Illumination device module

FIELD: physics.

SUBSTANCE: invention provides a module of an illumination device with one or more light-emitting elements operatively connected to a substrate and a loop lying in at least partly around one or more light-emitting elements. The loop and the substrate define a cavity in which one or more light-emitting elements lie, where the cavity can be tightly closed by a light-transmitting system. At least part of the cavity can be filled with encapsulating material. The loop defines one or more channels, where each channel joins the cavity with the outer surface through an outer opening. For example, the outer opening can be accessible when the light-emitting device is at the assembly stage, thus facilitating fluid movement of the encapsulating material inside and/or outside the cavity. Also disclosed is a method of making the module described above.

EFFECT: high optical efficiency of the illumination device module.

19 cl, 3 dwg

 

The technical field to which the invention relates.

This invention relates to lighting, in particular, to the design module of the lighting device.

The level of technology

Light-emitting diodes (LEDs) can be more productive, if the LED module is designed more rationally for more efficient release of light, which is formed inside the LED during operation. In future design capabilities of the device, the performance of the release of light can be subject to improvement opportunities that the light from the LED efficiently routed in such a way that can leave the LED module in the desired direction. The number of structural features can affect things such as the direction and location of reflecting surfaces, in which the reflection type has a mirror or the nature of the discharge. Additionally reflective properties of the LED module can affect the performance of the release of light. Many works describes how to design the LED modules, taking into account features such as structure and composition, for example.

PCT No. WO 2005/067063 describes the location containing substrate with multiple electrically conductive paths and at least one radiating device, the surface of which is attached to the substrate and connected to the first and second electro is AMI with electrically conductive tracks. The ring, which is located on the substrate, prevents the light emission device and contains a bottom surface that is attached to the substrate, and an upper surface which is designed to reflect light emitted from the unit light emission in a given direction. This ring allows you to collect and direct the light and can provide the exact location encapsulates the details or lenses, which may be part encapsulates the details and to absorb thermal energy from the encapsulating items that can be transferred from the upper and side surfaces of the unit light emission.

U.S. patent No. 6940704 describes a light emitting diode containing surface mounting module having a metal circuit by mass, sufficient to ensure low thermal resistance, at least one contact of the anode and at least one contact of the cathode. LED also includes a reflector located in the module, semiconductor and an additional focusing dome. The semiconductor includes a transparent substrate and a semiconductor component, which is located inside the module, so that the semiconductor component and the substrate, located side by side above the reflector, or semiconductor, located in the module, so that the substrate is at the top of the semiconductor component.

Patentsa No. 6982522 describes the LED device, contains a base having a cavity with an open upper surface, the inner surface of the wall of the cavity has a reflective surface; LED is located on the inner bottom surface of the cavity; rubber fills the cavity, the rubber contains a phosphor which absorbs a part of light emitted by the LED to conversion and emission light; and a layer of phosphor covers the reflective surface, a layer of phosphorus contains particles of phosphorus.

U.S. patent No. 6949771 describes a light source containing a planar substrate with located at the center of the slit. Diode, light emitting, attached on the metal layer covering the bottom of the slit and hidden using a transparent encapsulating material. The metal layer provides a thermal path for heat generated during light emission diode.

U.S. patent No. 6590235 and 6204523 describes the LED component with emission of light in the green, close to the UV wavelength range. Light emitting semiconductor encapsulated with one or more silicone compounds containing massive outer casing covered with a gel or viscous layer, or both. Silicone material resistant to the temperature and humidity, and prevents the spread of UV radiation.

U.S. patent No. 6995402 describes mount for semiconductor device radiation of light, which is passed contains a built-in reflecting cover. Reflecting cover includes a wall formed on the mount, which is shaped and positioned to reflect light rays from the light emission device along the vertical axis design device/mount.

U.S. patent No. 6897486 describes a light emitting module and method of its production. The module includes a substrate having grooves, the conductor attached to the grooves, LED attached to the substrate. Attached to substrate sleeve, the reflector and the lens. For manufacturing light emitting module is formed of a long substrate, which are attached to the conductor. The substrate has an attached wires, cut to a specific length for the formation of separate substrates. For each individual substrate attached LED, lens and reflector.

U.S. patent No. 6610563 describes a method of manufacturing a surface with attached optoelectronic components, which includes the following steps: preparing a main body (module) with an optoelectronic receiver and/or transmitter located in the cavity of the main body, which is filled with a transparent material by means of casting, with the location of the optical device within the main body, in which the optical device in contact with the fill material.

U.S. patent No. 2005/0221519 describes a method of manufacturing the semiconductor module emitting light in which trojstva, which contains the first molding encapsulating material into the cavity, in which the radiation device. The first casting of encapsulating material into the cavity intended for the formation of a hard top surface of the selected shape. Glowing transforms element contains material conversion wavelength and has a thickness region of the cavity greater than near the wall cavity.

U.S. patent No. 2005/0269587 describes a light-emitting dot matrix module and production method. The module contains a circuit, at least one LED, the housing and the lens. The circuit contains many conductors and has upper and lower sides. Part of the path determines the site of attachment. LED mounted to the platform mounting. The casing is partially merged with the contour and defines a free space in the upper part of the circuit, open space protects the site of attachment. The housing further comprises a latch located on the bottom side of the circuit. The lens is connected to the housing. A compound lens is used as the reflector and a tool for collecting and directing light emitted by the LED to the desired spectrum and brightness of execution.

U.S. patent No. 2005/0199884 describes the LED module high power, which, in fact, planar main and auxiliary circuits are made of metal with high reflectivity, which are separated from each other by a cover. LED is located on at least one circuit and has conclusions electrically connected to the circuits. The module housing is made of rubber, provides LED and at the same time fixes the circuit below. The encapsulating material fills the gap between the primary and auxiliary circuits.

U.S. patent No. 2005/0045904 describes a light emitting diode with high heat dissipation, which contains the circuit Board, conductive material, and LED rubber of complex composition. The circuit Board has an upper surface and a lower surface opposite the upper surface. Through the upper surface to the lower surface of the printed circuit Board passes the hole. The upper surface of the printed circuit Board is formed with electrodes. Conductive material is filled through the hole in the printed circuit Board. LED attached to the upper surface of the printed circuit Board and in contact with the conductive material. Rubber of complex composition encapsulates the LED chip.

U.S. patent No. 2004/0041222 describes a light-emitting dot matrix module, which contains the substrate, the reflector and the lens. The substrate is made of a thermally conductive, but electrically insulated material. The substrate has conductors for connecting an external source of electric current with the LED in place of the connection. The reflector is connected to the substrate and in fact protects the connection. The lens is freely lane is meshaetsia relative to the reflector and has the ability to be raised or lowered using the encapsulating material, which is located at an optimal distance from the LED. The lens may be covered with any optical system chemical action when performing device.

European patent No. 1453107 describes the LED containing a light emission device, which is provided by means of energy supply, means for closing the closure device, the light emitted from a light-absorbing material, a reflective surface to reflect light emitted from the unit light emission in the direction perpendicular to the Central axis of the light emission device or at a large angle to the Central axis opposite the surface of the light emission of the light emission device, diode, light emitting, has a guide surface for directing light reflected from the surface in the direction perpendicular to the Central axis of the light emission device or at a large angle to the Central axis of the reflecting mirror is located around the diode, emitting light.

Produced to date, conventional LED modules require many components and extensive manual tuning or complicated production to ensure the optical setup. Also LED modules are typically encapsulated using the encapsulation material before secures the optical lens, which encapsulates the LEDs. This design can cause COI is whether encapsulating material in excess or missing number, what can cause deterioration of the optical performance of the LED module. Therefore, there is a need for a new design module of the lighting device.

The above information provides disclosures involving the applicant urgency of the present invention. No need to explain that any previous information constitutes prior art against the present invention.

The INVENTION

The purpose of this invention is the provision of a module of the lighting device. In accordance with an aspect of the present invention it provides a module of the lighting device, which includes: a substrate, a circuit located on the substrate, which defines the cavity, the circuit contains one or more channels defined therein, each of the one or more liquid channels connects the cavity with a corresponding external eye; one or more light-emitting elements of the current image are located inside the cavity and the optical transmitting system located on the circuit and optically coupled to one or more light-emitting elements, where the cavity is at least partially filled with a light-absorbing encapsulating material and where the above-mentioned one or more channels give the possibility of liquid movement encapsulating material.

In accordance with another aspect of the present invention provides a production method of a module of the lighting device, which includes the steps of: thus, defining a cavity and an outline that defines two or more liquid channels connecting the cavity with the respective outer holes; the current United one more light-emitting elements to the substrate, where the specified one or more light-emitting elements are located inside the cavity; the connection system optical transmission path, and insert the desired quantity of encapsulating material into the cavity through the outer hole and through one or more of the two or more channels provides the output gas from the cavity.

BRIEF DESCRIPTION of DRAWINGS

Figure 1 schematically shows a view of the transverse section modulus of the lighting device in accordance with the implementation of this invention.

Figure 2 schematically shows the cross-section of a circuit module of the lighting device in accordance with the implementation of this invention.

Figure 3 schematically shows the cross-section of the connected circuit and system optical transmission module of the lighting device in accordance with the implementation of this invention.

A DETAILED DESCRIPTION of the PREFERRED OPTION IMPLEMENTATION

p> Definition

The term "light emitting element" is used to mean the device that contains the element that emitted radiation wavelength or combination of wavelengths of the electromagnetic spectrum, such as visible spectrum, the infrared spectrum or the ultraviolet spectrum, which is in the working state by applying a potential difference or transmission of electric current. For example, the light-emitting element can be monochromatic, quasi-monochromaticity, polychromatic or broadband characterization of the spectrum of radiation. Examples of light-emitting elements of the light include inorganic or organic solid-state light emitting diodes, organic or polymeric light emitting diodes, optical nakazanie phosphorus, covering the light emitting diode, optically pumped nanocrystaline a light emitting diode or other similar device, that without difficulty understand a specialist in this field. Additionally, the phrase "light emitting element" is used to identify specific devices emitting radiation, for example stamped LED or other device.

For the purposes of this application, the term "about" is used here to denote a deviation of +/-10% from the nominal value. Should be taken into account that such discard the deposits always contain any values here, in any case, if you have a reference to it or not.

Until not specified to the contrary, all technical and scientific terms used herein have the same meaning, the total taken in the field to which this invention relates.

This invention provides a module of the lighting device with one or more light-emitting elements, the current way connected with the substrate and the circuit located at least around one or more light-emitting elements. The circuit and the substrate define a cavity in which are located one or more light-emitting elements, in which the cavity may be in fact encapsulated using the optical transmission system. At least part of the cavity may be filled with encapsulating material. The path defines one or more channels, where each channel connects the cavity with the outside through the outer holes. For example, the external port may be available for liquid movement during Assembly of the module of the lighting device, providing a liquid movement means encapsulating material into the cavity. One or more light emitting parts may be applicable way connected to the source of energy by means of, for example, spikes, array of balls (BGA), or launched for the s on the substrate to supply electricity to one or more light-emitting elements during their work.

In implementing this invention, the encapsulating material can be placed in different ways during the Assembly of the substrate, circuit and system optical transmission for the security module of the lighting device, which has a cavity filled with the desired quantity of encapsulating material. For example, one or more light-emitting elements can be positioned on the substrate, at that time, as the path can be located on the substrate in which the circuit may in fact cover the outer perimeter of the one or more light-emitting elements. Next, the desired amount of encapsulating material in the desired form, for example, in a liquid state, can be placed on or between one or more light-emitting elements, in fact, the circuit can be placed in the optical transmission. The Assembly may completely encapsulate one or more light-emitting elements and one or more light-emitting elements may be sealed between, for example, encapsulating material and the substrate. During the manufacturing process, if necessary, the excess encapsulating material may fill one or more channels defined by the contour, allowing you to stock form the desired quantity of encapsulating material in the cavity, the cavity defined by the substrate and the circuit./p>

In implementing the present invention, one or more light-emitting elements may be located on the substrate, the circuit determines two or more channels, which may actually be located on the substrate and in fact the surrounding horizontal one or more light-emitting elements, and an optical transmission can be located on the contour, forming a free space between the one or more light-emitting element. In fact, the encapsulating material may be introduced from an external openings through one or more channels in the circuit to fill the cavity of the desired quantity of encapsulating material, in which the channels defined by the circuit can ensure the removal of air or other gas, which is contained actually in the volume similar to the volume of the corresponding cavity during introduction of the encapsulating material into the cavity.

In implementing this invention, the module of the lighting device can be connected by thermal method, for example, by soldering or other method thermal compound, what could be more clear, as the heat sink or the heat conductor.

Figure 1 schematically displays a view of the transverse section modulus of the lighting device 100 in accordance with the implementation of this image is etenia. The module of the lighting device includes a substrate 110, a lens 120, the circuit 130 and the light emitting elements 140. Light emitting elements 140 are located in the cavity 160 defined by the substrate 110, and the circuit 130, in which the light emitting elements effective way connected with the pressed connection plate 150. The substrate 110 has the conductors 112, which provide electrical connection of the light emitting element 140. The circuit contains channels 134, which are located between the cavity 160 and the external contacts 136, in which the channels 134 connect the liquid cavity 160 and the outer holes 136 in which these channels 134 can provide a liquid movement encapsulating material, which is located in the cavity 160 during production module of the lighting device.

The contour of the current image is connected to the substrate, where the contour together with the substrate define a cavity in which are located one or more light-emitting elements. The circuit further defines one or more channels that provide fluid connection between the cavity and the outer holes located outside of the module of the lighting device.

In implementing this invention, the cavity is additionally defined as actually encapsulated defined by the substrate, the circuit and the optical system is transmitting, together, in fact, encapsulate one or more light-emitting elements arranged in the cavity. One or more channels defined in the circuit, can allow filling of the encapsulating material of the cavity, thus allowing you to place the right amount of encapsulating material in the cavity.

In implementing this invention, the desired amount of encapsulating material is placed in the cavity before placing the optical transmission system in which one or more channels defined by the circuit, enabling liquid movement encapsulating material during the placement system optical transmission system, if necessary.

One or more channels can be performed with a variety of options, for example, a channel may be linear, curved, or partially linear or partially curved or other form that can easily be understood by the skilled worker in this field.

In implementing the present invention, one or more number of channels can be performed with the opportunity to have a form of a cut cross-section, which can be selected for a more simple production, flowing and for other purposes, it is easy to understand. For example, every one or more channels may have the same form VI is and the cross-section or a different shape of cross-section view, in which the form of the cross-section can include round, square, ellipsoidal, oval, octagonal, or any form that is easy to understand.

In implementing the present invention, the cross-sectional shape of the channel may be the same or different along the length. For example, the channel may have a reduction in the area of the cross section before connecting with the cavity defined by the circuit and the substrate. In this configuration, during the liquid movement encapsulating material into the cavity through the channel of the pressure caused by the encapsulating material can be increased until the influx into the cavity with a corresponding limitation of cross-sectional area of the channel.

In one implementation of this invention the inner surface of the loop planes of one or more light-emitting elements are mainly designed to reflect light that has been emitted from one or more light-emitting elements. For example, a correspondingly designed reflective inner surface contour can facilitate efficient extraction of light from the lighting module.

In one implementation of this invention, the inner surface planes of the contour of the light-emitting elements can be scattering or reflecting mirror. the example the inner surface contour may be white and made with the possibility of scattering and specular reflection at the same time. White surfaces can be implemented in various ways, for example, the surface may have a coating or can be painted. In the implementation of the present invention the portion of the path or the entire circuit can be made of white material, for example, white ceramic or white plastic, for example, Amodel(tm) plastic or the like, to provide the desired optical performance of the inner surface contour. In the implementation of the present invention the inner surface of a circuit can be metallized, for example, the mirror with the necessary indicators of exhaustion and reflection.

In one implementation of this invention the inner surface or the other surface of the circuit can be coated or made with the possibility of a layer of reflective material such as Al, Ag or the like. These types of metal layers can be applied in a variety of ways, including spraying, diffusion or evaporation, or the like for example.

In one implementation of this invention, the circuit may be covered with a solution with the metal layer on the inner surface for example. In implementing this invention, the material for contour or the inner surface of the circuit can b shall be performed with the opportunity to have a reflection coefficient below, the reflection coefficient of encapsulating material, which is located in the cavity to encapsulate one or more light-emitting elements. For example, if the inner surface of the circuit has the proper form and properly fitted reflectance, the light encapsulating material can be completely reflected inside from the inner surface and is directed to the system optical transmission, thus achieving the desired level of extraction of light from the lighting module.

In one implementation of this invention, the angle of intersection between the inner surface contour and the substrate can be made with the possibility of having radiation of light. For example, the intersection angle may be between about 90 and 170 degrees, and in another implementation of this invention, the angle may be approximately 135 degrees.

The inner surface contour can be performed with either be in the form of one or more configurations. For example, the inner surface may be planar, segmented planar, curved, ellipsoid, paraboloid, or other shape. In addition, the circuit can have a plot of the cross-section of a regular or irregular polygon or a simple form and can be open or closed type, which is parallel cross-section. In implementing this invention, the circuit is configured to fully or partially reduce one or more light-emitting elements.

In another implementation of this invention, the circuit may be a separate node or the path can be simultaneously manufactured with one or more nodes of the optical transmission system. In another implementation can be applied to the process of double, short Assembly for production of contour and lenses.

In another implementation of this invention, the circuit may be directly applicable way attached to the substrate by casting on a substrate using the substrate as part of the casting during the forming process, for example, as molding insert.

In another implementation of this invention, the circuit contains a support system that provides positioning for placement and support system optical transmission module of the lighting device. For example, the support system can be performed with possible built-in shoulder, which can provide support for the deepening of lenses or other optical transmission system. When the support system is made with the possibility of deepening, the support system can optionally provide a mechanical clamping system optical transmission path.

In another implementation Dunn is the first invention, the circuit contains two or more attached devices, made with the possibility of a mechanical connection with the joint area of the substrate. For example, the circuit may contain two or more pins that are used for the mechanical positioning of the path relative to the substrate and/or to provide a mechanical connection between them. In another implementation of this invention, two or more connecting devices can be attached to the substrate using sticky heat or friction, or extruded, or intermediate connection.

Figure 2 shows the circuit in accordance with one implementation of the present invention. Circuit 330 and the inner surface 332 have an area that has a curvilinear orthogonal form. The inner surface may be of a form that provides vysokozatratnoe reflection for light emission through the adjacent light-emitting element and which stuck to him. Properly educated inner surface can help to extract the desired distribution of light emission. Circuit 330 has a recess 338 for the location of the optical transmission system such as a lens.

In one implementation of this invention, the circuit formed of metal, such as aluminum or other metal or alloy known to the person skilled in the art. Many metals reflect visible light to the ain is well protected from corrosion by using the oxide film. The metal loop can have a coating that protects the surface from corrosion or oxidation. Surface protection from oxidation may be important, especially for circuits made of aluminum. The use of metallic circuits may require placement of a layer of electrical insulation of, for example, of polyimide on the upper surface of the substrate, to provide electrical isolation of one or more electrically conducted layers connected to the substrate.

In one implementation of this invention, the module of the lighting device includes a plastic loop which is formed directly on the substrate. For example, using the process of forming the first insert is inserted substrate, which in reality is filled with the desired quantity of the component casting for the manufacture of the circuit. The inner surface contour can be covered by selecting, for example aluminum or silver by using, for example, a process of spraying or evaporation. A layer of electrical insulation can be placed on the substrate before will be located any electronic components of the module of the lighting device. In one implementation of the circuit can be manufactured using material with the corresponding reflection coefficient, providing total internal reflection in combination with an encapsulating material which with the corresponding reflection coefficient.

In one implementation of this invention, the circuit is made of material with high temperature resistance. High temperatures can occur during operation of one or more light-emitting elements connected to the module of the lighting device. High temperatures can occur during Assembly of the module of the lighting device, for example during soldering, curing the epoxide or during termoultrasonic welding. Examples of materials with high temperature resistance and endurance include LCP plastic and Amodel(tm) plastic, and the like.

In one implementation of this invention, the circuit is formed from a material with a reflectivity lower than the reflectivity of encapsulating material. In this implementation, the circuit can be performed without covering, for example, by metallizing the inner surface. If the circuit is made of a corresponding shape, the lower the reflection coefficient of the material of the circuit will cause a high degree of total internal reflection at the inner surface contour for light output from the encapsulating material. The appropriate amount of light that can be reflected to improve the retrieval performance of the light module of the lighting device, depends on the value of the reflection coefficient encapsules the existing material and the material of the circuit. Having the correct location of the inner surface of the can to provide a high angle of total internal reflection, in which total internal reflection of light can be redirected in the direction of the lens.

Background.

The substrate provides a substrate, over which the current image is attached one or more light-emitting elements. The substrate can be made with the ability of different variants and can be executed with ability, for example, the substrate may be a printed circuit Board (PCB) multi-level circuit Board, for example, a circuit Board with a metal base (MCPCB) or other substrate that can easily be understood by the skilled worker in this field.

In one implementation, the substrate has an extremely high thermal conductivity. For example, the substrate may contain one or more layers of AIN ceramics plated bottom and top, or the substrate can be LTCC ceramics deposited on a Cu/Mo/Cu metal base PC Board or to be made with the possibility of other applications, which provide a highly heat-conductive properties, which will easily notice a specialist in this field. In one implementation, the substrate may also contain a molded plastic material such as LCP plastic, or Amodel(tm) plastic, or similar.

In one implementation the data of the invention the surface of the substrate layer is the outermost layer of the cavity or a predetermined area of the substrate, can be scattering or reflecting mirror.

Reflective indicators can relate to metal, such as aluminum or silver coating, in which the optical indices of the substrate can help to redirect light emitted by one or more light-emitting elements in the direction of the system optical transmission.

In one implementation of the present invention, the substrate contains one or more layers of conductors or tracks to connect the current image of the one or more light-emitting elements, forged connecting pads or other devices. Layers or conductors may contain various materials such as metal alloy, including any combination of, for example, copper, silver, gold, aluminum, tin, or similar materials.

Substrate layers, which contain electrically conductive elements, for example, light-emitting elements, which should not cause the circuit, such as, for example, certain combinations of conductors carrying electricity, have a need for electrical isolation from layers which are optical reflectors, but also conducting electricity. Therefore, in one implementation of the present invention corresponding to the material of the electrical insulation used in this field, the can is to be used for the appropriate electrical insulation, for example, conductors or layers. In one implementation of this invention the metal conductors of the upper surface of the substrate can be coated with a thin layer of insulating material or dielectric, such as polyimide with a thickness of 0.5 to 2 mil or other insulating electricity material that can be easily understood by a skilled worker in this field. In one implementation insulating electricity layer may also be fully or selectively located on areas of the substrate, which can be closed by means of circuit to ensure electrical isolation of the circuit, which may be electrically conductive. Applying a layer of electrical insulation can have a significant benefit, as it can provide a smoother surface for the connection between the substrate and the circuit.

In one implementation of this invention the substrate is soldered to the PC Board, circuit, or two wires connect the electrical drive. The substrate can have one or more conductive layers containing Au or Au/Sn or another alloy for soldering, as can easily be understood by the skilled worker in this field. In one implementation, the substrate is considerably more to provide the desired or required number of electrical circuits located on the substrate.

In one domestic the present invention, the circuit and the substrate are formed as one unit, in which the substrate contains one or more grooves, which can be used as a reflecting cavity. The notches can be formed in the substrate using various methods, depending on the substrate material. For example, the notches in the joint firing of the ceramic substrate can be formed during production of the substrate. To ensure the production of grooves in the ceramic substrate requires preparation of the substrate, since the shape of the ceramic material can significantly change its shape during co-firing.

In one implementation can be beneficial to the repetition of the grooves in the substrate, using a suitable tool during co-firing of the ceramic substrate. Tool for forming grooves can provide a composite part having a predetermined shape, which can be applied to a ceramic base during co-firing for forming grooves. It should be noted that the pressure with which the forming tool can be applied accurately controlled during the process of joint firing, to avoid cracking or splitting of a ceramic material. The shape of the forming tool can help to determine the form of slots, for example, the bevel of the ledge excavation. The forming tool may be made of a certain cast material, which has the fine is a form and the length of the working surface, when exposed to high temperatures. The forming tool must have the property that protects from unwanted exposure to the ceramic material or permanent position and to release any unwanted material on or in the surface of the ceramic material. Different methods and technologies for co-firing the ceramic substrate is widely known in this field.

In one implementation, the ceramic substrate can be performed in a predetermined shape having a notch before co-firing, located in calculation of differential shrinkage and duration during co-firing. In fact, the shape and length of preferowanych substrates may be different from the shape and extent of the joint firing of the substrate.

The encapsulating material.

The encapsulating material fills at least a portion of the cavity defined by the circuit substrate, which may be further defined as the amount of connection of the optical transmission system. The encapsulating material may surround one or more light emitting devices attached to the substrate, in which the encapsulating material may selectively have a reflectance greater than the reflectance of the optical transmission system.

For example, the total NR the internal reflectivity, which module of the lighting device can be reduced when one or more light emitting devices, for example, stamped LED, in fact, directly in contact with the optical element, for example, with the encapsulating material. In one implementation of this invention, the encapsulating material may be selected having a reflection coefficient close to that of light emitting devices. The encapsulating material, the reflection coefficient, which is only slightly smaller than the reflection coefficient of the light emitting device can reduce the percentage of light rays to the total internal reflection optical surface between the light emitting device and encapsulating material.

In one implementation of the encapsulating material, for example, of soft or liquid material that can help manage thermal conductivity at or near the optical surface at the time of occurrence of the different thermal coefficients and variations in operating temperature.

In one implementation of the present invention a soft or liquid encapsulating material or optical silicone may be sealed, for example, between adjacent optical transmission, for example, a lens or other element, such as a substrate. Additionally, the encapsulating material may be in direct thermal interaction is the interaction with one or more light-emitting elements.

Conventional encapsulating material contains certain, silicone and elastic or pure gel with low ionic impurity such as, for example, Cl, K, Na, or similar. Other encapsulating materials with the appropriate reflection coefficient include PMMA, polycarbonate, nylon and silicone, for example, which absorbs little visible light and usually only certain ultraviolet (UV) light. Some of these materials can provide resistance to discoloration under prolonged exposure to UV light and the range of appropriate reflection coefficients. Many encapsulating materials well known in this area and is available under trademarks such as, for example, Dow Corning(tm), Nye(tm), or Nusil(tm) for an example.

In one implementation of the present invention encapsulating material suitable for the installation or closure of the light emitting device may have a reflectivity of about 1.55 or less.

The optical relay system

The optical relay system essentially provides optically transparent cover for one or more light-emitting elements attached to the substrate together with the substrate and the circuit provides space for the cavity, which actually encircles one or more light-emitting elements, in which the cavity is partially what about or completely filled with encapsulating material.

The optical relay system helps to process and extract the electromagnetic radiation from the module of the lighting device, which is formed using one or more light emitting devices. In one implementation of the present invention, the optical transmission is designed as a lens such as a convex lens or another lens that will easily understand qualified in this field of work.

The surface of the optical transmission system, which is the outer surface of one or more light emitting devices, may be curved or flat. In one implementation of this invention, this surface is a convex shape, thus, decreases the likelihood that gas gets trapped between the surface of the optical transmission system and encapsulating material.

In one implementation of the present invention, the optical transmission contains a combination of optical elements, in which these optical elements can be of different sizes. For example, from sub-micrometers to millimeters or larger lenses or other optical reflecting element can be built into the system optical transmission.

The optical transmission can be made of pure PMMA, COC, BK7 glass, polycarbonate, nylon, silicone rubber or other mA is eriala as will easily be understood to the skilled worker, working in this field. The optical transmission may optionally be performed as a color component, meanwhile, hold the necessary level of the optical conductivity for a module of the lighting device.

In one implementation of this invention, the materials are suitable reflectivity for optical transmission, and the encapsulating material is selected to ensure the efficient extraction of light from the module of the lighting device. The appropriate choice of the reflection coefficients of these materials can reduce changes that can cause the light inside the module of the lighting device, for example, encapsulating material, and in fact, in the optical transmission undergoes total internal reflection. Total internal reflection can take place on the optical surfaces when light travels from an optically transparent module with a large reflection coefficient and affects the surface of the optically transparent module with a lower reflectance.

In one implementation of this invention, the optical transmission system can be formed in one piece with the circuit, for example circuit and the lens can be released together or sequentially, with the assistance of multi-shot molding. For example, dual shot molding can provide the possibility of making Lin is s from a material with different coefficients of reflection, than the path. Depending on the shape of the path and lens sequence of casting may be different.

Other processes for the simultaneous molding of these components can be easily understood by a skilled worker in this field. For example, figure 3 displays the path and the lens module of the lighting device in accordance with one implementation of the present invention. The circuit 230 and the lens 220 module of the lighting device has a coupling element 232, which allows you to perform long-term adhesion. It should be noted that the materials of the path and the lens must have a suitable similar coefficient of thermal conductivity, to help manage mechanical stresses that may be caused by heat fluxes. The materials of the lens and contour in the best case should also have good adhesiveness to ensure proper sealing of the cavity and encapsulating material from, for example, ambient humidity. Moreover, a good adhesiveness between the lens and the encapsulating material and also between the circuit and the encapsulating material is necessary to prevent separation between these elements. Delamination can cause unwanted losses and breaks on the optical surfaces between the elements of the module of the lighting device, which may cause an undesirable change tragoudi the indicators and, in fact, change the retrieval performance of the light module of the lighting device.

Attaching the light-emitting elements.

One or more light-emitting elements, for example, stamped LED current image attached to the substrate is performed so that the necessary electric current can be served on one or more light emitting devices. In one implementation of the present invention, the substrate contains one or more stamped mounting plate, which is attached light-emitting element, for example, soldered to the hackneyed phrases of the attaching plate. Stamped mounting plate may have contacts with solder alloy containing gold, for example, gold brightening eyelid primer, gold-silver alloy or the like. Light-emitting element may have a contact containing, for example, gold, gold-tin, or other alloys. In one implementation, depending on the contact position of the radiating light of the light-emitting element and the location of the mounting plate, the solder alloy may be liquefied elevated temperatures to enable attachment of the light-emitting element to the mounting plate. In one implementation, the solder paste may be located on the mounting plate before the location of the light emitting device. The solder paste may contain, for example, Au/Sn, which can be liquefied under Chennai temperature for the formation of connections between the light emitting device and mounting plate.

In one implementation of the present invention electrically and thermally conductive adhesive may be used to attach the light emitting device to the mounting plate. This adhesive layer may contain, for example, Ag containing epoxide, or similar. Depending on the type of the adhesive layer, the solder alloy mounting plate may not be required on the substrate in order to provide reliable mechanical and electrical connection with the light-emitting element.

In one implementation of this invention the mounting plate on the substrate can provide the upper surface of high optical reflectance and can be attached to a common underlying metal layer by thermal method, in which metal layers are widely used in certain ceramic substrates, which is well known to the skilled in this field of work.

In one implementation of the various contacts of the light-emitting element can be separately attached to the mounting plate or conductors, which can be located on the mounting plate or anywhere on the substrate. Different contacts on the mounting plate can be effective way connected to the conductors on the substrate.

Now the image is the buy will be described with reference to a specific example. It should be clear that this example is intended to describe the invention and does not limit the invention in any way.

EXAMPLE

Figure 1 is a schematically shown cross-section of the module of the lighting device 100 in accordance with one implementation of the present invention. The module of the lighting device includes a substrate 110, a lens 120, the circuit 130, the light emitting element 140 and monotonous mounting plate 150. The angle of the plane of intersection between the inner surface 132 of the contour and surface of the substrate can be defined as the desired angle, for example, 135 degrees. Usually different angles can provide the formation of various patterns of light radiation, which, in turn, alter the ability of the module of the lighting device to retrieve and to redirect the light from the module of the lighting device. The substrate 110 has a track 112, which provide the electrical connection. Additionally, the substrate 110 has the ability to combine coating electrical insulation 114 and the reflective coating 116. The inner surface 132 may have a direct, straight segmented or any simple or complex curve, perpendicular to the cross section. Perpendicular means any direction with a right angle with the longitudinal surface of the substrate. As in the version, the inner surface may have a polyhedral shape (not shown). The path can be any continuous or discontinuous, multi-faceted or round shape, open or closed plane parallel to the cross section. The circuit has a channel 134 between the cavity 160 and the outer holes 136.

As shown in figure 1, the circuit further may have two or more, for example, cylindrical or conical pins 170, which can be inserted into corresponding holes in the substrate. Studs and holes can be used longitudinal location of the circuit on the substrate. Studs can be inserted into the holes of the heat way for a strong connection of circuit to the substrate. Alternatively, the circuit may be attached adhesive layer.

The circuit has a grooved ledge 138 to accommodate the lens. The groove and the lens corresponding form can be firmly attached to each other. As shown, the module of a lighting device is provided with two external openings, which can be used to enter encapsulating material such as, for example, silicone gel. One external port may be used to enter the encapsulating material, and the other at the same time to ensure the removal of excess encapsulating material during its input. Excess encapsulating material can pack ablate liquid by the movement of the encapsulating material and the pressure inside the cavity.

Many of the encapsulating material can be degassed for removal of unwanted entities, such as air, gas or steam bubbles. The conclusion can be performed at different stages of the Assembly process before infusion and after infusion into the cavity. It is well known that combining depressurization of the environment together with the corresponding heat flux, it is possible to facilitate the removal of bubbles and entities.

The lens can be attached to the circuit by means of thermal impact on the flanges of the lens 122 and the circuit. It is well known that energy can be located for thermal impact on the item in the right place, for example, adjacent the location of the groove and the flanges of the lens.

It is clear that further implementation of the invention are examples and can be implemented in different ways. Such data or possible examples should not be construed as a retreat beyond the scope of this invention and all such changes, as should be clear to the person skilled in the art, are intended to include within the claims.

1. The module of the lighting device includes:
a) a substrate;
b) circuit located on the substrate, which defines the cavity, the circuit contains one or more channels defined therein, each of the specified one or more liquid channels connecting the t cavity with a corresponding external eye;
c) one or more light-emitting elements of the current image are located inside the cavity; and
d) an optical transmitting system located on the circuit and optically coupled to one or more light-emitting elements;
where the cavity is at least partially filled with a light-absorbing encapsulating material, and where the above-mentioned one or more channels to enable fluid movement encapsulating material.

2. The module of the lighting device according to claim 1, in which the circuit contains an internal surface forming a cavity, in which the inner surface is optically reflective.

3. Module light emission device according to claim 2, in which the inner surface has a mixed diffuse and specular reflective characteristics.

4. The module of the lighting device according to claim 2, in which the inner surface is covered with a specularly reflective material.

5. The module of the lighting device according to claim 2, in which the encapsulating material has a first reflectivity, and the inner surface has a second reflectivity that is lower than the first reflectance.

6. The module of the lighting device according to claim 2, in which the inner surface has a surface shape selected from the group consisting of: a planar, segmented planar, envelope, slip aidou, paraboloid or polyhedral.

7. The module of the lighting device of claim 1, wherein the circuit includes a supporting structure configured to support and mechanical retention system optical transmission in the desired location.

8. The module of the lighting device according to claim 1, in which the circuit and the system optical transmission have a solid form.

9. The module of the lighting device of claim 8, in which the circuit is formed from the first material, and an optical transmission formed from the second material.

10. The module of the lighting device according to claim 1, in which the circuit contains two or more attached devices, configured with the possibility of a mechanical coupling with a corresponding coupling attachable places connected with the substrate.

11. The module of the lighting device of claim 1, wherein the circuit is electrically isolated from the substrate.

12. The module of the lighting device according to claim 1, in which the circuit and the substrate have a solid form.

13. The module of the lighting device according to claim 1, in which one or more channels have a shape selected from the group of linear, curvilinear, linear-segmented and curved-segmented.

14. The module of the lighting device according to claim 1, in which one or more channels has a transverse cross-section selected from the group:
round square, rectangular, elliptical, oval, and octagonal.

15. The module of the lighting device according to claim 1, which contains two or more channels have the same cross-sectional shape.

16. The module of the lighting device according to claim 1, which contains two or more channels, where each channel has an independent form.

17. The module of the lighting device according to claim 1, in which one or more channels has a cross-section and length, where the cross section varies along the length.

18. The module of the lighting device of claim 1, wherein the contour defines two or more liquid channels connecting the cavity with corresponding external contacts, where one or more of the two or more channels configured to output gas from the cavity.

19. The production method of the module of the lighting device that includes the steps:
a) providing a substrate;
b) connection of the circuit substrate, thereby defining a cavity and an outline that defines two or more liquid channels connecting the cavity with the respective outer holes;
c) the current United way of one or more light-emitting elements to the substrate, where the specified one or more light-emitting elements located within the cavity;
d) a connection system optical transmission path; and
) insert the desired quantity of encapsulating material into the cavity through the outer hole and through one or more of the two or more channels, where one of the one or more channels provides the output gas from the cavity.



 

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Illumination device // 2425432

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FIELD: physics.

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FIELD: physics.

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12 cl, 12 ex, 6 dwg

FIELD: spectral-analytical, pyrometric and thermal-vision equipment.

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3 cl, 3 tbl, 6 dwg

FIELD: semiconductor emitting devices.

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1 cl, 1 dwg, 1 tbl

FIELD: semiconductor emitting devices.

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1 cl, 1 dwg, 1 tbl

FIELD: semiconductor optoelectronics; various emitters built around light-emitting diodes.

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EFFECT: ability of shaping desired light-beam emission directivity pattern.

1 cl, 3 dwg

FIELD: semiconductor optoelectronics; various emitters built around light-emitting diodes.

SUBSTANCE: proposed light-emitting diode has light-emitting chip covered by optical component made of translucent material whose outer surface is aspherical in shape due to rotation of curve f(x) built considering optical properties of light-emitting chip and optical component material about symmetry axis of light-emitting diode. This surface emits light and f(x) curve in coordinate system whose origin coincides with geometric center of active area of light-emitting diode has initial point A0 disposed on ordinate axis at distance corresponding to characteristic size of light-emitting diode which is, essentially, optical component height or its desired diameter, and is formed by plurality of points A, (i = 1, 2... n); coordinates of intersection point of straight line drawn from coordinate origin point at angle αini to ordinate axis drawn from preceding point Ai - 1 at angle Gi to abscissa axis drawn to point Ai - 1 are taken as coordinates of each of them;; αini is angle of propagation of iin light beam pertaining to plurality of beams emitted by light-emitting chip chosen between 0 and 90 deg. Angle Gi is found from given dependence. Angle αouti is found by pre-construction of directivity pattern DPin of beam emitted by light-emitting chip. Coordinates of A points are checked by means of light-emitting diode simulator that has optical component whose outline is formed by plurality of Ai points as well as light-emitting chip whose beam directivity pattern is DPin; this chip is used as distributed light source having three-dimensional emitting area whose size and appearance correspond to those of emitting area used in light-emitting diode of light-emitting chip. Light emitting points in light-emitting chip of simulator under discussion are offset relative to origin of coordinates within its emitting area; coordinates of Ai points are checked by comparing directivity pattern DPout and directivity pattern DPsim of beam emitted by light-emitting diode simulator, both displayed in same coordinate system. When these directivity patterns coincide, coordinates of points Ai function as coordinates of points forming curve f(x); if otherwise, coordinates of points Ai are found again, and DPoutj is given as directivity pattern DPout whose points are disposed above or below the latter, respectively, depending on disposition of directivity pattern DPsim below or above directivity pattern DPout in the course of check.

EFFECT: ability of proposed light-emitting diode to shape desired directivity pattern of light beam.

1 cl, 3 dwg

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