Electric insulating filling compound

FIELD: electricity.

SUBSTANCE: electric insulating filling compound contains epoxide diane resin, amine hardener in the form of triethylene tetramine (TETA), and also a modifier - a phosphorus-containing methyl acrylate (PCM), at the following ratio of components, wt parts: epoxide diane resin ED-20 - 100 triethylene tetramine (TETA) - 10-15 phosphorus-containing methyl acrylate (PCM) - 30-40.

EFFECT: reduced viscosity of a filling compound, its higher viability, improved elasticity after hardening, preservation of dielectric properties.

1 tbl

 

The invention relates to low viscosity epoxy compounds used to fill the conductive circuits and parts for sealing and protection of items of electronic equipment from moisture and mechanical damage. Such compounds are widely used in radio, electronics, machinery and other industries.

Known epoxy potting compound based on epoxy Dianova resin, triglycidyl ether polyoxypropyleneamine monoglycidyl ether n-butanol, as a hardener of amine type - a mixture of aliphatic amine and a low molecular weight polyamide resin [1].

However, this compound has insufficient electrical strength (20 kV/mm), lack of elasticity (elongation 10 %), significant shrinkage (1,5%), inflammability. When pouring this compound requires heating the mixture, prolonged mixing and degassing.

Also known epoxy compound type K-115 containing epoxy Dianova resin ED-20, the curing agent is a polyethylenepolyamine, unsaturated oligoester brand IFG-9 [2].

Compound refers to a fuel source and does not have sufficient elasticity.

These compounds are designed to fill the details as insulating material.

Similar in composition to the proposed filling material is ialu is a compound insulating destination based on epoxy Dianova resin ED-20, polyamide hardener IS 300, modifier dibutyltindilaurate the following composition, parts by weight [3]:

epoxy Dianova resin ED-20100
polyamide hardener-30030
the modifier dibutyltindilaurate30

The compound is prepared before use. In the epoxy resin is injected modifier - dibutyltindilaurate, the system is being homogenized by stirring, and a curing agent at a stoichiometric ratio of resin-hardener. The curing process takes place at the following mode: "cold curing" (20±2°C) for 24 h, dauvergne at 140°C for 5 h and at 160°C for 1.5 hours

The disadvantage of this compound is a high viscosity (15 PA×s), insufficient dielectric properties.

The objective of the invention was to reduce the viscosity of the filling compound, increasing its viability for better sealing products, reduced Flammability, increased elasticity of the material and its dielectric characteristics, the preservation of these properties in a large temperature range -40 to +130 °C.

This object is achieved in that in an electrically insulating casting compound, including ED-20 is the number of 100 parts by weight, curing agent and modifier, as a hardener contains amine curing agent of Triethylenetetramine THETA in the amount of 10-15 parts, as a modifier - phosphorus-containing acrylate FOM in the amount of 30-40 parts by weight of

New in this compound is used as a moderator burning phosphorus-containing acrylate FOM, which is also the epoxy plasticizer composition, in the following ratio of components, parts by weight:

epoxy Dianova resin ED-20100
Triethylenetetramine THETA10-15
phosphorus-containing acrylate vom30-40

The proposed compound is produced by mixing the components and curing in the following mode: "cold curing" (20±2°C) for 24 h and dauvergne at 90 °C - 1 h

The amount of curing agent is introduced in a stoichiometric ratio to the epoxy resin, the amount less than 10 parts by weight will result in insufficient curing of the composition, and more than 15 parts by weight will result in over allocation. Introduction Thomas in the amount less than 30 parts by weight does not result in achievement of the required properties: the material has little viable is functioning (80 min), high viscosity (15-17 PA·s), low oxygen index (CI=22%), has no plasticity. The increased concentration of Thomas more than 40 parts by weight is economically not profitable.

The table below presents basic physical and mechanical properties of the proposed casting compound and the prototype.

The technical result of the invention is to reduce the number of steps of the curing compound from 3 to 2 and temperature of curing with 140-160°C to 90°C, and the decrease of the viscosity on 33-47%, shrinkage on 77-22%, Flammability, increased vitality 1.7-2 times, specific surface resistance 10 times compared with the prototype. The effect of 10 daily cycles at temperatures of -40 to +130°C did not cause changes in the output electric parameters of the compound.

References

1. Pat. 2343577 of the Russian Federation. Insulating casting compound / Songlady, Annaleena, Liinamaa etc. // BI No. 1 from 10.01.09.

2. Handbook of plastic masses. Ed. Vmichael and others - M.: Chemistry, 1975. - 210 S.

3. Pat. 2131895 RF Modified epoxy compound for insulation purposes. / Searchamerica, Lgeepa, Evelia, etc. // BI from 20.06.1999.

Insulating casting compound comprising epoxy Dianova resin, curing agent, modifier, characterized in that the hardener contains amine curing agent three is tileceramic (THETA), and as a modifier phosphorus-containing acrylate (FOM) in the following ratio of components, parts by weight:

epoxy Dianova resin ED-20100
Triethylenetetramine (THETA)10-15
phosphorus-containing acrylate (FOM)30-40



 

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1 tbl

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18 cl, 2 ex, 4 tbl

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