Semiconductor device, head for fluid discharge, cartridge for fluid discharge and device for fluid discharge

FIELD: printing.

SUBSTANCE: invention relates to a semiconductor device that can be used in a head for fluid discharge, a cartridge for fluid discharge and a device for fluid discharge. The semiconductor device comprises segments, platform for power supply site power and electrically conductive structures. Each segment contains activating units for fluid discharge. Each activating unit has an activating circuit and an element driven by the activating circuit to apply the energy for discharge to the fluid. The electrically conductive structure comprises a first electrically conductive section connected to the platform for power supply, the second rectangular electrically conductive section, the third electrically conductive section connected to the activating units, and a section of connection that connects the second and third electrically conductive sections. These electrically conductive sections pass in the first direction. In the second direction the length of the second electrically conductive section is greater than the length of the first electrically conductive section. The second electrically conductive section is connected to the first electrically conductive section in the first corner and the connecting area in the second corner diagonally to the first corner.

EFFECT: exception of increase of the size of the printing head in the plan due to reducing the area of routing and eliminating the change of resistance of tracks to the respective segments.

9 cl, 15 dwg

 

The technical field to which the invention relates.

The present invention relates to a semiconductor device, head to eject the liquid having the semiconductor device, the cartridge for ejection of the liquid and the ejection liquid.

Prior art

Head to eject the liquid, which ejects the liquid from the hole is used as a printhead for an inkjet method. Inkjet method uses, for example, the ink as the liquid, and controls the ejection of ink in accordance with a print signal for applying ink on a printing medium such as paper. Device for the discharge of liquid having a head for ejection of the liquid, is used as, for example, inkjet printing device. Inkjet print head that uses thermal energy selectively forms a bubble in the liquid by applying thermal energy released by the heater to the liquid and ejects a drop of ink from orifices by means of the energy. Recently, the number of holes increases for more high-speed printing. However, the resistance from the pad to each of the heater varies, making difficult the same power multiple heaters. To solve this problem, in patent laid bid, medium, small is Japan's No. 2005-104142 proposed layout of figure 5, in which the conductive path to supply power to the heater is divided into a number of conductive paths in order to reduce the change in resistance of the conductive paths. Figure 5 depicts four of the heater 101, four powerful transistor 102 and four circuit 103 conversion levels form one segment. The width of the track is set greater for the track VH, going to the segment in position in addition to the pads, reducing change resistance tracks VH, going to the relevant segments. This also applies to the tracks GNDH coming from the pads to the respective segments. It provides the same power multiple heaters.

The invention

In the print head disclosed in patent application laid Japan No. 2005-104142, when the print head is lengthened by increasing the number of heaters placed on the semiconductor substrate, the number of divisions of the conductive track connected to the ground power supply increases. The width of the tracks coming from the pads to the respective segments, the total increases. Topology wiring requires a large area, increasing the size of the printhead. One object of the present invention provides a technology for eliminating the increase in the area of the wiring when eliminate the changes resistances of the paths to the respective segments.

In one aspect of the present invention proposed a semiconductor device in which multiple segments formed on the semiconductor substrate, each segment includes multiple trigger blocks to release liquid in the nozzle, each activating unit includes activating schema and element, which is actuated by the trigger circuit to be applied to liquid energy for ejection of the liquid in the nozzle, when this semiconductor device includes a ground power supply, which receives external power, and many of conductive structures that can supply platform supply power to the respective segments, each of the conductive structures includes first conductive portion which is connected to the ground power supply, and is held in the first direction, the second rectangular conductive patch, which is held in the first direction, the third conductive portion which is connected to the multiple trigger blocks, and the wiring which connects the second conductive area and the third conductive section, and the length of the second conductive section in a second direction perpendicular to the first direction, is greater than the length of the first conductive area in the second direction, the WTO is Oh conductive section connected to the first conductive segment in the first corner and plot connection in the second uh-huh diagonally to the first corner and the third conductive section goes from section connected to the wiring in the first direction.

Brief description of drawings

Additional features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings, on which:

Figure 1 depicts the fundamental exemplary layout of a semiconductor device 100 according to the first variant of implementation;

Figa and 2C depict exemplary wiring layout of the semiconductor device 100 according to the first variant of implementation;

Figa-3C depict exemplary wiring layout of a semiconductor device in a comparative example;

Figa and 4B depict the wiring diagram of a modification of the semiconductor device 100 according to the first variant of implementation;

Figa and 5B depict the wiring diagram of exemplary layout in which many semiconductor devices 100 are placed according to the first variant of implementation; and

Figa-6D depict views for explaining another variant implementation.

Description of embodiments of the invention

Embodiments of the present invention will now be described with reference to the accompanying drawings.

The first option exercise

The layout of the semiconductor is the first device 100 according to the first variant of implementation will be presented with reference to figure 1. Semiconductor device 100 may be used to control an inkjet printhead. A semiconductor substrate of the semiconductor device 100 may include many of the heaters 101 for application of thermal energy to the ink to eject the ink, serving as a liquid in the nozzle inside the inkjet printhead. A semiconductor substrate of the semiconductor device 100 may further include a multitude of powerful transistors 102 of n-type as the activating circuits. Each power transistor 102 is connected to the corresponding heater 101 and supplies current to operate the heater 101. In the semiconductor device 100, the heater 101 and the power transistor 102 are in one to one correspondence, and forms a pair of energizing the unit. Many activating adjacent blocks form one segment. In the semiconductor device 100 variant implementation, for example, four adjacent the activating unit form one segment 104.

Each segment 104 is connected to two pads 105A and 105b of the power supply through the conductive structure. Pads 105A and 105b power take food from outside, for example, inkjet printing device. A conductive structure connected to the pad 105A power supply, called a track 106 VH, whereas providesa structure, connected to the other pad 105b power supply, called a track 107 GNDH. In the first embodiment, the pad 105A power supply has a positive potential, and the space 105b power supply is grounded. In another embodiment, the pad 105A power supply can serve as ground and space 105b power supply may have a positive potential. Track 106 VH branched near the ground 105A power supply, and the corresponding branches stretched to the respective segments 104. In each segment 104 track 106 VH optionally branched, and the branches connected to the respective heaters 101. Similarly, the track 107 GNDH branched near the ground 105b power supply, and the corresponding branches stretched to the respective segments 104. In each segment 104 track 107 GNDH optionally branched, and the branches connected to the respective powerful transistors 102.

One end of the heater 101 is connected to the track 106 VH, and the other end connected to the source or drain of a powerful transistor 102. Either the source or the drain of a powerful transistor 102 that is not connected to the heater 101 is connected to the track 107 GNDH. The gate electrode powerful transistor is connected to the logic circuit 103. Logic 103 may control the actuation of a powerful transistor 10 in accordance with an external signal (not shown). Logic 103 may take the conventional layout of the circuit, so that the description of the detailed layout will be omitted.

The wiring layout of the semiconductor device 100 in the embodiment will be presented with reference to figa-2C. As shown in figa, in the semiconductor device 100 wiring layers formed using the multilayer wiring on a silicon semiconductor substrate on which elements are formed using the manufacturing technology of semiconductor devices. In the embodiment, for example, as the track 106 VH and track 107 GNDH formed by forming an aluminum layer wiring of the same thickness, which is located in the second layer. Track 106 VH formed over the area where the generated power transistors 102, while the track 107 GNDH formed over the area where the generated logic circuit 103. Track 106 VH and track 107 GNDH respectively connected to pads 105A and 105b power supply outside (for example, on the right side) of the region where the generated power transistors 102, and the region where the generated logic circuit 103. In the example shown in figa, the semiconductor device 100 has four segments, aligned horizontally. These segments are labeled 104a, 104b, 104c and 104d sequentially from a segment nearest to super is m 105A and 105b power.

The detailed shape of the track 106 VH will be explained with reference to figv. Figv depicts a view of the track 106 VH and pad 105A power supply, shown in figa. Track 106 VH may include four independent conductive patterns a-106d. One end of each of the conductive structures a-106d is connected to the pad 105A power supply and the other end connected to one of the respective segments a-104d. The conductive structure a supplies power segment a, and the conductive structure 106b supplies power to the segment 104b. The same applies to conductive structures s and 106d. Despite the fact that will be explained in more detail form conductive patterns 106d, conductive patterns 106b and C have the same shape. Form conductive patterns a will be described separately. For convenience in describing the system 200 of coordinates on the plane, which includes the track 106 VH is set by setting the x-axis direction (first direction)in which the aligned segments a-104d, and the y-axis direction (second direction)perpendicular to the x-axis. On figv the left direction along the x-axis serves as a positive direction, and the upward direction along the y-axis serves as a positive direction.

The conductive structure 106d can be divided into the first conductive section 108d, the second conductive section 109d, section 10d of the connection and the third conductive section 111d sequentially from the site, near to the site 105A power supply. This separation is only explanatory. The conductive structure 106d does not necessarily have to be formed by connecting different metal plates, and may be formed by forming a single layer wiring. The first conductive section 108d may be connected to the pad 105A power supply and continue from the site 105A power in the positive direction along the x-axis. In the example semiconductor device 100, the length of the first conductive section 108d in the y direction is constant regardless of the position x. The second conductive section 109d may have a rectangular shape (rectangle in the example semiconductor device 100) is longer in the x direction than in the y direction, and continue along the x-axis. The second conductive section 109d can be connected in its upper right corner 109d1 (first corner) on figv to the end of the first conductive section 108d on the left side in the x direction, that is, the end opposite that connected to the pad 105A power supply. The second conductive section 109d is connected to the section 110d connection in its lower left corner 109d2 (second corner) on FIGU diagonally to the corner 109d1. The upper right corner 109d1 on figv is one of the four corners of the second pryamougolnogo the conductive section 109d, which is nearest to the site 105A power supply and the furthest from the third conductive section 111d, and the heater 101. The lower left corner 109d2 on figv is one of the four corners of the second rectangular conductive section 109d, which is the most remote from the site 105A power supply and closest to the third conductive section 111d, and also to the heater 101.

Section 110d of the connection may be rectangular. Section 110d connection can be connected to the second conductive section 109d from the upper side in the y direction, that is, the side farthest from the heater 101, and is connected to the third conductive section 111d on the lower side in the y direction, that is, the side near to the heater 101. The third conductive section 111d may be connected to the section 110d of the connection and continue from the connected area in the negative direction along the x-axis, i.e. the direction to the platform 105A power supply. As shown in figa, the third conductive section 111d may be connected to each heater 101 in the segment 104d. Conductive structure 106d length of the second conductive section 109d in the y direction may be longer than the length of the first conductive section 108d in the y direction. Also in the conductive structure 106d length 112 of the second conductive at Asda 109d in the x-direction may be equal to the length of 113 segment 104d in the x-direction. In addition or instead, the length 112 of the third conductive section 111d in the x-direction may be equal to the length of 113 segment 104d in the x-direction. As shown in figv, the upper side of the first conductive section 108d and the upper side of the second conductive section 109d may coincide with each other in the y position. The second conductive section 109d and the third conductive section 111d is connected through a section 110d of the connection. Thus, the gap 114d having a break from the site 105A power supply, can be formed between the second conductive section 109d and the third conductive section 111d.

As shown in figv, conductive structure a includes a first conductive section 108A, section 110A of the connection and the third conductive area street 111A, but does not include the second conductive area. The first conductive section 108A may be connected to the site 110A connection at the end opposite that connected to the pad 105A power supply. Section 110A connection may be rectangular. Section 110A connection can be connected to the first conductive section 108A from the side farthest from the heater 101, and is connected to the third conductive area street 111A on the side near to the heater 101. The third conductive area street 111A may be connected to the costco 110A connection and continue from the connected area in the negative direction along the x-axis, that is, the direction toward the platform 105A power supply. As shown in figa, the third conductive area street 111A may be connected to each heater 101 in the segment a. The first conductive section 108A and the third conductive area street 111A is connected across the segment 110A connection. Thus, the gap a having a break from the site 105A power supply, can be formed between the first conductive section 108A and the third conductive area street 111A.

Next will be explained the relationship between conductive structures a-106d. Despite the fact that will be compared conductive patterns C and 106d has the following relation for any two conductive structures track 106 VH. The conductive structure s supplies power segment s (first segment), and the conductive structure 106d supplies power segment 104d (second segment) on the left side of the segment s, that is, at the position distant from the site 105A power supply. In this case, the length of the first conductive section s in the x-direction conductive structure s may be longer than the length of the first conductive section 108d in the x-direction conductive structure 106d. To make the resistance of the conductive structures s and 106d are equal to each other or to reduce the difference between them, the length of the first conductive at Asda 108d in the y-direction conductive structure 106d can be set more than the length of the first conductive section s in the y-direction conductive structure s. Additionally, the length of the second conductive section 109d in the y-direction conductive structure 106d may be set greater than the length of the second conductive section s in the y-direction conductive structure s. In the variant example of the second conductive section 109d on the left side of the second conductive section s. Thus, the length of the second conductive section 109d in the y direction may be set greater than the length of the second conductive section s in the y-direction through a gap between the second conductive area is conductive patterns C and the first conductive section 108d conductive patterns 106d. By placing the second conductive section 109d on the left side of the second conductive section s thus, the second conductive section in a position more distant from the site 105A power supply, can be made longer in the y direction. The second conductive section 109d the current flows from the corner 109d1 to the corner 109d2, so that the resistance decreases for greater length of the second conductive section 109d in the y direction. Although the conductive structure a not have a second conductive area, visar who led the discussion applies also that the length of the second conductive section in the y direction is equal to 0.

All sections 110A-110d connections can be of the same form, and all third conductive areas street 111A-111d may have the same shape. If the forms sections 110A-110d connections and form third conductive areas street 111A-111d are identical between segments a-104d, changes resistances from sites 110A - 110d connections to the heaters 101 between segments compensated. When the third conductive areas street 111A-111d are connected to the conductive structures of other wiring layers, the length of the third conductive areas street 111A-111d in the y direction can be adjusted to equalize the combined resistance of the connected conductive structures per unit length in the x direction. Resistance conductive structures a-106d may be equal to each other. However, if the resistance changes less than 10%, the deterioration of image quality does not occur due to printing inkjet printing device.

Figa-3C depict views showing the wiring layout of the semiconductor device 300 as a comparative example for explaining effects of the first variant implementation. The semiconductor device 300 has the wiring diagram that is expected when the distribution wiring two segments, pakatan the x figure 5 published Japan patent No. 2005-104142, on the wiring diagram of the four segments. The same reference position as figa-2C denote the same parts, and their descriptions will not be repeated. The semiconductor device 300 differs from the semiconductor device 100 according to a variant implementation in the form of tracks 301 VH and track 302 GNDH. Figv depicts a view, track 301 VH and pad 105A power.

Track VH 301 includes four independent conductive patterns 301a-301d. One end of each of the conductive structures 301a-301d connected to the pad 105A power supply and the other end connected to one of the respective segments a-104d.

The conductive structure 301d is divided into the first conductive section 303d, plot 304d connection and the third conductive area 305d sequentially from the site, near to the site 105A power supply. The first conductive section 303d connected to the pad 105A power and lasts from the site 105A power in the positive direction along the x-axis. Plot 304d connection has a rectangular shape and connects the left end of the first conductive section 303d to the top left corner of the third conductive area 305d. The third conductive area 305d connected to the lower side of the site 304d connections on figv and continues from the connected area in the negative direction is along the x-axis, that is, the direction toward the platform 105A power supply. As shown in figa, the third conductive area 305d connected to each heater 101 in the segment 104d.

We will explain the result of the comparison of the lengths of the first conductive sections in the y-direction conductive structures VH tracks in semiconductor device 100 according to a variant implementation and semiconductor device 300 in the comparative example. As preconditions for comparison, the distance 201 from the site 105A power to segment a adjacent to the site 105A power supply is 0.5 mm, the step 202 of segments is 1 mm and the minimum L/S is 5 μm. Resistance of conductive structures extending from the pad 105A power-up stations 110A-110d or a-304d connections are made equal to each other, and the sum of widths of the first conductive sections in the y-direction in each of the corresponding conductive structure is minimized. Table 1 shows the length of the first conductive sections in the y-direction in the respective conductive structures track VH when these pre-conditions. Full width layout" indicates the sum of the lengths of the first conductive sections in the y-direction in the respective conductive structures. For the semiconductor device 100 is shown for reference length is which conductive areas a-109d in the y direction.

Table 1
The semiconductor device 100 (an implementation option)The semiconductor device 300 (comparative example)
First tokoro-conductive areaSecond tokoro-conductive areaFirst tokoro-conductive area
The conductive structure a5,00,0The conductive structure
A
5,0
The conductive structure 106b6,316,3The conductive structure
303b
8,4
The conductive structure 106c9,430,7The conductive structure
303c
11,7
The conductive structure 106d12,648,3The conductive structure is round
303d
15,1
The total width of the distribution33,3-The total width of the distribution40,1
unit: µm

Table 1 shows that the track 106 VH semiconductor device 100 according to a variant implementation is shorter by 17% at full length in the y direction than the path 301 VH semiconductor device 300 in the comparative example.

The detailed shape of the track 107 GNDH will be explained with reference to figs. Figs depicts a view of the track 107 GNDH and pad 105b power supply, shown in figa. Track 107 GNDH may include four independent conductive patterns 107a-107d. One end of each of the conductive structures 107a-107d connected to the pad 105b power supply and the other end connected to one of the respective a-104d. The conductive structure 107a supplies power segment a, and the conductive structure 107b supplies power to the segment 104b. The same applies to conductive structures s and 107d. Despite the fact that will be explained in more detail form conductive patterns 107d, conductive structure s also has the same shape. Form conductive structures 107a and 107b will be described separately.

Tokodi the holding structure 107d can be divided into the first conductive section 121d, the second conductive section 122d, section 123d connection and the third conductive section 124d sequentially from the site, near to the area 105b of the power supply. This separation is only explanatory. The conductive structure 107d does not necessarily have to be formed by connecting different metal plates, and may be formed by forming a single layer wiring. The first conductive section 121d may be connected to the pad 105b power supply and continue from the site 105b power in the positive direction along the x-axis. In the example semiconductor device 100, the length of the first conductive section 121d in the y direction is constant regardless of the position x. The second conductive section 122d may have a rectangular shape (rectangle in the example semiconductor device 100) is longer in the x direction than in the y direction, and continue along the x-axis. The second conductive section 122d may be connected in its upper right corner 122d1 (first corner) on figs to the end of the first conductive section 121d on the left side in the x direction, that is, the end opposite that connected to the pad 105b power supply. The second conductive section 122d is connected to the section 123d connection in its lower left corner 122d2 (second corner) Nafis diagonally to the corner 122d1. The upper right corner 122d1 on figs is one of the four corners of the second rectangular conductive section 122d, which is nearest to the area 105b of the power supply and the furthest from the third conductive section 124d, as well as from powerful transistor 102. The lower left corner 122d2 on figs is one of the four corners of the second rectangular conductive section 122d, which is the most remote from the site 105b power supply and closest to the third conductive section 124d, as well as to powerful transistor 102.

Section 123d connection may be rectangular. Section 123d connection can be connected to the second conductive section 122d from the upper side in the y direction, that is, the side far from the powerful transistor 102, and is connected to the third conductive section 124d on the lower side in the y direction, that is, the side near to powerful transistor 102. The third conductive section 124d may be connected to the plot 123d connection and continue from the connected area in the positive direction along the x-axis, i.e. the direction in addition to pad 105b power supply. As shown in figa, the third conductive section 124d may be connected to each powerful transistor 102 in the segment 104d. Conductive structure 107d length of the second conductive section 122d in the example is in relation to y may be greater than the length of the first conductive section 121d in the y direction. Also in the conductive structure 107d length 125 of the second conductive section 122d in the x-direction may be equal to the length of 113 segment 104d in the x-direction. In addition or instead, the length of the third conductive section 124d in the x-direction may be equal to the length of 113 segment 104d in the x-direction. As shown in figs, the upper side of the first conductive section 121d and the upper side of the second conductive section 122d may coincide with each other in the y position.

As shown in figs, conductive structure 107a includes a first conductive area a and the third conductive section 124A beaches, but does not include neither the wiring nor the second conductive area. The first conductive area a can be connected to the third conductive section 124A beaches at the end opposite that connected to the pad 105b power supply. The third conductive section 124A beaches can be connected to the first conductive section a and continue from the connected area in the positive direction along the x-axis, i.e. the direction from the site 105b power supply. As shown in figa, the third conductive section 124A beaches can be connected to each powerful transistor 102 in the segment a.

As shown in figs, coprofagia structure 107b includes a first conductive section 121b, section 123b connection and the third conductive section 124b, but does not include the second conductive area. The first conductive section 121b may be connected to the section 123b connection at the end opposite that connected to the pad 105b power supply. Section 123b connection may be rectangular. Section 123b connection can be connected to the first conductive section 121b side, far from powerful transistor 102, and is connected to the third conductive segment 124b on the side near to powerful transistor 102. The third conductive section 124b may be connected to the section 123b connection and continue from the connected area in the positive direction along the x-axis, i.e. the direction from the site 105b power supply. As shown in figa, the third conductive section 124b may be connected to each powerful transistor 102 in the segment 104b.

Next will be explained the relationship between conductive structures 107a-107d. Despite the fact that will be compared conductive patterns C and 107d has the following relation for any two conductive structures track 107 GNDH. The conductive structure s supplies power segment s (first segment), and the conductive structure 107d supplies power segment 104d (second segment) on the left side of the segment is enta s, that is, at the position distant from the site 105b power supply. In this case, the length of the first conductive section s in the x-direction conductive structure s may be longer than the length of the first conductive section 121d in the x-direction conductive structure 107d. To make the resistance of the conductive structures s and 107d are equal to each other or to reduce the difference between them, the length of the first conductive section 121d in the y-direction conductive structure 107d may be set greater than the length of the first conductive section s in the y-direction conductive structure s. In addition, the length of the second conductive section 122d in the y-direction conductive structure 107d may be set greater than the length of the second conductive section s in the y-direction conductive structure s. In the variant example of the second conductive section 122d on the left side of the second conductive section s. Accordingly, the length of the second conductive section 122d in the y direction may be set greater than the length of the second conductive section s in the y-direction through a gap between the second conductive area is conductive patterns C and the first conductive section 121d conductive patterns 107d. By posting in the showing conductive section 122d on the left side of the second conductive section s second conductive section in position, more distant from the site 105b power supply, can be made longer in the y direction. The second conductive section 122d the current flows from the corner 122d1 to the corner 122d2, and thus the resistance decreases for greater length of the second conductive section 122d in the y direction. Although the conductive structure 107b not have a second conductive section, the discussion above applies to the fact that the length of the second conductive section in the y direction is equal to 0.

All areas 123b-123d connections can be of the same form, and all third conductive sections 124A beaches-124d may have the same shape. If form areas 123b-123d connections and form third conductive sections 124b-124d identical between segments 104b-104d, changes resistances from areas 123b-123d connection to the power transistors 102 between segments compensated. As for the conductive patterns 107a, the difference in resistance relative to the other conductive structures 107b-107d, which occurs due to the absence of wiring, can be adjusted by the length of the first conductive section a in the x-direction. When the third conductive sections 124A beaches-124d is connected to the conductive structures of other wiring layers, the length of the third conductive sections 124A beaches-124d in the y direction can be from regulirovanie, in order to equalize the combined resistance of the connected conductive structures per unit length in the x direction. Resistance conductive structures 107a-107d can be equal to each other. However, if the resistance changes less than 10%, the deterioration of image quality does not occur on the basis of printing inkjet printing device.

Figs depicts a view of the track 302 GNDH and pad 105b power supply. Track 302 GNDH includes four independent conductive patterns a-302d. One end of each of the conductive structures a-302d are connected to the pad 105b power supply and the other end connected to one of the respective segments a-104d.

The conductive structure 302d is divided into the first conductive area 321d and the third conductive area 322d sequentially from the site, near to the area 105b of the power supply. The first conductive area 321d connected to the pad 105b power and lasts from the site 105b power in the positive direction along the x-axis. The third conductive area 322d connected to the first conductive section 321d and continues from the connected area in the positive direction along the x-axis, i.e. the direction in addition to pad 105b power supply. As shown in figa, the third conductive area 322d poda is Dinan to each powerful transistor 102 in the segment 104d.

We will explain the result of the comparison of the lengths of the first conductive sections in the y-direction conductive structures of the tracks GNDH in the semiconductor device 100 according to a variant implementation and semiconductor device 300 in the comparative example. Pre-conditions for comparison are the same as pre-conditions for comparison relative paths VH, and their description will not be repeated. Table 2 shows the length of the first conductive sections in the y-direction in the respective conductive structures track GNDH when these pre-conditions. Full width layout" indicates the sum of the lengths of the first conductive sections in the y-direction in the respective conductive structures. For the semiconductor device 100 is shown for reference length of the second conductive sections a-122d in the y direction.

Table 2
The semiconductor device 100 (an implementation option)The semiconductor device 300 (comparative example)
First tokoro-conductive areaSecond tokoro-conductive area First tokoro-conductive area
The conductive structure 107a5,00,0The conductive structure 321a5,0
The conductive structure 107b15,10,0The conductive structure 321b15,1
The conductive structure 107c19,544,5The conductive structure 321c25,1
The conductive structure 107d28,878,4The conductive structure 321d35,2
The total width of the distribution68,4-The total width of the distribution80,3
unit: µm

Table 2 shows that the track 107 GNDH semiconductor device 100 according to a variant implementation is shorter by 15% at full length in the y direction than the track 302 GNDH pressurizat Ognianovo device 300 in the comparative example.

As shown in figa, in the semiconductor device 100 track 106 VH is connected with the left side of the segment in the x direction, and the track 107 GNDH connected with his right hand in the x-direction to reduce the difference between the resistances of the tracks on the heaters in the segment. However, the arrangement may be reversed in another embodiment. More specifically, the track 106 VH may be in the form of the track 107 GNDH and track 107 GNDH may be in the form of tracks 106 VH.

As described above, placement of the second conductive sections in the track 106 VH and track 107 GNDH can resolve changes resistances of the paths to the respective segments and reduce the overall length of the conductive patterns in the y direction.

So it is possible to implement a compact semiconductor device 100, to increase the number of integrated circuits formed from one semiconductor wafer, and thus, to reduce manufacturing cost of an integrated circuit.

In the above embodiment, the second conductive areas are located in the track 106 VH and track 107 GNDH. Even when the second conductive area is placed in one track can be realized a semiconductor device, smaller than conventional semiconductor device 300. The conductive areas and the area of connection is not necessarily on what should be rectangles, and can be rounded or be rounded. For example, the conductive areas may have a stepped shape, like the track 401 VH and track 402 GNDH shown in figa. Although not shown, the conductive areas may be a parallelogram or the like, or a combination of many forms. Also, the first conductive section can be bent in the field 405 near areas 105A and 105b power supply, like the track 403 VH and track 404 GNDH shown in figv.

In the semiconductor device 100 number of segments is four, the number of heaters 101 in one segment four. However, increasing the number of segments to increase the total number of heaters leads to a higher printing speed and higher-definition printing. When the number of segments increases, the number of tracks VH and tracks GNDH also increases, which increases the area of the wiring, which further enhances the effects of option exercise. On the other hand, the two semiconductor devices 100 may be placed together in the x-direction, similarly to the semiconductor device 500 shown in figa. In this case, the semiconductor device 501 and 502 symmetric about the y-axis. Additionally, two of the semiconductor device 500 may be placed in the y-direction, similarly to the semiconductor device is at 510, shown in figv. In this case, the semiconductor device 511 and 512 symmetric about the x-axis.

Other embodiments of the

In another embodiment, the head to eject the liquid, the cartridge for ejection of a liquid and a device for ejection of a liquid using the semiconductor device 100 described in the first embodiment will be described with reference to figa-6D. Figa shows as an example the head to eject the liquid substrate of the print head 600 having the semiconductor device 100 described in the first embodiment, as the base 601. Figa shows the heater 101 in the first embodiment, as teploobrazovanija block 602. For convenience of description, the portion of the top plate 603 is cut. As shown in figa, elements 606 of the walls of the liquid channel for forming liquid channels 605, communicating with many holes 604 and the top plate 603 having a channel 607 ink supply, combined with the base 601, forming the printhead 600. In this case, the ink introduced through the channel 607 ink supply is stored in the internal common ink chamber 608 and then fed to each liquid channel 605. In this state, the base 601 is driven to eject ink from the hole 604.

Figv depicts a view for explaining in what her layout inkjet cartridge 610 as an example of the cartridge to release liquid. The cartridge 610 includes a print head 600 having a number of holes 604, and the capacity of 611 for ink, which stores the ink, which will be submitted to the printhead 600. The capacity of 611 for ink serving as containers for liquid, removable printhead 600 on the boundary of K. the Cartridge 610 has an electrical contact (not shown) for receiving afferent signal from the carriage when it is installed in the printing device shown in figs. In accordance with the resulting signal is driven fuel block 602. The capacity of 611 for ink contains a fibrous or porous ink absorber to hold the ink. The ink absorber to hold the ink.

Figs depicts a General view showing the external appearance of an inkjet printing device 700 as an example of a device for ejection of the liquid. Inkjet printing device 700 includes a cartridge 610 and can realize high-speed printing and high quality printing by means of the control signal applied to the cartridge 610. In the inkjet printing device 700 cartridge mounted on the carriage 720, which is coupled with the screw groove 721 lead screw 704, which is rotated by means of gears 702 and 703 of the driving force in synchronization with rotation clockwise/counterclockwise drive on the " 701. By the driving force of a drive motor 701 cartridge 610 can perform reciprocating motion in the directions indicated by arrows a and b along the guide 719 together with the carriage 720. Plate 705 clamp the paper to the printing paper P is transported on the platen 706 feeder print media (not shown), presses the printing paper P to the roller 706 in the direction of movement of the carriage. Optocoupler 707 and 708 confirm the presence of the lever 709 attached to the carriage 720 in the area where the optocoupler 707 and 708, and detects the initial position, to perform switching of the direction of rotation of a drive motor 701 and the like. Supporting element 710 supports the covering element 711 to cover the entire surface of the cartridge 610. Section 712 of the suction sucks the internal contents of the covering element 711 in order to restore the cartridge 610 suction through the hole of the nozzle. The movable element 715 allows the movement of the cleaning blade 714 back and forth. Support plate 716 main body supports the cleaning blade 714 and the movable element 715. The cleaning blade 714 is not limited to the form shown in figs, and a well-known cleaning blade applies for option exercise. The lever 717 placed to start the suction of the suction recovery. The lever 717 move is carried out along with the movement of the Cam 718, coupled with the carriage 720, and its movements are controlled in a known manner of transmission, such as switching clutch in accordance with driving force from a drive motor 701. The main body device includes a control unit seal (not shown), which sends a signal teploobrazovaniem block 602 cartridge 610 and controls the actuation of each mechanism, such as a drive motor 701.

The layout of the control circuit for performing control the inkjet printing device 700 will be explained with reference to the flowchart shown in fig.6D. The control circuit includes an interface 800 that receives the print signal, MP (microprocessor) 801, a ROM 802 program, which stores the control program which will be performed by MP 801. The control circuit also includes a dynamic RAM (random access memory) 803 for saving various data (for example, the print signal and print data, which will be submitted to the head) and a logical matrix 804, which manages the flow of print data to the printhead 808. Logical matrix 804 also controls data transfer between the interface 800, MP 801 and RAM 803. Additionally, the control circuit includes a motor 810 carriage for transporting the printhead 808 and the engine 809 transportation for transporting ecatel paper. In addition, the control circuit includes a circuit 805 for head control and circuits 806 and 807 for controlling the motor to actuate the motor 809 transportation and motor 810 carriage, respectively. Action layout control will be explained. When the print signal is injected into the interface 800, it is converted into print data for printing between the logical matrix 804 and MP 801. Then trigger circuit 806 and 807 for controlling the motor. At the same time the print head is brought into action in accordance with print data sent to the circuit 805 for head control, through this conduct printing.

Although the present invention has been described with reference to exemplary embodiments of the implementation, it should be understood that the invention is not limited to the disclosed exemplary embodiments of the implementation. The volume of the following claims should be given a wide interpretation so as to encompass all such modifications and equivalent structures and functions.

1. Semiconductor device, in which many segments formed on the semiconductor substrate, and each segment includes multiple trigger blocks to release liquid in the nozzle, each activating unit includes activating schema and element, which is arranged to bring in on the op perate by activating schema, for applications to fluid energy to eject the liquid in the nozzle, thus
the semiconductor device includes a ground power supply, which is configured to receive external power, and many of conductive structures, which are made with the ability to deliver power from the power supply to the respective segments,
each of the conductive structures includes
the first conductive area connected to the ground power supply and passing in the first direction,
the second rectangular conductive patch, passing in the first direction,
the third conductive area connected to multiple trigger blocks, and
plot connections, which provides connection of the second conductive segment and the third conductive area,
the length of the second conductive section in a second direction perpendicular to the first direction, is greater than the length of the first conductive area in the second direction,
the second conductive section connected to the first conductive segment in the first corner and plot connection in the second corner diagonally to the first corner, and
the third conductive section goes from section connected to the wiring in the first direction.

2. The device according to claim 1, in which the first angle W is cerned conductive section is the angle in position, near to the ground power supply and the furthest from the third conductive area among the corners of the second conductive section.

3. The device according to claim 1, wherein a set of segments includes a first segment and a second segment in a position more distant from the site of power than the first segment,
the length of the first conductive area in the second direction in the conductive structure, which supplies power to the first segment, is less than the length of the first conductive area in the second direction in the conductive structure, which supplies power to the second segment, and
the length of the second conductive section in the second direction in the conductive structure, which supplies power to the first segment, is less than the length of the second conductive section in the second direction in the conductive structure, which supplies power to the second segment.

4. The device according to claim 1, in which the resistance of the set of conductive structures are equal to each other.

5. The device according to claim 1, in which the length of the third conductive sections in the second direction in the set of conductive structures are equal to each other.

6. The device according to claim 1, in which the length of the segment in the first direction in which the conductive structure is configured to supply power equal to the length of the second conductive teaching the TKA in the first direction in the conductive structure.

7. Head to eject liquid containing
the semiconductor device according to claim 1 and
the nozzle, the ejection of the liquid from which is controlled by a semiconductor device.

8. The cartridge for ejection of a fluid containing cylinder for ejection liquid according to claim 7 and a reservoir for storing fluid.

9. A device for ejection of a fluid containing cylinder for ejection liquid according to claim 7 and a power supply unit configured to supply an activating signal to eject fluid to the cylinder to release liquid.



 

Same patents:

FIELD: process engineering.

SUBSTANCE: fluid ejecting head comprises ejecting element silicon substrate with one surface provided with generator of power for fluid ejection and substrate support. Proposed method consists in that pitch composition to be cured on heating is placed between said substrate and support element so that portion of rear surface of substrate one surface comes in contact with both sides of support element. Then, light comprising at least ultraviolet rays and infrared rays is emitted onto said pitch composition from the side of ejecting element substrate through silicon plate to cure said composition.

EFFECT: higher printing quality of said head.

8 cl, 5 dwg

FIELD: measurement equipment.

SUBSTANCE: invention refers to element base of head with electrothermal converter, recording head and recording device. Element base of head, which includes many recording elements, contains the receiving device of the data in which data bits of pulse width of drive are inserted between recording data bits, device of extracting the recording data from the data received with the receiving device, and device of signal generation of pulse width of the drive determining the period of switching on the power of many recording elements by extracting the data of pulse width of the drive from the data received with the receiving device; at that, many recording elements are brought into action on the basis of the recording data extracted with the extraction device, and the drive pulse width signal. Recording device for performing the recording by means of recording head includes generation device of recording data and drive pulse width data, multiplexing device for generation of data bits of drive pulse width, in which there digitised is drive pulse width signal, and recording data bits, and device for transmitting the data generated with the multiplexing device to the recording head.

EFFECT: invention allows reducing the data receiving period and can multiplex the recording data and drive pulse width signal.

13 cl, 23 dwg

FIELD: polygraphy.

SUBSTANCE: ink cartridge comprises printing head for thermal jet printing. The said printing head incorporates element to generate heat for ejecting ink out through appropriate orifice. Aforesaid element in contact with ink features a protective layer comprising at least one component selected from the group consisting of silicon nitride and silicon carbide. Proposed inks comprise at least one component selected from polyvalent carboxylic acid and its salts. Note that aggregate level of content of aforesaid chemicals varies from at least 0.001 mmol/l to not less than 0.5 mmol/l.

EFFECT: expanded performances.

7 cl, 8 dwg, 8 tbl

FIELD: printing industry.

SUBSTANCE: invention concerns fluid recording head. Fluid recording head for recording by drop ejection from multiple ejection orifices in the substrate includes multiple first ejection orifices, each for ejection of rather large volume drops; multiple second ejection orifices, each for ejection of rather small volume drops; power generation elements for drop ejection from multiple first and second ejection orifices; storage tank for fluid ejected from multiple first and second ejection orifices; at least two first fluid passages for fluid flow between fluid tank and each of the first ejection orifices; and second fluid passage for fluid flow between fluid tank and each of the second ejection orifices.

EFFECT: concordance of small and large drop ejection rates, maintenance of normal ejection mode.

13 cl, 13 dwg

FIELD: mechanics.

SUBSTANCE: proposed fluid ejection device incorporates heating cells comprising the first stock of heating cells and second stock of heating cells, the first address generator designed to generate signal in response to the control signal for selective sequence of the first address signals used to activate the first stock of heating cells and to generate the second address signals to activate the second stock of heating cells. Note here that the second sequence of signals is sent irrespective of the first one. The control signals are received and in response to the control signals the first sequence of the first address signals is selectively sent out to activate the first stock of heating cells and then the second sequence is sent to activate the second stock of heating cells. Note here that for selective transmission control pulses in one of the control signals are received, along with the sequence of the sync pulses in the control signals. Note here that to initiate the first and second sequences, the control signals are duly processed.

EFFECT: higher speed and quality of printing.

20 cl, 20 dwg

FIELD: technological processes; printing industry.

SUBSTANCE: device for ejection of fluid medium contains multiple activating cells, activation bus bar arranged with the possibility of energy signal reception and generator of address intended for formation of address signals sequence. Address generator contains shift register, which has double-stage cells designed for reception of input signal and storage of input signal, and logical elements that are intended for reception of input signals during every address time slot and formation of address signals sequence. Energy signal represents pulse of energy during every address time slot in sequence of address time slots for excitation of selected permitted activating cells. Unit of printing head is suggested that contains controller for generation of set of signals, in preset configuration, the first bus bar for passage of the first pulses, the second bus bar for passage of the second pulses, the first group of resistors and the second group of resistors, which are connected with the possibility to conduct on the basis of mentioned set of signals and pu;se signals.

EFFECT: device provides specific height of printing strip and makes it possible to retain costs.

22 cl, 27 dwg

FIELD: printing.

SUBSTANCE: invention relates to a substrate for jet printing head, printing head and jet printing device. The said substrate with electrical heat converters intended for generation of heat required for releasing the ink incorporates a logic circuit to generate a unit selection signal to select the said converters in separate units proceeding from the voltage amplitude first level input signal and the element excitation signal for excitation of every electrical heat converter in the selected unit at the second voltage amplitude level exceeding the first one, and the excitation circuit intended for every electrical heat converter to excite the said converters in separate units proceeding from the unit selection and element selection signals of the second level of voltage amplitude, the said signals coming from the logic circuit. The method of controlling the excitation of electrical heat converters incorporates feeding the voltage amplitude first level input signal allowing for the input signal, the unit selection signal to select the unit of electrical heat converters in separate units and the element excitation signal to excite every electrical heat converter in the selected unit at the second level of the voltage amplitude exceeding that of the first one, and exciting the electrical heat converters in separate units allowing for the unit selection and element selection signals of the second voltage amplitude level coming from the logic circuit, the above functions are realised by exciting the excitation circuit designed for every electrical heat converter. The jet printing head contains outlets for ink and the substrate supporting the electrical heat converters arranged in compliance with outlets. The jet printing head cartridge carries a jet printing head and a cup filled with ink to be fed into the printing head. The jet printing device has outlets to let out the ink and a substrate whereon installed are electrical heat converters arranged in compliance with outlets. The circuit design is developed wherein the logic excitation voltage is converted into the voltage of elements excitation without increase in the length of segments in direction perpendicular to the direction of the matrix of segments. Annual output of finished products is increased and circuitry is simplified by reducing the circuit of pulse-amplitude modulation and the number of elements on the substrate.

EFFECT: increased annual output and simplified circuitry.

12 cl, 12 dwg

FIELD: engineering of stream printing devices containing printing head assembly, receiving signals for activating drop generators for selective discharge of ink.

SUBSTANCE: device for controlling operation of drop generators is made so, that only one of them is enabled at one time moment. Device for controlling operation of drop generators is made with possible generation of signal of address and first resolution signal before excitation current for first drop generator and second resolution signal before excitation current for second drop generator.

EFFECT: prevented cross interferences on liquid during simultaneous discharge of drops from closely positioned drop generators.

2 cl, 11 dwg

FIELD: engineering of jet printing devices.

SUBSTANCE: device contains jet printing head, having a set of electric contacts: address contacts and resolution contacts for unblocking drop generators 42, and excitation currents contacts for feeding excitation currents for enabling drop generators for selective discharge of ink from them. Generated in printing device are periodic signals of address (A(1-13)) and signals of resolution (E(1-2)) for contacts of address and resolution on printing head. Also, fed selectively from printing device are excitation currents (P(1-16)) to perform generation of images on print carrier. Each individual heating element 44 is controlled by excitation circuit, containing three field transistors 48,50,52. Under effect of first and second signals, E(1) and E(2), and address signal A(1), switching device 48 selectively switches on for letting current through heating element 44, in case if excitation current is received from excitation source P(1).

EFFECT: decreased number of contacts between printing head and printing device, high quality of printing due to provision of possible positioning of large amount of drop generators in printing heads.

4 cl, 11 dwg

FIELD: jet printers.

SUBSTANCE: device has to be jet-printing head. Printing head has many drop generators reacting to excitation current and address signals; printing head is used for releasing ink. Jets printing head has first and second drop generators disposed in printing head. Any drop generator is made for reception excitation current from excitation current source. Any drop generator is made for reception of address signals from common address source. Jet printing head also has switching unit connected between common address source and any drop generator. Switching device is made for reaction to resolution signals for selective application of address signal for either first or second drop generator.

EFFECT: high speed of printing.

21 cl, 11 dwg

FIELD: ink jet printers.

SUBSTANCE: method includes precipitating resistive layer and conductive layer on insulated substrate, forming a resistive heating element, forming of insulating barrier layer above contour of said conductive layer, forming of gap in said barrier layer, forming of metallic layer being in electrical contact with said conductive layer contour through said gap, having geometry, which opens predetermined portion of said contour of conductive layer, making a layout from metallic layer from said contour of conductive layer through said gap in insulating barrier layer to adjacent portion of said insulated substrate, so that layout from metallic layer on said adjacent portion of said insulating substrate forms a relatively large and flat area, remote from said conductive layer contour, for forming displaced spring contact. After precipitation of resistive layer and conductive layer on insulating substrate, contour of conductive layer is formed first, having a recess, forming later said resistive heating element, and then contour of resistive layer is formed with overlapping of conductive layer contour for value, exceeding precision of combination during lithography process and error of dimensions during etching of resistive layer.

EFFECT: higher quality, higher reliability, higher efficiency.

2 cl, 10 dwg

FIELD: printers.

SUBSTANCE: printer has ink cartridge, carriage where ink cartridge is installed, and printing head mounted onto carriage. Ink cartridge has case for placing ink, ink supplying department where hole for feeding ink is formed, memory unit for storing data on ink in case, contact outputs unit disposed onto second side wall of case and connected with memory unit. Hole for supplying ink is disposed onto first side wall of case. Cartridge has fitting element protruding from second side wall of case for correct installation of ink cartridge relatively printer at the moment when ink cartridge is placed into printer. Precise connection of ink's output unit and printer's output unit is provided. Higher degree of freedom is provided at installation of ink cartridge's contact output unit.

EFFECT: improved efficiency of operation.

28 cl, 16 dwg

FIELD: jet printing, in particular, narrow-film jet printing head having control circuits on field transistors configured so as to compensate for the parasitic resistance of supply routes.

SUBSTANCE: the narrow jet printing head (100A) has effective control circuits on field transistors, which are configured so as to compensate for the parasitic resistances of the supply routes (86a, 86b, 86c, 86d). In addition, the jet printing head has ground buses, which overlap the active areas of the control circuits on field resistors.

EFFECT: provided compactness of the head at a large number of drop formers.

21 cl, 15 dwg

FIELD: jet printers.

SUBSTANCE: device has to be jet-printing head. Printing head has many drop generators reacting to excitation current and address signals; printing head is used for releasing ink. Jets printing head has first and second drop generators disposed in printing head. Any drop generator is made for reception excitation current from excitation current source. Any drop generator is made for reception of address signals from common address source. Jet printing head also has switching unit connected between common address source and any drop generator. Switching device is made for reaction to resolution signals for selective application of address signal for either first or second drop generator.

EFFECT: high speed of printing.

21 cl, 11 dwg

FIELD: engineering of jet printing devices.

SUBSTANCE: device contains jet printing head, having a set of electric contacts: address contacts and resolution contacts for unblocking drop generators 42, and excitation currents contacts for feeding excitation currents for enabling drop generators for selective discharge of ink from them. Generated in printing device are periodic signals of address (A(1-13)) and signals of resolution (E(1-2)) for contacts of address and resolution on printing head. Also, fed selectively from printing device are excitation currents (P(1-16)) to perform generation of images on print carrier. Each individual heating element 44 is controlled by excitation circuit, containing three field transistors 48,50,52. Under effect of first and second signals, E(1) and E(2), and address signal A(1), switching device 48 selectively switches on for letting current through heating element 44, in case if excitation current is received from excitation source P(1).

EFFECT: decreased number of contacts between printing head and printing device, high quality of printing due to provision of possible positioning of large amount of drop generators in printing heads.

4 cl, 11 dwg

FIELD: engineering of stream printing devices containing printing head assembly, receiving signals for activating drop generators for selective discharge of ink.

SUBSTANCE: device for controlling operation of drop generators is made so, that only one of them is enabled at one time moment. Device for controlling operation of drop generators is made with possible generation of signal of address and first resolution signal before excitation current for first drop generator and second resolution signal before excitation current for second drop generator.

EFFECT: prevented cross interferences on liquid during simultaneous discharge of drops from closely positioned drop generators.

2 cl, 11 dwg

FIELD: printing.

SUBSTANCE: invention relates to a substrate for jet printing head, printing head and jet printing device. The said substrate with electrical heat converters intended for generation of heat required for releasing the ink incorporates a logic circuit to generate a unit selection signal to select the said converters in separate units proceeding from the voltage amplitude first level input signal and the element excitation signal for excitation of every electrical heat converter in the selected unit at the second voltage amplitude level exceeding the first one, and the excitation circuit intended for every electrical heat converter to excite the said converters in separate units proceeding from the unit selection and element selection signals of the second level of voltage amplitude, the said signals coming from the logic circuit. The method of controlling the excitation of electrical heat converters incorporates feeding the voltage amplitude first level input signal allowing for the input signal, the unit selection signal to select the unit of electrical heat converters in separate units and the element excitation signal to excite every electrical heat converter in the selected unit at the second level of the voltage amplitude exceeding that of the first one, and exciting the electrical heat converters in separate units allowing for the unit selection and element selection signals of the second voltage amplitude level coming from the logic circuit, the above functions are realised by exciting the excitation circuit designed for every electrical heat converter. The jet printing head contains outlets for ink and the substrate supporting the electrical heat converters arranged in compliance with outlets. The jet printing head cartridge carries a jet printing head and a cup filled with ink to be fed into the printing head. The jet printing device has outlets to let out the ink and a substrate whereon installed are electrical heat converters arranged in compliance with outlets. The circuit design is developed wherein the logic excitation voltage is converted into the voltage of elements excitation without increase in the length of segments in direction perpendicular to the direction of the matrix of segments. Annual output of finished products is increased and circuitry is simplified by reducing the circuit of pulse-amplitude modulation and the number of elements on the substrate.

EFFECT: increased annual output and simplified circuitry.

12 cl, 12 dwg

FIELD: technological processes; printing industry.

SUBSTANCE: device for ejection of fluid medium contains multiple activating cells, activation bus bar arranged with the possibility of energy signal reception and generator of address intended for formation of address signals sequence. Address generator contains shift register, which has double-stage cells designed for reception of input signal and storage of input signal, and logical elements that are intended for reception of input signals during every address time slot and formation of address signals sequence. Energy signal represents pulse of energy during every address time slot in sequence of address time slots for excitation of selected permitted activating cells. Unit of printing head is suggested that contains controller for generation of set of signals, in preset configuration, the first bus bar for passage of the first pulses, the second bus bar for passage of the second pulses, the first group of resistors and the second group of resistors, which are connected with the possibility to conduct on the basis of mentioned set of signals and pu;se signals.

EFFECT: device provides specific height of printing strip and makes it possible to retain costs.

22 cl, 27 dwg

FIELD: mechanics.

SUBSTANCE: proposed fluid ejection device incorporates heating cells comprising the first stock of heating cells and second stock of heating cells, the first address generator designed to generate signal in response to the control signal for selective sequence of the first address signals used to activate the first stock of heating cells and to generate the second address signals to activate the second stock of heating cells. Note here that the second sequence of signals is sent irrespective of the first one. The control signals are received and in response to the control signals the first sequence of the first address signals is selectively sent out to activate the first stock of heating cells and then the second sequence is sent to activate the second stock of heating cells. Note here that for selective transmission control pulses in one of the control signals are received, along with the sequence of the sync pulses in the control signals. Note here that to initiate the first and second sequences, the control signals are duly processed.

EFFECT: higher speed and quality of printing.

20 cl, 20 dwg

FIELD: printing industry.

SUBSTANCE: invention concerns fluid recording head. Fluid recording head for recording by drop ejection from multiple ejection orifices in the substrate includes multiple first ejection orifices, each for ejection of rather large volume drops; multiple second ejection orifices, each for ejection of rather small volume drops; power generation elements for drop ejection from multiple first and second ejection orifices; storage tank for fluid ejected from multiple first and second ejection orifices; at least two first fluid passages for fluid flow between fluid tank and each of the first ejection orifices; and second fluid passage for fluid flow between fluid tank and each of the second ejection orifices.

EFFECT: concordance of small and large drop ejection rates, maintenance of normal ejection mode.

13 cl, 13 dwg

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