lighting device 14, in which each of the light emitting diode includes a blue light-emitting chip, a red light-emitting chip and the green light-emitting chip, and configured to emit white light.

19. The lighting device 14, in which each of light emitting diodes includes an ultraviolet light-emitting chip and a fluorescent material, and configured to emit white light is.

20. The lighting device 14, in which each of light emitting diodes includes an ultraviolet light-emitting chip and a fluorescent material having a peak of light emission in the blue, green and red regions, and configured to emit white light.

21. A display device that contains
the lighting device according to any one of claims 1 to 20 and
a display panel configured to perform display by using light emitted from the lighting device.

22. The display device according to item 21, in which the display panel is a liquid crystal panel using liquid crystals.

23. Television receiver containing the display device according to item 21 or 22.



 

Same patents:

FIELD: physics.

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EFFECT: improved uniformity of the amount of light from the backlight unit.

21 cl, 39 dwg

FIELD: electricity.

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FIELD: electricity.

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FIELD: physics.

SUBSTANCE: liquid crystal display device includes a first polariser, a second polariser facing the first polariser, a liquid crystal display panel provided between the first polariser and the second polariser, and a first phase plate and a second phase plate provided between the first or second polariser and the liquid crystal display panel. The display panel has a pair of substrates and a liquid crystal layer placed between the pair of substrates, which includes homogeneously aligned liquid crystal molecules. The phase plate includes a liquid crystal film placed in a position where the nematic liquid crystal is hybrid-aligned. Phase difference in the perpendicular direction of the element situated between the first and second polarisers, excluding the liquid crystal layer and the first phase plate, is 120 nm or greater.

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19 cl, 116 dwg

FIELD: physics.

SUBSTANCE: method of modulating optical radiation involves transmitting natural visible light in the wavelength range 350-850 nm at an angle of 5-75°, between the direction of the light and the perpendicular to the surface of the working optical element made from n layers of manganite A1-xBxMnO3 (where n≥1), wherein the trivalent rare-earth metal A is partially substituted with a univalent or divalent metal B with degree of substitution x. Visible light transmitted through and reflected from the working element is modulated under the effect of a control external magnetic field in which is located the working optical element, having giant visible light magnetotransmission and magnetoreflection effect.

EFFECT: wider range of methods of modulating optical radiation, simple design.

2 cl, 3 dwg

FIELD: electricity.

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12 cl, 27 dwg

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9 cl, 15 dwg

FIELD: electricity.

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32 cl, 29 dwg

FIELD: electricity.

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19 cl, 12 dwg

FIELD: electricity.

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36 cl, 29 dwg

FIELD: information technology.

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13 cl, 21 dwg

FIELD: electricity.

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12 cl, 27 dwg

FIELD: physics.

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14 cl, 14 dwg

FIELD: information technology.

SUBSTANCE: disclosed liquid crystal display device has a liquid crystal panel having a rectangular shape; a frame lying on the back side of the liquid crystal panel; and a front panel lying on the front side of the liquid crystal panel; where the liquid crystal panel is held between the frame and the front panel. The peripheral part of at least one side of the liquid crystal panel is connected by a flexible mounting pad to a printed-circuit board. At least part of the printed-circuit board is held on the outer side surface of the frame by the board clamp mounted on the outer side surface of the frame. The board clamp includes a main body part in form of a plate facing the outer side surface of the frame and a part for engaging the front side and a part of parts for engaging the back side. A receiving part for the front panel is formed in the vicinity of parts for engaging the front side, which is capable for coming into contact with part of the peripheral part of the front panel.

EFFECT: providing a board clamp which can be mounted more stably and a liquid crystal display device having a printed-circuit board held by the board clamp in a specified position on the outer side surface of the frame.

10 cl, 6 dwg

FIELD: physics.

SUBSTANCE: optically controlled device has: an optically transparent first base having at least a curved first base surface; a conducting layer lying next to the curved first base surface of the first base; an aligning polarisation layer lying next to the conducting layer; an optically transparent second base, having at least a curved first base surface and a layer of liquid crystal material between the aligning polarisation layer and the curved first base surface of the second base. The aligning polarisation layer contains an aligned chromone material, which additionally contains at least one pleochroic dye. The curved first base surface of the first base and the curved first base surface of the second base are interfaced with each other such that a cavity is formed in between them; and the layer of liquid crystal material is in contact with the aligning polarisation layer.

EFFECT: easier production of a self-darkening filter.

26 cl, 9 dwg

FIELD: physics.

SUBSTANCE: disclosed liquid crystal display has: a liquid crystal display component which includes a liquid crystal display panel; a light source unit which has a light source and lies behind the liquid crystal display component; a first circuit for controlling the liquid crystal display component and/or a second circuit for controlling the light source unit lie in a region whose boundary is defined by (i) the plane of the front surface of the liquid crystal display component, and (ii) the plane of the back surface of the light source unit. The light source unit provides backlighting of the liquid crystal display panel, and the front surface of the liquid crystal display component is parallel to the vertical plane. The first circuit and/or second circuit lie in a region located under the light source unit such that they touch the housing of the light source which is included in the light source unit.

EFFECT: design of a liquid crystal display and a liquid crystal display device which enable to cut power consumption and have a smaller depth size.

13 cl, 19 dwg

FIELD: electrical engineering.

SUBSTANCE: lighting device contains a highlighting unit 12 with cold cathode (CC) lamps 18 positioned inside the inverter board (20) mounting rack and transmissive connectors 21. The inverter boards 20 are placed on the mounting rack 14 side opposed to the CC lamp 18. Each inverter board 20 is intended for supply of excitation voltage to the CC lamps 18. The transmissive connectors 21 are installed on the mounting rack 14 and are intended for transmission of power supply from the inverter boards 20 to the CC lamps 18. Each inverter board 20 is linked to a transmissive connector 21 so that to enable detachment in one direction along the board surface. Installed on the mounting rack 14 side are the interlocking parts 35 and 36 projecting above the basic surface BS in the direction of the inverter board 20 butt-end parts 20e - 20g. Each of the interlocking parts 35 and 36 passes from one edge of the butt-end part 20e, 20f or 20g to the other edge. A gap C is arranged between the basic surface BS and each inverter board 20 that is overlapped by the interlocking parts 35 and 36.

EFFECT: reliability improvement.

40 cl, 27 dwg

Display // 2473939

FIELD: physics.

SUBSTANCE: display 1 comprises case 4 composed of front unit 41 to house LC panel 2 and rear unit to house back-lit unit 3. Circumferential surface of front unit 41 covers that of rear unit 42. Moving parts (411a, 412a, 413a, 414a) are secured to circumferential surface of front unit 41. Said parts feature hinges to allow them to turn relative to fixed parts (411b, 412b, 413b, 414b).

EFFECT: ease of handling and servicing.

6 cl, 10 dwg

FIELD: instrument making.

SUBSTANCE: invention relates to facilities for assembly of display devices and is aimed at reduction of mechanical stresses, which are applied to assembly structures, when a clamping accessory is exposed to thermal expansion or compression, which is provided due to the fact that a display device, for instance, a liquid-crystal one, comprises a plate capable of light transmission, a clamping accessory formed as frame-shaped, with multiple extended parts, stretching along edges of the plate, and multiple connection parts that connected extended parts, besides, the clamping accessory retains the plate edges. There is also a base, on which a clamping accessory is installed, assembly structures designed on connection parts of the clamping accessory and base to retain the clamping accessory, and the base in a condition, in which the clamping accessory is installed on the base. There are structures provided to allow for displacement on connection parts of extended parts and connection parts, to provide for the possibility of movements of extended parts relative to connection parts along the extension direction, in which extended parts stretch. Besides, structures of displacement allowance include the first fastening parts designed on connection parts, and the second fastening parts, designed on extended parts so that each first fastening part and each second fastening part are fixed to each other with a gap between the first fastening part and the second fastening part in direction of extension.

EFFECT: improvement of a device.

25 cl, 21 dwg

Display device // 2468402

FIELD: physics.

SUBSTANCE: invention describes a display device, having: a display panel for displaying images; a heat source lying on the lateral side of the display panel on at least one side of the display panel; a heat absorption section for absorbing heat released by the heat source; a back surface plate lying on the side of the back surface of the display panel and made of metal, a front surface plate lying on the side of the front surface of the display panel and made of metal; and a middle frame lying between the front surface plate and the heat absorption section, wherein part of the back surface plate is in thermal contact with the heat absorption section.

EFFECT: wider field of use of the device.

6 cl, 12 dwg

FIELD: electrical engineering.

SUBSTANCE: lighting device contains a highlighting unit 12 with cold cathode (CC) lamps 18 positioned inside the inverter board (20) mounting rack and transmissive connectors 21. The inverter boards 20 are placed on the mounting rack 14 side opposed to the CC lamp 18. Each inverter board 20 is intended for supply of excitation voltage to the CC lamps 18. The transmissive connectors 21 are installed on the mounting rack 14 and are intended for transmission of power supply from the inverter boards 20 to the CC lamps 18. Each inverter board 20 is linked to a transmissive connector 21 so that to enable detachment in one direction along the board surface. Installed on the mounting rack 14 side are the interlocking parts 35 and 36 projecting above the basic surface BS in the direction of the inverter board 20 butt-end parts 20e - 20g. Each of the interlocking parts 35 and 36 passes from one edge of the butt-end part 20e, 20f or 20g to the other edge. A gap C is arranged between the basic surface BS and each inverter board 20 that is overlapped by the interlocking parts 35 and 36.

EFFECT: reliability improvement.

40 cl, 27 dwg

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