Silicone rubber material for soft lithography

FIELD: chemistry.

SUBSTANCE: invention relates to silicon rubber-like materials suitable for use in soft lithography. Disclosed is method of making a patterned stamp layer containing a silicone rubber-like material having Young's modulus in the range of from 7 MPa to 80 MPa, said method involving preparing a composition containing at least one functional T-branched and/or Q-branched polysiloxane precursor; adding at least one functional linear polysiloxane to said composition; holding said composition on a standard matrix pattern at a temperature below 100°C until formation of a stamp layer having said pattern in said silicone rubber-like material; and removing the stamp layer from the standard pattern. The invention also discloses a patterned stamp layer made using the disclosed method and a printing device having said patterned stamp layer.

EFFECT: stamp layer made using the disclosed method provides stable image elements, having dimensions in the nanometre range, obtained on a substrate, and also provides matching on uneven and curved surfaces of the substrate.

10 cl, 2 dwg, 1 tbl

 

The technical FIELD TO WHICH the INVENTION RELATES.

The present invention relates to silicone kauchukopodobnoe material and the layer of the stamp containing such material, for use in soft lithography. The present invention also relates to methods of producing silicon kauchukopodobnoe material and to its use in lithographic methods and devices.

BACKGROUND of INVENTION

In recent years there has been developed the technology to create structures with micron size for use in electrical, optical and photonic fields. This technology can be based on the formation and contact printing, called together by soft lithography.

Soft lithography typically uses a device that generates an image, such as a stamp containing the carrying surface, have a well-defined embossed pattern. At the conformal contact between the carrying surface of the stamp and substrate are formed of the structure and elements of the image.

To obtain large areas of the image using the techniques of soft lithography is critical that there is no deformation of the template when the stamp. Also critical is the fact that the stamp was consistent with the variation of flatness or roughness of the surface. Features m the material of the stamp are, thus, of particular importance and can be critical.

Usually the materials used stamp include polydimethylsiloxane (PDMS) containing materials, such as Dow Cornings Sylgard 184. Despite the fact that such materials are able to establish a reproducible conformal contact with the substrate, they are subject to problems associated with the deformations imposed pressure, while providing a very small picture elements of the template in the nanometer range, for example, in the range of less than 100 nm. In addition, traditional PDMS materials are susceptible to rounding sharp corners due to surface tension, especially when there are image elements is less than 100 nm.

One way of increasing the stability of the materials of the stamp is the increase of young's modulus, i.e. the modulus of elasticity of the material. However, the increase of young's modulus can lead to the fact that the material becomes too hard, resulting in poor adhesion to the rough and non-planar surfaces. However, soft lithography is limited by the resolution of the material used stamp, and to imprint a large area, the material has a young's modulus high enough to obtain a stable image elements of very small size, but at the same time the material must be soft to obespechitelnymi contact with uneven and neploscostnykh substrates.

WO 2007/121006 considers compositions and methods that can be used to produce forms with a low thermal deformation. The compositions contain vulkanizasiya silicone elastomeric composition formed using a polymer with remote volatile and at least one cross-linking agent with remote flying. In one embodiment, the silicone composition comprises a silicone resin and an organosilicon compound having on average at least two associated with the silicon atom of hydrogen molecule and a catalytic amount of a hydrosilation catalyst.

The disadvantage of using the silicone resin in carrying layers for lithographic purposes is that the resins are glassy with glass transition temperatures in the range from room temperature to 300 to 400°C. the young's Modulus of such polymeric materials is very high (above 100-200 MPa)that can prevent conformal contact, because the stamp cannot follow the unevenness of the substrate micron or even nanometer size. Causing the imprint layer forms a hard material, and removing the stamp requires a lot of effort. This leads to the fact that the forces acting on the elements forming the image in the stamp and image elements of the printout, become very high, which may give damage ..... the PA and/or elements of the image of the fingerprint.

Accordingly, in the technique there is a need of creation of the material used in the printed lithographs large surfaces, which specified the material is able to create templates structures of nanometric level, with high fidelity and good mechanical strength while maintaining good conformal contact on uneven or non-planar surfaces of the substrate.

BRIEF description of the INVENTION

The aim of the present invention is at least partially overcome the above problems and satisfying the needs of technology.

In particular, the aim of the present invention is to provide a material suitable for use in lithographic method, which material has a young's modulus that provides printing image elements in the nanometer range, but at the same time provide conformal contact on rough and non-planar substrates.

Thus, in the first aspect of the present invention relates to silicone kauchukopodobnoe material containing at least one T branched and/or Q branched (poly)siloxane precursor, stitched, at least one linear polysiloxane, where specified material has a young's modulus in the range from 7 MPA to 80 MPa.

The material according to the present invention I have provided is flexible and easy to co-ordinate with a wide range of substrates. In addition, it is less susceptible to deformation caused by polymerization and vulcanization in the manufacturing process. It is therefore suitable for use in the construction of the stamp and devices imaging to obtain a lithographic images.

Silicone koutsokoumnis material has a young's modulus in the range from 7 MPa to 80 MPa. This makes the material in a deformable and minimizes distortion of the embossed pattern that can occur during the formation of conformal contact between the surface of the stamp and the surface of the substrate.

Accordingly, a stable and reproducible image elements in the nanometer range, even below 10 nm can be obtained on the surface of the substrate regardless of whether the surface is flat or uneven.

In a second aspect the present invention relates to the printer, has a layer with a stamp containing silicone koutsokoumnis material according to the present invention. Printing device can be used, for example, in lithographic method.

Printing device can be as simple as a layer of a stamp containing the pattern elements form the image.

Alternatively, the printing device may be a device having means to control the layer of the stamp p. the relation to the substrate, you want to ensure the printing template image elements. Such a device is a device that generates an image that can be used for use in soft lithography. This allows you to use the device forming the image in a controlled way, contributes to the formation of conformal contact over large areas of the surface of the substrate and improves the fidelity of the image on the surface of the substrate. Accordingly, the overall efficiency and energy consumption of the method of image formation is improved.

Printing device according to the present invention provides minor image elements on the surface of the substrate without damage or deterioration of the thus formed image elements.

In another aspect the present invention provides a method of obtaining silicon kauchukopodobnoe material having a young's modulus in the range from 7 MPa to 80 MPA. moreover, this method contains:

- providing compositions containing at least one functional T branched and/or Q branched (poly)siloxane precursor,

- the introduction of at least one functional linear polysiloxane in the specified composition,

- maintaining the specified composition at a lower temperature is 100°C to implement-linkage specified, at least one functional T branched and/or Q branched (poly)siloxane precursor specified, at least one functional linear polysiloxane.

This method ensures the implementation of the high degree of crosslinking of the T-branched (poly)siloxane precursor to obtaining the result in the silicone mesh structure having elastic chain. Therefore, it may be obtained selikonovoy koutsokoumnis material having a young's modulus in the range from 7 MPa to 80 MPa, even when exposure occurs at a very low temperature exposure, for example, below 100°C.

In embodiments, the method comprises a stage of placing the template in silicon kauchukopodobnoe material. Preferably, the template represents a relief pattern having elements forming images with their smallest transverse dimensions smaller than 300 nm. Even more preferably, they are smaller than 200 nm. Most preferably, the dimensions are smaller than 100 or 50 nm.

Specified is usually carried out at a speed of composition at the stage (s) in the template reference matrix with the receiving layer of the stamp containing the pattern elements form the image.

Preferably, the composition is maintained at a temperature below 50°C.

The method according to the present invention has the advantage that the since it does not require high temperature exposure, i.e. temperatures curing. Therefore, it is possible to avoid the disadvantages associated with high temperature exposure. For example, high temperature exposure can result in thermal mismatch between the material of the reference pattern and the material of the stamp. Specified due to the large increase tension in the process of heating and cooling can lead to crack formation and destruction of elements of the image.

The method according to the present invention has the advantage that it is relatively simple, inexpensive and has a high reproducibility, which makes it suitable for mass production. Educated so that layers of the stamp can be used in several types of designs stamps or devices forming the image.

The term "T-branched"are used to determine the functional T branched polysiloxane precursor of this application, means that the precursor has at least one silicon atom attached to three (poly)siloxane chains. Preferably, the silicon atom chemically bound oxygen of each of the (poly)siloxane chains.

The term "Q-branched"are used to determine the functional Q-branched polysiloxane precursor of this application, means that predshestvennica there, at least one silicon atom attached to four (poly)siloxane chains. Preferably, the silicon atom chemically bound oxygen of each of the (poly)siloxane chains.

The term "functional"is used to determine the functional T branched or functional Q-branched polysiloxane precursor of this application, means that the precursor has at least one chemical group, or a Deputy, who is capable of chemical reaction under conditions of exposure in order to create the stitching with a linear polysiloxane.

In one embodiment, at least one silicon atom bears a functional group.

In another embodiment, at least one of the three (T-branched) or four (Q-branched) polysiloxanes circuits shall be at least one and, preferably, a single functional group. In yet another embodiment, all three (T-branched) or four (Q-branched) polysiloxane chain branched predecessor are at least one and, preferably, a single functional group.

The functional group may be any functional groups that are able to create a chemical reaction and, thus, the stitching between the functional T branched and/or Q-branched polysiloxane precursor is a linear polysiloxane.

In one embodiment, the functional group is in the form of vinyl groups.

In embodiments of the invention, at least one functional T branched and/or Q-branched polysiloxane precursor selected from the group consisting of gidrirovannogo T branched and/or Q-branched polysiloxane precursor, vinylnaphthalene T branched and/or Q-branched polysiloxane precursor and/or mixtures thereof.

Vinyl and/or hydride functionality improves and regulates the degree of crosslinking and gives silicone mesh structure. The so formed material is an elastomeric silicone koutsokoumnis material that has a young's modulus in the range from 7 MPa to 80 MPa.

To further increase the degree of crosslinking of at least one functional linear polysiloxane selected from the group consisting of gidrirovannogo linear polysiloxane, vinylnaphthalene linear polysiloxane and mixtures thereof.

In preferred embodiments, at least one vinylnaphthalene linear polysiloxane is at least 5% vinylnorbornene. The percentage is interpreted as the value, which means that 30% of the silicon atoms in a linear siloxane should be gitignore clonally (the same applies to vinylnaphthalene the silicon atoms).

Functional vinyl groups of the linear polysiloxane (polysiloxanes) interact with functional T branched and/or Q-branched polysiloxane precursor (precursor), which provides a greater degree of crosslinking, resulting in silicone koutsokoumnis material having a young's modulus in the range of from 7-80 MPa.

In other preferred embodiments, at least one gerentonlgy linear polysiloxane is at least 30% hydrideforming.

In embodiments, the ratio gidrirovannogo linear polysiloxane functional linear polysiloxane is in the range from 2:10 to 8:10.

Regulation of the proportions hydride and/or vinylnaphthalene T branched and/or Q-branched polysiloxane precursor (predecessors) and linear polysiloxanes, respectively, it is possible to vary the degree of crosslinking. This is an advantage, since the young's modulus thus obtained silicone kauchukopodobnoe material can be adjusted to the desired value. The degree of crosslinking and hence the young's modulus can therefore be regulated precisely.

In still another aspect, the present invention relates to the use of silicone kauchukopodobnoe material according to the above or obtained by the above method as a layer of the stamp for lithographic methods.

These and other aspects of the invention will be apparent and explained with reference to variant (variants), described below.

BRIEF DESCRIPTION of DRAWINGS

Figure 1 shows the diagram of the printing device in the form of a layer of a stamp according to the present invention.

Figure 2 presents the scheme of the construction of a stamp containing layer of the stamp according to the present invention.

DETAILED description of the INVENTION

The present invention relates to silicone kauchukopodobnoe material containing at least one T branched and/or Q branched (poly)siloxane precursor made of at least one linear polysiloxane, where specified material has a young's modulus in the range from 7 MPa to 80 MPa.

As used here, the term "T-branched (poly)-siloxane precursor" refers to a silicone material containing the grid of oligosiloxane, in which one or more silicon atoms linked to at least three oxygen atoms with other atoms of silicon. The term "Q branched (poly)siloxane precursor" refers to a silicone material containing the grid of oligosiloxane, in which one or more silicon atoms linked, at least four oxygen atoms other silicon atoms.

T-branched (poly)siloxane of predestiny is able to form a circuit with 3-way branching, i.e. grid, cross-linking of linear polysiloxane usually linear PDMS chains. Similarly, Q branched (poly)siloxane precursor can form a circuit with 4-way branching, i.e. grid, cross-linking of linear polysiloxane usually linear PDMS chains.

The resulting silicone koutsokoumnis material according to the present invention easily forms a conformal contact with a wide range of substrates, including silicon-containing materials, glass and plastics. Thus, the material is well-suited for use in the construction of dies or devices forming the image, to obtain a lithographic images.

Silicone koutsokoumnis material has a young's modulus in the range from 7 MPa to 80 MPa.

From here the material is deformable, and when used in soft lithography, he has the ability to enter into conformal contact with both flat and uneven surfaces. In addition, it provides a stable and reproducible image elements having dimensions in the nanometer range, even below 10 nm, on the surface of the substrate.

Therefore, it is possible to avoid problems with rounding a sharp corner, as is the case with traditional PDMS materials.

When used in stamp lithography is critical is about, the material of the stamp has the ability to significantly deform (e.g., in the range of 2-100%), but returns to original shape when stress is removed. Silicone koutsokoumnis material according to the present invention has the specified property. Despite the fact that it has a high young's modulus, it avoids the shortcomings of hard and glass-like materials, which can show creep and permanent deformation, when the effort. The material according to the present invention has kauchukopodobnoe behavior and is able to vulcanizates of fluid in the rubber at room temperature or at temperatures which uses ready-made stamp.

In addition, the deformability of the material minimizes the distortion of the embossed pattern that can occur during the formation of conformal contact between the stamp and substrate, and also provides a more accurate copy of the image elements. Hence silicone koutsokoumnis material of the invention has the ability to provide a stable image elements without the formation of creep.

Silicone koutsokoumnis material according to the present invention is typically used above its glass transition temperature.

In a preferred embodiment, the present invention relates to the printer having the layer ..... the PA 100, containing the above-mentioned silicone koutsokoumnis material, for use in lithographic method, shown in figure 1.

The layer of the stamp 100 contains a lot of relief elements imaging 101, separated by many carved parcel 102. The surface layer of the stamp forming the image, also has a large number of contact surfaces 103 placed in contact with the surface of the substrate 104. Relief elements forming the image can have any desired shape. The smallest width of the embossed elements forming the image in the stamp may have dimensions in the range of 300, 200, 100, 50, and/or 25 nm.

Module silicon kauchukopodobnoe material is in the range from 7 to 80 MPa. If the module is below 7 MPa, for example, below 5 MPa, it is impossible to form the elements forming images having sizes below 300 nm. On the other hand, if the modulus is too high, for example above 80 MPa, conformal contact may be degraded because the stamp cannot follow the unevenness of micron and nanometer size. This leads to high local stress, which can damage the stamp and image elements.

The young's modulus in the range from 7 to 80 MPa allows you to create a stable image elements having high fidelity and sizes in the interval is from 10 nm to more than 1 mm.

Stable elements of the image are obtained when the energy is increased by reducing the surface area is lower than the energy required permanent deformation of the material of the stamp.

The layer of the stamp 100 typically has a thickness in the range of 10-100 μm. The thickness of the layer forming the image 100, preferably not more than 100 μm, because this can lead to high bending stiffness, giving the deterioration in conformal contact. On the contrary, if the layer of the stamp 100 is too thin, for example, when used in multilayer design of the stamp, it may be exposed to the next layer of the stamp, which usually has a low modulus. For example, if the layer is too thin, present dust particles can break high modulus silicone koutsokoumnis material (which has reduced the value of the shift to fracture compared to industrial PDMS).

Accordingly, the present invention can be obtained very small picture elements on the surface of the substrate 104 without damage or deterioration molded so that image elements.

Typically, the distance between one element in the formation of the image 101 and the other, i.e. the width of the cut out section 102 is at least 6 nm, for example, in the range of 6-10 nm. Such nebolsine areas require low deformation elements forming the image in contact with the substrate, and high modulus is required to increase energy for the release of elements forming the image again.

If the distance between one element in the formation of the image 101 and the other is too wide, the stamps can be destroyed by contact with the surface of the substrate. On the other hand, if the elements of the image-forming layer 101 of the stamp 100 are located close to each other, narrow structures tend to stick together upon contact with the surface of the substrate 104 (they tend to stick together even when judged from the reference template).

The contact surface 103 of the layer of the stamp 100 is formed in close contact with the surface of the substrate 104, regardless of whether the surface is flat or uneven. No problems with the destruction of the stamp and/or destruction of elements of the image.

Relief elements forming the image 101 are usually placed in the lines having a width of, for example, 3-30 nm, the layer of the stamp 100.

In embodiments of the invention the layer of the stamp can be used in the design of the stamp 200 shown in figure 2.

Printing device 200 includes a layer of stamp 201 containing silicone koutsokoumnis material according to the present invention. The layer of the stamp 201 contains many elements forming the image 202 and the many carved sections 203 between no and, as well as the contact surface 204, which form a conformal contact with the substrate material.

Printing device 200 further contains a deformable layer 205, typically formed from PDMS-like material having a low young's modulus. Low modulus of the deformable layer 204 allows a layer of the stamp 201 to deform and be consistent with irregular and non-planar surfaces without increasing pressure on the imaging surface layer 201.

Printing device 200 may also contain supporting layer 206, which is much more rigid than the deformable and forming the image layers. Specified bearing layer may be a thin glass sheet, which prevents the deformation of the deformable layers 201 and 205. Alternatively, it may be a thin plastic or metal sheets.

Despite the fact that the layer of the stamp 201 containing silicone koutsokoumnis material according to the present invention has a high modulus, for example, 80 MPa, the stamp still provides good conformal contact with the surface of the substrate.

Accordingly, in embodiments, the present invention additionally provides for the printing device 200 to the printing method, containing the first deformable layer 205, which is a layer of the stamp 201, and the specified layer of the stamp 201 contains forces which conomy koutsokoumnis material, having the young's modulus of 7 MPa to 80 MPa, where the specified image forming surface layer 201 is designed to transfer the lithographic image on the surface of the substrate.

The printing method may be a method of microcontact printing, in which the pasta of any type of material first applied to the stamp, then stamp is brought into contact with the substrate in order to transfer at least part of the applied paste from the stamp to the substrate. Such pastes may, for example, to include (but not limited to) curable materials, substances forming the monolayer, proteins or any other biological material. Alternatively, a printing method may be the method of application of the imprint or emboss. The relief image is then transferred to the substrate by providing a substrate material stamping, which receives a complementary relief structure, when the relief structure of the stamp is brought into contact with it. After curing or hardening of this material stamping printing device is then removed from the surface, leaving it a relief structure, which is a complementary structure on a printing device. This stage can be a part of a lithographic method, using other stages, such as etching of any kind.

In vari is ntah the present invention also provides a method of obtaining silicon kauchukopodobnoe material, having young's modulus in the range from 7 MPa to 80 MPa, and the method includes:

- providing compositions containing at least one T branched and/or Q branched (poly)siloxane precursor,

- introduction to the specified composition, of at least one functional linear polysiloxane, extract the specified composition at a temperature below 100°C.

The chemical reaction taking place in the process of aging, preferably, provides chemical linking between at least one of the T-branched and/or Q branched (poly)siloxane precursor and at least one functional linear polysiloxane to such an extent that the obtained silicon lattice structure, which has elastic siliconsamurai chain.

The term "exposure" must be interpreted as meaning: providing a mixture of time for the chemical reaction of its components, in particular, at least one of the T-branched and/or Q branched (poly)siloxane precursor and at least one functional linear polysiloxane. The exposure time or working time, i.e. the time from the beginning of mixing stitched composition before reaching the point of gelation is usually in the range from 5 to 30 minutes, However, there may be another p the work station of a restorer time depending on the conditions of the exposure period.

In embodiments, the method comprises a stage of placing the template in silicon kauchukopodobnoe material. This template may be placed any suitable technology of image formation, for example, by etching or punching on the reference matrix.

Preferably, the template is placed at the exposure of the composition at the stage (s) in the template reference matrix with the receiving layer of the stamp containing the pattern elements form the image.

Silicone koutsokoumnis material is moulded on the pattern of the reference matrix, i.e. the reference material that contains many of the cuts that define the pattern of the reference matrix, and a layer of the stamp, which is complementary to the matrix, is then released and removed from the matrix. Usually the material is maintained on the matrix until the morning. The material can, optionally, pottergate for about 2-5 days (48-120 h), depending on the desired hardness of the material. The material becomes more rigid with time.

Optional, can be entered one or more curing catalysts, for example, platinum (Pt) catalyst. Also may not necessarily be present cyclic modulator for platinum.

Preferably, the composition is maintained at a temperature below 50°C.

It is highly desirable to avoid the disadvantages associated with high temperature exposure. E.g. the measures during curing of compositions containing conventional silicone resins having a high glass transition temperature, typically require high temperature curing (in the range from 150°C to 400°C). For some reason this is undesirable. Thermal mismatch between the matrix, usually templated silica or quartz is so high that in the process of heating and cooling between the stamp and the matrix grow large voltage. This can lead to crack formation and damage to the elements forming the image. The coefficient of thermal expansion of the silicone resin is typically one to two orders of magnitude higher (linear CTE ~100 h/m*K-1)than that of the materials used, on which is printed the final image elements (e.g., silicon, quartz). The regulation mismatch value is therefore extremely difficult.

Preferably, at least one functional T branched (poly)siloxane selected from the group consisting of gidrirovannogo T-branched (poly)siloxane precursor, vinylnaphthalene T-branched (poly)siloxane precursor, or mixtures thereof. This T-branched (poly)siloxane precursor can be represented by the following formula:

Vinylnaphthalene Q-branched (left) and

T-OSVETLENIE (right) (poly)siloxane precursor

(component 1)(part 2)

Gerentonlgy Q branched (poly)siloxane precursor (HTS)

In the compounds of formula 1 and formula gidrirovannogo T-branched (poly)siloxane precursor of the three lines extending from the lowest two Si atoms, show that these Si atoms are each connected with three polysiloxane chains, when the Si atom is far to the right in the specified connection. To eliminate doubt these lines do not show the ethylene chemical bond.

Optional available Q - or T-branched siloxanes may include Si-OH group, as shown in the figure Q - branched siloxanes. These Si-OH groups can be adverse, because they increase the surface tension and are reactionary in relation to the other Si-OH groups that are present on silicon or glass. Si-OH-groups may optionally interact with silanes, such monochloroethane, attach inert or functional groups. Inert methyl group can be attached is in the introduction of Cl-Si-(CH 3)3in the connection and ensuring that this interaction in the formation of HCl, which is removed from the siloxane mixture. The functional group may be vinyl groups (for example, Cl-Si-(CH3)2-CH=CH2and will increase the reactivity siloxane in the grid and to provide additional stitching. Other functional groups that may be attached, may be fluorine (Cl-Si-(CH3)2-CH2CH2CF3), which will reduce the surface tension.

Vinyl and/or hydride functionality provide a functional T - or Q branched (poly)siloxane precursor ability to form branched chain silicone mesh structure.

Preferably, the functional T or Q branched (poly)siloxane and functional linear polysiloxane (polysiloxane) are miscible in any proportion. T - or Q branched (poly)siloxanes containing large and bulky organic group, for example, fenilmetilovy T - or Q branched (poly)siloxane, are usually poorly miscible with linear methylsiloxane. Improved Miscibility provides materials with the effect of the invention. In addition, modifications with large groups can lead to the worst mechanical properties and bolivia.com surface tension. This is unfavorable because a small image elements, thus, tend more easily to stick together.

However, in preferred embodiments, at least one functional T - or Q branched (poly)siloxane is a T or Q branched (poly)methylsiloxane.

When used vinylnaphthalene Q branched (poly)siloxane component 1, can be entered monochloroethane with the passivation of the Si-OH group or modifications to the system with feromonami groups.

For additional branching functional T - or Q-branched polysiloxane precursor, at least one functional linear polysiloxane is selected from the group consisting of gidrirovannogo linear polysiloxane, vinylnaphthalene linear polysiloxane or mixtures thereof. Such linear polysiloxane can be represented as follows:

Vinylnaphthalene linear (VL) PDMSGerentonlgy linear (HL) PDMS

The ratio of m to n vinylnaphthalene PDMS is usually located in INTA the shaft from 20:1 to 10:1, for example, from 13:1 to 11:1. Molecular weight is in the range from 800 to 40000 Yes, for example, from 1,000 to 30,000 Da.

The ratio of m to n gidrirovannogo PDMS is usually in the range from 1:4 to 1:1. Molecular weight is in the range from 800 to 40000 Yes, for example, from 1,000 to 30,000 Da, preferably from 1000 to 20000 Da.

In preferred embodiments, at least one vinylnaphthalene linear polysiloxane is 5% vinylnaphthalene. Usually vinylnaphthalene linear polysiloxane is 6-8% vinylnaphthalene.

When used hydrideforming linear polysiloxane, they are at least 30% gidrogeologii, for example, 30-50% gidrogeologii, in relation to the silicon atoms in the precursor. These intervals provide a material with a high degree of crosslinking and silicone koutsokoumnis material, suitable for use in soft lithography.

Accordingly, the proportion of the vinyl and hydride parts as functional T branched (poly)siloxane precursors and linear polysiloxanes may be different and, thus, also the degree of crosslinking. This allows you to adjust the modulus of the material to the desired value, usually from 7 MPa to 80 MPa.

Preferably, the ratio gidrirovannogo linear floor is of siloxane to vinylnaphthalene linear polysiloxane is in the range from 2:10 to 8:10, preferably, in the range from 5:10 to 6:10.

Accordingly, silicone koutsokoumnis material having a high modulus, even at such low temperature curing, as 50°C.

The table below shows the adjustability of the module when receiving silicone kauchukopodobnoe material according to the present invention by combining different parts vinylene and gidrirovannogo T-branched (poly)siloxa-new predecessor and polysiloxanes, respectively.

Uriroot young's modulus
The vinyl part I (VL)The vinyl part IIHydrideThe young's modulus (MPa)
Component 1Component 2HL 30%HL 50%HTS
1,70,5the 5.7
1,7 0,37,4
1,70,255,11
1,40,30,6212
1,30,40,6221
10,50,724 16,1
10,50,5821,3
1of 0.6250,65a 21.5
1of 0.6250,58540,5
1of 0.6250,53636,5
1of 0.6250,81328,5
1of 0.6250,58559,8
10,1250,3750,4516,3
10,7060,55380,0
10.800 to0,58580,0
All parts are parts by weight.
The curing temperature of 50°C

Since the layers of the stamp may be obtained from the matrix template, it is very suitable for mass production. In addition, it is a relatively simple, inexpensive and has a high reproducibility. Thus obtained image forming layers can be used in several types of designs stamp or the imaging device is.

Silicone koutsokoumnis material according to the present invention can be used in several applications such as soft lithography in General, for example, lithography application prints vasodila lithography, microcontact printing, etc.

Examples of printing devices are well described in the variants WO 2003/099463, US 2004/0197712, US 2004/0011231 and previously unpublished applications international patent IB 2007/054888, the contents of which are cited as references. Specialists in the art will find in these references for a detailed description of how to get the device application fingerprinting, which uses elastic stamp or printing device with silicone koutsokoumnis material according to the present invention. Such a device will be able to create a small image elements on a substrate using printing, microcontact printing methods of printing prints or drawing lithographic prints that are described in the indicated references.

Although the present invention is shown and described in detail in the drawings and the above description that such showing and description should be considered illustrative or exemplary, but not restrictive; the invention is not considered limited options.

Other variations are considered VA is Ianto can be understood and implemented by experts in the field of technology in the implementation of patentable inventions based on the study of the drawings, description and appended claims. For example, silicone koutsokoumnis material or the layer of the stamp are not limited to the individual design of the stamp, but can be used in any type of stamp or printing device.

In the claims, any reference symbols, placed between parentheses shall not be construed as limiting the claims. The expression "comprising" does not exclude the presence of elements or steps, other than those outlined in the claims. The word "a" or "an"preceding an element does not exclude the presence of many such elements. In the device listing multiple values, some of these values may refer to the same item of equipment. The fact that some measures are related difference in the dependent claims does not indicate that the combination of these measures cannot be used with advantage.

1. The method of forming the image receiving layer of the stamp containing silicone koutsokoumnis material having a young's modulus in the range from 7 MPa to 80 MPa, and the method includes:
- providing compositions containing at least one functional T branched and/or Q-branched polysiloxane precursor, wherein said functional T is the run siloxane precursor has at least one silicon atom, attached to the three (poly)siloxane chain through an oxygen atom to each of the (poly)siloxane chains, and the specified functional Q-branched polysiloxane precursor has at least one silicon atom attached to four (poly)siloxane chain through an oxygen atom to each of the (poly)siloxane chains, and in which at least one functional T branched and/or Q-branched polysiloxane precursor selected from the group consisting of gidrirovannogo T-branched (poly)siloxane precursor, vinylnaphthalene T-branched (poly)siloxane precursor and mixtures and/or in which at least one functional Q branched (poly)siloxane precursor selected from the group consisting of gidrirovannogo Q branched (poly)siloxane precursor, vinylnaphthalene Q branched (poly)siloxane precursor and mixtures thereof;
- introduction to the specified composition, of at least one functional linear polysiloxane, wherein said at least one functional linear polysiloxane is a mixture of getreferencevalue linear polysiloxane and wikifunctions linear polysiloxane;
- the shutter speed specified composition on the template, the reference matrix at a temperature below 100°C. before the formation of the layer of the stamp, containing the specified pattern in the specified silicone kauchukopodobnoe material; and
the release layer of the stamp from the reference template.

2. The method according to claim 1, in which stage of placing the template in the specified silicone kauchukopodobnoe material is carried out at the implementation stage extracts the template reference matrix with the receiving layer of the stamp (100; 201), containing the pattern elements forming the image (101; 202).

3. The method according to claim 1, in which the above composition is maintained at a temperature below 50°C.

4. The method according to claim 1, wherein said at least one vinylnaphthalene linear polysiloxane is at least 5% vinylnaphthalene.

5. The method according to claim 1, wherein said at least one gerentonlgy linear polysiloxane is at least 30% hydrideforming.

6. The method according to any one of claims 1 to 5, in which gerentonlgy linear polysiloxane and vinylnaphthalene linear polysiloxane are used in a ratio in the range from 2:10 to 8:10.

7. Forming the image layer of the stamp obtained by the method according to any one of claims 1 to 6.

8. Forming the image layer of the stamp according to claim 7, in which the imaging layer of the stamp is suitable for use in lithographic method of obtaining fingerprints.

9. Printing the e device containing the imaging layer of the stamp (100; 201) according to claim 7 or 8, and the layer of the stamp contains silicone koutsokoumnis material containing at least one T branched and/or Q branched (poly)siloxane, sewn, at least one linear polysiloxane, where specified material has a young's modulus in the range from 7 MPa to 80 MPa.

10. Printing device according to claim 9, in which the layer of the stamp contains the pattern elements forming the image (101; 202).



 

Same patents:

FIELD: chemistry.

SUBSTANCE: invention relates to rubber-technical, tyre, footwear industry and other fields of technology, in particular, to rubber mixtures based on diene and ethylenepropylene elastomers, filled with silica white or its combination with technical carbon. Rubber mixture includes diene or ethylenepropylene caoutchouc, silica white with caoutchouc interaction promoter. As promoter mixture contains two-component composition. First component of composition - alkoxysilane, contains unsaturated hydrocarbon substituent at silicon atom, selected from group-gamma- methacryloxypropyl-trimethoxysilane and vinyl trimethoxysilane in quantity 1-6 wt.fr. per 100 wt.fr. of caoutchouc. Second component of composition is polyorganosiloxane with content of hydridesilane groups -1.0-1.7% and is selected from group methylhydridesiloxane and methyl(methyloctyl)hydridesiloxane in quantity 1.0-2.2 wt.fr per 100 wt.fr. of caoutchouc.

EFFECT: invention makes it possible to improve properties of rubber mixture and its vulcanisers, as well as to increase temperature of mixture preparation above 150°C without risk of scorching.

5 tbl, 5 ex

FIELD: chemistry.

SUBSTANCE: method of making moulded articles from vulcanised silicone involves a step for continuous moulding of a mixture which contains linear polyorganosiloxane, having at least three alkenyl groups and average number of diorganosiloxane links, determined by gel-permeation chromatography with polystyrene as the standard, of at least 3000, polyorganosiloxane which contains at least two SiH groups and a transition metal-based photoactivated catalyst, and an irradiation step for photoactivation of the catalyst.

EFFECT: invention provides a sufficient rate of vulcanisation and good mechanical properties at room temperatures.

25 cl, 1 tbl, 8 ex

FIELD: chemistry.

SUBSTANCE: invention relates to a curable composition which forms an organosilicon gel containing at least one (A) organopolysiloxane containing at least two alkenyl groups per molecular which are bonded through a silicon atom, and having viscosity from approximately 10 to approximately 1000000 cP at 25°C. (B) at least one organohydrogenpolysiloxane containing at least two hydrogen atoms per molecule which are bonded through a silicon atom, where said organohydrogenpolysiloxane (B) is used in such an amount that molar ratio of total number of hydrogen atoms bonded through a silicon atom contained in the organohydrogenpolysiloxane (B) to one alkenyl group bonded through a silicon atom contained in the organopolysiloxane (A) ranges from approximately 0.20 to approximately 0.79, (C) filler in amount ranging from approximately 25 to approximately 100 parts per hundred parts of organopolysiloxane (A), (D) a catalyst and (E) an inhibitor, where the restoration time of said curable composition which forms a hysteretic organosilicon gel which is longer than approximately 3 seconds. The invention also relates to a hand held device which has an outer surface, at least part of which contains a hysteretic organosilicon gel. The hand held device is a writing device, a shaver, a toothbrush, a utensil, sports equipment, an instrument, a motor-driven device or steering wheel.

EFFECT: obtaining an organosilicon gel with improved hysteresis.

25 cl, 1 tbl

FIELD: chemistry.

SUBSTANCE: disclosed is a method of producing functional polyorganosiloxanes through polycondensation of organoalkoxysilanes in an active medium which is an anhydrous carboxylic acid or mixture thereof with an organic solvent, where said organoalkoxysilanes are selected from R'CH3Si(OR)2; R"Si(OR)3; R"2Si(OR)2 and R'n(CH3)3-nSiOR, where R denotes CH3 or C2H5; R' - CH2=CH- or H; R" - C6H5 or CH2=CH- or CH3; n equal 0 and/or 1; where the starting organoalkoxysilanes are selected in a way which enables to obtain in one production cycle functional polyorganosiloxanes of given structures from: (A) - containing an average of at least two vinyl groups for each macromolecule; (B) containing an average of at least two hydride silyl groups for each macromolecule. Disclosed also is a curable composition based on functional polyorganosiloxanes obtained using the disclosed method.

EFFECT: method enables to obtain polyorganosiloxanes with reproducible composition and molecular weight and the obtained composition can be used to encapsulate light-emitting devices.

21 cl, 5 dwg, 6 ex

FIELD: chemistry.

SUBSTANCE: invention relates to processing polyvinyl chloride through dispersion, particularly to production of highly filled adhesive plastisols used in making protective coatings in motor-car construction, as anticorrosion protection of inner surfaces of metal structures. The method of producing highly filled plastisol based on polyvinyl chloride involves successive addition and mixture in a mixer of di(2-ethylhexyl)phthalate, triethylene glycol dimethacrylate, isopropylbenzene hydroperoxide, half of the given amount of kaolin, calcium strearate, polyvinyl chloride and the remaining amount of kaolin. Aliphatic silicon acrylate, diatomite and NGZ-4 phosphate hydraulic fluid are added before adding polyvinyl chloride, and after adding the remaining amount of kaolin, a polysulphide oligomer - liquid thiocol II with weight ratio of SH groups of 1.7-2.6% and molecular weight of 2100 is added.

EFFECT: high degree of restoration of the thixotropic structure, extrusion, fire resistance and tensile strength of the polyvinyl chloride plastisol and the hardened material.

1 tbl

FIELD: chemistry.

SUBSTANCE: invention relates to silicon composite materials obtained from a polyaddition reaction. The silicon composite material, which has high adhesion and is obtained from polydimethylsiloxane with terminal vinyl groups of general formula (CH2=CH)(CH3)2Si-[O-Si(CH3)2-]nO-Si(CH3)2(CH=CH2), (n=1280-1300, weight ratio of vinyl groups equals 0.08 wt %, dynamic viscosity equals 92822-93000 cP), contains at least 40 pts. wt organosilicon resin of general formula {[(CH3)3 SiO1/2]x[SiO2]1[(CH3)2SiO]y[CH3VinSiO]z} (x=0.9-1.2; y=0-0.4; z=0.1-0.4), and an adhesion-enhancing additive in form of 5-25 pts. wt halloysite per 100 pts. wt polymer. The method is relevant for filling compounds, sealing and damping coatings and other possible applications.

EFFECT: higher adhesion power of silicon composite materials obtained from a polyaddition reaction.

1 cl, 6 ex

FIELD: chemistry.

SUBSTANCE: invention relates to functional polyorganosiloxanes included in compositions suitable for producing optical materials. The invention discloses novel functional polyorganosiloxanes containing two or more vinyl groups on average per macromolecule, the average composition of which includes several building blocks whose structure and quantitative ratio are expressed by general formula (R23SiO1/2)a-(C6H5)2SiO2/2)b(R1SiO3/2)c-(C6H5SiO3/2)d-(R1R'2SiO2/2)e (I), where R1 - CH2=CH-; R2 - CH3- or C6H5-; denotation from a to e represent molar ratios of links, the sum of which is equal to 1, and their values are: a=0.15-0.4; b=0.1-0.2; c=0.15-0.4; d=0.2-0.4; e=0-0.2. Disclosed also is a curable organosilicon composition which contains: functional polyorganosiloxane from the family of polyorganosiloxanes of formula (I); polyorganohydride siloxane containing two or more hydrogen atoms bonded to silicon atoms in each molecule and a hydrosilation catalyst. The refraction index of the cross linked product is equal to or greater than 1.5. The composition is meant for encapsulating light-emitting devices.

EFFECT: disclosed functional polyorganosiloxanes are suitable for preparing curable compositions used for encapsulating optical devices, compared to existing encapsulants, the solidification products have better properties, specifically high refraction index, thermal- and weather resistance.

15 cl, 2 tbl, 3 dwg, 4 ex

FIELD: chemistry.

SUBSTANCE: inventions refer to medical materials and can be used for polymer materials for soft contact lenses (SCL) of prolonged wearing. Engineering problem is development of polymer composition in the form of interpenetrating grids for SCL of prolonged wearing, possessing oxygen barrier property, hydrophilic properties, mechanical strength and optical transparency in both hydrated and dehydrated state, as well as development of simplified, efficient production method not requiring large quantity of highly toxic organic solvents. Offered are polymer composition representing bi-phase silicone-hydrogel material in the form of sequential interpenetrating grids consisting of cross-linked polysiloxane that is reaction product of vinyl-containing and hydro-containing oligosiloxane, and hydrophilic polymer that is cross-linked polyvinyl alcohol, and production method thereof including synthesis of cross-linked polysiloxane; polysiloxane saturation with monomeric mixture containing vinylacetate, cross-linking monomer and radical polymerisation initiator; copolymerisation of vinylacetate and cross-linking monomer, alcoholysis of cross-linked polyvinylacetate and production of silicone-hydrogel polysiloxane - polyvinyl alcohol.

EFFECT: production of polymer composition in the form of interpenetrating grids for SCL of prolonged wearing, possessing oxygen barrier property, hydrophilic properties, mechanical strength and optical transparency, and development of simplified, efficient production method not requiring large quantity of highly toxic organic solvents.

6 cl, 1 tbl, 9 ex

FIELD: polymer materials.

SUBSTANCE: composition represents biphasic silicone-hydrogel material in the form of in series arranged interpenetrating lattices consisting of cross-linked (i) polysiloxane, which is reaction product of vinyl-containing component including oligosiloxane/polysiloxane mixture and hydride-containing component, which is oligomer, and (ii) hydrophilic polymer, which is cross-linked (co)polymer of N-vinylpyrrolidone, 2-hydroxyethyl methacrylate, acrylamide, and dimethylacrylamide.

EFFECT: improved performance characteristics of polymer composition and simplified method for preparation thereof.

2 tbl, 11 ex

FIELD: chemistry.

SUBSTANCE: invention relates to radioelectronic engineering, particularly to producing polymer compositions for absorbing high-frequency energy in microwave devices, e.g. in amplifiers of compensation channels of radar stations. The polymer composition for absorbing high-frequency energy contains a polymer - low-molecular weight dimethylsiloxane synthetic rubber SKTN, a cold curing catalyst No68 and absorbent filler - pigment aluminium powder.

EFFECT: invention provides improved absorption properties with low thickness of the absorbent layer in a wide temperature range and high humidity.

2 tbl, 3 ex

FIELD: chemistry.

SUBSTANCE: polymer composition contains low-molecular weight dimethylsiloxane rubber STKN as a base, a cold curing catalyst K-68, radio carbonyl iron P-10 as absorbing filler, additionally a solution of high-molecular weight rubber SKT in liquid polymethylsiloxane and tetraethoxysilane or derivatives thereof, as well as polyethylene polyamine as a curing rate controller. When producing the polymer composition, carbonyl iron is first bound with low-molecular weight rubber SKTN in a mixture with derivatives of tetraethoxysilane and liquid polymethylsiloxane (component A). The mixture (component A) is held for at least 24 hours. The rubber SKT is bound with another portion of the liquid polymethylsiloxane and tetraethoxysilane derivatives (component B) and also held for 24 hours. Component A and component B are mixed with each other immediately before adding the catalyst. The amount of catalyst K-68 or mixture thereof with polyethylene polyamine determines the overall rate of cure and controlled time of loss of fluidity of the composition.

EFFECT: obtaining a polymer composition with absorbent properties with small layer thickness, having sufficient strength and elasticity of the vulcanisate in a wide temperature range, shorter curing time and enabling control of the rate of cure.

2 cl, 4 tbl, 5 ex

FIELD: chemistry.

SUBSTANCE: invention relates to fire-retardant silicone coatings meant for fireproofing cable factories having metal structures, ventilation ducts, including at atomic power plants and thermal power plants, as well as fire-resistant and moisture-protective finishing of industrial and building structures, including at atomic power plants and thermal power plants. The coating is obtained from a surface-bulk cold-setting composition which contains low-molecular weight siloxane rubber, low-molecular weight silanes, dibutyltin diacetate, ammonium polyphosphate and technical pentaerythritol, glased at defined ratios. The composition is prepared by bulk mixing of ingredients and is characterised by that the mixing process is supplemented with forced rubbing of granular ingredients in liquid siloxane rubber in a closed container with working volume ranging from 0.1 to 0.5 m3. Rubbing is carried out between movable blades and fixed legs, wherein the movable blades forcefully inject the composition into a grinding zone, thereby causing heating of the working mixture of the composition.

EFFECT: invention provides efficient fireproofing and corrosion protection of materials.

2 cl, 1 tbl, 3 ex

FIELD: chemistry.

SUBSTANCE: by increasing resistance to inflammation in combustion conditions, the electrically insulating material, which is obtained from additive vulcanisation silicone rubber, simultaneously contains vinyl and hydride-containing siloxanes, a cyano-containing organophosphorus compound in amount of 40-70 pts.wt and/or modified aluminium hydroxide in amount of 10-150 pts.wt per 100 pts.wt polyorganosiloxane, filler materials and polymers with block trimethyl-containing siloxane links that are cross-linked under the action of a platinum catalyst, wherein the latter is added to the rubber mixture before use thereof. The siloxane rubber can further contain powdered quartz in amount of 10-40 pts.wt per 100 pts.wt polyorganosiloxane.

EFFECT: high resistance of the electrically insulating material to inflammation in combustion conditions.

3 cl, 3 ex

FIELD: chemistry.

SUBSTANCE: invention relates to chemical industry and production of fire-resistant materials. The composition contains liquid low-molecular weight siloxane rubber, ethyl silicate-40, tetrabutoxytitanium, boric acid and cobalt phthalocyanine.

EFFECT: invention increases fire resistance and wear resistance of coated material, provides a place for connecting components made from said material with resistance to an open flame, high strength and elasticity for a long period of time.

1 tbl

Rubber mixture // 2488614

FIELD: chemistry.

SUBSTANCE: invention relates to production of rubber mixtures based on silicone rubber. Disclosed is a rubber mixture based on silicone rubber, containing highly active filler, an organic peroxide and dimethyl siloxanediol as an anti-texturing agent which contains silanediol groups, said dimethyl siloxanediol being obtained by hydrolysis in the medium of an alkali acceptor of a product of reaction of a depolymerisate or hydrolysate with sodium hydroxide in a ratio which defines content of silanediol groups in the range of 8-12%, in the presence of isopropyl alcohol and water.

EFFECT: high stability of processing and physical-mechanical properties of rubber mixtures for up to 10 months.

1 cl, 2 tbl, 5 ex

Hardening mixture // 2487149

FIELD: chemistry.

SUBSTANCE: hardening mixture for vulcanising materials based on liquid siloxane rubber consists of two prepared and separately stored components (component No1 and component No2) which are joined when mixed before adding to the siloxane material to be hardened; component No1 contains ethyl silicate, an organic tin salt and polyethylene polyamine; component No2 contains polymethylsiloxane, active silicon dioxide and organochlorosilane.

EFFECT: obtaining a strong and elastic vulcanisate while cutting duration of the vulcanisation process.

2 cl, 4 tbl, 22 ex

FIELD: chemistry.

SUBSTANCE: invention relates to chemistry, particularly single-component sealants with microbiological protection, and can be widely used in various engineering fields and construction as a protective coating and for sanitary and hygienic purposes in buildings and other places with high humidity. The bactericidal organosilicon sealant contains low molecular weight siloxane rubber, aerosil, liquid fraction C14-C17 paraffin, methyl triacetoxy silane, tin dibutyl dilaurate and a biocidal additive.

EFFECT: providing microbiological protection in high humidity conditions, during prolonged storage of the composition and preservation of its properties at high temperatures.

2 cl, 2 tbl

FIELD: chemistry.

SUBSTANCE: invention relates to structural components. Disclosed is a structural block having at least two components joined to each other by a silicone rubber composition, which is obtained by hardening a mixture of at least one polydiorganosiloxane with terminal silanol groups; at least one cross-linking agent for polydiorganosiloxanes with terminal silanol groups; at least one cross-linking reaction catalyst; zinc oxide for fast setting in bulk, having mean particle size of 50-70 nm, in amount of 1-60 wt % of the total weight of the composition; and, optionally, additional components.

EFFECT: disclosed composition for joining components of the structural block is capable of fast hardening in bulk, is suitable for use as a window sealant, in making such structural components as window modules, door units, building glazing, for use in curtain walls and so forth.

25 cl, 5 dwg, 7 tbl, 2 ex

Coating composition // 2481368

FIELD: chemistry.

SUBSTANCE: invention relates to a coating composition, a coating which contains such a composition, an article and a method of coating a substrate. The coating composition contains a copolymer obtained from a reaction mixture containing: ethylenically unsaturated hydrolysable silane, ethylenically unsaturated polyoxyalkylene, ethylenically unsaturated fluorinated polyether, an initiator and a chain-transfer agent. The coating contains a curable sol-gel dispersion and a coating composition. The article has a substrate and a cured coating on at least one surface of the substrate, where the cured coating is a curable composition which contains a curable sol-gel dispersion and a coating composition. The method of coating the substrate comprises steps of: providing a substrate, providing a curable coating composition which contains a curable sol-gel dispersion and a coating composition, applying a coating from the curable coating composition on at least part of the substrate and curing the coating.

EFFECT: obtaining a coated substrate which provides low surface energy to make cleaning easier, having low degree of picking up cleaning waste.

26 cl, 12 tbl, 50 ex

FIELD: physics.

SUBSTANCE: invention pertains to a printing matrix engraved by a laser, used for obtaining a relief image using known methods. Description is given of the printing matrix engraved by a laser, obtained through photocuring a compound on a photosensitive resin base (a), consisting of a polymerised unsaturated group and which has an average molecular mass between 1000 to 20 x 104, an organic compound (b), with a polymerised unsaturated group and average molecular mass less than 1000 and an organic silicon compound (c), with at least, one Si-O bond and not containing a polymerised unsaturated group. Content of the organic silicon compound (c), lies in the range from 0.1 to 10 % of the mass of the compound on the photosensitive resin base. Description is given of obtaining the printing matrix engraved by a laser, through formation of the given compound on a canvas or cylinder with subsequent linking and solidification under exposure to light.

EFFECT: increased resistance of the printing matrix to abrasion and to adhesion on its surface.

19 cl, 2 tbl, 12 ex

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