Method of manufacturing substrate for head for ejecting fluid and method of processing substrate

FIELD: printing.

SUBSTANCE: method for processing a substrate of head for ejecting the fluid includes the stage of providing the substrate and the stage of providing a deepened section on the rear surface of the substrate by ejecting fluid in a linear form from the rear surface of the substrate, and by processing the rear surface of the substrate by laser light which passes along the fluid and in the liquid.

EFFECT: increased mechanical strength of the substrate.

9 cl, 10 dwg

 

The technical field to which the invention relates

The present invention relates to a method of manufacturing a substrate for a head to eject the liquid. More specifically, the present invention relates to a method of manufacturing a substrate for a recording head used for an inkjet printhead. In addition, the present invention relates to a method of processing a substrate.

Prior art

Type printhead, which is called the head with side spray ink is used as ink-jet printhead (in this document may be referred to as a "printhead"), which ejects ink onto the medium to be printed. Head with side spray ink ejects ink to the upper side of the heater, which block the generation of energy, which generates energy used for ink ejection. On figa and 2B shows the basic structure of a substrate for a printhead with side spray ink. In the substrate for a printhead shown on figa and 2B, the channel 13, the ink supply is provided in the silicon substrate 12 having the heaters 11, performed on its surface. Channel 13, the ink supply is a through hole passing through the silicon substrate 12. Ink is served from the side of the rear surface and the silicon substrate 12 to the front surface of the silicon substrate 12 through channel 13 of the ink.

A method of manufacturing a substrate for a printhead having the above structure is disclosed in USP6143190. USP6143190 discloses a method of manufacture comprising the following steps prevent modification of the diameter of the hole of the ink supply channel, which is a through hole.

These stages are:

(a) forming a deleted layer that can be selectively treated with respect to the substrate material, on the site of formation of the feed channel of the ink on the surface of a silicon substrate,

(b) forming resistant to etching pestiviruses layer on a silicon substrate so as to cover the removed layer,

(c) forming a layer of the etching mask having an aperture provided in accordance with a removable layer on the back surface of silicon substrate

(d) etching the silicon substrate by anisotropic etching of the crystal axis up until the removed layer is not exposed from the openings of the layer mask etching,

(e) etching layer removed from the area where it is subjected to the step of etching the silicon substrate to remove it, and

(f) forming the ink supply channel by removing section pestiviruses layer.

Anisotropic etching along the axis of the silicon crystal, used in the above step (d), known as those who alogia, which allows you to accurately form the flow channel of the liquid.

USP6805432 discloses a manufacturing method in which, after performing dry etching using a layer mask, etching is provided on the rear surface of a silicon substrate, performing anisotropic etching on the crystal axis using the same etching mask. According to this method of manufacture, formed the site of treatment, which is L-shaped. In this method of manufacturing a layer mask etching is used collectively as dry etching and wet etching. Consequently, the hole width (the width of the mask layer etching mask formed on the rear surface of a silicon substrate, and the amount of excavation in the dry etching determine the width of an opening of the ink supply channel formed in the back surface of the silicon substrate. In this document, the term "width of the openings of the ink supply channel refers to the width in the direction of the short side of the ink supply channel. The term "long holes" channel ink supply refers to the width in the long side direction of the ink supply channel.

To achieve high-speed printing high definition image, the outlet is placed very close to each other and place a greater number of outlets carrying out the series is TVersity longer. However, when the rows of outlet openings is made longer, it is necessary to increase the length of the openings of the ink supply channel. This may reduce the mechanical strength of the substrate. The decrease in mechanical strength causes deformation or damage of the substrate in the manufacturing process of the printhead. We know that this is, in particular, causes the peeling plate with holes due to the deformation of the substrate and damage when installing the chip.

The invention

Variant implementation of the present invention provides a method of manufacturing the substrate of the head to eject the liquid, comprising a substrate which has on its one surface element generating energy, which generates energy used to eject liquid, and a flow channel of fluid, which passes through one surface of the substrate and through the rear surface on the rear side of the one surface. The method includes the steps of providing a substrate having an element generating energy, performed on the one surface; forming in-depth section on the rear surface by pouring liquid in a linear form to the rear surface and by processing the rear surface of the laser radiation, which passes along and in the liquid; and forming the supply channel by etching the substrate on the rear surface, in which performed an in-depth plot.

According to a variant implementation of the present invention it is possible to form the flow channel of the liquid having a satisfactory flow characteristics while preventing the deterioration of the mechanical strength of the substrate.

Brief description of drawings

In the drawings figa depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention;

Figv depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention;

Figs depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention;

Fig.1D depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention;

Figa depicts a General schematic views of an exemplary structure of the substrate of the printhead;

Figv depicts a schematic General view of an illustrative structure of the substrate of the printhead;

Figure 3 depicts a schematic General view of an illustrative substrate of the printhead in accordance with this is they the invention;

Figa depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention;

Figv depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention;

Figs depicts schematic views in section, illustrating the method of manufacturing the substrate of the printhead according to a variant implementation of the present invention.

Description of embodiments of the invention

Next will be described a method of manufacturing the substrate of the printhead for ejection liquid according to a variant implementation of the present invention with reference to the drawings.

Below will be described substrate of the printhead, which is an example of the substrate of the head to eject the liquid.

Figure 3 depicts the print head using the substrate of the printhead according to a variant implementation. The substrate 100 printhead includes a substrate 1, is provided with elements 101, which blocks the generation of energy, such as heaters, used to eject the liquid, such as ink used in the print operation. The substrate 1 has a feed channel 6, which is a through hole is La fluid supply to the elements 101 energy generation. In addition, the substrate 1 is provided by the terminal 104 for electrical connection with an external site. Additionally, on the substrate 100 of the print head elements are provided 103 outlet, fitted with a venting holes 102 to eject the liquid.

A method of manufacturing the substrate of the printhead according to a variant implementation is a method of manufacturing the substrate of the printhead used in an inkjet printhead. A characteristic feature of this method is the stage of formation of the through hole, which serves as a supply channel of the ink, in the silicon substrate. More specifically, the characteristic feature of this method is that when performing a blind hole that does not reach the surface opposite to the back surface, the back surface of the silicon substrate, the fluid under high pressure is discharged into a columnar shape in the direction of a silicon substrate and a silicon substrate is irradiated laser beam, which passes into and along a column or line of the liquid. More specifically, this method includes the step of forming a masking layer on the back surface of the silicon substrate, the step of forming openings in the masking layer, the step of forming multiple non-through holes in the silicon substrate and the tap of forming blind holes so that so they continued to the front surface of the silicon substrate and so that the non-through holes, which are adjacent to each other, it was reported with each other. Further, these stages will be described in detail with reference to figa-1D. Figa-1D depict the species in the incision made along the line I-I according to Fig 3.

Although not shown, the electrothermal transducers (TaN) heaters, which blocks the generation of energy for generating energy used to eject the ink placed on the front surface of the silicon substrate 1, the orientation of the front and rear crystallographic planes which are indicated (100). In this case, as shown in figa resistant to etching of the passivating layer 2 that serves as a protective layer for electrothermal transducers formed on the front surface of the silicon substrate 1.

The electrodes of the input control signal (not shown) for control of electrothermal transducers, electrically connected to the electrothermal transducers. The thickness of the silicon substrate 1 is approximately 625 microns. Although in the embodiment, is processed single crystal silicon substrate 1, in this way can be processed polycrystalline plate.

As shown in figa, after forming the metal layer (layer mask) 3 ass is her si substrate 1, there are a lot of holes 4 in the layer 3 of the mask. 3 layer mask is made of metal, which does not absorb laser light used in operations subsequent processing, or which has a very low absorptive capacity, such as An, Au, Ag or Cu. In the embodiment, since the operation further processing is applied YAG laser, layer 3 mask made of gold.

As shown in figv, many non-through holes 5 are made with the ability to continue from the rear surface to the front surface of the silicon substrate 1 in the (100) plane by using a laser (laser microinjecting) technology management-jet type. In this document laser microinjection technology involves the irradiation of the object of the processing laser radiation directed columnar water jet having a diameter that is less than or equal to 100 μm, instead of directly focusing the laser light to the processing object, as in conventional laser processing.

In laser microinjecting technology provides optical system so as to create the condition for complete reflection of laser light at the interface between the flow of water and air. This allows effective cooling of the treatment object through complianc is but a moving stream of water and to prevent heat affecting the processing object.

When this silicon substrate can be processed relatively quickly even by conventional laser processing. When the securing element forming a flow passage of the ink on the surface of a silicon substrate, the heat generated during processing may cause, for example, deformation of the element forming the ink flow passage formed by coating a photosensitive polymer. Therefore, it may be difficult to perform relatively deep holes. When blind holes that do not proceed through the front surface of the silicon substrate from the back surface of the silicon substrate is performed by a conventional laser processing, waste generated within the non-through holes during processing, complicate stable running relatively deep blind holes. That is, there is a tendency of occurrence of changes in the depth of blind holes formed in the silicon substrate. This problem can be solved by processing the silicon substrate using laser microinjecting technology.

Next will be continued description of option exercise. As shown in figv and 1C, in the embodiment, non-through holes 5, which is an in-depth plots, which do not continue across the front surface of a silicon substrate 1, performed on the back surface using laser light having a wavelength (532 nm), the light of the second harmonic emitted from the YAG laser. The wavelength of the YAG laser that is used is not limited to the second harmonic (with a wavelength of 532 nm) so that the fundamental wave (having a wavelength of 1064 nm) or third harmonic (with a wavelength of 355 nm) can also be used. In any case, it is obvious that the frequency and output power of the laser light is set at the appropriate values. Figv depicts a blind hole 5 in the process of formation and figs depicts the non-through holes 5, which are formed.

In the embodiment, the diameter of each blind hole 5 which is formed, is approximately 100 μm and a depth of approximately 500-600 microns. The depth of each blind hole 5 refers to the distance from the back surface of silicon substrate 1 to the end of each blind hole 5.

Thus from the point of view of the diameter of the water jet, it is desirable that the diameter of each blind hole 5 was approximately 30-100 μm. When the diameter of each blind hole 5 is too small, the liquid for etching hardly flows continuously in each blind hole 5 during the anisotropic etching, which is performed in the OPE is then further processing. This is undesirable. On the contrary, when the diameter of each blind hole 5 is too large, it takes a relatively long time for the education of the blind hole 5 having a specified depth. It is also not desirable.

When performing non-through holes 5, since the same area of the silicon substrate is repeatedly irradiated by laser light, the laser light is irregularly reflected inside the silicon substrate 1 due to the influence of water, which is flowing back. As a result, non-through holes 5 extend in the transverse direction. More specifically, as shown in figs, the plot (the first inclined section), which is placed at an angle so that the hole size of each blind hole 5 gradually increases from the rear surface to the front surface of a silicon substrate 1, and a second inclined portion which is inclined in a direction opposite to the direction of the first inclined section, formed on the inner surface of each blind hole 5. In the embodiment, the inclination angle of each of the first slope relative to the bottom surface of the silicon substrate 1 is greater than or equal 54,7°. In other words, the hole size of each blind hole 5 (cross-sectional area parallel to the front surface or the rear surface is rnost substrate) gradually increases from the rear surface to the front surface of the silicon substrate 1 and then gradually decreases in the same direction. That is, the hole size of each blind hole 5 is the maximum between the front and rear surfaces of the silicon substrate 1 and in a plane parallel to the front and rear surfaces. In General, the cross section of each blind hole 5, which is perpendicular to the front and rear surfaces of the silicon substrate 1 has a rhombic shape. Pets arrow-shaped form in which the back surface and the side of the front surface are different from each other. The broadening of each blind hole 5 in the transverse direction (i.e. in a direction parallel to the front and rear surfaces of the silicon substrate 1) is determined by the water pressure, the output power of the laser and the frequency of the laser. For example, it is known that when the water pressure is 6 MPa, the output power of the laser is 24.7 watts and generation frequency is 90 kHz, the transverse broadening of approximately 20% in relation to the depth. That is, the width obtained by processing the silicon substrate 1 is approximately 20% of the depth resulting from processing.

In the longitudinal direction of the silicon substrate 1 made many blind holes 5 in a row with a pitch of 240 μm. When non-through holes 5, which are adjacent to each other, if they are formed with the opportunity together is about being with each other, the flow of the water jet is undefined, the result can not be obtained the desired form. Therefore, it is desirable to set the step at which the non-through holes 5 that are adjacent to each other, are not communicated with each other.

Through layer 3 mask with metal, which does not absorb laser light, YAG laser, which is used or has a very low absorption ability, you can limit the broadening of each hole 4, the resulting laser light reflected from the water that flows backwards.

This will be described in more detail with reference to figa-4C. Figa-4C depict views in section, as in the case of figa-1D.

As shown in figa, the rear surface of the substrate 3 with 3 layer mask, made of gold, is irradiated by laser light 51 emitted by the YAG laser and passing in and along a column or line of the liquid 50. This causes the formation of small holes 5A, as shown in figv. In small holes 5A has a water and laser light is reflected irregularly. When the layer 3 of the mask is irradiated irregularly reflected laser light, 4 holes become larger, thereby increasing the outflow of water to the outside. In the embodiment, because the layer 3 masks made of gold, poorly absorbs laser light, YAG laser, dia the points of the holes 4 are stored. As a result, the water remains in small holes 5A, thereby increasing the uneven reflection. Then, by irradiating the inside of each of the small holes 5A through laser and water jet processing is accelerated, thereby effectively increasing small holes 5A and forming deep areas 5, as shown in figs. By repeating the above operations and speeding up processing for in-depth sections 5, you can reach the front surface and to be made in the form of input channels.

Next, the silicon substrate 1 is immersed in an aqueous solution of alkali to perform wet etching (anisotropic wet etching of the crystal). More specifically, as shown in fig.1D, non-through holes 5 are made with the possibility of continuing to the front surface of the silicon substrate 1 and the non-through holes 5 that are adjacent to each other, are made with the ability to communicate with one another to form one through hole 6. The aqueous alkali solution used for etching may be, for example, TMAH or KOH. The etching starts from all surfaces of the inner walls of the blind holes 5. Then, at some sites, the etching continues as formed (111) surface on which the etching rate is low. In other parts of the etching proceeds along the (001) plane or (011) over the barb, where the etching rate is high. the (111) planes are formed from the ends of the blind holes 5.

After that, the plot pestiviruses layer 2, formed in accordance with the open areas of the through hole 6 on the surface of the silicon substrate 1 is removed by dry etching. This leads to the fact that the through hole 6 is opened even on the side of the front surface of the silicon substrate 1 and becomes the ink supply channel.

According to this manufacturing method, since the rays 7 are formed on the back surface and the front surface of the substrate in the channel 6 of the ink, it is possible to prevent the deterioration of the mechanical strength of the substrate in order to prevent the peeling plate with holes caused by the deformation of the substrate, and damage while installing the chip.

You can reduce the cross section of the channel 6 ink on the back surface of silicon substrate 1 and effectively perform channel 6 ink supply. Consequently, it is possible to increase the processing speed channel 6 ink supply and reduce the cost of manufacture of the substrate of the printhead and thus the printhead.

At the stage of forming blind holes 5 with the possibility of continuing to the front surface of the silicon substrate 1 so that the non-through holes 5 that prima is up to each other, it was reported with each other for the formation of one of the through hole 6 may be used isotropic etching. For example, can be conducted by dry etching using an active gas containing, for example, any of: a carbon atom, a chloride atom, a sulfur atom, a fluorine atom, an oxygen atom, a hydrogen atom and an atom of argon, using an active gas comprising molecules containing any of these atoms.

Variant implementation of the present invention described above is applicable for the formation of through holes, for example, in the semiconductor substrate, in addition to the substrate of the head to eject the liquid. This applies, for example, micromachining, the acceleration sensor.

Although the present invention is described with reference to illustrative embodiments of, it should be understood that the present invention is not limited to the disclosed illustrative embodiment. The volume below the claims corresponds to the broadest interpretation to encompass all of these modifications and equivalent structures and functions.

This application claims the priority of Japanese patent application No. 2008160306 filed June 19, 2008, which is included in this document under reference in its entirety.

1. A method of manufacturing the substrate of the printhead to eject W is dcosta, includes a substrate which has on one surface element for generating energy, which generates energy used to eject liquid, and a flow channel of fluid, which passes through one surface of the substrate and through the second surface of the substrate, the other surface is provided on the rear side of the specified one surface containing phases in which:
provide an in-depth section on the other surface of the substrate by releasing fluid in a linear form to the other surface of the substrate by processing the other surface using laser light, which passes along and linear fluid; and
form a channel from the fluid by etching the substrate from the other surface provided with in-depth plot, while
perform a substrate provided with a metal layer having a hole on its rear surface and the rear surface is treated with the use of laser radiation through the hole.

2. The method according to claim 1, wherein the etching is wet etching.

3. The method according to claim 1, in which laser light is pulsed laser light and a rear surface repeatedly irradiated by laser light.

4. The method according to claim 1, in which the orientation of the crystallographic plane of one surface is (100).

. The method according to claim 1, wherein the metal layer comprises gold and the laser light is laser light, YAG laser.

6. A method of manufacturing the substrate of the head to eject the liquid, comprising a substrate which has on its one surface element for generating energy, which generates energy used to eject liquid, and a flow channel of fluid, which passes through one surface of the substrate and through the second surface of the substrate, while the other surface provide on the rear side of one surface containing the stages are:
provide the substrate;
supply the specified substrate metal layer having a hole on its rear surface, and process the rear surface using laser light through the hole, and
provide in-depth plot, which serves as a channel of fluid, by processing the substrate in the vent fluid in a linear form to the other surface of the substrate and as a result of repeated exposure to another surface by means of pulsed laser light, which passes along and linear fluid to an in-depth plot had a shape in which the cross-sectional area parallel to the one surface, has increased from the other surface to the one surface and the area of the Sich, the deposits decreased from the position in which the sectional area is maximum, to one surface.

7. The method according to claim 6, in which provide a lot of in-depth sections on the rear surface and carry out the etching of the substrate from the rear surface, provided with recessed areas to remove areas of the substrate that form the walls of the recessed sections, with walls placed between the recessed areas.

8. The method according to claim 6, in which the metal layer contains gold and laser light is emitted by a YAG laser.

9. The method of processing poloski containing phases in which:
provide the substrate;
supply the specified substrate metal layer having a hole on its rear surface, and process the rear surface using laser light through the hole, and
provide in-depth plot by processing the substrate in the Wake of the release of fluid in a linear form to one surface of the substrate and the multiple exposure of one surface by means of pulsed laser light, which passes along and linear liquid, so that an in-depth plot had a shape in which the cross-sectional area parallel to the one surface, has increased from one surface to the other surface, which is the rear side of the one surface, and the area is ecene decreased from the position in which the cross-sectional area is a maximum to the other surface.



 

Same patents:

FIELD: process engineering.

SUBSTANCE: method of producing said head including silicon substrate and inlet channel comprises: producing silicon substrate including isolating layers on first surface and mask layers with etching holes substrate other surface. Note here that said insulating layer is located in section extending from position opposite section between adjacent mask layer holes, and producing holes by etching section of silicon substrate so that etched section extends to insulated layer section opposite aforesaid hole. Silicon substrate located between adjacent holes is subjected to etching so that secintion on its first surface may be thinner than that on its second surface.

EFFECT: higher hardness of thus produced head and higher efficiency.

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EFFECT: simplified formation of ink supply channel and reduced time of substrate making.

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EFFECT: invention makes it possible to reduce formation of satellites (secondary drops) and to accordingly improve quality of printing.

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EFFECT: fast formation of slot for ink feed in semiconducting substrate for jet printing head with low costs.

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EFFECT: invention provides stable manufacturing of substrate for fluid ejection heads with form accuracy and high efficiency of technological process.

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EFFECT: possibility to arrange moment of ejected liquid separation as occurring earlier and to reduce tail of flying drop of liquid.

19 cl, 37 dwg

FIELD: printing industry.

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EFFECT: fast formation of slot for ink feed in semiconducting substrate for jet printing head with low costs.

19 cl, 14 dwg

FIELD: printing industry.

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FIELD: printing industry.

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FIELD: process engineering.

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EFFECT: higher hardness of thus produced head and higher efficiency.

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FIELD: printing.

SUBSTANCE: method for processing a substrate of head for ejecting the fluid includes the stage of providing the substrate and the stage of providing a deepened section on the rear surface of the substrate by ejecting fluid in a linear form from the rear surface of the substrate, and by processing the rear surface of the substrate by laser light which passes along the fluid and in the liquid.

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FIELD: chemistry.

SUBSTANCE: photosensitive composition contains a cation-polymerisable compound, an acid photogenerator having an anionic part and a cationic part, as well as a salt having a cationic part having anyone of a quaternary ammonium structure or a quaternary phosphonium structure, and an anionic part. The anionic part of the salt is substituted with the anionic part of the first acid obtained from the anionic part of the acid photogenerator, to form a second acid having acid strength lower than that of the first acid. The cation-polymerisable compound is an epoxy resin. The acid photogenerator is at least a compound selected from a group comprising a sulphonic acid compound and other sulphonic acid derivatives, a diazomethane compound, a sulphonium salt, an iodonium salt, a sulphonimide compound, a disulphonic compound, a nitrobenzene compound, a benzoin tosylate compound, an iron arene complex, a halogen-containing triadine compound, an acetophene derivative, and a cyano group-containing sulfatoxim. The method of forming a pattern involves preparing a substrate on which the photosensitive composition is provided. A portion of the composition is then exposed to light to cure the exposed portion. The cured portion is then heated. The liquid ejection head has a part with an outlet channel for ejecting liquid. The part with the outlet channel is formed from cured material made from said composition.

EFFECT: invention increases heat resistance of the photosensitive composition and increases accuracy of forming a pattern.

13 cl, 4 dwg, 5 tbl, 9 ex

FIELD: printing.

SUBSTANCE: invention relates to an ink-jet printer in which the operation of restoring is performed in the print head for ejecting ink, and to a method for restoring the print head in the ink-jet printer. The ink-jet printer comprises a print head that can eject ink. The device also comprises a transportation unit, which serves for transportation of a recording medium along the transportation path passing the printing position in which printing can be performed on the printing carrier by the print head. The cutter which can cut the printing carrier. The restoring unit to perform operations of restoring the print head. The control unit to control the restoring operation performed by the restoring unit based on the number of passes which is the number of times that the cut-off part of printing carrier, which is cut off by the cutter, passes the printing position.

EFFECT: proposed invention provides the systematisation of the process of restoring the print head taking into account cutting of the carrier.

14 cl, 13 dwg

FIELD: printing industry.

SUBSTANCE: in the invention the ink jet printing head is designed, comprising an element provided with an ejection port for ejecting the ink. The said ink jet printing head additionally comprises a water-repellent layer comprising a cured product of the condensed product obtained by condensation of the hydrolyzable silane compound comprising an epoxy group, and a hydrolyzable silane compound comprising a perfluoropolyether group on the surface of the said element on the side where the ejection port comes.

EFFECT: improved quality of printing.

16 cl, 8 dwg, 1 tbl

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