Surface-modified electrical insulation system with improved tracking and erosion resistance

FIELD: chemistry.

SUBSTANCE: surface modified electrical insulation system, comprising a cured synthetic polymer composition including at least one filler and optional additives, wherein the surface of said synthetic polymer composition is modified by applying a thin coating; said thin coating being applied via plasma enhanced chemical vapour deposition (PECVD) with thickness within the range of about 50 nm to about 50 mcm; and/or said thin coating is applied via a sol-gel technique with thickness within the range of about 0.5 mcm to about 2 mm; and wherein said thin coat is an electrically non-conducting polymeric material with melting point which is considerably higher than the melting point or degradation temperature of the synthetic filler containing polymer composition; and a method of making said electrical system involving formation of a hardened or cured synthetic polymer composition, applying a thin coating on the surface of said synthetic polymer composition via plasma enhanced chemical vapour deposition.

EFFECT: improved system.

18 cl, 2 ex, 4 tbl

 

The technical field to which the invention relates.

The present invention relates to surface modified system insulation with improved tracking resistance and near erosion resistance. The present invention mainly relates to surface modified system of electro-containing synthetic polymer composition comprising a filler and optional additives specified synthetic polymer composition applied composition thin coating, the melting point of which is considerably above the melting point or decomposition temperature of the polymer composition.

The outer electrical insulation during operation is often subjected to surface discharges. The temperature of the surface discharge is usually above 1000°C (>1000°C). In the case of electrical insulation systems based on synthetic polymers filled with filler composition, such as high temperature discharge lead to erosion and carbonization (also called tracking) of insulating material, as the decomposition temperature of the polymeric insulation material is usually much below 1000°C, and mainly below 400°C (<400°C). Composition of epoxy resin usually begin to decompose at a temperature of about 250°C.

The level of technology

In the US 6541118 disclosed electric insulator ceramic belt surface is here which is coated with the hydrophobic coating, comprising a polymer obtained by polymerization in plasma, applied directly to the ceramic. Ceramic materials are very stable and have high dimensional stability and high heat resistance. Therefore, the ceramic surface may be covered with a thin coating, e.g. a coating of a polymer obtained by polymerization in plasma, applied directly to the ceramic surface.

The outer electrical insulation, especially for high-voltage applications, very often made on the basis of synthetic polymers filled with filler composition. Such preferred synthetic polymeric compositions are, for example, compositions based on epoxy resin including a filler and optional additives. These compositions, epoxy resins are often made on the basis of cycloaliphatic epoxy resin with filler contents in the form of silicon dioxide of about 60-80%, and typically about 65%, relative to the total weight of the insulation system. There is a need to increase the time during which such polymer insulator can withstand high temperatures, surface discharges without decomposition. The sustainability of such insulators to high temperature surface discharges without decomposition is determined by the standard the test tracking an inclined plane (international Electrotechnical Commission) IEC 60587.

Disclosure of inventions

At the moment it is established that the system of insulation, made of compositions of synthetic polymer, especially made from the composition cycloaliphatic epoxy resin comprising at least one filler and optionally additional additives, can be applied in a thin layer with a thickness in the range from about 50 nm (50 nm or 50×10-3μm) to about 50 μm (microns)specified in a thin layer is electroconductive polymer material with a melting point appreciably above the melting point of the synthetic resin composition containing the filler, thus significantly increasing the time during which such polymeric insulation system can withstand the high temperatures of surface discharges without decomposition. Preferably specified polymer insulation system contains a filler in the range of about 60-80% of the mass. with respect to the total weight of the insulation system. This effect is unexpected, since the surface of the electrical insulation system made from the composition of synthetic polymer that is permeable to the components inside the insulation system, as well as many other properties, such as dimensional stability and heat resistance are significantly different from the properties of the ceramic surface.

The volume at which azani of the present invention defined in the claims. The present invention notably relates to surface modified system of insulation, including hardened or utverzhdennuyu composition of synthetic polymer containing at least one filler and optionally additional additives, characterized in that the surface of the specified compositions of synthetic polymer modified thin coatings;

- the specified thin coating plasma-chemical deposition from the gas phase (PECVD) to a thickness in the range from about 50 nm to about 50 μm; and/or

- the specified thin coating Sol-gel process with a thickness in the range from about 0.5 micron to about 1 mm; and where the

- the specified thin layer is electroconductive polymer material with a melting point considerably above the melting point or decomposition temperature of the synthetic resin composition containing the filler.

In accordance with the present invention it is also possible that both types of coatings were deposited one on top of another in any desired sequence.

The present invention also relates to a method of manufacturing specified surface modified electrical insulation system. The present invention also relates to the application of the specified surface modi is Anna electrical insulation system as insulation in electrical products. The present invention furthermore relates to electrical products, including specified surface modified system insulation.

Surface modified system insulation in accordance with the present invention includes the composition of a synthetic polymer. The specified polymer may be selected from polymers of the prior art used in the compositions of electrical insulators, such as polyesters, for example poly(methyl methacrylate), or poly(alkylacrylate), or thermoregulate, such as polyurethanes or compositions based on epoxy resin. Preferred are compositions based on epoxy resin, preferably compounds based on cycloaliphatic epoxy resins. These compositions based on epoxy resins usually contain a hardener to speed up the curing process, as well as additional additives. These compounds are known as such.

Compounds based on cycloaliphatic epoxy resins included in the scope of claims of the present invention contain at least two 1,2-epoxy groups per molecule. Compounds based on cycloaliphatic epoxy resins suitable for the present invention include unsubstituted Picadilly group and/or substituted metal groups Picadilly group. Epoque is idea number (EQ./kg) these Picadilly compounds is preferably, at least three, preferably at least four and mostly five or higher, preferably about 5.0 to 6.1. Preferred are, for example, optionally substituted epoxy resin of the formula (I)

where

D=-O-, -SO2-, -CO-, -CH2-, -C(CH3)2-, -C(CF3)2-

n=0 or 1

Preferred are the compounds of formula (I), where D represents -(CH2)or [-C(CH3)2-]. Other compounds, cycloaliphatic epoxy resins applicable in the present invention, moreover, are, for example, bis-glycidyloxy broadcast hexahydro-o-phthalic acid, bis-glycidyloxy broadcast hexahydro-m-phthalic acid or bis-glycidyloxy broadcast hexahydro-p-phthalic acid. The preferred connection cycloaliphatic epoxy resins are liquid at room temperature or when heated to a temperature of about 65°C. the Preferred compounds, cycloaliphatic epoxy resins are, for example, Araldite® CY 184 (Huntsman Advanced Materials Ltd.), connection cycloaliphatic epoxy resins (diglycidyl ether) containing an epoxy group 5,80-6,10 (EQ./kg) or Araldite ® CY 5622 (Huntsman Advanced Materials Ltd.), modified compound epoxy resin (diglycidyl ether) containing an epoxy group 5,80-6,10 (EQ./kg). Araldite® CY 5622 is what I composition hydrophobic cycloaliphatic formulation of epoxy resin to impart hydrophobicity and use in the compositions of epoxy resin for outdoor use. The hydrophobic composition of the cycloaliphatic epoxy resin means that the material of the filler pretreated with silane or silane was added to the composition.

Curing the epoxy resin composition typically comprises epoxy resin and hardener. Hardeners are, for example, hydroxyl and/or carboxyl-containing polymers, such as polyesters with limit carboxyla and/or carboxyl-containing acrylate and/or methacrylate polymers and/or anhydrides of carboxylic acids. Useful curing agents are aliphatic, cycloaliphatic polycarboxylic acids. The preferred anhydrides are liquid cycloaliphatic anhydrides with a viscosity at 25°C. of about 70 to 80 mPas. Such liquid cycloaliphatic anhydride is, for example, hardener Aradur® HY 1235 (Huntsman Advanced Materials Ltd.). If necessary, the curing agent can be used with a concentration in the range of 0.2 to 1.2, equivalents of the present curing groups, for example one anhydride group per 1 epoxide equivalent.

The inorganic filler is contained in the composition of the synthetic polymer in the range of about 60-80% of the mass. preferably in the range of about 60-70% of the mass. and preferably about 65% of the mass. with respect to the total weight of the composition of the synthetic polymer.

The average particle size of the inorganic filler typical d which I use in electric insulation and is typically in the range from 10 microns to 3 mm and is not critical to the present invention. Mineral filler is preferably selected from typical filler materials that are commonly used as fillers in the insulation. Preferably the specified filler selected from silica, quartz, known silicates, aluminum oxide, three-hydrate of aluminum (aluminum hydroxide) [ATH], titanium oxide or dolomite [CaMg(CO3)2], nitrides such as silicon nitride, boron nitride and aluminum nitride or metal carbides such as silicon carbide. Preferred are silicon dioxide and quartz with a minimum content of SiO2about 95-97% of the mass.

As an optional addition, the composition may further include a curing accelerator to increase the polymerization of the epoxy resin with the hardener. Additional additives can be selected from a wetting/dispersing agents, plasticizers, antioxidants, setpagetitle, organosilicon compounds, pigments, flame retardants, fibers, and other additives commonly used in electrical applications. They are known to experts in the art and are not critical to the present invention.

If the specified thin coating is applied by plasma chemical deposition from the gas phase (PECVD), its thickness is in the range from about 50 nm to about 50 μm; predpochtitel is but in the range of from about 100 nm to about 30 μm, preferably in the range of from about 200 nm to about 20 μm, preferably in the range from about 250 nm to about 10 μm, preferably in the range of from about 300 nm to about 5 microns.

The specified thin layer is electroconductive polymer material and essentially consists of a polymer obtained by plasma polymerization, or an amorphous glassy coating. The melting point of the thin coating substantially above the melting point of the composition of the synthetic polymer, i.e. a melting point of at least 200°C., above the melting point or decomposition temperature of the synthetic polymer composition.

Polymer coating plasma-chemical deposition from the gas phase (PECVD), also called "plasma polymer". Plasma polymers obtained PECVD, different from synthetic polymers obtained by the polymerization of the initial monomer. When using plasma-chemical vapor deposition (PECVD) of the original monomer is heated in gas-carrier to a relatively high temperature, optionally together with the component of the filler. Plasma gives the ionized molecules due to high temperatures caused by an application, for example, a strong electric field or radio frequency (RF). Plasma polymer formed on the surface composition of synthetic polymer healthy lifestyles is of material flow, ionized in a plasma reactor, the surface composition of the synthetic polymer to be coated, which is modified accordingly. Similar methods using plasma technology were described and well-known specialists in this field of technology.

As the carrier gas preferably used are oxygen, nitrogen or hydrocarbon, preferably methane or ethane. As source material to create a thin coating preferably used volatile compounds with non-polar groups, preferably selected from organosilane compounds, alkoxysilanes, organofluorine compounds and mixtures thereof. Preferred compounds are compounds selected from hexadecylamine, preferably hexamethyldisiloxane or vinyltrimethylsilane; tetrachlorozincate, preferably of tetraethylorthosilicate; or mixtures thereof. These compounds can be optionally mixed with fine material of the filler, preferably Microfine silicon dioxide or quartz with a minimum content of SiO2about 95-97% of the mass. and preferably with an average particle size in the nanometer range or very low micron size (1-10 μm).

Plasma polymer consists of many different Venev, derived from the ionized plasma particles, and has the exact chemical composition in comparison with a synthetic polymer polymerized by known methods of polymerization. Unexpectedly stable hydrophobic glassy plasma polymer is obtained on the surface composition of a synthetic polymer, a modification of the specified surface and with the specified glassy material also has a high melting point and/or temperature of decomposition.

If the specified thin coating is applied to the Sol-gel process, its thickness is in the range from about 0.5 μm to about 2 mm, preferably in the range of from about 1.0 μm to about 1 mm, preferably in the range of 1-500 μm, preferably in the range of 1-100 microns.

Coatings prepared with silane-based Sol-gel process (tightly stitched mesh structure obtained after removal of solvent), the compositions of synthetic polymers, preferably the compositions of cycloaliphatic epoxy resins, unexpectedly improve the track resistance of the materials and erosion resistance of the insulation system made in accordance with the present invention.

The silanes used in the Sol-gel process based on silane, to form a thin layer on the synthetic polymer compositions in accordance with the present invention prefers the equipment selected from alkoxysilanes and Versilov. Organo-alkoxysilane belong to the class of molecules alkoxysilanes one organic chain and three alkoxy groups linked to the silicon atom. They correspond to the following formula: [R-Si(OR1)3], where R additional (OR1- Deputy or alkyl or substituted alkyl, preferably (C1-C22) alkyl, optionally substituted amine, an epoxy group, an acrylate, a methacrylate, phenolic residue or remainder of melamine. R1preferably is (C1-4) alkyl, preferably the stands. Thus, the hydrolysis and condensation obtained by the combination of organic-inorganic mesh structure. The sequence of reactions and special technology for thin films, respectively coatings are known and described in ..Plueddmann, Silane Coupling Agents, 2. Ed., 1990, Plenum Press, Ne York.

Suitable compounds that are used to implement the present invention, which correspond to the formula [R-Si(OR1)3]as defined above are, for example, hexadecyltrimethylammonium, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, tetraethoxysilane, methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, where the alkoxy may be ethoxy or methoxy group.

Hydrolysis and condensation are strongly dependent is it on the content of acid (pH value), but in optimal conditions, the hydrolysis occurs relatively quickly (a few minutes), whereas the condensation reaction is slower (a few hours). In moderately acidic conditions neutral alkoxysilane units are hydrolyzed with the formation of Monomeric silanetriol, which then slowly condense to polymeric organic siloxanes. In the initial stages of the reaction there is competition between reactions of hydrolysis and condensation. In the course of the hydrolysis should take extra precautions to avoid crosslinking, because if this happens, then the mixture will react with the formation of the polymerized siloxane with high molecular weight and will not be able to form a coating on the desired surface. Therefore, you should prepare any Sol-gel silane-based in two stages. In the first stage, carried out the hydrolysis of a solution of the silane in a solvent. At the next stage, already gidralizovanny mixture is applied on a substrate, preferably epoxy substrate and spend the stitching.

The present invention also relates to a method for producing surface modified electrical insulation system containing a synthetic polymer composition including at least one filler and optionally additional additives, as defined in the present invention, VK is causea the following stages: (i) creation of a hardened or utverzhdenii compositions of synthetic polymer, containing at least one filler and optionally additional additives using known methods; and (ii) coating the surface of the specified compositions of synthetic polymer thin coating with a thickness in the range from about 50 nm to about 50 μm (as defined in the description of the previously mentioned thin coating is deposited by plasma chemical deposition from the gas phase (PECVD); and/or coating the surface of the specified compositions of synthetic polymer thin coating with a thickness in the range from about 0.5 microns to about 2 mm (as defined in the description earlier) Sol-gel process; and (iii)in which to obtain the thin coating is used elektroprovodyashchie monomer, as defined in the description above.

Surface modified system insulation in accordance with the present invention preferably is used in power lines and wiring, for example, insulating materials, particularly in the field windings are impregnated in the manufacturing of electrical components, such as transformers, built-in contacts, bushings, high-voltage insulators for indoor and outdoor use, especially for outdoor insulators associated with high-voltage lines, as long-rod, composite insulators and number of accomoda type, sensors, inverters and termination, as well as for base insulators in the sector of medium voltage, production of insulators for outdoor power switches, measuring transducers, inputs and surge protection, distribution devices.

The following examples illustrate the invention.

Example 1

Example 1 describes obtaining a glassy coating with a thickness in the range of 0.3 to 1.2 μm, deposited by plasma chemical deposition from the gas phase (PECVD) on a substrate of the cycloaliphatic epoxy outer insulator. PECVD can be performed so that the substrate is not exposed to heat above 100°C.

Used oxygen plasma in the atmosphere of hexamethyldisiloxane (HMDSO). Thus communication in the HMDSO molecules are broken high-energy plasma and accelerated toward the substrate. When the elements recombine on the surface of the substrate goes through many chemical reactions, are formed and are oxygen, hydrogen and carbon dioxide. The coating that is formed on the surface of the substrate, has a dense crosslinked amorphous structure and essentially contains silicon atoms and oxygen in the ratio of about 1:2. The exact composition of the coating is difficult to determine. So the floor is called "plasma polymer" or "SiOx-polymer".

Preparation of substrate

With the Tav cycloaliphatic epoxide (SER), used as the substrate material in this example is given in table 1. All components except the catalyst is pre-heated to 45°C. they are Then intensively mixed together at atmospheric pressure propeller stirrer. The resulting mixture was then Tegaserod in a vacuum furnace under stirring, at a pressure of about 5 mbar for 20 minutes at 60°C.

The mixture is then formed into plates of 6 mm thickness using steel molds preheated to 90°C and covered with a tool that improves connector molds Huntsman QZ13. To ensure complete curing apply a cycle of 2 hours at 90°C, followed 24 hours at 140°C.

Table 1
Components%
Huntsman CY184 (Resin)100
Huntsman HY1235 (hardener)90
Huntsman DY062 (Catalyst)0,54
Huntsman DW9134 (Pigment, TiO2)2,7
Quarzwerke W 12EST (Filler)359

Araldite® CY 184: cycloaliphatic epoxy resin (Huntsman)

Aradur® HY1235: modificirowan the th cycloaliphatic anhydride (Huntsman)

The catalyst DY062: liquid tertiary amine

W 12EST:SiO2(QuarzWerke GmbH)

PECVD Coating

SiOxthe coating is applied on the MID substrate plasma-chemical deposition from the gas phase (PECVD). The equipment used for PECVD is essentially a vacuum chamber with radio frequency (RF) plasma generator. The equipment is designed to cover the flat polymeric film substrates. The size of the sample for testing tracking erosion is 6 mm × 50 mm × 120 mm, the Thickness of the coating of SiOxis 0.3 μm. During the deposition process the temperature of the epoxy resin does not exceed 100°C.

Other samples cover to the thickness that is a multiple of 0.3 microns, i.e. 0.6 μm, and 0.9 μm and 1.2 μm. The desired coating thickness is achieved by varying the time of deposition of the coating. To achieve a thickness of 0.3 μm is used, the deposition time of 60 seconds and increases to 120 seconds 280 seconds and 240 seconds, respectively, to obtain a greater thickness.

To ensure good adhesion SiOxcoating SER substrate surface of the sample is cleaned in an ultrasonic bath in acetone before being placed in the camera. In the chamber of the plasma light in the absence of a working gas to activate the surface of the sample. The parameters of this pre-treatment and subsequent coating deposition are given in table 2.

Table 2
Vacuum Luggage
The main pressure3-8×10-3mbar
Preliminary plasma processing
Power (RF)50 W
The amount of oxygen (O2)50 cm3/min
Pressure0.1 mbar
Time6
Precipitation
Power (RF)212 W
The amount of HMDSO10 cm3/min
The amount of O2150 cm3/min
02: HMDSO (the ratio in the mixture)15:1
Pressure0.1 mbar
Temperature SER substrate25°C
Settling time60

Resistance to tracking and erosion (IEC 60587)

<> Used test tracking and erosion in an inclined plane (IEC 60587, ed. may 2007) for evaluating resistance to tracking and erosion samples with coating and without coating. Four-defined standard test voltage (2.5 kVrms, 3.5 kVrms, 4,5 kVrmsand 6 kVrmsare the potential applied between the two electrodes at the base and at the top of the sample during testing. A solution of sodium chloride containing nonionic wetting agent, with a given conductivity, flows along the sample surface from the upper to the lower electrode with a given flow rate. This scheme causes the formation of an arc on the surface of the sample, concentrated at the base of the electrode. The standard allows two ways of determining the failure of the sample, denoted as criterion a and B. In this paper we use the criterion And defined as the leakage current through the sample in excess of 60 mArmswithin 2 seconds. The sample is considered to have passed the test if he can withstand 6 hours of testing without failure. For material that passed the test, all 5 samples should be kept for 6 hours.

Evaluating resistance to tracking and erosion SER samples of coated and uncoated spend way inclined plane. SIR check samples after Stripping and without Stripping. The results are presented in table the e 3.

Table 3
Results test resistance to tracking and erosion according to IEC 60587
3.5 kVrms4,5 kVrms6 kVrms
SER (peeled)PassedNot passed (all 5 samples out of action for 30 minutes)
SER (not peeled)Failed (4 samples passed, 1 sample failed after 40 minutes)
SER coated with 0.3 μm of SiO2(not cleared)PassedPassed

When the material is classified as "failed" for a particular test voltage, 1 or more of the 5 samples did not pass the test. When he is classified as the last test, none of the 5 samples is not out of order.

Samples with a thickness of 0.6 μm, and 0.9 is km and 1.2 microns check together with 6 kV rms. All samples incubated for 6 hours and not found differences between their characteristics and the coating thickness of 0.3 μm. The results show that the definition of tracking and erosion (IEC 60587) demonstrates a clear improvement in the resistance to tracking and erosion of the samples coated with PECVD, the results of testing the ICE by way of an inclined plane.

Example 2

Example 2 describes how to obtain a glassy coating with a thickness in the range of 0.5 μm-2 mm, caused a hybrid Sol-gel process on a substrate cycloaliphatic epoxy outer insulator. The manufacture of the substrate performed as described in example 1, with the components shown in table 1.

The silanes used in hybrid Sol-gel coating process, are functionalized by alkoxysilane, i.e. tetraethoxysilane (TEOS), 3-glycidylmethacrylate (GPTMS, trimethoxysilane with epoxy groups) and hexadecyltrimethylammonium (HDMS) with hydrophobic Deputy long chain.

The coating compositions and conditions of the Sol-gel coating process on the basis of silane presented in table 4. These chemicals are mixed together at room temperature and should be stored separately to avoid cross-linkage between them. The coating performed at room temperature.

the figure 4
The molar ratio
The coating compositionTEOSGPTMSHDMSWaterEthanolAerosilHClProcess conditions
And21-.-227-.-0,07(A)
In1-.--.-227-.-0,07(In)
-.-1-.-227-.-0,07(C)
D-.--.- 1227-.-0,07(D)
E-.--.-1-.-275% of the mass. HDMS0,07(E)

The process conditions

(A) First hydralicious TEOS within 6 hours and then slowly add GPTMS and stirred for 18 hours at 25°C.

(B) Hydrolysis for 10 hours at 25°C.

(C) Hydrolysis for 10 hours at 25°C.

(D) White precipitation receive after 1 minute of hydrolysis and, therefore, the formulation of the coating is not used

(E) is Stirred for 4 hours at 25°C.

Resistance to tracking and erosion (IEC 60587)

For the Sol-gel coating composition a or b+C (in the ratio of 70:30% vol.) or b+C+E (ratio 60:30:10% vol.) on SER substrates and curing for 2 hours at 100°C, determination of the resistance to tracking and erosion SER samples according to the present example 2 shows that they improved on the results of the IEC 60587. The obtained results similar to the results of example 1, table 3.

1. Surface modified system of insulation, including hardened or utverzhdennuyu composition C is synthetic polymer, containing at least one filler, characterized in that the surface of the specified compositions of synthetic polymer modified thin coatings;
and
- the specified thin coating is deposited by plasma chemical deposition from the gas phase (PECVD) and has a thickness in the range from about 50 nm to about 50 μm; and/or applied
the Sol - gel process and has a thickness in the range from about 0.5 micron to about 2 mm; and
- the specified thin layer is electroconductive polymer material with a melting point substantially above the melting point or decomposition temperature of the synthetic resin composition containing the filler.

2. System electric insulation according to claim 1, characterized by the fact that both types of thin coatings deposited one on top of another in any desired sequence.

3. System electric insulation according to claim 1 or 2, characterized in that the synthetic polymer is selected from polymers used in the compositions of electroisolation, preferably of polyester, preferably poly(methylmethacrylate) or poly(alkylacrylate); or from thermoregulate, preferably polyurethane or of compositions based on epoxy resins.

4. System electric insulation according to claim 3, characterized in that the synthetic polymer is HDMI is of epoxy resin, preferably based on a cycloaliphatic epoxy resin.

5. System electric insulation according to claim 1, characterized in that the inorganic filler is contained in the composition of the synthetic polymer in the range of about 60-80 wt.%, preferably in the range of about 60-70 wt.% and preferably about 65 wt.%, in terms of the total weight of the composition of the synthetic polymer.

6. System electric insulation according to claim 1, characterized in that the composition of a synthetic polymer additionally contains an additive selected from a wetting/dispersing agents, plasticizers, antioxidants, setpagetitle, silicones, pigments, flame retardants, fibers.

7. System electric insulation according to claim 1, characterized in that the thin coating is deposited by plasma chemical deposition from the gas phase (PECVD) to a thickness in the range from about 50 nm to about 50 μm; preferably in the range of from about 100 nm to about 30 μm, preferably in the range of from about 200 nm to about 20 μm, preferably in the range from about 250 nm to about 10 μm, preferably in the range of from about 300 nm to about 5 microns.

8. System electric insulation according to claim 7, characterized in that the starting materials for the production of thin coatings are volatile compounds with non-polar groups, preferably selected from compounds organosol is s, alkoxysilanes, organofluorine compounds and mixtures thereof.

9. System electric insulation according to claim 8, characterized in that the specified source material selected from hexadecylamine, preferably hexamethyldisiloxane or vinyltrimethylsilane; tetrachlorozincate, preferably of tetraethylorthosilicate; or mixtures of these compounds.

10. System electric insulation according to claim 9, characterized by the fact that these raw materials are mixed with fine material of the filler, preferably Microfine silicon dioxide or fine quartz, with a minimum content of SiO2about 95-97 wt.%, and preferably with an average particle size in the nanoscale range, or in a very low micron particle size range (1 μm-10 μm).

11. System electric insulation according to claim 1, characterized in that the thin coating is deposited Sol-gel process with a thickness in the range from about 0.5 μm to about 1 mm, preferably in the range of about 1.0 μm to about 1 mm, preferably in the range of about 1-500 μm, preferably in the range of about 1-100 microns.

12. System electric insulation according to claim 11, characterized in that the said coating obtained by the Sol-gel process on the basis of silane in which the silanes are selected from alkoxysilanes and Versilov.

13. System electr the insulation on p.12, characterized in that alkoxysilane and porcelany selected from compounds of the formula: [R-Si(OR1)3], where R additional (OR1]the Deputy, or an alkyl or substituted alkyl, preferably (C1-C22) alkyl, optionally substituted amine, an epoxy group, an acrylate, a methacrylate, phenolic residue or remainder of melamine, and R1is (C1-4) alkyl, preferably the stands.

14. System electric insulation according to item 13, characterized in that alkoxysilane and porcelany selected from the group comprising hexadecyltrimethyl, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, tetraethoxysilane, methacryloxypropyltrimethoxysilane, vinyltriethoxysilane, where the alkoxy may be ethoxy or methoxy group.

15. A method of manufacturing a surface modified electrical insulation system according to any of claims 1 to 14, comprising the following stages: (i) creation of a hardened or utverzhdenii composition of synthetic polymer containing at least one filler, and (ii) coating the surface of the specified compositions of synthetic polymer thin coating with a thickness in the range from about 50 nm to about 50 μm, the specified thin coating is applied by plasma chemical deposition from the gas phase (PECVD); and/or coating over the outer coat of the specified compositions of synthetic polymer thin coating with a thickness in the range from about 0.5 microns to about 2 mm Sol-gel process, and (iii) moreover, for this thin coating is used elektroprovodyashchie the original monomer.

16. The method according to item 15, in which both types of thin layers applied one on top of another in any desired sequence.

17. The use of surface modified electrical insulation system according to any one of claims 1 to 14 in power lines and wiring, preferably insulating materials, particularly in the field windings with impregnation of electrical components, such as transformers, built-in contacts, bushings, high-voltage insulators for indoor and outdoor use, especially for outdoor insulators associated with high-voltage lines, as long-rod, composite and cap insulators type, sensors, inverters and termination, as well as for base insulators in the sector of medium voltage insulators for outdoor power switches, measuring transducers, inputs and protection overvoltages in distribution devices.

18. Electrical products, including surface modified system electric insulation according to any one of claims 1 to 14.



 

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Sealing compound // 2329280

FIELD: chemistry.

SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.

EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.

3 tbl

FIELD: electrical and instrumentation engineering, microelectronics.

SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.

EFFECT: enhanced strength and electric conductivity properties of adhesive composition.

5 cl, 2 tbl

FIELD: antenna engineering.

SUBSTANCE: proposed composite dielectric material used, for instance, to produce antenna lenses of desired dielectric constant and density capable of operating under vibrating load conditions at temperatures ranging between -60 and +85 °C has epoxy resin functioning as binder and hollow glass microspheres and titanium, as fillers, their proportion being given in invention specification.

EFFECT: enhanced resistance to vibrations, enlarged operating temperature range.

2 cl, 1 tbl

FIELD: electrical engineering.

SUBSTANCE: proposed method for producing polymeric case of vacuum circuit breaker includes installation of vacuum chamber in mold, locking of the latter, and chamber sealing followed by filling space between chamber and mold with liquid insulator. In the course of molding, prior to filling chamber-to-mold space with liquid insulator, external surface of chamber is covered with flexible shock-absorbing silicon rubber, epoxy compound being used as liquid insulator. Epoxy compound has following composition, parts by mass: epoxy resin, 100; filler, 360; hardener, 85; promoter, 1. Polymeric case is molded at mold temperature of 140 - 145 °C and pole molding time of 27-35 minutes, followed by hardening for 12 h at 140 °C.

EFFECT: facilitated procedure, reduced cost.

3 cl, 3 dwg

FIELD: insulation materials.

SUBSTANCE: method of preparing insulation compound, which can be used for impregnating and pouring high- and low-voltage components of electrical and radio equipment, transformers, and throttle valves, comprises mixing at temperature 50-60°C resin having molecular weight 1000-6000 with phosphorus-containing modifier, in particular triglycidyl phosphate or diglycidyl methyl phosphate, or diglycidyl methyl phosphonate, after which is added stoichiometric amount of hardener, in particular 4,4'-diaminodiphenylmethane or 4,4'-diaminodiphenyl sulfone, or 4,4'-diaminodiphenyl oxide.

EFFECT: reduced viscosity of compound, enhanced insulation and electric-strength properties, and simplified preparation procedure.

2 tbl, 17 ex

The invention relates to a method for insulating self-extinguishing epoxy compounds intended for impregnation and casting high-voltage and low-voltage elements of electrical and radio equipment operating in the range from -60oC to +150oC

FIELD: insulation materials.

SUBSTANCE: method of preparing insulation compound, which can be used for impregnating and pouring high- and low-voltage components of electrical and radio equipment, transformers, and throttle valves, comprises mixing at temperature 50-60°C resin having molecular weight 1000-6000 with phosphorus-containing modifier, in particular triglycidyl phosphate or diglycidyl methyl phosphate, or diglycidyl methyl phosphonate, after which is added stoichiometric amount of hardener, in particular 4,4'-diaminodiphenylmethane or 4,4'-diaminodiphenyl sulfone, or 4,4'-diaminodiphenyl oxide.

EFFECT: reduced viscosity of compound, enhanced insulation and electric-strength properties, and simplified preparation procedure.

2 tbl, 17 ex

FIELD: electrical engineering.

SUBSTANCE: proposed method for producing polymeric case of vacuum circuit breaker includes installation of vacuum chamber in mold, locking of the latter, and chamber sealing followed by filling space between chamber and mold with liquid insulator. In the course of molding, prior to filling chamber-to-mold space with liquid insulator, external surface of chamber is covered with flexible shock-absorbing silicon rubber, epoxy compound being used as liquid insulator. Epoxy compound has following composition, parts by mass: epoxy resin, 100; filler, 360; hardener, 85; promoter, 1. Polymeric case is molded at mold temperature of 140 - 145 °C and pole molding time of 27-35 minutes, followed by hardening for 12 h at 140 °C.

EFFECT: facilitated procedure, reduced cost.

3 cl, 3 dwg

FIELD: antenna engineering.

SUBSTANCE: proposed composite dielectric material used, for instance, to produce antenna lenses of desired dielectric constant and density capable of operating under vibrating load conditions at temperatures ranging between -60 and +85 °C has epoxy resin functioning as binder and hollow glass microspheres and titanium, as fillers, their proportion being given in invention specification.

EFFECT: enhanced resistance to vibrations, enlarged operating temperature range.

2 cl, 1 tbl

FIELD: electrical and instrumentation engineering, microelectronics.

SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.

EFFECT: enhanced strength and electric conductivity properties of adhesive composition.

5 cl, 2 tbl

Sealing compound // 2329280

FIELD: chemistry.

SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.

EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.

3 tbl

Insulating enamel // 2342723

FIELD: technological processes.

SUBSTANCE: invention is related to finishing baking enamels intended for production of insulating protective coatings for impregnated windings, units and parts of electric machines and devices with insulation of thermal endurance class of (155°C). Enamel that includes filming agent, coupling agent, siccative, pigments, fillers, desired additives and organic dissolvents, as filming agent it contains epoxy ester produced by reactions of etherification and thermal polymerisation 1.0 Mole of epoxy modified resins with content of epoxy groups of 3.5÷4.5 wt %, 2.4 Mole of fatty acids of bodied oils and 1.3 Mole of colophony, and as active filler for increase of electric strength of enamel coating it additionally contains hydrophobic aerosil at the following ratio: Epoxy ester (55%-solution in xylene) 62.0÷81.0, Hydrophobic aerosil 0.3÷0.6, Hydrophobic aerosol 0.3÷0.6, Pigments and fillers 13.0÷29.0, Hydrophobic aerosil 0.3÷0.6, Coupling agent 4.5÷5.5, Desired additives (dispenser, defoaming agent, thixotropic, anti-flotation, antioxidant) 1.5÷6.5, Siccative (cobalt oktoat) 0.2÷0.5, Organic dissolvents 1.5÷7.5.

EFFECT: higher class of enamel thermal endurance, higher adhesion of enamel coating, improvement of coating dielectric properties.

2 tbl, 7 ex

FIELD: electricity.

SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.

EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).

1 tbl

FIELD: electricity.

SUBSTANCE: housing has inner layer and outer layer. Thickness of inner layer is at least by 50% more than thickness of outer layer, and inner layer is more flexible than outer layer. Inner layer is made from composition of the first resin which at hardening has relative elongation at rupture which is more than 5%, and outer layer is made from composition of the second resin which at hardening has relative elongation at rupture which is less than 5%.

EFFECT: improving insulation and strength properties of electric item, and profitability of its manufacture.

14 cl, 2 dwg

FIELD: chemistry.

SUBSTANCE: surface modified electrical insulation system, comprising a cured synthetic polymer composition including at least one filler and optional additives, wherein the surface of said synthetic polymer composition is modified by applying a thin coating; said thin coating being applied via plasma enhanced chemical vapour deposition (PECVD) with thickness within the range of about 50 nm to about 50 mcm; and/or said thin coating is applied via a sol-gel technique with thickness within the range of about 0.5 mcm to about 2 mm; and wherein said thin coat is an electrically non-conducting polymeric material with melting point which is considerably higher than the melting point or degradation temperature of the synthetic filler containing polymer composition; and a method of making said electrical system involving formation of a hardened or cured synthetic polymer composition, applying a thin coating on the surface of said synthetic polymer composition via plasma enhanced chemical vapour deposition.

EFFECT: improved system.

18 cl, 2 ex, 4 tbl

FIELD: electricity.

SUBSTANCE: electric insulating filling compound contains epoxide diane resin, amine hardener in the form of triethylene tetramine (TETA), and also a modifier - a phosphorus-containing methyl acrylate (PCM), at the following ratio of components, wt parts: epoxide diane resin ED-20 - 100 triethylene tetramine (TETA) - 10-15 phosphorus-containing methyl acrylate (PCM) - 30-40.

EFFECT: reduced viscosity of a filling compound, its higher viability, improved elasticity after hardening, preservation of dielectric properties.

1 tbl

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