Current-conducting adhesive tape having various adhesion on both surfaces, and method for its manufacture

FIELD: electricity.

SUBSTANCE: adhesive tape includes adhesive polymeric resin on acryl basis and conductive fillers. Adhesive polymeric resin includes polymer obtained by copolymerisation of alkyl acrylate monomer having C1-C14 alkyl group with polar copolymerised monomer. Conductive filler is chosen from the group consisting of precious metals, base metals, precious or base metals with coating from precious metals, precious and base metals with coating from base metals, non-metals with coating from precious and base metals, conductive non-metals, conductive polymers, and their mixtures. Conductive fillers are oriented in adhesive tape both on longitudinal and in transverse directions. Electrically conducting adhesive tape is obtained by mixing monomers for preparation of adhesive polymeric resin with conductive fillers. Mixture in the form of sheet is formed. Both surfaces of the sheet are illuminated with light in order to perform photochemical polymerisation of adhesive polymeric resin. Each surface of the sheet is illuminated with light of various intensity. Light is emitted selectively to some part of the sheet of surface. Adhesive tape has flexibility and more effective electric conductivity.

EFFECT: adhesive tape can be used in electronic components, as adhesive tape screening electromagnetic waves, which provides the possibility of easy attachment and detachment.

18 cl, 3 tbl, 6 ex

 

BACKGROUND of INVENTION

The technical field

The present invention relates to a conductive adhesive tape having different sizes of adhesion on its two surfaces, and the method of its manufacture. More specifically, the present invention relates to an adhesive tape having electrical conductivity in its longitudinal direction and in the transverse direction, and exhibiting different adhesion values on its two surfaces, due to which it can possess the ability to easy peeling if necessary, and to the method of making adhesive tape.

Description of the prior art

In General, to impart conductivity sticky tape was used in the following ways.

First, for the production of glue fine conductive powder, such as the gas carbon black, graphite, silver, copper, Nickel or aluminum, are distributed uniformly in the adhesive as conductive fillers. However, to make the conductivity of the glue through the use of conductive fillers, particles of conductive fillers to form a continuous chain in the polymer resin for glue preparation. This means that, in the case of the adhesive, made in the usual way, to create sufficient conductivity requires an excessive amount of conductive fillers. However, in this case, it is difficult RA is nomemo to distribute the gas particles of soot, and viscoelasticity of the melt adhesive resin is reduced, so that the liquid particles can stick to each other, thereby greatly increasing the viscosity. As a result, the weight of the resulting product increases with the deterioration of the physical properties of the product so that the product's ability to absorb the impact energy and vibration can usadata. At the same time, even when using such excessive amounts of conductive fillers, it is often difficult to achieve sufficient conductivity.

Sometimes you need to remove the glue with electric/electronic products, in order to attach/disconnect such products with each other, without undesirable effects on the products when the products you want to reject or when the products have been incorrectly assembled in the manufacturing process. Also, the adhesive may require the presence of high values of adhesion on one surface, and at the same time, low values of adhesion or no adhesion to another surface. To achieve this, in accordance with the prior art, it was proposed to use for the manufacture of adhesive tape sheet substrate, and then to apply the adhesive on one surface of the sheet substrate or to apply different types of adhesives having different adhesion values on both surfaces.

The INVENTION

Order N. the present invention is to provide a masking tape, having different sizes of adhesion on its two surfaces. Another objective of the present invention is to provide a method for giving electric conductivity adhesive tape having different sizes of adhesion on its two surfaces in its transverse direction, as well as its longitudinal direction, for more effective conductivity of the adhesive tape.

Another objective of the present invention is to provide a tape having conductivity in its transverse direction, but also in its longitudinal direction, and having different adhesion values on its two surfaces.

Another objective of the present invention is to provide a method of manufacturing a tape having conductivity in its transverse direction, but also in its longitudinal direction, and having different adhesion values on its two surfaces.

The present invention provides an adhesive tape, which comprises an adhesive polymer resin and conductive fillers dispersed in the adhesive polymer resin, and has different adhesion values on its two surfaces, where the conductive fillers are oriented in both longitudinal and transverse directions in the adhesive polymer resin, being at the same time electrically connected to each other on one surface of the adhesive tape to the other surface of the adhesive linen is s.

The present invention also provides a method of manufacturing a tape having conductivity in its transverse direction, but also in its longitudinal direction, and having different adhesion values on its two surfaces, which includes the stage of mixing the monomers of the adhesive polymer resin with conductive fillers; molding the resulting mixture into a sheet and irradiating both surfaces of the sheet light for carrying out the photopolymerization adhesive polymer resin, where the light emitted from each surface of the sheet, has a different intensity of light and light is emitted selectively on the portion of the surface of the sheet.

Adhesive tape in accordance with the present invention has a level of adhesion and conductivity by itself and, thus, can be used for various applications, including adhesives, shielding electromagnetic waves. In addition, the adhesive tape in accordance with the present invention, shows a high value of adhesion on one surface, which can be used preferably for fastening, and at the same time has the other surface with a degree of adhesion that can be easily removed, thereby providing excellent manufacturability.

BRIEF DESCRIPTION of DRAWINGS

The above and other objectives, features and advantages of the present and the gain will be better understood from the following detailed description in conjunction with the attached drawings, on which:

Figa is a photographic image of the upper surface (exposed to UV-rays of low intensity) and lower surface (exposed to UV-rays of high intensity) adhesive tape in accordance with one embodiment of the present invention, which is obtained by irradiation of each surface of the adhesive polymer resin containing conductive fillers, light of different intensity;

.1b is a photographic image of the upper surface and the lower surface of the adhesive tape, which is obtained by irradiating both surfaces of the adhesive resin light with the same intensity;

Figa is a schematic illustration showing the orientation of the fillers in the adhesive tape shown on Figa;

.2b is a photographic image obtained by means of SEM (scanning electron microscope)showing a cross section of masking tape and fillers, oriented in accordance with one embodiment of the present invention;

Figs is a photographic image obtained by means of SEM, which shows the surface of the adhesive tape and fillers, oriented in accordance with one embodiment of the present invention;

.2d of the displays is an example of the present invention, in which a conductive mesh film obtained by coating on a conductive mesh layer of the polymer resin, is used as a photomask having a mask pattern, and a conductive mesh film included in sticky tape.

FIGURE 3 is a schematic illustration showing a mask pattern suitable for anti-adhesive sheet in accordance with one embodiment of the present invention;

Figa and 4b are diagrams showing the change in orientation of the fillers when exposed to light in accordance with one embodiment of the present invention; and

Figa and 5b are diagrams showing the initial adhesion (Figa) upper surface and the lower surface of the adhesive tape, which is obtained by using light of different intensity, and its adhesion after aging (.5b), measured after aging for one week at 65°C.

A DETAILED DESCRIPTION of the INVENTION

Next will be Detelina described preferred embodiments of the present invention.

In accordance with the present invention, the adhesive tape 100 can be manufactured in the form of a sheet. In the sticky tape 100 conductive fillers 120 is oriented in the transverse direction 130, as well as in the longitudinal direction of the lip 140 the second tape 100. This orientation of the conductive fillers 120 allows the conductive fillers 120 can be electrically connected to each other on one surface of the adhesive tape 100 to the other surface of the adhesive tape 100. Thus, the conductive fillers 120 can form a conductive grid in the whole volume of the adhesive tape 100.

Figa-2C show different orientations of the conductive fillers 120 in the sticky tape 100 in accordance with the present invention. Adhesive tape 100 allows the electric current to flow through the grid formed by the conductive fillers 120, as shown in Figa-2C.

In accordance with the present invention, in order to allow the conductive fillers 120 oriented in the transverse direction 130, as well as in the longitudinal direction 140 adhesive polymer resin, can be used mobility fillers 120 in the polymerization process. In detail, during the process of photopolymerization by irradiation with light of 450 in syrupy condition polymeric composition 110 after adding conductive fillers 120 to a syrupy state polymeric composition 110 (here and hereinafter also referred to as "polymer syrup 110"), in which the monomers have not yet been fully solidified, the light 450 is selectively directed to the surface of the polymer syrup 110 such education is, to selectively initiate photopolymerization on the surface of the polymer syrup 110, thereby orienting the conductive fillers 120 in the desired pattern. To implement this selective initiation of polymerization can be used, the photomask having a desired masking pattern 310, such as a release sheet 300 having a masking pattern 310 (see figure 3).

More specifically, when performing exposure through a photomask having a mask pattern 310, 450 light cannot pass through the light-reflecting region formed by the masking pattern 310, or the amount of light 450 passing through the photomask, can be significantly reduced, so that the photopolymerization not initsiiruetsya, or the rate of photopolymerization is reduced or will be very low, even if the photopolymerization can be initiated (see .4b). However, photopolymerization may actively occur in the area that is not covered by the masking pattern 310, thereby forming radicals. As a result, the polymerization can uniformly flow in a downward direction from the mask pattern 310.

When the polymer syrup 110 containing fillers 120 begins to dry out from the surface under the action of light irradiation, fillers 120 remaining in the area, which was initiated polymerization, move to an area where floor is Marisela has not yet been initiated. Thus, when the photopolymerization occurs with both surfaces of the polymer syrup 110, the polymerization is initiated from the surface and conductive fillers 120 remaining on the surface are shifted in the inner intermediate layer, where the polymerization has not yet been initiated (see Figa). In contrast, since the polymerization is not initiated in the region formed below the mask pattern 310, the conductive fillers 120 remaining in the above areas, do not move down (see .4b).

Accordingly, as shown in Figa-2C, the conductive fillers 120 are concentrated in the Central part (as viewed in the longitudinal direction 140) of the sheet in the region where the mask pattern 310 is not formed and retained in the longitudinal direction 140 in the area, forming a masking pattern 310, thereby forming a conductive grid in the whole volume of the sheet of polymeric resin. Thus, the conductive fillers 120 is oriented in the longitudinal direction 140 (z axis direction) of the sheet of polymeric resins in the field, forming a masking pattern 310, and is oriented in the intermediate layer of the sheet of polymeric resin in the transverse direction 130 (plane x-y) in the region where the mask pattern 310 is not formed, thereby forming a conductive grid in the longitudinal and transverse directions 130 sheet adhesive poly the EPA. In this case, the conductive fillers 120 can be electrically connected to each other on one surface of the adhesive tape 100 to the other surface of the adhesive tape 100. Thus, the adhesive tape 100 in accordance with the present invention can have improved electrical conductivity compared with conventional adhesive tape 100, in which the conductive fillers 120 are randomly distributed.

In addition, when each surface of the polymer syrup 110 for forming the adhesive tape 100 is irradiated with light 450 different intensity, mobility fillers 120 is changed, and therefore the adhesive tape 100 has different adhesion values on its two surfaces. For example, on the surface irradiated with light 450 greater intensity, photopolymerization of the polymer syrup 110 proceeds more rapidly, leading to increased mobility of the fillers 120. In this case, the fillers 120, which should be oriented in the transverse direction 130, tend to go on the side irradiated with light 450 lesser intensity. Thus, the fillers 120, which should be oriented in the plane x-y, move closer to the surface irradiated with light 450 lower intensity in comparison with the surface irradiated with light 450 greater intensity (see FIG. 2A). In addition, on the surface irradiated with light 450 greater intensity, is fast photopolymer the grouting, and because the fillers 120 is moved rapidly, leading to the formation of surface roughness.

In this case, the layer of adhesive polymer formed from irradiated with light 450 greater intensity, will be thicker than the layer of adhesive polymer formed from irradiated with light 450 lower intensity, because the fillers 120, orientirovanie in the plane x-y, move closer to the latter. However, the surface is irradiated with light 450 greater intensity, may have a lower value of adhesion due to the above-mentioned surface roughness.

So you can get the sticky tape 100, which has different adhesion values on its two surfaces, having at the same time, electrical conductivity, using a single process in accordance with the present invention.

The adhesion value of the each surface of the adhesive tape 100 depends on the specific purpose and irradiated material with the adhesive tape 100. In accordance with one embodiment of the present invention, one surface of the adhesive tape 100 may have an initial adhesion value of the approximately 300-1000 g/inch (116-386 centinewton/cm) and the other surface of the adhesive tape 100 may have an initial value of adhesion is equal to about 800-2500 HS/inch (309-965 centinewton/cm).

Although not beings who no particular restrictions on the thickness of the adhesive tape 100, adhesive tape 100 may have a thickness of approximately 0.2 mm to 3 mm, zavisimosti characteristics characteristics etc.

In accordance with the present invention, the adhesive polymer resin can be used in a quantity of about 10-95 wt.%. of the total weight of the adhesive tape 100.

In the present invention, the polymer resin on acrylic basis can be used as the adhesive polymer resin. In accordance with a preferred embodiment of the present invention may be used in the polymer, acrylic-based, which can be obtained by polymerization photopolymerizing monomers.

Photopolymerizing monomer includes alkylacrylate monomer having a C1-C14alkyl group. Non-limiting examples alkylacrylate monomers include butyl(meth)acrylate, hexyl(meth)acrylate, n-octyl(meth)acrylate, isooctyl(meth)acrylate, 2-ethylhexyl(meth)acrylate and isononyl(meth)acrylate addition, specific examples alkylacrylate monomers that can be used in the present invention, also include isooctadecyl, isoenergetic, 2-ethyl hexyl acrylate, dellaquila, dodecylamine, n-butyl acrylate and hexidecimal.

Although alkylacrylate monomer can form an adhesive polymer resin, acrylic-based by homopolymerization, he can b the th copolymerization with copolymerization monomer, having a polarity different from alkylacrylate monomer, with the formation of the adhesive polymer resin. Thus, in accordance with the embodiment of the present invention, it is also possible to use a copolymer of C1-C14alkylacrylate monomer with a polar copolymerization monomer, as an adhesive polymer resin, acrylic-based.

There is not set any specific limits on the ratio alkylacrylate monomer to polar copolymerizable the monomer. However, it can be taken the weight ratio 99-50:1-50, depending on the physical properties of the obtained adhesive polymer resin.

Non-limiting examples of polar copolymerizing monomers include acrylic acid, taconova acid, hydroxyethylacrylate, cyanoacrylate, acrylamide, substituted acrylamide, N-vinyl pyrrolidone, N-vinylcaprolactam, Acrylonitrile, vinyl chloride and diallylphthalate.

Polar copolymerizing monomer gives a polymer resin adhesive properties and the ability to grip with improved adhesion of the polymer resin.

Adhesive tape 100 in accordance with the present invention includes a conductive filler to impart conductivity. Although special restrictions on the form of a conductive filler is missing, a conductive filler, which can be used, includes noble metals; base metals; noble or base metals plated with precious metal; precious and base metals plated with precious metal; non-metals plated with precious or non-precious metal; non-conductive non-metals; conductive polymers and mixtures thereof. More specifically, a conductive filler, which may include noble metals such as gold, silver, platinum; base metals such as Nickel, copper, tin, aluminum and Nickel; noble or base metals with a coating of noble metal, such as copper, Nickel, aluminum, tin or gold plated silver; precious and base metals plated with precious metal, such as copper or silver plated with Nickel; non-metals plated with precious or non-precious metal, such as graphite, glass, ceramics, plastics, elastomers or mica coated with Nickel or silver; conductive non-metals, such as gas soot or carbon fiber; conductive polymers, such as polyacetylene, polyaniline, polypyrrol, polythiophene, poly(sulfur nitride), poly(p-phenylene), poly(phenylindole) or poly(p-phenylenevinylene); and mixtures thereof.

The filler is classified in a broad sense as “dispersed” in appearance, although the specific forms of the this type is not considered critical to the present invention and may include any shape, usually used in the manufacture or preparation of the compositions of the conductive materials described here of the type including a hollow or solid microspheres, elastomeric microspheres, flakes, lamellar particles, fibers, rod-like particles, particles of irregular shape or their mixture.

Similarly, the particle size of the filler is not critical and can have a narrow or wide interval or range of size distribution, but in one typical embodiment of the present invention will be in the range of about 0,250-250 microns, and in another typical implementation is in the range of about 1-100 microns.

The conductive fillers 120 can be used in an amount of 5-90% by weight. of the total weight of the adhesive tape 100 in accordance with the present invention. In accordance with the embodiment of the present invention, the adhesive tape 100 may include 40-80 wt.%. the adhesive polymer resin and 20 to 60% wt. conductive fillers 120. In accordance with another embodiment of the present invention, the conductive fillers 120 can be used in quantities of from 100 to 500 weight parts per 100 weight parts of the adhesive polymer resin.

To achieve the physical properties required for the product, which is applied to adhesive tape 100, the adhesive tape 100 in accordance with izaberete the receiving may further include at least one filler. Is not set specific restrictions on the type of fillers 120, provided that the filler does not adversely affect the characteristics and suitability of the adhesive tape 100. For example, the fillers include, without limitation, thermally conductive fillers, non-combustible fillers, antistatic agents, foaming agents and polymeric hollow microspheres.

In accordance with the present invention, the fillers may be used in quantities of less than 100 weight parts, for example 10-100 weight parts, per 100 weight parts of the adhesive tape 100.

In addition, the polymer resin may include other additives, such as polymerization initiators, crosslinking agents, photoinitiators, pigments, antioxidants, UV stabilizers, dispersants, defoamers, thickeners, plasticizers, resins, increase stickiness, or staining agents.

Next will be described in more detail the method of making adhesive tape 100 in accordance with the present invention.

Adhesive tape 100 in accordance with the present invention can be manufactured by mixing the monomer for the preparation of the adhesive polymer resin with conductive fillers to impart conductivity, the addition of fillers or additives, if necessary, and then carrying out polymerization of the mixture. Currently photopolymerization is carried out by irradiation of each surface of the adhesive polymer resin 450 light of different intensity with getting this tape 100, having different sizes of adhesion on its two surfaces.

In detail, the adhesive tape 100 in accordance with the present invention, which has a conductivity in the longitudinal direction 140, and in its transverse direction 130, and having different adhesion values on its two surfaces, can be obtained by the method comprising the stages:

the mixture of monomers for the preparation of the adhesive polymer resin with conductive fillers;

molding the mixture in the form of a sheet, and

exposure of both surfaces of the sheet light 450 for carrying out the photopolymerization adhesive polymer resin, where each surface of the sheet is irradiated with light 450 different intensity and 450 light emitted selectively on the portion of the surface of the sheet. The method may additionally include the stage of adding the initiators of polymerization or cross-linking agents.

In accordance with one embodiment of the present invention, to ensure uniform distribution of the conductive fillers 120 and to facilitate the initiation of the above-mentioned selective photopolymerization monomers for the preparation of the adhesive polymer resin pre-polymerized to produce the polymer syrup 110 and then add the conductive fillers 120 and other additives to the polymer syrup 110. Thus, the stage of mixing the monomers for the prepara is placed adhesive polymer resin with conductive fillers 120 can include a stage of partial polymerization of the monomers for preparation of the adhesive polymer resin with the formation of the polymer syrup 110 and adding conductive fillers 120 to the polymer syrup 110. In accordance with the embodiment of the present invention, the polymer syrup 110 may have a viscosity of approximately 500-20000 SP.

As mentioned above, as the adhesive polymer resin may be used a polymer resin on acrylic basically.

Thus, in accordance with the embodiment of the present invention, the adhesive tape 100 can be obtained by a process comprising the stages:

carrying out partial polymerization of the monomers for preparation of the adhesive polymer resin with the formation of the polymer syrup 110;

the addition of conductive fillers 120 to the polymer syrup 110 and uniform mixing;

molding the polymer syrup 110 containing added thereto conductive fillers 120, sheet and placing a photomask having a predetermined masking pattern 310 on the surface of the sheet; and

irradiation with light of 450 sheet through a photomask for carrying out the photopolymerization, where each surface of the sheet is irradiated with light 450 different intensity.

More specifically, the monomers for preparation of the adhesive polymer resin partially polymerized by using a polymerization initiator in the absence of oxygen to produce the polymer syrup 110 having a viscosity equal to the prima is but from 500 to 20,000 CPS. Then, to the polymer syrup 110 adds the conductive fillers 120, other additives, crosslinking agents and photoinitiator, after which the mixture is formed into a sheet, which can be used as adhesive tape. At this time, the sheet of polymer syrup 110 may be placed between the release sheet 300 by using the light transmitting adhesive sheet 300. This placement allows you to create conditions essentially complete absence of oxygen. In addition, if the mask pattern 310 is formed on the release sheet 300, the release sheet 300 can serve as a photomask having a mask pattern 310. Then the sheet is irradiated with light 450 (preferably UV light) through the release sheet 300 or another photomask having a mask pattern 310, so that the polymer syrup 110 polymerizes and crosslinks in terms of the essentially complete absence of oxygen. In this case, each surface of the polymer syrup 110 is irradiated with light 450 different intensity to obtain the adhesive tape 100 having different sizes of adhesion on its two surfaces. This allows you to get the sticky tape 100 that includes a grid formed by conductive fillers 120 and having different size adhesion on its two surfaces.

In accordance with the embodiment of the present invention, t is sotropy material, such as colloidal silicon dioxide, may be used, if necessary, to thicken monomers sufficiently so that the monomer can form a syrup.

For example, when both surfaces of the sheet irradiated with light 450, the oxygen content may be 1000 ppm (m-1) or less. With decreasing oxygen content of undesirable oxidation of the adhesive polymer resin can inhibit more efficiently, thus providing excellent adhesion value. In other words, after placing the polymer syrup 110 between the release sheet 300 and molding the resulting mixture into a sheet, this sheet can be irradiated with light 450 is essentially not containing oxygen chamber, where oxygen is present in a concentration of less than 1000 ppm, through a photomask having a mask pattern 310. If necessary, you can bring the oxygen concentration to a value of 500 ppm or less.

At the stage of photopolymerization, for providing selective irradiation of the polymer sheet may be used in the photomask having the mask pattern 310. A photomask having a predetermined masking pattern 310 includes a transmissive light region, allowing the light 450 to pass through it, and no light area for reflection or attenuation 450 passing through it. The photomask may include, b is C restrictions transmits light with a release sheet 300 having a predetermined masking pattern 310, a mesh net, a mesh, or a lattice. In accordance with the embodiment of the present invention, as a photomask may be used which transmits light with a release sheet 300 having a predetermined masking pattern 310 (see figure 3). In this case, the light transmissive adhesive sheet 300, which can be used includes a transparent plastic film treated with a release agent or having low surface energy. For example, light transmissive adhesive sheet 300 may be manufactured using a plastic film such as polyethylene film, polypropylene film or polyethylene terephthalate (PET) film.

Thus, for formation of the mask pattern 310 may be used a material that can weaken 450 light incident on the shielding part, 10-100%, preferably 50% or more. In accordance with the embodiment of the present invention, the mask pattern 310 may be planned in such a way that it could weaken 450 light incident on the mask pattern 310, 70% or more. If necessary, the mask pattern 310 may be planned in such a way that he could fully (100%) screening 450 light incident on a mask the second pattern 310.

Is not set specific limits for the method of forming a masking pattern 310 on the surface of the light transmissive adhesive sheet 300. Any ways to get the material for forming the mask pattern 310, which may reduce light transmission or can screen light transmission, designed for use on light transmissive adhesive sheet 300 can be used without any restrictions. For example, there may be used a method of printing. The printing method includes the currently used printing methods such as screen printing method, a printing method using termoyadernogo sheet or a method of gravure printing. For forming a masking pattern 310 can also use black printing ink having excellent light absorption. The shape of the mask pattern 310 is not limited, for example, can be used as a masking pattern 310, shown in figure 3.

Is not set specific restrictions on the type of the mask pattern 310 formed on the release sheet 300. In accordance with the embodiment of the present invention, the light shielding part formed by the masking pattern 310 may take from 1 to 70% of the release sheet 300. If the area of the light shielding part is equal to less than 1% antithese the frame sheet 300, the conductive fillers 120 can not be effectively oriented in the longitudinal direction 140. In contrast, if the area of the light shielding part is greater than 70% of the release sheet 300, it can interfere with the photopolymerization.

Although not set specific restrictions on the thickness of the release sheet 300, in accordance with the embodiment of the present invention can be used with a release sheet 300 having a thickness of approximately 5 μm - 2 mm If the release sheet 300 has a thickness less than 5 μm, the release sheet 300 is too thin for forming a pattern and applying a polymer syrup 110. No need to use anti-adhesive sheet 300 having too thick. This is because the anti-adhesive sheet 300 having a thickness more than 2 mm, can disrupt the photopolymerization.

In one embodiment of the present invention, as a photomask having a mask pattern 310 for selective irradiation, can be used a conductive mesh film. A conductive mesh film can be obtained by coating on a conductive mesh layer of the polymer resin. In the conductive mesh film conductive grid does not pass through the light 450 and can therefore perform the function of the mask pattern 310; and a conductive mesh about what has conductivity. A conductive mesh film selectively escapes through her light 450 to conduct selective photopolymerization, however, a conductive mesh film is not removed after the photopolymerization, and is included in the adhesive tape 100 with the formation of one side of the adhesive tape 100. When using a conductive mesh film can be easily obtained by different values of adhesion.

The thickness of the conductive mesh film is not limited, but in accordance with one embodiment of the present invention, the thickness may be approximately 5 μm-2 mm

Also, do not set specific restrictions on the thickness of the adhesive tape 100 in accordance with the present invention. For example, adhesive tape 100 may have a thickness of approximately 25 μm to 3 mm, taking into account the ability of the monomers of photopolymerization and the mobility of the conductive fillers 120. If the thickness of the adhesive tape 100 less than 25 μm, the processability may deteriorate due to the small thickness of the adhesive tape 100. On the contrary, if the thickness of the adhesive tape 100 more than 3 mm, it may interfere with the photopolymerization.

Light 450 is the intensity, suitable for typical photopolymerization. In accordance with the embodiment of the present invention, the light 450 is the intensity, the identical UV rays. In addition, the exposure time can be changed depending on the intens is vnesti light 450 during the photopolymerization. In accordance with the present invention, both surfaces of the sheet of polymer syrup 110 for forming the adhesive tape 100 is irradiated with light 450 different intensity. Thus, one surface is irradiated with light 450 relatively high intensity, while the other surface is irradiated with light 450 relatively low intensity. Low intensity may be 10-90% of high intensity.

In accordance with the present invention, a crosslinking agent may be used for crosslinking the adhesive polymer resin. The properties of the adhesive polymer resin, in particular the adhesive power of the adhesive polymer resin, can be adjusted depending on the amount of cross-linking agent. For example, a crosslinking agent may be used in a quantity of from about 0.05 to 2 weight parts per 100 weight parts of the adhesive polymer resin. Specific examples of the crosslinking agent that can be used in the present invention include multifunctional acrylate such as 1,6-hexanediamine, trimethylolpropane, pentaerythrityl, 1,2-etilenglikolevye or 1,12-dodecandioic. However, the present invention is not limited to them.

In addition, photoinitiator can be used in the manufacture of adhesive tape 100. The degree of polymerization is polimernoi resin can be adjusted depending on the number of photoinitiator. For example, photoinitiator can be used in a quantity of from about 0.01 to 2 weight parts per 100 weight parts of the adhesive polymer resin. Specific examples of photoinitiator, which can be used in the present invention include 2,4,6-trimethylbenzenesulfonamide, bis(2,4,6-trimethylbenzoyl)phenylphosphine, α,α-methoxy-α-hydroxy-acetophenone, 2-benzoyl-2-(dimethylamino)-1-[4-(4-maronil)phenyl]-1-butanone or 2,2-dimethoxy-2-phenylacetophenone. However, the present invention is not limited to them.

In accordance with the embodiment of the present invention, to improve the flexibility of the adhesive tape 100 adhesive tape 100 may be subjected to a foaming process. The foaming process includes different schemes of expansion, such as mechanical distribution of the foam through the injection of a gaseous foaming agent, dispersing hollow polymeric microspheres or the use of thermal foaming agent. Non-limiting examples of foaming agents include, without limitation: water; volatile organic compounds (VOC), such as propane, n-butane, isobutane, butylene, isobutene, pentane, neopentane or hexane; and inert gases such as nitrogen, argon, xenon, krypton, helium or CO2. Foaming agent may be added to the partially polymerized polymer Siro is at 110.

Further, the present invention will be described in more detail with reference to examples, comparative examples and experimental examples, which are given only for illustration and do not limit the scope of the present invention.

In the following description, the term “parts” refers to “weight parts per 100 weight parts of the adhesive polymer resin obtained by polymerization of monomers.

Examples 1-4 and Comparative Example 1

First, 93 parts of 2-ethylhexyl acrylate as the acrylic monomer, 7 parts of acrylic acid as a polar monomer and 0.04 parts of Irgacure-651 (α,α-methoxy-α-hydroxyacetophenone) as photoinitiator, partially polimerizuet in IL glass reactor to obtain a syrup with a viscosity of 3000 CP. Then, 100 parts of the syrup is mixed with 0.1 part of Irgacure-819 [bis(2,4,6-trimethylbenzoyl)phenylphosphine] as photoinitiator, of 0.65 parts of 1,6-hexanediamine (HDDA) as a crosslinking agent and 1.5 parts of colloidal silica and the mixture is stirred sufficiently. Then, 30 parts of hollow steklosfera with a coating of silver (SH230S33, Potters Industries Inc.), having a particle size equal to about 44 microns, is mixed with the above mixture as a conductive filler, and then the resulting mixture was thoroughly mixed to a homogeneous state, getting cut is ltate mixture in the form of a polymer syrup.

Meanwhile, as shown in figure 3, the bars having a width of 700 μm and an interval of 1.5 mm, is applied on a transparent polypropylene film having a thickness of 75 μm, using black ink to obtain a photomask having a mask pattern, in the form of a release sheet.

Then, the polymer syrup ekstragiruyut glass reactor and anti-adhesive sheets with a pattern laid on both surfaces of the polymer syrup with roller device for coating so that the polymer syrup can be placed between the release sheet with a thickness equal to approximately 0.5 mm As anti-adhesive sheets are placed on both surfaces of the polymer syrup, prevents contact of the resin syrup with air, especially oxygen.

Then, irradiated with UV rays with a release sheet having a mask pattern, using a metal halide UV lamp with an intensity that is specified in the following Table 1, receiving adhesive tapes, which were designated as Examples 1, 2 and 3 and Comparative Example 1. For convenience, the UV-rays of high intensity was irradiated with the bottom surface (B), and UV-rays of low intensity irradiated to the upper surface (T). In Comparative Example 1, UV-rays were irradiated as the bottom surface and the top surface with the same intensity.

Table 1
SampleUV intensity, mW/cmLinear speedThickness
Zone 1Zone 2Zone 30.5 m/m (mpm) (520)500 mcm
(T:)(T:)(T:)
Crowner4,14,14,14,14,14,1
App.1 2,84,12,84,12,84,1
PR1,34,11,34,11,34,1
PR0,24,12,84,14,14,1

Sticky tape investigated to determine the distribution of the fillers. Figa-2C represent a photographic image made using SEM (scanning electron microscope), which show in cross-section of adhesive tapes in accordance with Example 1.

As shown in Figa-2C, the conductive fillers are oriented in the longitudinal direction (z axis direction) of the sheet adhesive polymer in the region where a mask pattern, and is oriented in the transverse direction (plane x-y) of the sheet adhesive polymer in the middle part of the adhesive sheet of polim the RA in the field, where the mask pattern is not formed, thereby forming a conductive grid throughout the volume (in the x direction, and the z-direction) of the sheet adhesive polymer. In addition, you can see that the fillers are oriented in the transverse direction (plane x-y)are shifted to the upper surface irradiated with light of low intensity (see Figa). Here, Figa is a photographic image of the upper surface and the lower surface of the adhesive tape obtained in Example 1, in accordance with the present invention. .1b is a photographic image of the upper surface and the lower surface of the adhesive tape obtained in Comparative Example 1.

Experimental Example 1. Measurement of resistance

Measured values of the surface resistance in the three zones of each adhesive tapes obtained in Examples 1-3 and Comparative Example 1, by means of surface probe, specific ASTMD991 using microammeter Kiethely 580. Determine the average value of the measured resistance, taking him by the surface resistance of each tape. The results are shown below in table 2.

Table 2
SamplePoverkhnostnoaktivnykh (T:), Ohm/square (sq)
EUR. App.10,440,48
App.10,410,42
PR0,440,43
PR0,490,44

Experimental Example 2. Test for adhesion adhesion

After lamination of aluminum each adhesive tape obtained in Examples 1-3 and Comparative Example 1 were measured adhesion adhesion of each tape with steel in the direction of 90°. For each tape initial adhesion and adhesion after aging was measured at 25°C.

Here, the initial adhesion is defined as the amount of adhesion measured after 20 minutes at 25°C., and the adhesion after aging is defined as the amount of adhesion measured after aging for one week at 65°C. the Results are shown below in Table 3. For ease of comparison, these results are shown in Figa and 5b in graphical form.

Table 3
SampleInitial adhesion (GF/inch) (T:) Adhesion after aging (g/inch) (T:)
EUR. App.11065107324572131
App.1105179624972310
PR934353277488
PR9795292063506

As can be seen from the above experimental results, the adhesive tape in accordance with the present invention not only exhibits excellent conductivity, but also has different adhesion values on its two surfaces. You can also see that the magnitude of adhesion on the bottom surface decreases with increasing intensity of light irradiation of the upper surface, at the same time not significantly affecting the magnitude of adhesion on the upper surface.

As described above, the adhesive tape in accordance with the present invention includes a conductive fillers, oriented in the longitudinal direction and in the transverse voltage is the t, so the sticky tape has excellent conductivity. In addition, since the adhesive tape in accordance with the present invention has different adhesion values on its two surfaces, it can be used for various applications requiring high adhesion value on the one hand and low values of adhesion with the other hand. Thus, when the adhesive tape in accordance with the present invention as a sealing gasket for packaging electronic devices sticky tape can effectively protect the electronic components installed in electronic devices, due to its ability to absorb impact energy and vibration, and excellent ability to shield electromagnetic waves.

1. Adhesive tape containing an adhesive polymer resin on acrylic base and conductive fillers dispersed in the above-mentioned adhesive polymer resin, with adhesive tape, characterized by different adhesion values on its two surfaces, and conductive fillers are oriented in both longitudinal and transverse directions in the above-mentioned adhesive polymer resin, being at the same time electrically connected to each other on one surface of the adhesive tape to the other surface of the adhesive tape.

2. Adhesive tape according to claim 1, characterized in that it has toxinout approximately 25 μm to 3 mm

3. Adhesive tape according to claim 1, characterized in that characterized the initial adhesion value of the approximately 300-1000 g/inch on one surface, and an initial adhesion value of the approximately 800-2500 HS/inch on the other surface.

4. Adhesive tape according to claim 1, characterized in that the conductive fillers are present in an amount of from 10 to 500 parts per 100 parts of adhesive polymer resin.

5. Adhesive tape according to claim 1, characterized in that the polymer resin on acrylic basis includes a polymer obtained by copolymerization alkylacrylate monomer having a C1-C14alkyl group, with the polar copolymerization monomer.

6. Adhesive tape according to claim 5, characterized in that alkylacrylate monomer selected from the group consisting of butyl(meth)acrylate, hexyl(meth)acrylate, n-octyl(meth)acrylate, isooctyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, isononyl(meth)acrylate, isooctadecyl, isononanoate, 2-ethylhexyl acrylate, decidability, dodecylamine, n-butyl acrylate and hexylaniline.

7. Adhesive tape according to claim 5, characterized in that the polar copolymerizing monomer selected from the group consisting of acrylic acid, basis of itaconic acid, hydroxyethylacrylate, cyanoacrylate, acrylamide, substituted acrylamide, N-vinylpyrrolidone, N-vinylcaprolactam, Acrylonitrile, vinyl chloride, and diallylphthalate.

8. If the Kai tape according to claim 5, characterized in that alkylacrylate monomer and the polar copolymerizing monomer are in the ratio 99-50:1-50.

9. Adhesive tape according to claim 1, characterized in that the conductive filler is selected from the group consisting of noble metals, base metals, noble or base metals plated with precious metals, precious and base metals plated with precious metals, non-metals plated with precious and base metals, conductive non-metals, conductive polymers, and mixtures thereof.

10. Adhesive tape according to claim 9, characterized in that the noble metals include gold, silver, platinum, base metals include Nickel, copper, tin, aluminum and Nickel; noble or base metals plated with precious metals include copper, Nickel, aluminum, tin and gold plated silver; precious and base metals coated with base metals include copper and silver plated with Nickel; non-metals plated with precious and base metals include graphite, glass, ceramics, plastics, elastomers, and mica coated with silver or Nickel; conductive nonmetals include gas soot and carbon fiber.

11. Adhesive tape according to claim 1, characterized in that it further comprises at least one fill the spruce, selected from the group consisting of thermally conductive fillers, flame retardant fillers, antistatic agents, foaming agents, and polymeric hollow microspheres.

12. Adhesive tape according to claim 1, characterized in that on one side of the adhesive tape is placed a conductive mesh film obtained by coating on a conductive mesh layer of the polymer resin.

13. Method of making adhesive tape, having a conductivity in both longitudinal and transverse directions, including the stages at which
mix the monomers for preparation of the adhesive polymer resin with conductive fillers; molded mixture in the form of a sheet and is exposed to both surfaces of the sheet light for carrying out the photopolymerization mentioned adhesive polymer resin, in this case, each surface of the sheet is irradiated with light of different intensity, and emit light selectively on the portion of the surface of the sheet.

14. The method according to item 13, wherein the step of mixing the monomers for preparing the aforementioned adhesive polymer resin with conductive fillers include stages in which molded polymer syrup by partial polymerization of the monomers of the adhesive polymer resin and adding conductive fillers to the polymer syrup, obtained by partial polymerization of the monomer.

15. The method according to item 13, wherein the stack is in the sheet surface of the photomask, having a mask pattern, and the light is directed through the photomask, so that the light fell selectively on the portion of the surface of the sheet at the stage of exposure of both surfaces of the sheet of light.

16. The method according to item 15, wherein the photomask includes a mesh grid, lattice, svetopropusknuyu anti-adhesive film, having previously created a mask pattern or a conductive mesh film formed by coating on a conductive mesh layer of the polymer resin.

17. The method according to item 16, wherein the adhesive film has a thickness from about 5 μm to 2 mm

18. The method according to item 13, wherein the adhesive polymer resin and conductive fillers are used in amounts of about 10-95 wt.% and about 5-90 wt.%, respectively, of the total weight of the adhesive tape.



 

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5 cl, 6 ex, 3 tbl, 10 dwg

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Tape glue // 2381249

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2 cl, 1 tbl, 17 ex

Tape glue // 2381249

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2 cl, 1 tbl, 17 ex

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1 tbl, 4 ex

FIELD: chemistry of polymers, gluing materials.

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11 cl, 1 tbl, 2 ex

The invention relates to polymeric compositions based on acrylic resins designed for fixing anchor bolts in concrete and bonding of concrete and reinforced concrete structures
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