Negative photosensitive polymer composition, method of forming pattern and liquid ejection head

FIELD: chemistry.

SUBSTANCE: photosensitive composition contains a cation-polymerisable compound, an acid photogenerator having an anionic part and a cationic part, as well as a salt having a cationic part having anyone of a quaternary ammonium structure or a quaternary phosphonium structure, and an anionic part. The anionic part of the salt is substituted with the anionic part of the first acid obtained from the anionic part of the acid photogenerator, to form a second acid having acid strength lower than that of the first acid. The cation-polymerisable compound is an epoxy resin. The acid photogenerator is at least a compound selected from a group comprising a sulphonic acid compound and other sulphonic acid derivatives, a diazomethane compound, a sulphonium salt, an iodonium salt, a sulphonimide compound, a disulphonic compound, a nitrobenzene compound, a benzoin tosylate compound, an iron arene complex, a halogen-containing triadine compound, an acetophene derivative, and a cyano group-containing sulfatoxim. The method of forming a pattern involves preparing a substrate on which the photosensitive composition is provided. A portion of the composition is then exposed to light to cure the exposed portion. The cured portion is then heated. The liquid ejection head has a part with an outlet channel for ejecting liquid. The part with the outlet channel is formed from cured material made from said composition.

EFFECT: invention increases heat resistance of the photosensitive composition and increases accuracy of forming a pattern.

13 cl, 4 dwg, 5 tbl, 9 ex

 

The area of technical applications

The present invention relates to a negative photosensitive polymer composition. More specifically the present invention relates to a negative photosensitive polymer composition used to obtain the head to eject the liquid, which is used in writing the method of ejection of the liquid for generating liquid droplets, for example, drops of paint. Additionally, the present invention relates to a method of forming a pattern, to the head to eject the liquid and to a method for the head to eject the liquid, using a negative photosensitive polymer composition.

Fundamentals of engineering

As the technology of micromachining to form a pattern or structure was known technique of photolithography through the exposure and manifestation of the negative photosensitive resin composition. This technology is widely used to obtain semiconductor integrated circuits and semiconductor masks and various microelectromechanical systems MEMS (MEMS microelectromecanical systems-MEMS) and the like. As an example, use to get this MEMS technology is used for receiving the nozzle (nozzles) of the head to eject the liquid. In this field the minute technology in recent years, there is a demand for obtaining patterns, having a more complex configuration with high clarity, high heat resistance, and therefore, there is a demand for the negative photosensitive polymer composition which shows high thermal stability and precision molding.

As an example, a negative photosensitive polymer composition in tiled application JP2008-256980 considered negative photosensitive polymer composition containing a polyfunctional epoxy resin and photogenerator acid

As an example, head to eject the liquid in US 5218376 discusses the configuration that includes a nozzle for ejection of the liquid, in which the droplet of the ink ejected by providing interaction between the bubbles generated by heating a heat-resistant element, and the outside air.

However, in the case of heating at high temperatures to give high reliability, part utverzhdenii film sometimes has been modified, which makes it impossible to obtain desired utverzhdenii film.

Brief description of the invention

The present invention focuses on the negative photosensitive polymer composition having high heat resistance and precision formation. Additionally, the present invention aims to head to eject the LM the bone, having a part with an outlet channel provided with outlet channels formed from the composition and having a high shape definition.

In accordance with an aspect of the present invention is provided a photosensitive polymer composition comprising a cation-curable compound; photogenerator acid, having the anionic part and cationic part; and a salt having a cationic part with any one of the Quaternary structure of ammonium or Quaternary structure of phosphonium and anionic portion, where the anionic portion of the salt is replaced by the anionic part of the first acid derived from anionic part of photogenerator acid to form a second acid having a strength of acid, lesser than the power of the first acid.

In accordance with exemplary embodiments of the embodiment of the present invention provided a negative photosensitive polymer composition having high heat resistance and is capable of creating utverjdenie a substance having good precision moulding. Additionally, there is the possibility to provide the ejection head of a liquid having a portion with an outlet channel provided with outlet channels with high-definition form.

Additional characteristic features of the present invention will become clear from the following detailed description of the use of the different variants of embodiment of the invention with reference to the attached drawings.

Brief description of drawings

Accompanying drawings, which are incorporated into and form part of the specification, illustrate exemplary variations of the embodiment of the invention, characteristic features and aspects of the invention and together with the description serve to explain the principles of the invention.

Figure 1 - schematic diagram illustrating the pattern that you want to use for evaluating the accuracy of molding in accordance with an exemplary alternative embodiment of the present invention.

Figure 2 is a perspective view schematically illustrating the head to eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Figure 3 is a perspective view schematically illustrating a substrate that you want to use for the head to eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Figa - section, illustrating the technological stage of the production process of the head to eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Figw - section, illustrating the technological stage of the production process heads eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Figs - section, illustrating the technological stage of the production process heads eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Fig.4D - section, illustrating the technological stage of the production process heads eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Five - section, illustrating the technological stage of the production process heads eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Fig.4F - section, illustrating the technological stage of the production process heads eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Description of variants of the incarnation

Various illustrative options embodiments, features and aspects of the invention will be described in more detail below with reference to the drawings.

Negative photosensitive polymer composition in accordance with an exemplary alternative embodiment of the present invention is composed of:

(a) acid-curable compound; (b) at least one photogenerator acid; and (c) the agent salt exchange, which is a salt with the cationic part, having any one of the Quaternary structure of ammonium or Quaternary structure of phosphonium, and anionic part.

Further in this document the components of the negative photosensitive polymer composition in soo is according to the exemplary variation of the embodiment of the present invention will be described in detail.

<(a) Cation-curable compound>

Examples of the acid-curable compounds include, but are not limited to, compounds having one or two or more reacts with functional groups selected from the group consisting of epoxy group, group oxetane (oxetane), groups, vinyl ether groups propilovogo ether.

Among them, preferred is a polyfunctional epoxy compound with multiple epoxy groups in one molecule. Examples of polyfunctional epoxy resins include polyfunctional alicyclic epoxy resin, polyfunctional phenomenology epoxy resin, polyfunctional ortho-krizanovicka epoxy resin, polyfunctional triphenylborane epoxy resin, polyfunctional bisphenol a Novolac epoxy resin and similar. Among them, preferably can be used polyfunctional bisphenol a Novolac epoxy resin, a polyfunctional alicyclic epoxy resin or polyfunctional phenonomena epoxy resin. Functionality can be preferably (Penta) pacifistically or more, and, for example, “Epicoat 157S70” manufactured by Japan Epoxy Resin Co., Ltd., “Epiclon N-865”, manufactured by DIC Corporation, and “EHPE 3150”, manufactured by Daicel Chemical Industries Ltd, are commercially is available and can be used more preferably.

Softening temperature polyfunctional epoxy resin may be preferably, but not limited to, 50°-180°C, more preferably 60°-160°C.

The content of the polyfunctional epoxy resin may be preferably 40 wt.%-99,9 wt.%, more preferably 45 wt.%-99,9 wt.%, additionally, preferably 50 wt.%-99,2 wt.%. In this content there is a possibility to obtain a resistive layer having an appropriate hardness when applied to (helper object).

As compounds with oxetanone group, may be used any compound having at least one oxetane ring. Examples of compounds with oxetanone group include bisphenol oxetane compound, bisphenol oxetane compound, bisphenol-S oxetanone connection, xylylene oxetanone connection, pinaneborane oxetanone connection, resolvefilename oxetanone connection, alkylphenolate oxetanone connection, biphenol oxetanone connection, mexicanal oxetanone connection, naphthalene oxetanone connection, Dicyclopentadiene oxetanone connection, oxetane compound which is the condensation product of phenol and an aromatic aldehyde having a phenolic hydroxide group, and similar.

More specific examples from the organisations, with oxetanone group include compounds represented by the following chemical formula:

[Chem. formula 1]

[Chem. formula 2]

where n is an integer from 1 to 20.

Examples of compounds that include a group of the vinyl ether (hereinafter in this document abbreviated to VE-VE) include monofunctional VE having 3 or more carbon atoms (C3 or more) and the average molecular weight (Mn) of 1000 or less, for example, alkyle (matile, Atila, butyle, isobutyl, cyclohexyl, 2-clarative, 2-phenoxyethyl, 2-hydroxyethyl 4 hydroxybutyl, sterile, 2-acetoxyethyl, monova diethylene glycol, 2-ethylhexyl, Godella, octadecyl etc), alkenilovyh VE (allyl VE), VE 2-methacryloyloxyethyl, VE 2-acroloxidae etc), arrowy VE (phenyl VE, VE p-methoxyphenyl, etc), polyfunctional VE (C6 or more and Mn of 1000 or less, for example, di-VE 1,4 butanediol, di-VE, triethylene glycol, di-VE 1,4-benzene, hydroxynonenal di-VE, di-VE of cyclohexanedimethanol, di-VE diethylene glycol, di-VE of DIPROPYLENE, di-VE of hexandiol, etc) and similar.

Examples of compounds with the group of propylene ether (hereinafter in this document abbreviated to PPE-PPE) include polyfunctional PES (C4 or more and Mn of 1000 or less, voltage is emer, alcippe (methyl PES, ethyl PES, butyl PES, isobutyl PES, cyclohexyloxy PES, 2-chlorotalonil PES, 2-phenoxyethylamine PES, 2-hydroxyethyloxy PES, 4-hydroxybutanoic PES, stearyl PES, 2-ecotoxicology PES, diethylenglycol monappa, 2-ethylhexyloxy PES, dodecyloxy PES, octadecylamine PES, etc), alkenilovyh PES (allyl PES, 2-methacryloyloxyethyl PES, 2-acroloxidae PES etc), aryl PES (phenyl PES, p-methoxyphenacyl PES etc), polyfunctional PES (C6 or more Mn 1000 or less, for example, 1,4-potentially di PES, triethyleneglycol di PES, 1,4-benzene di-PES, hydroxynonenal di PES, cyclohexanedimethanol di PES, diethyleneglycol di PES, DIPROPYLENE di PES, hexandiol di PES etc) and similar.

<(b) Photogenerator acid>

Component (b) is a substance which decomposes perceive light, for the formation of acid directly or indirectly. Because photogenerator acid has the above property, the type, structure and similar that are not specifically limited. The acid formed from photogenerator acid, has the effect of starting or accelerating the polymerization reaction. Additionally, the acid includes cation.

Examples of photogenerator acid component (b) include a connection sulfonic sour the s and other derivatives of sulfonic acid, diazomethane connection, the connection salts sulfone, the compound salt iodone (iodonium), sulfonamide connection, disulfonate connection, nitrobenzophenone connection, benzonatate (benzonorbornadiene) connection, the arene complex of iron, halogenated connection triazine derived compound acetophenone containing the cyano sulfate the oxime (oxime) and similar. Any one of the known or conventionally used photogeneration acid can be used in the present invention without particular limitations.

More preferred examples of photogenerator acid include a salt compound of sulfone and the connection of salt iodone (iodonium). From the viewpoint of heat resistance salt monocrystalline, salt varisolve and salt triarylsulfonium with one or more aryl groups, the cationic part can be preferably used as a compound salt of sulfone. As compounds of salt iodone (iodonium) preferably used may be Sol diarylethene (iodonium).

Additional preferred examples of photogenerator acid include a salt monocrystalline, salt varisolve and salt triarylsulfonium and salt diarylethene terms of acid generation, power acid, which is sufficient to reject the Denia epoxy resin. As the strength of the acid is sufficient to cure the epoxy resin is a strong acid, for example, geksaftorpropena acid or acid stronger than geksaftorpropena acid are preferable among the Lewis acids (Lewis). “Strong acid, for example, geksaftorpropena acid or acid stronger than geksaftorpropena acid” means an acid having an acidity function of Gamete (Hammettte)-HO, which is equal to or greater than 18. Among the acids Branstad (Brensted), the preferred strong acid, for example, nonattributable acid or acid stronger than nonattributable acid. “Strong acid is equal to or stronger than nonattributable acid” means an acid having a PKa value that is equal to or larger than -3,57. Later in this document will be described specific examples of the structure of anion part of the salt sulfone and salt iodone (iodonium), which will be a source of formation of strong acids. However, connections are no more than examples, and the present invention is not limited to the given examples of the compounds.

[Chem. formula 3]

[Chem. formula 4]

Among the above examples of the most preferable examples of the structure of anion part on the require - (b-1)to(b-14). There is a possibility to obtain a cured material with high precision moulding, using the structure of anion part which is the source of a strong acid.

The above-described components (b) can be used individually or in combination of two or more. The content of component (b) may be generally from 0.01 to 20 wt.%, preferably from 0.1 to 15 wt.%, more preferably from 0.15 to 10 wt.%.

<(c) the Agent salt metabolism>

Agent salt exchange is a Quaternary ammonium salt or Quaternary phosphonium salt, which is able to create a second acid having a strength of less acid than the acid strength of the first acid exchange with anionic part of the first acid derived from anionic part of photogenerator acid after photogenerator acid decomposes the perceived light. The type, structure and similar to the above are not specifically limited, as agent salt exchange has the above property. There is a possibility to choose the agent salt exchange, comparing the anionic part of photogenerator acid (b) and the anionic part of the agent salt exchange (s) and using as a criterion of the strength of acids obtained by the conversion of the anionic parts in acid. More specifically, a compound satisfying the Formula <1> is capable of capturing sour is the first acid), formed from photogenerator acid (b), and throw acid (second acid), with a smaller force acid than captured acid, and used in the present invention as an agent for salt exchange. “Anionic part” refers to the element containing the character expressed by “-”, as a negative charge, and transformation into acid” refers to the addition of H+to the anionic part. In the Formula <1> the strength of the acid on the left of the at sign (> stronger, and the strength of the acid to the right of the at sign (> weaker.

The strength of the acid, when the anionic part of photogenerator acids (b) converted into acid]>[strength acid, when the anionic part of the agent salt exchange converted into acid] <1>

There is a possibility to use physical values physical characteristics, reporting the strength of the acid, for example, the function of the acidity of Gamete (Hammette) and PKa to Express the strength of the acid. In a similar way can be used the actual values of the measurements. As a measuring method, there is an opportunity in itself to determine the strength of the acid, subjecting the exposed photosensitive resin composition using photogenerator acid, in which the cationic part are the same, and the anionic part of the change, and comparing the sensitivity. In short photogenerator acid that I have is more sensitive has a higher strength acid. Details of the measuring method will be described in <Rating>described below in the invention.

As principles of chemical reactions related to salt exchange, shows an illustrative scheme in the following Formula <2>.

[Chem. formula 5]

M-/S+is photogenerator acids (b); E represents the process of irradiation light energy (power light); M-/H+is acid formed from photogenerator acids (b) after exposure light; and N-/A+is the agent salt exchange. Here the ratio [strength acid M-/H+]>[strength acid N-/H+]. Briefly for convenience M-/H+is a strong acid, and N-/H+is a weak acid in the Formula <2>.

The link with the sign “-” represents an anionic portion, and the link with the sign “+” represents a cation part. In short photogenerator acid (b) and the agent salt exchange (s) are salts with oppositely charged ions, in which the anionic part and the cationic portion of the Formula <2> is 1:1. As a concrete example: S+is triphenylsulfonium; A+is tetraalkylammonium, M+is (b-1)described above, and N+is pendaftar what timonator.

In the formula <2> acid M-/H+formed from photogenerator acid, converted to N-/H+that is a much weaker acid if the acid M-/H+faces N-/A+that is the agent of the salt exchange (s)in the drying process after the exposure to the PEB (Post-Exposure Baking-drying after exposure), which is the process of performing imaging using diffusion formed by acid and heat treatment (drying) after developing. This chemical phenomenon called “salt exchange.”

In the case of heating the negative photosensitive polymer of the cured substance at high temperature to give high reliability using conventional technological processes existed the problem of insufficient heat resistance, which sometimes cause modification utverzhdenii film, which leads to damage resulting desired utverzhdenii film. The inventors of the present invention discovered that the cause of damage is the combination of the presence of a strong acid and high temperature, to ensure that it is possible to improve the heat resistance utverzhdenii film by converting the acid formed from the acid generator (b) in the acid, which has a lower strength is th acid, and a stable salt with the help of an agent salt exchange. Sustainable salt implies M-/A+that is the connection of the salt formed after the acid formed from photogenerator acids (b) captured by the agent salt exchange (c), and does not modify utverzhdennuyu film, because it is stable at high temperatures.

In contrast, for the polymerization it is desirable to use an acid having a high strength acid, to achieve high precision moulding. Thus, since the precision molding and thermal stability are the trade-offs between, it has been difficult to achieve both of these properties. However, the solution provided through the use of a salt exchange reaction of the present invention.

As agent for salt exchange (C), preferred is the following structural Formula (1).

[Chem. formula 6]

A represents a nitrogen atom or a phosphorus atom; R1-R4represent an aryl group having a total of 6-30 carbon atoms, heterocyclic group having a total of 4-30 carbon atoms, alkyl group having a total of 1-30 carbon atoms, alkenylphenol group having in total 2 to 30 carbon atoms, and alkylamino group having in total 2 to 30 carbon atoms, to which each of which may be substituted, at least one group selected from the group consisting of alkyl groups, hydroxyl groups, group cycloalkyl (cycloalkyl group), group alkenyl, alkoxygroup, group alkylcarboxylic, group arylcarbamoyl, group alkoxycarbonyl, group aryloxyalkyl, group uriticaria, alloctype, aristocraty, allylthiourea, aryl groups, groups containing a heteroatom in the aromatic ring, alloctype, group alkylsulfonyl, group arylsulfonyl, group alkylsulfonyl, group arylsulfonyl, accelerometry, amino, ceanography, nitro and halogen groups. More specific examples of substituting groups include an alkyl group having 1-6 carbon atoms (e.g. methyl group, ethyl group, propyl group, isopropyl group and butyl group), a hydroxyl group, a group of cycloalkyl having 3-6 carbon atoms (for example, a group of cyclopropyl, group cyclobutyl, group cyclopentyl and a cyclohexyl group), a group alkenyl having 2-6 carbon atoms (for example, vinyl group, group 1-propenyl, group 2-propenyl and group 2-butenyl), a group of quinil having 2-6 carbon atoms (for example, a group acetylenyl, group 1-propenyl, group 2-propenyl and group 2-butenyl), alkoxygroup having 1-6 carbon atoms (for example, a methoxy group, this is the system of groups, n-propoxylate, isopropoxy, n-butoxypropyl and tertbutoxide), a group of alkylcarboxylic having 2-6 carbon atoms, a group of arylcarbamoyl having 7-11 carbon atoms group alkoxycarbonyl having 2-6 carbon atoms (for example, methoxycarbonyl group, ethoxycarbonyl group and tertbutoxycarbonyl group), a group of aryloxyalkyl having 7-11 carbon atoms, a group of uriticaria having 7-11 carbon atoms, alloctype having 2-6 carbon atoms, aricioglu having 2-6 carbon atoms (for example, phenylthiourea and naphthylthiourea), allylthiourea having 1-6 carbon atoms (for example, methylthiourea, ethylthiourea, n-PropertyGroup, isopropylthio, n-butylthiourea and tributyltin), an aryl group having 6-14 carbon atoms (for example, phenyl group, naphthyl group and the group AstraZeneca), a group containing a heteroatom in the aromatic ring having 4 to 8 carbon atoms (for example, fullaway group and teenlove group), alloctype having 6-10 carbon atoms (for example, fenoxaprop and NATEXPO), a group of alkylsulfonyl having 1-6 carbon atoms, a group of arylsulfonyl having 6-10 carbon atoms, a group alkylsulfonyl having 1-6 carbon atoms, a group arylsulfonyl having 6-10 carbon atoms, accelerograph having 1-6 carbon atoms is, an amino group, a cyano, a nitro-group, a halogen group (e.g., chlorine atom, bromine atom, fluorine atom) and similar. R1-R4may be the same or different. Additionally, if a is a nitrogen atom, R1and R4can form a double bond to form R2-N+(=R6)-R3. Additionally, two or more of R1-R4and R6can form a ring structure having one ring or multiple rings via a carbon atom, an oxygen atom, a sulfur atom or a nitrogen atom. In the case of forming a ring structure, it can have one or more double bonds and may be a heterocyclic ring or aromatic ring containing the nitrogen atom.

X is selected from nitrogen atom, phosphorus atom, antimony atom, boron atom and oxygen atom. If X is nitrogen: m+n is 2; n is an integer selected from 0 and 1; and Y is selected from-S(=O)2- alkalinous fluoride group,-O-CF2-, -C(=O)-CF2-, O-C(=O)-CF2-, -C(=O)-O-CF2- and a single bond. R5represents a hydrocarbon group having from 1 to 30 carbon atoms which may be substituted by a fluorine atom, and the hydrocarbon group has at least one fluorine atom, if n is 0 and Y is selected from-S(=O)2- or a single bond. If X is a phosphorus atom or an antimony atom: m+n SOS which defaults to 6; n is an integer selected from 0 to 6; and Y is selected from-S(=O)2-, -O-CF2-, -C(=O)-CF2-, O-C(=O)-CF2-, -C(=O)-O-CF2-, -O - and a single bond. R5represents a group selected from a hydrocarbon group which may be substituted by a fluorine atom and has 1 to 30 carbon atoms and a hydrogen atom, and the hydrocarbon group has at least one fluorine atom, if n is 0 and Y is selected from-S(=O)2-, -O - or a single bond. If X is a boron atom: m+n is 4; n is an integer selected from 0 to 4; and Y is selected from-S(=O)2-, -O-CF2-, -C(=O)-CF2-, -O-C(=O)-CF2-, -C(=O)-O-CF2-, fenelonov group which may be substituted by fluorine, and a single bond. R5represents a group selected from a hydrocarbon group which may be substituted by a fluorine atom and has 1 to 30 carbon atoms, fluorine atom and hydrogen atom, and the hydrocarbon group has at least one fluorine atom, if n is 0 and Y is selected from-S(=O)2- or a single bond. If X is an oxygen atom, m is 1, n is an integer 0; and Y is selected from-S(=O)2and-C(=O)-. R5represents a hydroxide group, a chlorine atom or a hydrocarbon group which may be substituted by a fluorine atom and has 1 to 30 carbon atoms. If X is an oxygen atom, R3and R5can be connected via groups of the hydroxide or a hydrocarbon group, which may be substituted by a chlorine atom and has 1 to 30 carbon atoms, to form an intramolecular salt.

Specific examples of compounds salt exchange (c) below. However, these compounds are no more than examples and are not limiting.

[Chem. formula 7]

[Chem. formula 8]

[Chem. formula 9]

The above-described components (C) can be used individually or in combination of two or more.

The acid that is released (exempted) from agent salt exchange (s), and has a lower strength acid than captured acid preferably may contain a fluorine atom arimana acid containing a fluorine atom phosphoric acid containing a fluorine atom boric acid, sulfonic acid, which may contain a fluorine atom, or a carboxylic acid include acid derived from the anionic part of the Formula <1>. Examples of the antimony acid containing a fluorine atom include hexaferrites acid and forcerenew acid in which from 1 to 5 hydroxyl groups are substituted. Examples of phosphoric acid containing a fluorine atom include hexaphosphoric acid and Portofino acid, in the cat the Roy one or two fluorine alkyl groups substituted. Examples of boric acid containing a fluorine atom include tetracarbonyl acid. Examples of sulfonic acid, which may contain a fluorine atom, or a carboxylic acid include methylsulfonyl acid, florexpo acid, acetic acid and similar.

The content agent salt exchange (c) may be usually 0.001 to 15 wt.%, preferably 0.01 to 8 wt.%, more preferably 0.05 to 7 wt.% in total dry matter content.

The content agent salt exchange (c) may preferably satisfy the ratio of the number of moles of photogenerator acid forming acid possesses the highest power of acid, among photogeneration acids (b)< number of moles agent salt exchange (c) x4” without special restrictions on it. In short, the content agent salt exchange (c) may be preferably ¼ times the number of moles of photogenerator acid forming acid possesses the highest power of acid. With regard to the above, the number of moles, the agent salt exchange (c) converts the acid generated by photogeneration acid (b), in a fairly weak acid, and, therefore, it is possible to improve the heat resistance utverzhdenii film. However, if the valence of the generated acid is plural, then the number of moles of photogenerator acid equals the number of moles multiplied by the and valence.

More preferably may be satisfied by a ratio of the number of moles of photogenerator acid forming acid possesses the highest power of acid, among photogeneration acids (b)< number of moles ×2 agent salt exchange (c)”. Briefly the contents of the agent salt exchange (c) may preferably be 1/2 times the number of moles of photogenerator acid forming acid possesses the highest power of acid. Additionally can be particularly preferably satisfied the ratio of the number of moles of photogenerator acid forming acid possesses the highest power of acid, among photogeneration acids (b)< number of moles agent salt exchange (c)”. Briefly the contents of the agent salt exchange (c) can be particularly preferably greater than the number of moles of photogenerator acid forming acid possesses the highest power of acid.

Additionally, the content agent salt exchange (c) may preferably be 20 times less than the number of moles of photogenerator acid forming acid possesses the highest power of acid. By maintaining content agent salt exchange (s) in the range shown above, there is the possibility to easily prevent deterioration of sensitivity and deterioration of coating properties.

From the viewpoint of heat resistance, accuracy, fo is mulki and sensitivity photogenerator acid (b) and the agent salt exchange (c) can be used in an appropriate combination within the relations of equivalence with the above-described power acid. If you attach special importance to thermal stability, as agent for salt exchange is preferable to choose the agent salt exchange (c)generating more than a weak acid. In this case, the degree (prozentrote) weak acids installed to achieve the preferred area of sensitivity. If you attach special importance to the balance between precision molding and heat resistance, it is preferable to choose as photogenerator acids (b) photogenerator acid, forming a stronger acid, and as agent for salt exchange (c) agent salt metabolism, forming a weak acid. In this case, it is desirable to choose the agent salt exchange (c) taking into account the weakening of the weak acid to achieve your preferred area of sensitivity. Additionally, if a particular emphasis on the sensitivity, it is preferable to choose as photogenerator acids (b) photogenerator acid, forming a stronger acid, and to choose as agent for salt exchange (s) agent salt metabolism, forming a weak acid. In this case, it is desirable to choose the agent salt exchange (C) from the point of view of the power of the stronger acid to achieve your preferred area of resistance.

For negative photosensitive polymer composition of the present invention codectweaktool get utverjdenie substance, demonstrating good precision molding and thermal stability, with a composition of (a) acid-curable compound (b) photogenerator acid and (C) the agent salt exchange, and the following additives can be incorporated on demand to improve various properties. Supplements are nothing more than examples, and not limited to the following compounds.

<(d) Aminosidine>

Aminosidine relates to alkaline compound containing a nitrogen atom, and demonstrates the basicity received from a single electron pair of the nitrogen atom. In the form action of amino compounds, this compound is able to capture the acid generated, for example, from photogenerator acid, and the inactivation of acidity. Therefore, there is a possibility to improve the clarity of the pattern by controlling the diffusion length of the acid in the process of diffusion of the acid under the action of heat, and it is possible to suppress the change in sensitivity during storage of the solution of photosensitive resin composition of inaktivirovanie very small quantity of acid generated from photogenerator acid during the dark reactions when stored.

As the amino compounds preferably aminosilane containing one or more nitrogen atoms in different chemical environments without special restrictions to this. In particular, connect the tion, containing at least one substituted or an unsubstituted amino group and at least one ring structure containing the nitrogen atom is preferred and additionally preferred is a compound containing at least one alkylamino.

Examples of amino compounds include guanidine, pyridine, pyrrolidine, indazole, imidazole, pyrazole, pyrazin, pyrimidine, purine, imidazole, pyrazoline, piperidine, piperidine, morpholine and the like. These compounds may be substituted. Examples of the substituted groups include amino group, aminoalkyl group, alkylamino, aminoaryl group, killingray, alkyl group, alkoxygroup, acyl group, allyloxy group, aryl group, aryloxy group, nitro group, hydroxyl group, cyano group and similar.

Other examples of amino compounds include tertiary amines, for example, triphenylamine, triethanolamine, triisopropanolamine, triisopropanolamine, N,N-diethyl-3-aminophenol, N-ethyldiethanolamine, and 2-Diethylaminoethanol; secondary amines, such as ethanolamine, diisopropanolamine, and N-methylbenzylamine; primary amines, for example, onomatology; diamines, such as Ethylenediamine, the compounds of the pyrimidine and its derivatives, for example, aminopyrimidine, 2-aminopyrimidine, 4-aminopyrimidine and 5-aminopyrimidine, compounds of the pyridine and proizvodnye, for example, pyridine, methylpyridine, 2,6-dimethylpyridine; and aminophenol and its derivatives, for example, 2-aminophenol and 3-aminophenol.

Specific examples of the preferred amino compounds include guanidine, pyridine, 1,1-dimethylguanidine, 1,1,3,3 - tetramethylguanidine, 2-aminopyridine, 3-aminopyridine, 4-aminopyridine, 2-dimethylaminopyridine, 4-dimethylaminopyridine, 2-diethylaminopropyl, 2-(aminomethyl)pyridine, 2-amino-3-methylpyridine, 2-amino-4-methylpyridine, 2-amino-5-methylpyridine, 2-amino-6-methylpyridine, 3-aminomethylpyridine, 4-aminomethylpyridine, 3-aminopyrrolidine, 2-aminopyrrolidine, piperazine, N-(2-amino-ethyl)piperazine, N-(2-amino-ethyl)piperidine, 4-amino-2,2,6,6-tetramethylpiperidine, 4-piperidinophenyl, 2-aminopiperidine, 1-(2-amino-ethyl)pyrrolidine, pyrazole, 3-amino-5-methylpyrazole, 5-amino-3-methyl-1-p-tollerson, pyrazin, 2-(aminomethyl)-5-methylpyrazine, pyrimidine, 2,4-diaminopirimidina, 4,6-dihydroxypyrimidine, 2-pyrazoline, 3-pyrazoline, N-and N aminomorpholine- (2-amino-ethyl)morpholine.

The above-described amino compounds can be used individually or in combination of two or more. The contents of amino compounds typically can be from 0.001 to 10 wt.%, preferably 0.005 to 5 wt.%, more preferably from 0.01 to 4 wt.% in total dry matter content.

<a Photosensitive substance>

Photosensitive substance may be used in owano to produce a high photosensitivity. If the light source of the scanner emits an i-line, it is preferable to use a photosensitive substance formed from the derivative of naphthalene or anthracene or its derivative, each of which can improve the photosensitivity of photogenerator acid salts sulfone and photogenerator acid salt iodone (iodonium). However, since the photosensitive substance may affect the accuracy of the moulding, which depends on the content and type of connection, it is preferable to choose according to the type and number.

<Solvent>

The solvent used in the present invention, in a special way unlimited and can be used the traditional solvents. Examples of solvents include γ-butyrolactone, ethyllactate, propylene carbonate, acetate propilenglikolmonostearata ether, methyl isobutyl ketone, butyl acetate, methylmercaptan, 2-heptanone, ethyl acetate, methyl ethyl ketone, diglyme, xylan, cyclohexanone and similar.

The solvent may be included in an amount of 5 to 99 parts by weight, preferably from 10 to 95 parts by weight per 100 parts by weight of a compound capable of polymerization under acidic type.

<a method of obtaining a>

Figure 2 is a perspective view schematically illustrating an example of a head to eject the liquid, formed the Anna by using a negative photosensitive polymer composition in accordance with an exemplary alternative embodiment of the present invention. Example of head to eject the liquid, shown in figure 2, is jet writing head without special restrictions. In the ink jet writing head shown in figure 2, the layer 4 forming the supply channel of the ink formed on the substrate 1 that has a number of elements 2 generation, and the outlet channels 5 paints and channel inking 3C, which communicates with the outlet channels 5 colors, and holds the ink, is formed on the layer 4 channel formation ink. Additionally on the substrate 1 provided with an inlet opening 6 of the paint, which gives the paint in the feed channel of the ink 3C.

Later in this document will be described a method of obtaining a head eject the liquid in accordance with an exemplary alternative embodiment of the present invention.

Referring to Figure 3, the set of elements 2 generation are located on the substrate 1 with a predefined step. In Fig. 4A-4F show the stages of obtaining the views in section, taken on line a-a In Figure 2, or 3.

Later in this document each stage of the process will be described with reference to Fig. 4A-4F. Managing input signal electrode (not shown) is connected with a generating elements 2, to control the elements 2.

Referring to Figa prepared substrate 1 having a generating elements 2. The substrate 1 before occhialino may be a Si substrate. In particular, the substrate 1 may be preferably monocrystalline silicon substrate, and in the case of performing the perforation holes in the substrate 1 by anisotropic etching, the substrate 1 may be preferably monocrystalline silicon substrate having a crystal orientation of 100. In the case of performing the perforation holes in the substrate 1 by dry etching, sandblasting or using a laser, can be used single-crystal silicon substrate having a crystal orientation 110 or equivalent.

Element 2 power generation is not limited in a particular way, because the element 2 generate energy capable of transmitting energy to eject the ink to eject droplets of the ink and to eject drops of ink from the ejection channel of the paint. If, for example, heat-resistant element is used as element 2, the generation of energy, the energy of the emission is generated, causing a state change in the ink by heating the ink by using heat-resistant element near heat-resistant element.

Referring to Figv soluble polymer composition is deposited on a substrate 1 to form a layer 3A of the pattern of the feed channel of the ink. As a method of forming a layer 3A of the pattern of the channel inking positive photosensitive polymer clay is, for example, dissolved properly in a solvent and then applied on the substrate 1 by centrifuging or similar. After this is done heating, to form a layer 3A of the pattern of the feed channel of the ink. The thickness of the layer 3A of the pattern of the feed channel of the ink may be equal to the height of the desired channel, inking, and is not limited in a particular way. For example, the thickness may be preferably from 2 to 50 μm (micrometers).

Referring to Figs, pattern 3b of the feed channel of the ink is formed by irradiation of the layer 3A of the pattern of the feed channel of the ink using the radiation source with the subsequent manifestation.

Next, layer 4 forming the supply channel of the ink formed from a negative photosensitive polymer composition of the present invention, formed on the layer 3b of the pattern of the feed channel of the ink and the substrate 1. The thickness of the layer 4 forming the supply channel of the ink may preferably be 2 μm or more, and the thickness of the layer 3b of the pattern of the feed channel of the ink. Additionally, the thickness of the layer 4 forming the supply channel of the ink may preferably be 100 μm or less, and the thickness of the pattern 3b of the feed channel of the ink, although the thickness is not limited in a particular way, since the thickness is within the range that does not impair the ability to manifest element with the outlet kr the ski.

Referring to Fig.4D, layer 4 channel formation inking subjected to irradiation with subsequent manifestation of using isobutyl ketone (MIBK) or similar. Additionally, the holes 5 of the ejection of the ink is formed by performing a process by washing with isopropyl alcohol (IPA).

Referring to Figi, the input channel of the ink 6 is formed by using an appropriate method, for example, etching processing.

As shown in Fig.4F, pattern 3b of the feed channel of the ink is removed by dissolving it in a suitable solvent. The appropriate solvent used in this document, there may be an alkali solution or an organic solvent. Additionally can be performed heat treatment at 200°C for one hour using the oven for the curing layer 4 channel formation ink.

After that, the substrate 1 is cut and separated using the machine for cutting thin disks or similar for receiving the chip, and the electrical connection for actuation elements 2 generate energy. Additionally, a joiner tank chip for supplying paint to get the inkjet recording head.

The above-described method is not limited to the method of obtaining ink-jet recording head and EF is the objective as a method of forming a pattern for forming the deep (embossed) image.

Additionally, although the ink jet writing head is used as the example to which the present invention is directed further description, applied interval of the present invention is not limited to the inkjet print head and the present invention is applicable to manufacturing of a biochip (biocrystal) and receive the head of the ejection liquid for electronic printed circuits. Examples heads eject the liquid includes a cylinder for receiving a color filter in addition to the inkjet print head.

Later in this document will be described examples of the present invention, but the invention is not limited to these examples.

<Examples 1 to 9, Comparative examples 1 to 3>

In accordance with the compositions (the unit is mass%), shown in Tables 1-4 polyfunctional epoxy resin as component (a), photogenerator acid as component (b), components (C), a solvent, a photosensitive substance, on demand, and the component (d) are mixed to obtain a negative photosensitive polymer compositions. In Tables 1-4 unit wt.% is the dry matter content (100% as the total dry matter content), and as a solvent was added 70 parts by weight of a mixed solvent having a ratio of acetate propylene is glycolmonomethyl ether/propylene carbonate=20:1.

After application by centrifugation of each of the negative photosensitive composition on the helper object, made of a silicon wafer was performed preliminary curing by drying at 90°C for 5 minutes, thereby obtaining a layer of a negative photosensitive polymer composition having a film thickness of 20 μm. After pre-curing was performed exposure pattern through a photomask on which a desired pattern is drawn using the PPA-300 i5+ (repeater i-line, manufactured by Canon Inc.), and were cured after exposure using a hot plate at 90°C for 4 minutes. After this was done the manifestation of using CDS-630+ (manufactured by Canon Inc.). Then the resistive pattern after development was subjected to further curing at 140°C for one hour and at 300°C for 20 minutes using the furnace, thereby inducing resistive pattern, and cured in an auxiliary object.

<assessment, evaluation>

You will learn how to assess strength of the acid obtained by converting the anionic part of photogenerator acid (b) and the anionic part of the agent salt exchange (s) in acid using actual values.

Negative photosensitive polymer composition was p who ugotovlena by mixing 65 wt.% EHPE as compounds (a), 2 wt.% photogenerator acid shown in Table 5 as component (b), 35 wt.% mixed solvent having a ratio of acetate propilenglikolmonostearata ether/propylene carbonate=20:1 as the solvent, about 1 wt.% 9,10-diethoxyanthracene as photosensitive substances and 0.02 wt.% triethanolamine as a component (d), and resistive pattern was obtained by the method described above. In the exposure process was performed stepwise exposure of the i-line in the range of 500 j/m2-40000 j/m2, and was measured exposure value required for forming a circular pattern having a diameter of 16 μm, for a nozzle with a circular outlet having as settlement size on the photomask inner diameter of 16 μm. Some exposure is illustrated in units of exposure in Table 5. Exposure were listed in ascending order to show the rank order. The rank order shown in Table 5 in order of ranking of the strength of the acid. This means that the smaller the magnitude of the exposure, i.e. the higher the sensitivity, the higher the strength of the acid formed from photogenerator acid (b). In the result of comparison of the strength of the acid, based on the results obtained, certain conversion anionic parts in acid, was coated the cut there is a ratio of (b-1)>(b-12)>(b-23)>(b-27)>PF6>CH3COO. This ratio is applicable also to assess anionic parts agents salt exchange (s), as and for the evaluation of anionic parts substances of motocicleta (b).

To assess the accuracy of the moulding in the drill hole oval outlet nozzle having a major axis of 20 μm and the minor axis 16 μm as calculated sizes, the sample for comparison, which was connected by a line image (s)having a width of 3 μm along the minor axis was converted to negative resistive pattern (see Figure 1). The part in which the oval (ellipse) and line jumpers images cross each other was observed using a scanning electron microscope (SEM) to measure resolution. As shown in figure 1, if the end part of the element, Crescent-shaped, in the case of forming the resistive pattern exactly matches the pattern of the photomask is “a”, the distance (b) from “a” to the part in which the line jumper pattern and the actual resolved pattern cross each other, is a precision forming (units is micrometer). Accordingly, the precision molding is 0 μm, i.e. the pattern is identical to the drawing size of the photomask, when the actual pattern is different to the end of paragraph (a) e is ment Crescent shape. However, if the precision moulding disturbed, negative substance remains at the end portion of the element Crescent shape. The value of the precision molding is determined by the degree of spread of negative substances.

To assess thermal stability of subsequent curing was performed at 140°C for one hour and then at 300°C for 20 minutes in the oven, and the staining was confirmed by visual assessment of the resistive pattern, cured to the supporting object. If staining was detected, it was determined that achieved good thermal stability. Case brown, dark brown or black staining was defined as worsening resistance. In Tables 1-4 good thermal stability indicated all familiarΟand the deterioration of the heat resistance is indicated with an x.

(a-1): Epiclon N-865 (manufactured by DIC Corporation,

the brand name)

(a-2): JER157S70 (made Japan Erahu Resin Co., Ltd., the brand name)

(a-3):EPHE 3150 (manufactured by Daicel Chemical Industries., Ltd., brand name)

TPS1: a compound expressed by the formula (E1)

[Chem. formula 10]

TPS2: a compound expressed by the formula (E2)

[Chem. fo the mule 11]

(C-80)

[Chem. formula 12]

(d-1): Triethanolamine

Photosensitive substance: 9,10-diethoxyanthracene

Table 5
Room(b) Photogenerator acidExposureThe rank order of the strength of acids
1TPS1/(b-l)10001
2TPS1/(b-12)20002
3TPS1/(b-23)35003
4TPS1/(b-27)100004
5TPS1/PFg300005
6TPS1/CH3COO-)>400006

TPS1:Triphenylsulfonium (compound expressed trail is ment formula)

[Chem. formula 13]

Examples 1-9 were able to create a formed on the pattern of cured material having good heat resistance. Precision moulding was 1.5 μm or less, which was infinitely small.

In contrast, as shown in Comparative Example 1, it was impossible to reach and heat resistance and infinitesimal precision molding, if the component (b) and component (C) does not satisfy the relation of Formula (1).

Additionally, as shown in Comparative Example 2, the observed deterioration in heat resistance, if you have not entered the component (C).

Additionally, in the same way have been conducted evaluating adding instead the agent salt exchange (C) antimony trioxide, red phosphorus and tin oxide, which is known as a flame retardant. However, because these inorganic compounds are not dissolved in the solvent and the solution of the photosensitive resin composition, the actual assessment was not completed.

Additional analysis was prepared with the composition in the same manner as in Example 1 except for the addition of the same amount instead of the agent salt exchange (s) of trimethylhydrazine ammonium, which is known as ammonium compounds. However, no pattern was not formed. This means that forces the Naya basicity of trimethylhydrazine ammonium inhibits the formation of the image.

As described in the foregoing, the negative photosensitive polymer composition in accordance with exemplary embodiments of the embodiment of the invention makes possible the formation of a pattern having a high heat resistance and excellent precision moulding. In the negative photosensitive polymer composition in accordance with exemplary embodiments of the embodiment can be suitably used for various devices, which made microprocessing for MEMS and similar.

Although the present invention is described with reference to exemplary variants of embodiment, it should be understood that the invention is not limited to the disclosed exemplary embodiments of the incarnation. The volume of the following claims must be consistent with the wide interpretation so as to encompass all modifications, equivalent structures and actions (functions).

The present Application claims the benefit of disclosure of Japanese patent Application JP 2010-024682, filed February 5, 2010, which is fully incorporated in the description by reference.

1. Photosensitive resin composition, including:
cation-curable compound, representing an epoxy resin;
photogenerator acid having anionic cationic part and the part containing at least one connection su is honowai acid and other derivatives of sulfonic acid, diazomethane connection, the connection salts sulfone, the compound salt iodone, sulfonamide connection, disulfonate connection, nitrobenzophenone connection, benzonatate connection, the arene complex of iron, halogenated connection triazine derived compound acetogen, and containing a cyano alfatoxin; and
salt having a cationic part with any one of the quanternary ammonium or Quaternary structure of phosphonium, and anionic part,
where the anionic part of the salt is substituted anionic part of the first acid derived from anionic part of photogenerator acid, to form a second acid having a strength of acid, lesser than the acid strength of the first acid.

2. The photosensitive polymer composition according to claim 1, where the second acid generated salt is containing a fluorine atom antimony acid containing a fluorine atom phosphoric acid containing a fluorine atom boric acid containing a fluorine atom sulfonic acid or carboxylic acid.

3. The photosensitive polymer composition according to claim 1, where photogenerator acid includes many types of connections, and the number of moles of salt in 1/4 times more than the number of moles of photogenerator acid having higher strength acid from many kinds of connections.

4. The photosensitive polymer composition p is 1, where photogenerator acid includes many types of connections, and the number of moles of salt in 1/2 times more than the number of moles of photogenerator acid forming acid having higher strength acid from many kinds of connections.

5. The photosensitive polymer composition according to claim 1, where photogenerator acid includes many types of connections, and the number of moles of salt more than the number of moles of photogenerator acid forming acid having higher strength acid from many kinds of connections.

6. The photosensitive polymer composition according to claim 1, further comprising aminosilane.

7. The photosensitive polymer composition according to claim 1, where the second acid is containing a fluorine atom antimony acid containing a fluorine atom of phosphoric acid or containing a fluorine atom boric acid.

8. Method of forming a pattern, including:
preparing a substrate on which is provided a photosensitive polymer composition, which comprises a cation-curable compound, representing an epoxy resin; photogenerator acid, having the anionic part and cationic part containing at least one connection sulfonic acid and other derivatives of sulfonic acid, diazomethane connection, the connection salts sulfone, the compound salt iodone, sulfonamide the connection, disulfonate connection, nitrobenzophenone connection, benzonatate connection, the arene complex of iron, halogenated connection triazine derived compound acetogen and containing a cyano alfatoxin; and salt with the cationic part with any one of the quanternary ammonium or Quaternary structure of phosphonium, and anionic portion, where the anionic part of the salt is substituted anionic part of the first acid derived from anionic part of photogenerator acid to form a second acid having a strength of acid, which is smaller than the acid strength of the first acid;
the exposure area of the photosensitive resin composition with light to cure the exposed part and
heating utverzhdenii part obtained by curing.

9. Method of forming a pattern of claim 8, where the second acid, the formed salt is containing a fluorine atom antimony acid containing a fluorine atom of phosphoric acid containing a fluorine atom boric acid containing a fluorine atom sulfonic acid or carboxylic acid.

10. Method of forming a pattern of claim 8, where photogenerator acid includes many types of connections, and the number of moles of salt in 1/4 times more than the number of moles of photogenerator acid forming acid possesses the highest power of acid from the centre of the VA types of connections.

11. Head to eject the liquid, including:
the part with the exhaust channel, fitted with a venting channel to eject the liquid,
where the part of the outlet channel is formed from a cured polymeric composition, comprising a cation-curable compound, representing an epoxy resin; photogenerator acid, having the anionic part and cationic part containing at least one connection sulfonic acid and other derivatives of sulfonic acid, diazomethane connection, the connection salts sulfone, the compound salt iodone, sulfonamide connection, disulfonate connection, nitrobenzophenone connection, benzonatate connection, the arene complex of iron, halogenated connection triazine derived compound acetogen and containing a cyano alfatoxin; and salt with the cationic part with any one of the quanternary ammonium or Quaternary structure of phosphonium, and anionic portion, where the anionic part of the salt is substituted anionic part of the first acid derived from anionic part of photogenerator acid, to form a second acid having a strength of acid, which is smaller than the acid strength of the first acid.

12. Head to eject the liquid in claim 11, where the second acid, the formed salt is what I containing a fluorine atom arimana acid, containing the fluorine atom of phosphoric acid containing a fluorine atom boric acid containing a fluorine atom sulfonic acid or carboxylic acid.

13. Head to eject the liquid indicated in paragraph 12, in which photogenerator acid includes many types of connections, and the number of moles of salt in 1/4 times more than the number of moles of photogenerator acid forming acid possesses the highest power of acid from many kinds of compounds.



 

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6 cl, 37 dwg

FIELD: printing industry.

SUBSTANCE: in method for arrangement of slot for supply of ink into semiconducting substrate for jet printing head, the first structural element is formed by means of multiple application of electric energy discharge to the first side of semiconducting substrate or by means of abrasive material application on the first side of semiconducting substrate, vibration is imparted to tool opposite to the first side, besides tool vibrates with a certain frequency and at a certain distance from the first side for formation of the first structural element, material of semiconducting substrate is removed from the second side for formation of the second structural element, besides at least part of the first and second structural elements crosses for formation of slot for ink feed, which passes through semiconducting substrate, and for removal method is used, which has been selected from group, including wet etching, dry etching, laser treatment, sand drilling, treatment with abrasive jet, rotary-vibration drilling, cutting with saws and mechanical treatment in machines.

EFFECT: fast formation of slot for ink feed in semiconducting substrate for jet printing head with low costs.

19 cl, 14 dwg

FIELD: technological processes.

SUBSTANCE: invention is related to head that ejects liquid, which carries out printing by means of drops ejection onto carrier, device that ejects liquid and method of liquid ejection. Liquid-ejecting head, in which liquid is ejected from ejection channel due to application of energy to liquid, besides ejection channel comprises one ledge having convex shape and arranged inside ejection channel, the first area for maintenance of liquid surface, which must be related to liquid in the form of column stretched outside from ejection channel, when liquid is ejected from it, and, in condition when the first area is created, the second area, to which liquid must be sucked in ejection channel in direction opposite to direction of liquid ejection, and which has hydraulic resistance that is lower than hydraulic resistance of the first area, at the same time the first area is created in direction, in which ledge shape convexity is inverted from distal end of ledge, and the second area is created on both sides from ledge.

EFFECT: possibility to arrange moment of ejected liquid separation as occurring earlier and to reduce tail of flying drop of liquid.

19 cl, 37 dwg

FIELD: printing.

SUBSTANCE: manufacturing method of head substrate for fluid ejection represents provision of silicon substrate containing on its surface layer of etching mask, which has opening, the formation of the first deepening in surface of the silicon substrate by means of anisotropic etching, the formation of the second deepening containing opening in the surface of the first deepening, thereby opening goes in the direction of the other surface of the silicon substrate, being inverse surface to the surface of a silicon substrate and the formation of the inlet channel by anisotropic etching of silicon substrate from surface having the second deepening. Fluid ejection head contains silicon substrate having element of energy generation on its surface that is configured with possibility to generate energy for liquid ejection and the inlet channel for liquid supply to the element of energy generation.

EFFECT: invention provides stable manufacturing of substrate for fluid ejection heads with form accuracy and high efficiency of technological process.

7 cl, 17 dwg

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