Light-emitting diode lamp

FIELD: physics.

SUBSTANCE: light-emitting diode lamp has an aluminium radiating housing with a power supply unit in its top part, formed by a hollow rotation body with external radial-longitudinal arms which form the outline of the lamp, fitted with internal radial-longitudinal arms with windows between them and a circular area on the butt-end of the external radial-longitudinal arms in its inner part, on which light-emitting diodes are tightly mounted. The design of the radiating housing with windows between the internal radial-longitudinal arms and guides in the top and bottom parts of the radiating housing, provides efficient convectional heat removal from powerful light-emitting diodes separated from each other by inner and outer streams. The light-emitting diode module has a light-emitting diode fitted into an optical lens and tightly joined to a printed circuit board through a flexible sealing element encircling the light-emitting diode, and the light-emitting diode is rigidly joined to a heat-removing copper plate through a hole in the printed circuit board.

EFFECT: stable light output and colour temperature over the entire service life, high light flux is ensured by a set of structural solutions of the radiating housing and compact light-emitting diode modules.

5 cl, 5 dwg

 

The invention relates to lighting devices, and more specifically to an led lamp for lighting of industrial, public, commercial and domestic premises.

Compared with traditional sources of electric light (incandescent, fluorescent, hid, halogen, sodium, mercury, and others), led one of the light sources with very high efficiency light output (up to 150 LM/W) and they consume 10-20% of capacity (compared with conventional incandescent lamp).

Led lamp based on the powerful LEDs are energy efficient, environmentally friendly light source with long service life.

The main indicator of efficiency of the light bulb - its luminous efficacy in LM/W luminous flux - LM per unit electric power consumption - watts).

A typical led lamp is based on the powerful LEDs includes LEDs secondary optics (reflectors, optical lenses), heat the case and power supply.

Each of these components in the aggregate affect the light output, reliability and durability of the led lamp.

The high operating temperature of the crystal (svetonedeljski element) when insufficient heat dissipation over time leads to faster degradation of the crystal changes color and decrease of luminous flux and, as a result, the ATA, to reduce the durability of led lamps.

Thus, the increase in light output at specific values of the efficiency of the power supply and optical lenses, can be achieved by reducing the temperature of the LEDs, that is, by increasing cooling efficiency svetovidovi elements LEDs.

The main objective of ensuring maximum light output, reliability and durability of led lamps is to provide the optimal thermal regime led.

All currently known types of led lamps used thermal model, including heat from the led to the heat sink and natural (without forced ventilation) convection heat transfer from the radiator to the environment.

The parameters provide the necessary heat sink mainly determined by the construction of the body of the radiator.

From a variety of known design solutions led lamps selected such that contain common essential features characterizing their cooling system.

Known led lamp LRP-38 American company CREE, with screw cap (E-26/27 for connection to an external source of AC power which has a metal cone-shaped longitudinally ribbed on the outside case-heatsink with led installed the led lens (www.creells.com/lrp-3 8-htm (Google)).

The disadvantage of this lamp is inefficient convection cooling system case-heatsink only through its outer fins.

Known led lamp LR6 American firm CREE (www.creells.com (Yandex)).

This lamp has a metallic hollow cylindrical body-radiator consisting of two parts connected via thermobalance, longitudinally ribbed on the outside. LEDs mounted on printed circuit Board associated with the case-heat sink, inside of which is placed the power supply.

The disadvantage of this led bulb is inefficient system of heat removal from the led through the metal base circuit Board to the massive aluminum case-heatsink, convection heat transfer to the surrounding air environment only through its outer fins and thermal pads between the case-sink.

In addition, the printed circuit Board from the side emitters LEDs has a coating designed to seal the LEDs and conductive rations.

Closest to the technical nature of the claimed led lamp is a led lamp DL-D007N firm SHARP, which is a cylindrical body mounted with its inner surface on the PCB LEDs in optical lenses (DL-D007N (Yandex).

Outside in the plane of the cylindrical casing, inside of which is placed the led modules on printed circuit boards, LEDs in optical lenses, mounted rigidly associated with the radiator from the perpendicular to the common inner wall of the longitudinal parallel edges, over which is placed a plane to the distribution of heat flow radiator.

The disadvantages of the above structure of led lamp are:

- low efficiency of heat transfer from the led through the printed circuit Board to the chassis of the heat sink;

- low intensity convection cooling flows in the environment;

- the presence of planes in the upper part of the radiator, slowing down the speed of longitudinal cooling convection currents.

All the above designs of led lamps for mounting LEDs, their electrical connections with the power supply and heat transfer to the body-radiator used printed circuit Board, the most common design is a printed circuit Board on an aluminum substrate (MCP SW), has the lowest thermal resistance: 3.4 K/W.

Design led modules for led lamps include led, electrically soldered on a printed circuit Board, the optical lens placed in her crystal led.

For protection against moisture designated Pai the LEDs on the printed Board varnished and/or'm entwined compounds.

The technical result that can be obtained in the claimed invention, is the creation of an led lamp with this case design-radiator, creating a natural high-speed convection currents, and the design of led modules, their attachment to the body of the radiator, which together will provide optimal thermal conditions of each led and the overall durability of led lamps (including thermal Cycling) without reducing the aperture for the entire period of its life cycle.

Mount the led to the body-the radiator must provide a reliable thermal contact.

The total thermal resistance in a heat lamp circuit is determined by the type of led, thermal characteristics of its fastening to the radiator and convection radiator size led lamp into the air.

The value of thermal resistance of the led (between svetovidovi element and heat the base of the led housing is a characteristic depending on the type of led, and therefore evaluation of the overall effectiveness of the cooling system of a particular lamp, this value is excluded.

The size of led lamps corresponds to the sizes of bulbs, limiting their geometrical parameters and mainly defines the shape and razmarilova system, in particular case-heat sink of the led lamp.

The heat dissipation is improved when the vertical location of the active surfaces of the body-radiator, as this will improve conditions convection (education additional heat flows and their high-speed mode). The technical result that can be achieved in the claimed led lamp with housing-radiator with external radial longitudinal ribs forming the contour of the lamp, installed on it from one end of the led modules and power supply from the other end, provided that the body is a radiator formed of a hollow body of revolution and has an internal radial longitudinal ribs with Windows between them in its upper part and the annular space at the outer end radially of the longitudinal ribs in the lower part, which are tightly mounted led modules.

In addition, the technical result is achieved by the fact that:

in the upper part of the body-radiator is made conical guide from the bottom of the window up to its periphery;

- from the end of the lower part of the body-radiator between outer edges made guides from the periphery to the center of the body-radiator;

- led module includes an led mounted in the optical lens and coupled to the circuit Board with tightness through the covering with modied elastic sealing element, and the led is rigidly connected to the heat sink with a copper plate through the hole in the printed circuit Board.

thermal model of the inventive led lamp is characterized by:

- thermal resistance between svetovidovi element and the heat sink base of the led, which is characteristic of the led type;

- thermal resistance between the heat sink base of the led housing and the radiator and is the sum of thermal resistance (thermal resistance soldering+thermal impedance copper heat plate+thermal resistance of the contact pair (copper heat sink plate and the annular space housing-radiator made of aluminium alloy);

- thermal resistance between case-heat sink and the surrounding air environment.

The claimed invention is illustrated best, but not exhaustive structural example of led lamp size standard PAR 38, represented in the drawings, namely, figures 1-5.

Size standard PAR 38 is geometrically limiting factor and determines the dimensions of the led lamps and, in particular, case-sink.

Figure 1 shows schematically the design of the led lamp in a General view in axonometric projection (bottom view side cover).

Figure 2 presents design which I led bulbs in the orthogonal lateral projection with a vertical cross-section housing-radiator.

Figure 3 presents a view of the chassis of led lamp radiator from the top, from the side of the power supply (not shown).

4 shows the chassis of the heat sink of the led lamp from below, from the side of the led modules.

Figure 5 presents the design of the led module in the orthogonal lateral projection in the vertical section.

Refer to figure 1, which schematically shows a led lamp, consisting of a body-radiator 1, formed by the hollow shape rotation with 2 outer radial longitudinal ribs, a power unit 3 and the contact node 4, a cover 5 and led modules 6.

The power supply unit 3, the circuitry and design of which is well known to experts in the art and require no further explanation.

Contact unit 4 is made to connect to a source of AC power (standard E 26/27).

The cover 5 is made of a perforated as with the front and from the sides to ensure the smooth passage of thermal convection currents.

The lid 5 is an element of protection against contact with elektroniske elements of the led lamp and protection against mechanical damage of led modules 6 of the lamp, and also performs the function of the design of led lamps in General.

Example run led lamp contains 6 led modules 6 however, their number may be different (more or less), and may also contain one or more led modules 6 in the Central region (for example, one in the centre and/or in several different geometric location) depending on the desired luminous flux and power LEDs.

Refer to figure 2, which presents the design of the led lamp in the orthogonal lateral projection with a vertical cross-section housing-radiator 1 and indicated by the perforated cover 5.

Case-heat sink 1 is formed of a hollow cylindrical body of rotation with radial-longitudinal outer 2 and inner 7 ribs. Hull shape-radiator 1 size standard PAR 38 is provided by the shape of the outer fins 2.

The body of revolution may be hollow conical extension down to allow for expansion of the lower shell of the heat sink 1, to accommodate larger number of led modules 6.

Quantity of external 2 and 7 internal ribs, the thickness and the distance between adjacent ribs is selected by calculation to ensure maximum efficiency of convection heat transfer.

The calculation of these parameters is not given, as it is known to experts in the art and is carried out depending on the number, power and colour temperature of the LEDs, power and brightness led lamp.

Housing is a heat sink 1 includes a disk plate 8 (in the upper part of the body-radiator 1) to install the power supply unit 3, an annular space 9 (in the lower part of the body-radiator 1) to install led modules 6 (shown schematically), box 10 between the inner edges 7, in their upper part, to pass With internal convection currents, ring guide 11 to separate internal and external convection flows, the rails 12 between outer edges 2, for the formation and separation of the external intercostal convection flows and A.

The annular space 9 is made on the end part of the outer fins 2 case - heatsink 1.

Refer to figure 3, which presents a view of the housing of the heat sink 1 led lamp on the top side of the power supply unit 3. The diameter of the supply unit 3 is shown equal to the diameter of the disk pad 8, but may be smaller.

Figure 3 also indicated the guide ring 11 and the guide 12.

Refer to figure 4, which presents a view of the housing of the heat sink 1 led lamp from below, from the side of the led module 6.

Figure 4 marked 2 external and 7 internal ribs, the annular space 9, and connecting the contact plates 13, which provides electrical connection between adjacent led modules 6 by means of screws 14, which simultaneously provide a rigid connection with the tightness of led modules 6 and the ring pad 9. Electrical connection light the diode modules 6 to the power unit 3 is carried out by wires 15.

Led module 6 according to the image in figure 4 are connected in series, but may be connected in parallel or in combination.

Refer to figure 5, which presents the design of the led module in the orthogonal lateral projection in the vertical section.

The led module 6 is an Assembly containing:

led 16 with the contact pins 17;

- printed circuit Board 18, which led 16 terminal leads 17 are electrically connected rations 19;

- the cooling plate 20 made of copper and placed under the circuit Board 18 with the tab placed in the hole of the circuit Board 18 that is connected to elektroprovodyashchimi case led soldering 21, by melt solder by heating the cooling plate 20;

optical lens 22 with the base;

the seal 23 of elastic material (rubber or silicone) for perimeter sealing of led rations and 19 of the contact pins 17 of the led 16, preset in the optical lens 22 and which, when the Assembly is compressed with tension.

The led module 6 is rigidly fixed to the annular space 9 by screws 24 through the sleeve-insulator 25.

The claimed invention is implemented as follows.

Case-heat sink 1 is made by means of pressure die casting of aluminum alloy; the number, the thickness and surface area of the heat sink 2 external and 7 internal edges depend on the power LEDs 16, and its outer shape - from size led lamp standard PAR 38.

The method of manufacture of such parts and equipment for their manufacture are well known to specialists in this field and in the application are not given.

The mating surface of the copper heat sink plate 20 of the led module 6 and the ring pad 9 housing-radiator 1 of aluminum alloy made with high geometric accuracy and surface finish of the surfaces that provides minimum thermal resistance between them.

Led modules 6 are mounted on an annular space 9 of the housing of the heat sink 1 with tension screws 14, which provide the tightness of the surface of the copper heat plate 20 with the annular space 9 aluminum housing-radiator 1 and simultaneously the electrical contacts with other (neighbouring) led modules 6 connecting the contact plates 13 made of copper alloy, end of different contacts connected to the power supply 3 wires 15, provided on the ends mechanically connected with them contacts copper alloy, also fastened by screws 14.

Optical lens 22 can be mounted on the led 16 to or possessory part of the led module with housing-radiator 1 on the latches, the design of which is known to experts in the art and not shown.

Thus, the dimensions of the led module 6 and the design of their electrical connections are minimized, which allows to vary the standard dimensions size PAR 38 (outer diameter of 121 mm) number of installed led modules 6 depending on the desired light output.

Constructive execution of the perforated cover 5 and its mounting to the chassis of the heat sink 1 requires no explanation because it is known to specialists in this field of technology.

Geometrical dimensions of the copper heat sink plate 20 is formed by calculation, known to experts in the art and are correlated with the width of the annular pad 9.

The claimed led lamp provides optimal thermal regime of power LEDs 16 as follows.

The heat from the led 16 through a copper cooling plate 20 is passed through the annular space 9 of the housing of the heat sink 1 of aluminum alloy, which is heated and forms a natural split unidirectional convection currents passing through the perforated cover 5 with different temperature and high-speed modes (one inside through the window 10 and two outer V and A), which provides efficient heat extraction from the housing is a heat sink 1 supply air with the ambient temperature in the Central part of the housing of the heat sink 1.

The positive effect is achieved due to the complex structural and technological solutions led lamps in General and, in particular, housing design-radiator 1 with additional internal fins 7 and the design of the led module 6 while minimizing its overall and mounting dimensions, which allows to increase their number depending on the required, at minimum cost led bulbs.

Temperature difference at rated power LEDs 16 between the temperature of the copper heat sink plate 20 and housing-radiator 1 of aluminum alloy in the inventive led lamp is not more than 0.5°C. In the best samples of led lamps American company CREE (generally recognized as one of the best in the world in the development of led lamps) the temperature difference is not less than 1.0°C.

Total thermal resistance of the claimed led lamp when the power dissipated energy led 1.3 W is 10.6°C /watt.

In addition, the design of the led lamp allows you to replace the led module 6 in case of failure of the led 16.

Thus, in the inventive led lamp you can use high-power LEDs and increase their brightness provided by lowering the temperature of the led 16 at about the ample stable maximum light output while maintaining stable color temperature, for example 2700 K.

The inventive led lamp also fully satisfies consumer requirements:

- power (luminous flux, brightness);

- reliability (durability);

- energy efficiency (energy consumption);

cost.

Refer to drawings

1. Case-cooler

2. The outer edges

3. Power supply

4. Contact node

5. Perforated cover

6. Led module

7. The internal ribs

8. Disk space

9. The annular space

10. Window

11. The annular guide

12. Guides

13. Connecting the contact plate

14. Screws

15. Wire

16. Led

17. Contact pin led

18. PCB

19. Soldering contacts of the led to the circuit Board

20. Heat plate

21. Soldering (the body of the led heat sink plate)

22. Optical lens

23. Seal

24. Sleeve-insulator

1. Led lamp, comprising a housing radiator, with outer radial longitudinal ribs forming the contour of the lamp, installed on it from one end of the led modules and power supply from the other end face, wherein the housing is a heat sink is formed of a hollow body of revolution and has an internal radial longitudinal ribs with Windows between them at the top and kolicevo the ground on the side of the outer radial longitudinal ribs in its lower part, which are tightly mounted led modules.

2. Led lamp according to claim 1, characterized in that the upper housing is a heat sink made of a conical guide from the bottom of the window up to its periphery.

3. Led lamp according to claim 1, characterized in that the end face of the lower shell of the radiator between the outer edges are made guides from the periphery to the center of the radiator.

4. Led lamp according to claim 1, wherein the led module includes an led mounted in the optical lens and coupled to the circuit Board with tightness through covering the led of the elastic sealing element, and the led is rigidly connected to the cooling plate through the hole in the printed circuit Board.

5. Led lamp according to claim 4, characterized in that the cooling plate is made of copper.



 

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15 cl, 11 dwg

FIELD: physics.

SUBSTANCE: multielement colour radiation source includes a plurality of light-emitting diode (LED) light sources of different colours for obtaining light of a mixed colour, optically interfaced with a screen, and a device for controlling the LED light sources in accordance with differences between given values, which represent light of a mixed colour, having the required colour, and control data representing the colour of the light of mixed colour generated by said LED light sources, wherein said control data are provided by at least one colour sensor connected to the input of the control device; the LED light sources are connected to corresponding outputs of the control device, wherein the colour sensor is interfaced with the screen; the plurality of LED light sources consist of at least one cluster, having at least one LED light sources of each colour; the clusters are combined into a LED array; the number of outputs of the control device connected to the plurality of LED light sources of each colour corresponds to the number of supply groups for the given colour, and the value of supply current of a group is determined from a given relationship.

EFFECT: uniformity of power illumination of a screen with the possibility of changing the illumination colour in a wide range of colours.

5 cl, 7 dwg

FIELD: physics, optics.

SUBSTANCE: invention relates to optoelectronics and specifically to semiconductor infrared, visible and ultraviolet radiation sources. The invention can be used in designing modern lighting equipment and systems. The invention can also be used in microwave microelectronics when designing monolithic power amplifiers and in power electronics when designing monolithic converters. In a semiconductor radiation source, a radiation-generating monolithic array of p-n mesostructures on a heat-conducting dielectric substrate is placed inside a chip holder which is made in form of a device with high rate of removing heat from the chip and transmitting said heat to the entire structure of the chip holder. The chip holder, having a dielectric cover soldered with a metal base, along with the array of p-n meostructures inserted into the window of the dielectric cover and connected thereto by soldering on the edges of the window, forms an airtight cavity which is partially filled with a capillary-porous material. A single network of capillary channels is formed on the back surface of the substrate of the chip and the adjoining inner surface of the dielectric cover. The is enables multifold reduction of thermal resistance of the semiconductor radiation source and provides uniform temperature distribution across the area of the chip. Input contacts which allow reliable and easy mounting of the article are formed on the surface of the dielectric cover.

EFFECT: invention reduces thermal resistance of the radiation source and increases radiation power of the radiation source, enables to design a radiation source which enables to produce lighting equipment with a large radiation area and compactly arranged light-emitting arrays; also, dense arrangement of elementary radiation sources solves the task of making a radiation source with the highest radiation power density (brightness).

3 cl, 2 dwg

FIELD: electricity.

SUBSTANCE: semiconductor emitter and transparent light-outputting element are joined into the united emitting element, protective antireflective coating is applied to outer surface of the light-outputting element. The protective antireflective coating is made of material, which refraction index is nCnE times less than refraction index of the material used for the light-outputting element, where nC is refraction index of the protective antireflective coating, nE is refraction index of the material used for the light-outputting element. Thickness hC of the protective antireflective coating is preset on conditions of transmission factor of the light-outputting element as per the formula where d0 is optical thickness of the antireflective coating, nC is refraction index of the protective antireflective coating.

EFFECT: simplified process of LED manufacture.

4 cl, 2 dwg, 1 tbl

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