Method of making plated holes in printed-circuit board

FIELD: physics.

SUBSTANCE: method involves making holes in a substrate by moving the focal spot of focused laser radiation and plating said holes. The laser radiation is in form of a cone with a focal spot at its vertex. The focal spot is moved vertically downwards from the upper surface of the board to the lower surface of the board, under which, before piercing, a substrate of electroconductive material which reflects laser radiation is placed. Reflected laser radiation is used when piercing. The holes are then plated via electric gas discharge by applying voltage with one pole to the substrate and another pole to a ring which encircles the laser radiation and which is placed over the printed-circuit board.

EFFECT: simple and faster process of plating laser-pierced holes in a printed-circuit board.

1 dwg

 

Scope

A new way of firmware and metallization of holes in a printed circuit Board by laser radiation relates to the handling electronic circuit boards in plastic design with a surface metallization through the creation of internal pressure in a printed circuit Board with a laser beam and is designed to prepare the installation and solder manufactured in the holes of the electronic parts.

Analogs

There is a method of firmware precision holes by laser radiation (RF Patent No. 2192341, IPC 7 WK 26/38, op. 10.11.2002). It includes the generation of laser radiation by excitation of one or more active elements, the q-switched resonator and the creation of radiation in the form of trains of pulses with a laser shutter, collimation and focusing of the laser radiation on the workpiece and the management of its intensity during processing of the workpiece.

As well as the fact that it generates radiation with s - or p-polarization, direct it to the element which transmits radiation only in the direction of the workpiece, and in the process control laser intensity increases the intensity of the pulse in Zug as the penetration hole channel.

There is a method of metallization of holes in a dielectric substrate (Patent RF №1820831, IPC 6 NC 3/18, op. 10.03.1996). the n includes forming holes in the substrate by laser and metallization.

But metallization of the holes is carried out by treatment of their surfaces in solutions - perform the activation, and further chemical and galvanic metallization of holes that lengthens, adds cost and complexity to the method.

Prototype

The closest to the new method is a method of firmware holes mainly of small diameter in the layers of printed circuit boards (Patent RF №1610704, IPC 5 B23K 26/00, op. 15.02.1994). It processing produce controlled by the pulse frequency of laser radiation in the process of moving with variable speed processed Board. While the focal spot of the focused laser beam is supported stationary or moving relative to the moving workpiece Board with speed, a slower speed of movement of the Board.

The invention

A new way of firmware and metallization of holes in a printed circuit Board by laser radiation is the formation of holes in the substrate by moving the focal spot of the focused laser beam and metallization.

New in it is the fact that the laser radiation is formed in a cone shape (for example, a lens with a focal spot at the top, move the focal spot vertically downwards (for example, by moving the lens down) from the top surface of the Board to the bottom of the card, which before the firmware on kladivo a substrate of electrically conductive material, the mirror reflects the laser light in the flashing process receive the reflected laser radiation and after the firmware holes get sharp increase of the signal from the reflected laser radiation, and then carry out the metallization of the holes (conical) electric gas discharge, which makes the voltage of one pole to the substrate, and the other pole to the ring placed over the circuit Board and covering the laser radiation.

The technical result

The technical result of the new method is a simplification and acceleration of the process of metallization layers by laser radiation holes in the Board.

The technical result (simplifying and accelerating the process of metallization layers by laser radiation holes in the Board) is achieved in a new way, through refusal galvanic (electrochemical) procedures metallization in favor deposition of metal on the wall of the hole of the electrical gas discharge in the separation of metal from the substrate and spread it on the walls of the holes of the gas discharge.

Description of the drawing.

The figure shows the scheme of realization of the new method. It shows the card 1 on the substrate 2, is connected to the voltage source 3, which is also connected to the ring 4, covering the focused and reflected laser radiation, pok is related by arrows.

Description of principle

The laser radiation generated by the laser focus using the lens and move the focal spot formed vertically downwards (for example, by moving the lens down) with the upper surface of the Board 1 to its lower surface. As a result it burned a hole. The substrate 2 mirror reflects the laser radiation at the end of the firmware holes, the result is a sharp increase of the signal from the reflected laser radiation. Then from the voltage source 3 making the voltage between the substrate 2 and the ring 4 is placed over the circuit Board and covering the laser radiation. Formed by electrical discharge, which pulls the metal from the substrate 2 and throws it on the walls of the holes in the circuit Board 1.

A method of manufacturing a plated holes in a printed circuit Board that includes the firmware holes focused laser radiation and its subsequent metallization, characterized in that in the process of firmware holes move the focal spot of the laser radiation vertically downward from the upper surface of the Board to the bottom of the card, which before flashing enclose a substrate of electrically conductive material, the mirror reflecting the laser light in the flashing process receive the reflected laser radiation, and after firmware holes ASU is estlat metallization of the holes of the electrical gas discharge by applying a voltage to one pole to the substrate, and the other pole to the ring, which is fitted over the circuit Board with the possibility of coverage of laser radiation.



 

Same patents:

FIELD: electricity.

SUBSTANCE: method involves the following: prior to application of electroplated conductive copper coating to the fibre-glass plastic surface and to inner surface of bypass openings there applied is thin silver coating with thickness of 2÷4 mcm using the chemical method, silver salts, protected with polymer film or photoresist material; pattern of electroconductive scheme is formed, and after creation of electroconductive paths and electroplated metal coating of inner surface of bypass openings the protective polymer coating is removed and thin metal coating is etched from the sections not protected with metal resistive coating.

EFFECT: elimination of activation of fiber-glass plastic surface and holes using expensive palladium chloride; and elimination of power loss, especially at low currents, due to big difference in electric resistance of silver and palladium.

FIELD: chemistry.

SUBSTANCE: method for metal coating holes in multilayer printed-circuit boards involves deoiling and pickling the workpiece, treating said workpiece in a silver solution based on potassium ferrocyanide and potassium rhodanate, sensitisation in a tin chloride solution, activation in a palladium chloride solution, chemical copper plating, galvanic copper plating and thermodiffusion treatment in an argon medium while raising temperature in steps. Galvanic copper plating in pyrophosphate electrolyte at temperature of about 40°C and raising temperature in steps during thermodiffusion treatment in an argon medium are carried out in the following modes: (40±0.1)°C for 64930 s; (41±0.1)°C for 41956 s; (42±0.1)°C for 528 s; (43±0.1)°C for 260 s; (44±0.1)°C for 97 s; (45±0.1)°C for 52 s; (46±0.1)°C for 33 s; (47±0.1)°C for 16 s; (48±0.1)°C for 10 s; (49±0s1)°C for 7 s.

EFFECT: high reliability of interlayer connections in multilayer printed-circuit boards, shorter cycle for making printed-circuit boards and reduced labour input of the process.

The invention relates to the field of microelectronics, in particular to devices printed circuit boards

The invention relates to the field of electrical engineering, in particular to methods of applying metal coating on the substrate with a polymeric surfaces in the manufacture of printed circuit boards with tiny holes and fine structure
The invention relates to the production of electronic equipment, namely the technology of printed circuit boards

The invention relates to the manufacture of multilayer printed circuit boards, in particular to the preparation for metallization of through conical holes

Bulk pcb // 2173945
The invention relates to the field of microelectronics, in particular to devices printed circuit boards

The invention relates to electrical engineering, radio engineering, electronics and microwave technique, in particular metal oxide PCB, and can be used in the manufacture of metal oxide printed circuit boards using the metal base circuit Board as a ground bus

Contact site // 2134498
The invention relates to the manufacture of permanent connections in the production process apparatus on the basis of microelectronics and semiconductor devices, and specifically to the contact nodes through which the Assembly, including multilayer switching structures for multichip modules (MCM)and mounting of crystals of BIS on the switching structure in the manufacturing process ΜM

FIELD: process engineering.

SUBSTANCE: invention relates to gas laser cutting of composite materials. Proposed method comprises feeding laser beam to machined surface and process gas, aligned therewith, collimating laser beam, embedding it in machined article and displacing by preset program in the presence of process fluid. Fluid jet is fed as swirled coaxially with laser beam into cutting thermal effect zone. Proposed device comprises laser cutter case wit focusing lens, union to feed process gas, nozzle, and cylindrical vessel with annular channel to feed process fluid. Said annular channel incorporates hollow tapered adapter with inner surface representing helical grooves to swirl fluid flow.

EFFECT: higher quality of cutting.

4 cl, 3 dwg

FIELD: process engineering.

SUBSTANCE: this invention relates to cutting of metals by laser. Its use allows expanding operating performances by application of independent operation of two or more laser heads at one machine tool. Laser cutting machine tool comprises: bed 1, at least, one longitudinal guide 2, at least, two transverse guides 3, at least, two laser heads 4 and computer. Every transverse guide 2 is mounted on longitudinal guide 2 for independent displacement while every laser head 4 is mounted on transverse guide 3 for independent horizontal and vertical displacement. Drives of transverse guides and laser heads are connected to computer for independent program control thereof.

EFFECT: six-axis control over laser heads.

1 dwg

FIELD: metallurgy.

SUBSTANCE: laser beam of short-wave laser 1 is directed to reflecting rotary mirror 13, reflecting mirror 14 and, therefrom, into lens 10 on focusing lens 15, and, via central conical nozzle 5, in pulse mode with amplitude equal to thickness of material being cut, into cutting zone 17. Laser annular beam of long-wave laser 2 is directed to reflecting mirror 13 and, therefrom, to focusing lens 10, wherein beam is reflected by annular mirrors 11, 12 and, besides, directed via central conical nozzle 5 into cutting zone 17. Simultaneously, process gas is fed from gas feed system 8 into annular converging-diverging supersonic nozzle 6 with skewed edge 7 at outlet to effuse therefrom onto material being cut.

EFFECT: required cutting depth and high surface quality.

3 cl, 2 dwg

FIELD: metallurgy.

SUBSTANCE: preliminary construction of calibration curve of dependence of cutting depth of specimen of the specified metal or its alloy on parameters of incident laser radiation to surface is performed at monotonic increase in specific power of laser radiation from value of 0.1 J/cm2·s to the value at which through cutting occurs. Then, metal or its alloy is molten-through along cutting line with laser beam by moving the laser beam progressively at speed V, and at the same time its rotation with radius R is performed. Radius R and angular rotation speed of laser beam ω is chosen considering the cut width and radius of laser beam.

EFFECT: high cutting speed at effective use of laser beam energy.

4 cl, 3 dwg, 1 ex

FIELD: process engineering.

SUBSTANCE: invention relates to separation of semiconductor chip surface layer. In compliance with first version, focused laser beam is directed onto chip so that its focus is located at layer separation plane perpendicular to beam axis and displaced to scan layer separation plane in direction of chip exposed side surface and deep down to make continuous cutout. In compliance with second version, focused laser beam is directed onto chip so that focus is located in layer separation plane perpendicular to beam axis and displaced in said plane to produce non-overlapping local regions with disturbed chip structure topology and weakened atomic bonds. Said local regions are distributed over entire said plane. External effects are applied to layer being separated to destruct said weakened atomic bonds.

EFFECT: separation of lateral surface layers from semiconductor crystals.

9 cl, 14 dwg, 12 ex

FIELD: process engineering.

SUBSTANCE: proposed method may be used in nuclear power engineering and other branches of machine building. Proposed method comprises focusing laser beam at material and feeding protective inert gas into cutting zone. Inert gas is fed via nozzle at its outlet pressure of, at least, 3.5·10-5 MPa. Note here that laser beam with wavelength of 1.06-1.07 mcm is used and directed via said nozzle coaxially with its lengthwise axis.

EFFECT: higher efficiency and quality, ruled out metal corrosion.

2 cl, 1 dwg, 2 ex

FIELD: process engineering.

SUBSTANCE: method of moulding cells for vessels or bottles for bottle washing machines. Proposed method comprises the following stages: moulding cell blank 3a from synthetic material and machining it. Said machining includes material removal or dissection to produce structures required for functioning and/or hardening cell 3, and/or for reducing weight of said cell.

EFFECT: higher strength and quality of complex cells.

9 cl, 5 dwg

FIELD: process engineering.

SUBSTANCE: invention relates to metal machining by laser beam. Proposed method comprises stages described below First step comprises making first bore with initial diameter and bore axis. Second step comprises displacing laser beam and rotating it about bore axis to produce intermediate bore aligned with initial bore but with larger diameter. Third step comprises displacing laser beam focus along bore axis and finishing said bore by pulsed laser beam.

EFFECT: boring in composite material with ceramic substrate, for example in gas turbine engine combustion chamber or vane.

11 cl, 6 dwg

FIELD: metallurgy.

SUBSTANCE: plate (7) is positioned parallel to first plate (5) and at close distance from it so, that outline of orifice (73a) is located opposite to outline of cut-out orifice (53a). Protective device (10) in form of plate of specific thickness with the third orifice (10a) and with outline set off inside relative to outline of second orifice (73a) is placed between two plates (5 and 7). Further, the first orifice is cut out.

EFFECT: prevention of melt metal hitting second orifice, of deviation of laser beam at cutting and of losses of density of laser beam power output.

7 cl, 4 dwg

Cutting tool // 2417879

FIELD: process engineering.

SUBSTANCE: invention relates to cutting tools and may be used for cutting whatever materials. Proposed cutting tool comprises top and bottom parts that may be parted by separating appliances. At least, one of top and bottom parts comprises cutting device while top and bottom parts are retained together by magnets made up of first and second magnetic appliances arranged on top and bottom parts. Metal strip is arranged atop the cutting tool to joint first and second magnetic appliances to, at least, top or bottom part. Invention covers also the method of cutting with the help of above described tool.

EFFECT: improved control over cutting tool, better quality of cutting.

24 cl, 25 dwg

FIELD: testing engineering.

SUBSTANCE: device comprises optical quantum generator, system for focusing the laser beam with the unmovable lens, and movable base for securing the object to be cut. The movable base is made of rotating platform mounted on the driving shaft of the mechanism for discrete control of the speed of rotation. The mechanism is made of an assembly of driven and driving pulleys connected by means of the driving belt. The rotating platform is provided with the model of the object to be cut. The driving belt that connects the driven and driving pulleys is made of a vibration insulation material. The driven shaft of the rotating platform is set in bearings, is provided with a mechanism for control of tension of the driving belt, and is mounted on the traverse gear.

EFFECT: decreased time and reduced power consumption of testing.

1 cl, 2 dwg

Up!