Head for ejecting fluid and method of making heads for ejecting fluid

FIELD: printing.

SUBSTANCE: reference element is formed of a material which contains a mixture of first resin and second resin, which structural formula is different from the first resin, and is moulded between the feeding element and the substrate of the ejecting element, so that is an integral part of the feeding element.

EFFECT: head for ejecting fluid and method of its manufacture provide the ability to compound the reference element and an element for supplying ink with high impermeability and low probability of delamination, ie with high affinity to each other.

19 cl, 17 dwg, 2 tbl

 

The technical field to which the invention relates.

The present invention relates to head to eject the liquid, which ejects liquid, and method of manufacturing head to eject the liquid. Specifically, the present invention relates to an inkjet recording head that ejects ink to the specified recording medium to implement the recording and method of manufacturing ink jet recording head.

The level of technology

An example of using the head to eject the liquid, which ejects the liquid is ink-jet recording head, designed for use in the method of ink-jet recording in which the ink discharge to the specified recording medium to implement the record.

In the inkjet recording head (recording head) has a substrate that includes at least: a lot of the ejection channels through which the waste ink; a flow channel which is connected with each of the ejection channels; input channel to supply the ink in the flow channel; a generating element intended for the message of the energy of ejection of the ink in the flow channel. The recording head further includes a support member that supports the substrate, the element forming channels for supplying ink, which chere the sludge fed to the substrate, etc. as the substrate, usually used substrate made of Si (silicon). The element forming channels for supplying ink, made from plastic or similar material.

In such a recording head, as a rule, due to the difference of the linear expansion coefficients of the substrate ejectable element, equipped with a generating element to eject the liquid from the ejection channel, and an element for supplying ink, designed to hold the liquid, increases the voltage at the contact surface and, as a result, the substrate-emitting element is subjected to warping or twisting.

In this case, the contact surface between the substrate-emitting element and an element for supplying ink due to the increase in temperature during recording occurs a thermal stress that is causing the deformation of the substrate-emitting element, which may deteriorate the recorded image.

To solve this problem, in patent US 6257703 proposed design, in which the reference element with the same coefficient of linear expansion as that of the substrate-emitting element is placed between the substrate-emitting element and an element for supplying ink. In addition, in the published patent application of Japan No. 2007-276156 described JV is the way of the wheels of the support element with the same coefficient of linear expansion, as the substrate-emitting element, together with the element supply of ink.

However, the properties that should be possessed by the materials used for the manufacture of item supply of ink and the support element. Therefore, even if the supporting element and an ink supply cast together, it is impossible to obtain favorable properties of the contact surface, there remains the likelihood of peeling, etc. of the support element and element for supplying ink after manufacture and, therefore, reduce tightness. Therefore, there is a need for connection of the support element and element for supplying ink with extremely high affinity.

Disclosure of invention

The present invention can solve the above problems inherent in the conventional technology; its purpose is to provide a head to eject the liquid in which the supporting element, the supporting substrate emitting element, and an element for supplying ink supply ink to the substrate-emitting element are connected to each other with extremely high affinity. The aim of the present invention is to provide an efficient and reproducible method of manufacturing such a head to eject the liquid.

In accordance with one example of this is bretania, it is possible to get the head to eject the liquid in which the supporting element, the supporting substrate emitting element, and an element for supplying ink supply ink to the substrate-emitting element are connected to each other with extremely high affinity. It is also possible to produce such a head to eject the liquid effective and reproducible method.

Other distinctive features of the present invention will become apparent from the following description of examples of implementation with reference to the accompanying drawings.

Brief description of drawings

Fig. 1A and 1B are a schematic view in section of part of the recording head corresponding to one of the embodiments of the present invention.

Fig. 2A and 2B are a schematic perspective view of part of the recording head corresponding to one of the embodiments of the present invention.

Fig. 3A and 3B are a schematic perspective view of part of the recording head corresponding to one of the embodiments of the present invention.

Fig. 4 is a schematic perspective view of a substrate emitting element used in a recording head in accordance with one embodiments of the present invention.

Fig. 6 is a schematic perspective view of the recording head corresponding to one of the embodiments of the present invention.

Fig. 7 is a schematic view in section of part of the recording head corresponding to one of the embodiments of the present invention.

Fig. 8A, 8B, 8C and 8D are schematic views in section, illustrating the casting process of the recording head in accordance with one embodiments of the present invention.

Fig. 9A and 9B are a schematic view in section of part of the recording head corresponding to one of the embodiments of the present invention.

Description of the preferred variant of the invention, the

Further, the present invention is described in detail with reference to the drawings.

In the following description, structural elements with the same functions in the drawings are assigned the same reference position, and their description may be omitted.

It should be noted that the head to eject the liquid can be installed on devices such as a printer, a photocopier, facsimil the second apparatus, having a communication system, a word processor having a printing unit, as well as industrial printing devices, combined with various processing apparatuses. Head to eject the liquid can also be used for ejection of drugs, etc.

Using the head to eject the liquid in the quality of the recording head, it is possible to perform recording on various recording media, such as paper, yarn, fiber, fabric, leather, metal, plastic, glass, wood, ceramics.

Further, the present invention is described using an inkjet recording head (recording head) as an example head to eject the liquid.

In Fig. 3A and 3B presents a perspective view illustrating the structure of an inkjet recording head, which puts him one of the embodiments of the present invention. In Fig. 3A shows a recording head Assembly of Fig. 3C shows the disassembled recording head. As shown in Fig. 3A and 3B, the recording head 101 includes unit 111 of the main body, the supporting element 121, the substrate 131 and throwing the substrate 135 PCB. Unit 111 of the main body element 116 for supplying ink, an ink tank, an ink storage element and the reference element 121 made in one piece. The substrate 131 webrasil the irradiation member has a channel ejection to eject ink, and is located in block 136 to accommodate the substrate-emitting element in the substrate 135 PCB. Element 116 for supplying ink does not have to be manufactured as an integral part of the capacity for ink.

The substrate 135 printed circuit Board provides electrical connection of the substrate 131-emitting element with terminal block 137 and gives the group control signals from the terminal block 137 to the substrate-emitting element 131. For example, for communication between the substrate 135 PCB and substrate 131-emitting element can be applied TAV (automated Assembly of crystals on a tape media).

In Fig. 2A and 2B presents the views in perspective of the support element 121. In the reference element 121 has a hole 123, which communicate with the channel for supplying ink, and the contact surface 122 that is attached to the substrate-emitting element. In Fig. 2A shows the case when there are many holes 123 of Fig. 2B shows the case when there is one hole. The size of the hole 123 can be set properly.

Fig. 1A and 1B are a schematic view in section along the line 1A(1B)-1A(1B) in Fig. 3A one part of the recording head, which is a first variant implementation of the present invention.

First, as shown in Fig. 1A, the reference element 121 is located in the recess 113 of the element 116 for supplying ink forming the channels 112 a supply of ink. porny element 121 is so, that hole 123 of the support element 121 correspond to the channels 112 a supply of ink. The channels 112 for supplying ink are separated by an intermediate wall 115 item 116 for supplying ink. In this embodiment of the invention showing an inkjet recording head with three channels 112 for supplying ink that allows you to submit different ink types. It should be noted that the supporting element 121 is not required to be located in the recess 113, which is an empty space inside the element 116 for supplying ink. Supporting element 121 may be located in the area of the element 116 for supplying ink that does not have grooves, as shown in Fig. 6 and 7.

In Fig. 1B shows the structure of connection of the support element 121 to the substrate 131-emitting element. The substrate 131-emitting element connected to the substrate 135 PCB is placed in the recess 113 of the block 111 of the main body so that the holes 123 of the support element 121 match the holes 132 for supplying ink to the substrate 131-emitting element. The result is a design in which the channels 112 a supply of ink, the holes 123 and openings 132 for supplying ink directly communicated with each other. In this design the control signals to the heaters (not shown), representing a generating elements, which are located is alauda on the upper surface of the substrate 131-emitting element and generate energy used to eject the liquid, the substrate 135 PCB. Thus, each heater generate heat. At this time, the ink flowing into the holes 132 for supplying ink to the substrate 131-emitting element through the channels 112 for supplying ink is heated to form a bubble, due to the phenomenon of film boiling, and are ejected from the channel 133 throwing in the direction of the surface for recording the recording media with the expansion of the bubble.

Thus, even if the substrate 131-emitting element under the action of heat of each of the heaters (not shown) extends, the deformation can be eliminated, since the reference element 121 has the same coefficient of linear expansion as the substrate-emitting element.

In addition, the contact surface 134 of the substrate 131-emitting element are connected to the contact surface 122 of the support element 121 by means of adhesive 141. While the flatness of the contact surface 122 of the support element 121, preferably is not more than 20 μm. With such flatness possible use of screen printing, which represents a simple method of applying the adhesive coating to gently attach the substrate 131-emitting element by pressing the contact surface 122 so that she repeated the flatness of the pin is ktoi surface 122. Thus, to prevent loss of accuracy of the ink during ejection. The adhesive 141 preferably has a low viscosity and low temperature curing, fast curing, after curing is characterized by a relatively high hardness and is resistant to ink.

Fig. 9A explains variant of the invention, used in which the supporting element is shown in Fig. 2B, in the same section, as in Fig. 1A and 1B. In this embodiment, the invention provides such a supporting element 121 that the holes 123 correspond to multiple channels 112 a supply of ink, that is, in block 111 of the main body is formed by multiple channels 112 a supply of ink corresponding to the holes 123. Therefore, the supporting element 121 is inserted in the block 111 of the main body around the channels 112 a supply of ink, eliminating the intermediate wall 115. Thus, the supporting element 121 is moulded as an integral part of the block 111 of the main body, however, he does not come into contact with the ink channels 112 a supply of ink.

The substrate 131-emitting element connected to the substrate circuit Board 135, is placed in the recess 113 of the block 111 of the main body so that the channels 112 of the ink supply unit 111 of the main body correspond to the holes 132 for supplying ink to the substrate 131 throw the element. The contact surface 134 of the substrate 131-emitting element is attached to the contact surface 122 of the support element 121 by means of adhesive 141. In the area of the intermediate wall 115, since the supporting element 121 in this place is missing, the substrate 131-emitting element is attached to the block 111 of the main body by means of adhesive 141.

Fig. 9B explains another variant of the invention, used in which the supporting element is shown in Fig. 2B.

In the embodiment of the invention shown in Fig. 9B, the reference element 121 is made as an integral part of the block 111 of the main building, in block 111 of the main body around the channels 112 a supply of ink, eliminating the intermediate wall 115. In this case, this entails supporting element 121 that the holes 123 correspond to multiple channels 112 a supply of ink that is inside the hole 123 is formed in multiple channels 112 of the ink supply unit 111 of the main body.

Next, an example of the substrate 131-emitting element is described with reference to Fig. 4.

Fig. 4 is a schematic perspective view illustrating an example of the substrate 131-emitting element. In this embodiment of the invention the size of the substrate 131-emitting element is from 2 mm to 3 mm in width from 25 mm to 35 mm in length (in the direction of the ejection channel, thickness ranges from 0.5 mm to 0.8 mm Substrate-emitting element includes the base N having a generating elements N that generate energy used to eject liquid, and channels N ejection to eject ink. In the substrate N there is a channel N supply ink from the hole 132 of the channel for supplying ink communicating with the hole 123 of the support element 121. In addition, the substrate made of Si, a is the electrode unit N, which has a contact pin N, electrically connected with a generating elements N; and an electrode unit N connected to the substrate 135 PCB. In addition, the wall N of the ink flow channel forms a channel N thread which communicates with the channel N supply on the one hand and channel N throwing from the other side.

In accordance with the present invention the supporting element 121, preferably made of a polymer alloy. Particularly preferably, the element 116 for supplying ink was made of the first resin, and the supporting element 121 contained a polymer alloy which is a mixture of the first resin and the second resin different from the first.

Examples of the first resin for the manufacture of element 116 for supplying ink are modified, re (positivenergy ether), PS (polystyrene), HIPS (high impact polyster is l) and PET. From the viewpoint of wettability, stability of the geometric dimensions in casting and stiffness preferred modified RRE (positivenergy ether). Modified RRE resin (modified polifenilengermana resin) are also suitable in the case of a one-piece casting element 116 for supplying ink tanks for ink. Even though the supply of ink may also contain a second resin, there are cases when the element supplying the ink, preferably, does not contain the second resin. For example, some of the resin used as the second resin, may impede accurate casting some small parts of item supply of ink.

On the other hand, the resin forming the support element 112 must have heat resistance against the heat coming from the substrate-emitting element, and wettability. Since this is the case, as the resin, it may include polystyrene, PPS (polyster), acrylic resin, HIPS (high impact polystyrene), PP (polypropylene), PE (polyethylene), nylon, PSF (polysulfone), etc. are particularly suitable resin PPS (polyphenylenesulfide resin), because it is easily molded, even when it contains a large amount of filler that can reduce the coefficient of linear expansion. It is preferable to use such material as the second resin and produce oporn the th element 121 of the alloy of the second resin material, with high affinity to the element 116 for supplying ink. Especially it is preferable to make the support element using the polymer alloy of the second resin is the same resin as the first resin, from which is made an element of a supply of ink. In this case, the support element preferably contains a larger amount of the first resin. Alternatively, there can be used an alloy of the first resin and metal, such as magnesium.

As a result, the supporting element performing the function of a support for holding the substrate, and with high affinity to the element of a supply of ink can be manufactured as a single unit with the element supply of ink. In particular, it is preferable to cast the element to a supply of ink and the reference element using the modified RRE element for supplying ink and polymer alloy PPS and modified RRE to the support element.

In this case, to increase the affinity to the element of the ink supply support element may further comprise a third resin such as a copolymer of polyethylene compound based on epoxy resin.

Add in the support element filler can reduce the coefficient of linear expansion. For use as a filler suitable material that reduces the coefficient of linear expansion of the resin, for example, inorganic filler, the th as the glass filler, carbon filler, spherical silica, spherical alumina, mica and talc. Adding filler, from the point of view of the flatness of the surface and to prevent the anisotropic expansion, it is preferable to use a spherical filler, which consists of spherical particles. In addition, the particle diameter of the filler is preferably small. The coefficient of linear expansion of the substrate-emitting element ((silicon based) + (polymer flow channel), typically used to head to eject the liquid, is 3 parts per million. To get close to the specified coefficient of linear expansion, it is preferable to introduce a large amount of filler. It is desirable to combine two or more types of filler with different diameters of the particles to small particles repeatedly filled the gaps between the large particles, thereby reducing the free volume and increasing the fill factor. For example, when using 75% to 85% by weight. spherical filler with an average particle diameter of 30 μm and from 15% to 25% weight. spherical filler with an average particle diameter of 6 μm, can be achieved in high density. When the content of filler in the support element in a ratio of 80 wt%, the coefficient of linear expansion of the supporting element which can be substantially reduced, and the difference in coefficients of linear expansion with the substrate-emitting element is significantly reduced. In the case where the filler is present in the reference element in a ratio of 80 wt%, the use of PPS in the manufacture of the support element in a proportion of not less than 3.8% of the weight., preferably, in a proportion of not less than 5% weight. relative to the filler allows to achieve extremely high yield strength of the material of the support element during casting.

As for the method of manufacturing the recording head, the following describes an example of a method of forming the support element 121. In the method of manufacturing the support element 121, the material of the support element is first mixed and granularit. For this purpose, in the case when the source material of the support element has at least 75% wt. filler, preferably using a mixer, suitable for large shear forces at high temperatures. For example, when using an extruder continuous open-roller "Kneadex" (trade name: manufacturer Mitsui Mining Co., Ltd.) and by submitting in this device the source material of the support element can continuously carry out all operations from mixing prior to granulation.

Then the granules are poured into the form to the specified profile, using injection-molding machine, and the supporting element is made by injection molding is imovane. For this purpose, in the case where the material of the support element is characterized by a high content of filler and low fluidity, use high-speed injection molding machine high pressure, suitable for otlivanija material of the support element at a high speed. Although the speed of casting conventional injection molding machine is about 500 mm/sec, high speed injection machine high pressure can provide a casting speed of 1,500 mm/sec to 2000 mm/sec. To improve the quality of content is preferable to use such terms of casting as the casting speed is not less than 1000 mm/sec and pressure casting not less than 300 MPa.

The temperature of the casting while the casting is in a range from (Tg-30)°C. to Tg°C inclusive, where Tg denotes the glass transition temperature specified thermoplastic resin. Setting the temperature of the casting in this range, it is possible to reduce the deformation of the support element 121, which occurs when the release forms, and to improve the fluidity and adhesion properties of the resin. This is also desirable because it contributes to improving the flatness of the contact surface 134 of the substrate 131 of the recording element.

In addition, it is desirable that the period of time (hereinafter referred to as "cooling period") from the end of the casting material of the support element to the moment when cast supporting element is removed from fo what we was not less than 60 seconds, and the mold temperature during excavation corresponded to the range of from (Tg-30)°C. to Tg°C inclusive. It should be noted that Tg means the glass transition temperature Tg°C of the specified thermoplastic resin. Setting the cooling time is not less than 60 seconds, you can reduce the deformation of the support element 121, which occurs when the release forms, and to achieve the flatness of the support element 121, not exceeding 20 microns. For example, Tg modified RRE, which is a polymer alloy re and PS, suitable for use as thermoplastic resin in the present invention, is about 110°C depending on the ratio of re and PS modified in RRE.

As shown in Fig. 5A, in a state where the supporting element 121 is placed and fixed in the form of block 111 of the main body, carry out injection molding material for the manufacture of element 116 for supplying ink and block 111 of the main body. While the contact surface of the element 116 for supplying ink and the support element 121 fused with each other, passing in the state shown in Fig. 5V. This is a one-piece casting, often referred to as "alloy wheels with insert, which allows you to securely connect the supporting element 121 unit 111 of the main body. This surface forms used for casting with Stavka is, the corresponding contact surface 122 of the support element 121 preferably has a flatness of not more than 5 μm.

Supporting element 121 and the element supply of ink can be manufactured in accordance with other casting methods. One of the examples described below. Fig. 6 is a schematic perspective view illustrating one portion of the recording head, which is one of the embodiments of the present invention, and Fig. 7 represents its section along the line 7-7. Supporting element 121, made of a material which is a mixture of the first resin and the second resin attached to the element 116 for supplying ink and block 111 of the main body, made of the first resin. In Fig. 8A-8D shows the casting process. In Fig. 8A shows that the first resin is subjected to the injection molding using the first form 151 and the second form 152 receiving element 116 for supplying ink and block 111 of the main body. Then the second handicap 152 is removed, as shown in Fig. 8B. At this time, the element 116 for supplying ink and block 111 of the main body remaining attached to the first form 151. Then, as shown in Fig. 8C, the third form 153, intended for forming the support element 121, attached to the first form 151, where left attached element 116 for supplying ink and block 111 of the main body, and perform the injection formovani is by casting material, representing a mixture of the first resin and the second resin. While the contact surface of the element 116 for supplying ink and the support element 121 fused with each other. After that, as shown in Fig. 8D, the third form 153 is removed and the molded product is removed. This way a one-piece casting, often referred to as "two-tone alloy wheels", its advantage is easy to achieve with respect to the exact sizes of the support element 121, item 116 for supplying ink and block 111 of the main body. In this case also, by necessity, can be used above preferred conditions of the wheels of the support element, such as mold temperature during molding of the support element.

Further supporting element is described in more detail from the point of view of its thermal properties.

Fabrication of substrate-emitting element long helps to increase the recording speed. When the scanning head to eject the liquid with the purpose of recording in the recording device, it is desirable to reduce the number of passes in order to increase the recording speed. Because of this, often use substrate-emitting element length from approximately 25 mm to 40 mm, it Is believed that excessively long substrate-emitting element, it is difficult to produce.

The following describes the heat capacity of the support element. Heat performance is to place a quantity of heat, needed to increase the body temperature by 1°C. When the substrate-emitting element has a length of from approximately 25 mm to 40 mm, the heat capacity of the support element is, preferably, from 2.5 j/K to 3.9 j/K. the Total amount of thermal energy emitted by applying an electric pulse that operate the generating power of the elements, with the elongation of the substrate-emitting element increases. If that is true, then if the supporting element, the supporting substrate emitting element, will have adequate heat capacity, thermal energy will be transferred from the substrate-emitting element to the support element. This reduces heat accumulation in the substrate-emitting element and promotes the stable ejection. On the other hand, from the point of view of manufacture, for example, in the case of injection molding of the support element, heat capacity, preferably, does not exceed a 3.9 j/K, to eliminate the increasing cooling time. When the heat capacity does not exceed a 3.9 j/K, the cooling time after injection molding is about 30 seconds. Thus, the advantage of injection molding can be used to achieve low cost and easy fabrication.

In addition, the flatness of the support element preferably does not exceed 20 μm. Such flatness allows supports shall be in a horizontal position long substrate-emitting element and promotes good throwing.

In addition, adequate heat capacity, thermal conductivity, preferably about 0.5 W/(m·K) up to 1.5 W/(m·K). When thermal conductivity is not less than 0.5 W/(m·K), the transfer of heat energy to the support element may occur more evenly. In addition, it is possible to suppress a negative phenomenon, which is expected to take place, for example, when molding with insert. When molding with insert, which when in the form fill material for the manufacture of item supply of ink, it refers to the already existing support element, and if the supporting element has a high conductivity, a material element of a supply of ink quickly loses heat and separately cooled, becoming solid. Accordingly, when the connection of the support element and element for supplying ink by pouring, is particularly preferable that thermal conductivity of the support element does not exceed 1.5 W/(m·K).

The following are examples, for a more detailed description of the present invention.

Example 1

Supporting element, combined with the element supply ink was manufactured as follows.

First produced supporting element 121 as follows. PPS (production Tosoh Corporation; SUSTEEL B-060P), modified RRE (SABIC manufacturing Corporation; SE1-X) and spherical silica with an average particle diameter of 30 μm (manufactured the Oia MICRON Co., LTD.) mixed in the weight ratio 8/2/90 when the temperature of the resin from 280°to 290°C. to obtain granules. This material is molded support element 121 under the following conditions: the casting speed 1500 mm/sec, pressure casting 343 MPa, the temperature of the resin 320°C., mold temperature of 100°C, the cooling time of 60 seconds. He got the support element shown in Fig. 2A.

Then the supporting element 121 in advance, put in the form of block 111 of the main body and element 116 for supplying ink and filled in this form the resin, the modified RRE (SABIC manufacturing Corporation; SE1-X to perform molding with insert). Conditions injection molding element 111 of the main building: the speed of the wheels 70 mm/sec, pressure casting 65 MPa, the temperature of the resin 320°C., mold temperature of 100°C. the Reference element had a length of 13 mm, width 9 mm, thickness 1 mm and three holes with a length of 9.5 mm and a width of 0.5 mm in the center.

The result obtained molded product, combining the supporting element 121, the element 116 a supply of ink and an element of the main building.

Then prepared substrate-emitting element with the base of Si with element forming the flow channel, and the channel dispersion of the resin; Si surface of the substrate emitting element opposite to the surface of the ejection channel, attached to the support element 121 molded articles by means of adhesive. SL what needs to be noted, the substrate-emitting element had a width of 4.3 mm, a length of 11.7 mm and a thickness of 0.65 mm

Thus, the produced recording head.

Example 2

The recording head was manufactured in the same way, except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) the material for the support element 121 changed 9.6/6,4/84.

Example 3

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed to 16/4/80.

Example 4

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed on 12/8/80.

Example 5

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed on 10/10/80.

Example 6

The recording head was manufactured in the same way in which the example 1, except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed on 8/12/80.

Example 7

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed on 4/16/80.

Example 8

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed on 3/17/80.

Example 9

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed to 2.5/22,5/75.

Example 10

The recording head was manufactured in the same way as in example 1 except that the polymer alloy PPS (production Tosoh Corporation; SUSTEEL 301-066) and spherical silica (MICRON manufacturing Co., Ltd.) mixed in the weight ratio 4/16/80.

Example 11

The recording head was manufactured the same way, the example1, except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed to 6/24/70.

Example 12

First resin modified RRE (SABIC manufacturing Corporation; SE1-X) molded unit 111 of the main body when the casting speed of 70 mm/sec, the pressure casting 65 MPa, the temperature of the resin 320°C. and a mold temperature of 100°C.

Then PPS (production Tosoh Corporation; SUSTEEL B-060P), modified RRE (SABIC manufacturing Corporation; SE1-X) and spherical silica (MICRON manufacturing Co., Ltd.) mixed in the weight ratio 8/2/90 when the temperature of the resin from 280°to 290°C and the obtained granules. This material was subjected to molding to obtain the support element 121 in a state where the block 111 of the main body was left in the form, under the following conditions: speed casting 15000 mm/sec, pressure casting 343 MPa, the temperature of the resin 320°C., mold temperature of 100°C, the cooling time of 60 seconds.

The result obtained molded product, combining the supporting element 121, the element 116 for supplying ink and block of the main building. Then, the recording head was manufactured in the same way as in example 1.

Example 13

First, as in example 6, produced supporting element. The difference from example 6 was as follows. On the surface of the support element, to which priciple the Xia substrate-emitting element, there was a plane 34 mm ×4 mm and tapering hole the size of 28.5 mm ×1 mm from the substrate-emitting element and a 30 mm ×1 mm from the inlet element. The flatness is measured using three-dimensional laser measuring device, was 9 μm. In addition, the supporting element had a thickness of 4 mm, weight 8 g, a density of 1.88 g/cm3and heat capacity of 3.5 j/K. thermal Conductivity and specific heat of the pellets, measured to the manufacture of the support element, amounted to 0.8 W/(m·K) and 0,817 j/(K·g), respectively, it should be noted that the specific heat capacity [j/(K·g)] was measured by the DSC method (differential scanning calorimetry differential scanning calorimetry) in accordance with JIS K 7123. Heat capacity [j/K] is calculated as the product of specific heat [j/(K·g)], previously measured, the mass [g] of the support element, measured using an electronic scale in accordance with the formula: (Heat capacity [j/K]) = (specific heat capacity [j/(K·g)]) ×(weight [g]). While thermal conductivity was measured using pulsed laser radiation.

Then, the recording head was manufactured in the same way as in example 6, except for the following differences from example 6. Substrate-emitting element, combined with the supporting member, had a width of 1.2 mm, length 33 mm, a thickness of 0.7 mm. in Addition, in the surface-emitting element is and there were 600 nozzles, allow the throwing of 30 square

Example 14

The recording head was manufactured as in example 13, except that an attached substrate-emitting element had a width of 1.2 mm, a length of 25 mm and a thickness of 0.7 mm

Example 15

The recording head was manufactured as in example 13, except that an attached substrate-emitting element had a width of 1.2 mm, a length of 40 mm and a thickness of 0.7 mm

Example 16

The recording head was manufactured as in example 13, except that the supporting element has a thickness of 4.5 mm, the Measured flatness of the support element was 12 μm, the measured heat capacity of the support element was 3.9 j/K.

Example 17

The reference element was manufactured as in example 6, except that the weight ratio of PPS, modified RRE and spherical silica was changed to 20/30/50. thermal conductivity of the pellet was 0.5 W/(m·K), the flatness of the support element 20 μm, the heat capacity of the support element to 2.5 j/K.

After that, the recording head was manufactured as in example 13.

Example 18

Differences from example 13 was as follows. As a material for the manufacture of the support element PPS, modified, re and spherical alumina with an average particle diameter of 30 μm (MICRON manufacturing Co., Ltd.) with Asali in mass ratio 8/12/80. The thickness of the support element was set equal to 2.5 mm. In other respects, the recording head was manufactured as in example 13.

Comparative example 1

The recording head was manufactured in the same way as in example 1 except that the weight ratio of PPS (production Tosoh Corporation), modified RRE (SABIC manufacturing Corporation) and spherical silica (MICRON manufacturing Co., Ltd.) changed to 20/0/80.

Comparative example 2

For the manufacture of the support element 121 used PPS (production Idemitsu Co., Ltd., NAC-117), which molded the support element 121 under the following conditions: the casting speed 1500 mm/sec, pressure casting 343 MPa, the temperature of the resin 350°C, mold temperature 80°C, cooling to the temperature of the mold 50°C. it Should be noted that the material used for the manufacture of the support element, contained fiber filler. Conditions forming unit 11 of the main building were the same as in example 1.

Example 19

The recording head was manufactured as in example 13, except that the thickness of the support element is changed to 2.5 mm, the Flatness of the support element was 8 μm, the heat capacity of the support element amounted to 2.2 j/K.

Test

After many recording heads manufactured in the examples and comparative examples was subjected to follow what he tested for cyclical temperature change, toured the substrate-emitting element and its environs. Examination surroundings produced by filling yellow ink for greater clarity, paying attention to the connection substrate and the support element and the peeling between the support element and the connecting element. Compared with test (1)test (2) included a sharp change in temperature and, thus, can be considered as a challenge in tough conditions.

Test 1: test on a cyclical temperature change

Head inspected after a 10-fold repetition of the following cycle: 2 hours at room temperature (25°C) → 2 hours at low temperature (-30°C) → 2 hours at room temperature (25°C) → 2 hours at high temperature (60°C).

Test 2: test thermal shock

Head inspected after a 10-fold repetition of the following cycle: 2 hours at high temperature (60°C) → 2 hours at low temperature (-30°C).

Test 3: test flow

Head examined after incubation for 360 hours in a climate with a temperature of 60°C and 20%humidity. During this test the head, sustained under specified temperature and humidity set in the recording device and filled some set of colored ink for image recording.

Assessment

In that the face 1 shows the results of the inspection substrate-emitting element for examples and comparative examples.

Evaluation criteria

Between the substrate and the supporting member

A: Between the substrate-emitting element and the reference element is missing peeling. In addition, the substrate-emitting element has not warped.

In: Between the substrate-emitting element and the reference element is missing peeling. Although in rare cases there is a warping of the substrate-emitting element, the distortion is small and does not adversely affect the throwing.

From: Between the substrate-emitting element and the reference element is missing peeling. In some cases there is a warping of the substrate-emitting element, which has a negative effect on the ejection of very small drops.

D: part of the substrate-emitting element noticeably failure, such as cracking; or a substrate-emitting element is peeled from the support element.

Between the support element and the connecting element

A: Between the support element and the connecting element there is no flaking.

In: In very rare cases, there is a slight peeling between the support element and the connecting element.

D: Frequent exfoliation between the support element and the connecting element.

Turnover

A: Continuous production of the support element with great precision pouring is possible since the beginning of the molding.

In: Continuous production of the support element with great precision casting is possible after a certain number of castings.

-: the assessment was not made.

Table 1
ExampleCf. Ave
No.12345678910111212
support
PPS, % weight.89,61612108432,5-6820And*
modifier. RRE, % weight.26,4481012161722,5-2412N*
PPS+a copolymer of polyethylene, % the EU. 20
the filler is spherical silica, wt%90848080808080807580708080
Fiber filler And*
FluidityAndAndAndAndAndAndAndInInAndAndAnd--
test (1)between the substrate and the supporting memberAndAndAndAndAndAndAndAndAndAndInAndAndIn
between the support e-Tom and supply e-TomAndAndAndAndAndAndAndAndAndAndAndDD
test (2)between the substrate and the supporting memberAndAndAndAndAndAndAndAndInAndAndAnd
between the support e-Tom and supply e-TomInInInInAndAndAndAndAndInAndAndDD
test (3)between p what dlikoj and reference AndAndAndAndAndAndAndAndAndAndAndAndDD
between the support e-Tom and supply e-TomAndAndAndAndAndAndAndAndAndAndAndAndDD
* - Used; N - not used

Table 1 clearly shows the following.

The evaluation of the connection substrate and the support element in the test (1) were obtained extremely good results in all examples. The evaluation of the connection substrate and the support element in the test (2), which is a more stringent test, extremely horserelated were obtained in examples 1-8, 11 and 12, in which the content of the filler in the support element was not less than 80% weight. From these results it can be concluded that the peeling between the substrate and the supporting member is particularly reduced when the content of the filler in the reference element is not less than 80% weight. This can be explained by the fact that the coefficient of linear expansion of the support element in this case is closer to the corresponding coefficient of the base.

In addition, the evaluation of the connection of the support element and the connecting element is extremely good results were obtained in all examples in the test (1). On the other hand, the peeling between the support element and the connecting element took place in the heads of the comparative examples. In test (2), which is a more stringent test than the test of (1), examples 5-9 and 11-12 differed from the other samples. More favorable than in other examples, the results were obtained in examples 5-9 and 11-12. From these results it can be concluded that especially preferably, the modified RRE, which is a material for the manufacture of item supply of ink is present in proportions of at least 50% weight. relative to the polymer components of the support element with the exception of the filler (examples 5-9 and 11-12). That is, the weight policyfailure ether, preferably, not less than the weight of p is liparilocalita.

In addition, from the viewpoint of the yield strength of the material of the support element during the molding, when the content of filler in the material of the support element at least 80 wt%, it is preferable to use PPS in the proportion of not less than 5% weight. to the weight of the filler. The reason is that the estimation results yield better in examples 1-7, where PPS is contained in the material of the support element in a proportion of not less than 5% weight. to the weight of a filler than in examples 8-9, where PPS is present in a proportion of not more than 5% weight. to the weight of the filler. These results show that the polymer components except filler number of PPS affects the yield and the number of re affects the affinity of the support element and the connecting element.

In examples 5-7 obtained extremely favorable results of evaluation of the connection substrate and the support element and the connection of the support element and the connecting element in the tests (1)to(3). From this it is clear that particularly preferably, the content of the filler in the material of the support element was not less than 80 wt%, PPS was present in a proportion of not less than 5% weight. to the weight of filler, and the proportion of modified RRE in polymer components with the exception of the filler was not less than 50% of the weight.

When throwing in the test (3) was obtained a good picture without lines or unevenness for heads of all exampl is. On the other hand, the image distortion was observed for heads of comparative examples. This can be explained by the fact that inks of different colors are mixed with each other due to peeling between the support element and the connecting element.

Evaluation of temperature increase

Each of the recording heads of examples 13-19 installed in the recording device and using the diode detector measured the temperature of the substrate-emitting element during continuous ejection of ink within 30 seconds with the ejection frequency of 5000 Hz and has made its assessment. The results are presented in table 2.

A: less than 50,1°C. In not less than 50,1°C.

Table 2
The type of fillerThe content of the reference element, wt.%Heat capacity, j/KThe length of the substrate-emitting element, mmReached temperature, °CScore
Example 13spherical silicon oxide803,53340And
Example 14spherical silicon oxide803,52538And
Example 15spherical silicon oxide803,54047And
Example 16spherical silicon oxide80a 3.93339And
Example 17spherical aluminum oxide502,93342And
Example 18spherical silicon oxide802,53344And
Example 19spherical silicon oxide80 2,23356In

In accordance with this table, in examples 13 and 16, the heat capacity varies due to differences in thickness. When comparing examples 13-18 with example 19 shows that by setting the heat capacity of the support element is not less than 2.5 j/K, the temperature increases during continuous ejection and a length of the substrate-emitting element is 25 mm or more, may be limited to a relatively small value of not more than 47°C.

Although the present invention is described with reference to the examples of its implementation, the experts in this field, it should be understood that the invention is not limited to the described embodiments. The volume of the next then the claims should be interpreted most broadly as encompassing all such modifications and equivalent structures and functions.

1. Head to eject the liquid, including:
substrate-emitting element including a substrate, provided with a generating element which generates energy to eject the liquid;
lead element formed from a material that includes the first resin, and having a supply channel for supplying a fluid to the substrate-emitting element; and
supporting element, form the integration of material, which contains a mixture of the first resin and the second resin, the structural formula of which is different from the first resin, and formed between the inlet element and the substrate-emitting element so that an integral part of the inlet element.

2. Head for ejection liquid according to claim 1, in which the reference element contains a filler.

3. Head for ejection liquid according to claim 1, in which the second resin is polyphenylenesulfide resin.

4. Head for ejection liquid according to claim 1, in which the first resin is a modified policygenerating resin.

5. Head for ejection liquid according to claim 1, in which the first resin is a modified policygenerating resin,
in which the second resin is polyphenylenesulfide resin, and
in which the supporting element weight of the modified policygenerating resin is not less than the weight polyphenylenesulfide resin.

6. Head for ejection liquid according to claim 3, in which the reference element contains a filler in a proportion of not less than 80 wt.% relative to the weight of the support element, and
in which polyphenylenesulfide resin contained in the reference element in a proportion of not less than 5 wt.% the weight of the filler.

7. Head for ejection liquid according to claim 1, in which the heat capacity of the supporting ele is enta corresponds to a range from 2.5 j/K to 3.9 j/K inclusive.

8. Head for ejection liquid according to claim 1, in which the flatness of the surface of the support element facing the substrate-emitting element is not more than 20 μm.

9. A method of manufacturing a head to eject the liquid, comprising: a substrate emitting element including a substrate, provided with a generating element which generates energy to eject the liquid; a supply element having a supply channel for supplying a fluid to the substrate-emitting element; and a support element located between the inlet element and the substrate-emitting element, and the method of manufacture includes:
the formation of the inlet element of the first resin with the use of the first form and the second form;
removing the second form, while leaving the inlet element in the first form;
connection with each other, the first shape and the third shape; and
forming the inlet element and the support element as a whole by injection molding a mixture between the first form and the third form, where the mixture is a material for forming the support element and contains the first resin and the second resin different from the first resin.

10. A method of manufacturing a head to eject the liquid, comprising: a substrate emitting element including a substrate, provided with the second generating element, which generates energy to eject the liquid; a supply element having a supply channel for supplying a fluid to the substrate-emitting element; and a support element located between the inlet element and the substrate-emitting element, and the method of manufacture includes:
the fixing of the support element in the form, where the supporting element is formed from a mixture containing the first resin and the second resin different from the first resin;
forming the inlet element and the support element as a whole by adding in the form of a first resin to form the inlet element.

11. Head to eject the fluid of claim 8 in which the supporting element contains a filler.

12. Head to eject the fluid of claim 8 in which the second resin is polyphenylenesulfide resin.

13. Head to eject the fluid of claim 8 in which the first resin is a modified policygenerating resin.

14. Head to eject the fluid of claim 8 in which the first resin is a modified policygenerating resin,
in which the second resin is polyphenylenesulfide resin, and
in which the supporting element weight of the modified policygenerating resin is not less than the weight polyphenylenesulfide resin.

15. The head d is I the ejection liquid according to item 12, in which the reference element contains a filler in a proportion of not less than 80 wt.% relative to the weight of the support element, and
in which polyphenylenesulfide resin contained in the reference element in a proportion of not less than 5 wt.% the weight of the filler.

16. The method of manufacturing of claim 10, in which the supporting element is formed by introducing the mixture into the form, and
when the mold temperature during molding is in a range from (Tg-30)°C Tg°C inclusive, where Tg denotes the glass transition temperature of the mixture.

17. Head to eject the liquid, including:
substrate-emitting element including a substrate, provided with a generating element which generates energy to eject the liquid;
lead element formed from a material that includes the first resin, and having a supply channel for supplying a fluid to the substrate-emitting element; and
supporting element containing mixture, which contains the second resin and the third resin, and is made by molding between the inlet element and the substrate-emitting element so that an integral part of the inlet member, the structural formula of a second resin different from the first resin, and the structural formula of the third resin different from the first resin and the second resin.

18. Head for ejection is hidcote on 17, in which the first resin is a modified policygenerating resin,
in which the second resin is polyphenylenesulfide resin, and
in which the third resin is a copolymer of polyethylene, copolymerizable with epoxysilane.

19. Head to eject the liquid, including:
substrate-emitting element including a substrate, provided with a generating element which generates energy to eject the liquid;
lead element formed from a material that includes the first resin, and having a supply channel for supplying a fluid to the substrate-emitting element; and
supporting element containing mixture, which contains the first resin and the second resin different from the first resin, and located between the inlet element and the substrate-emitting element.



 

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