External electric device with improved polymeric insulation system

FIELD: electricity.

SUBSTANCE: housing has inner layer and outer layer. Thickness of inner layer is at least by 50% more than thickness of outer layer, and inner layer is more flexible than outer layer. Inner layer is made from composition of the first resin which at hardening has relative elongation at rupture which is more than 5%, and outer layer is made from composition of the second resin which at hardening has relative elongation at rupture which is less than 5%.

EFFECT: improving insulation and strength properties of electric item, and profitability of its manufacture.

14 cl, 2 dwg

 

The technical field to which the invention relates.

The present invention relates to an electrical device and more specifically to the external electrical device having a design dry type with solid insulating material.

The level of technology

External electrical device (such as a transformer)having a design dry-type, contains at least one electrical component (such as a node of the coil core), sealed solid insulating material, to isolate and seal the electrical component from the environment. Traditionally, the electrical component is sealed in monoblock casting resin, that is, the formulation is designed to meet electrical, chemical and thermal insulation requirements of the electrical device during operation. In addition, the recipe monoblock casting resin designed to withstand the harsh environmental conditions with the aim of preserving insulating properties of the resin and maintaining an aesthetic appearance. Typical resin for a monoblock casting is an epoxy resin. An example of a specially designed formulation of epoxy resins for use as the resin monoblock casting is disclosed is U.S. patent No. 5939472 (authors Ito and others), which is included in the present description by reference.

Because you want monoblock casting resins meet numerous requirements, production monoblock casting is usually expensive. In addition, the resin for a monoblock casting does not provide the optimal amount of characteristics. In the past, the construction of some electrical devices used numerous resin. An example of the electrical device using multiple resins is built-in vacuum breaker having a current sensor, which is produced at the company ABB Calor Emag Mittelspannung GmbH of Ratingen, Germany. For this built-in vacuum breaker designed insulation system with low partial discharge and having an inner layer consisting of a rigid epoxy resin based on bisphenol a, and an outer layer consisting of a hard cycloaliphatic epoxy resin. Another example of the electrical device using multiple resins disclosed in U.S. patent No. 5656984 (issued by Paradis and others). In the patent Paradis and others described transformer, which has a sheet material of silicone foam rubber (sealed cell), wrapped around the metal core. The wrapped core and the winding is encapsulated in the housing, consisting of USTC the second epoxy resin Araldite CW229. The sheet material of foam rubber provides protection to the core, when the epoxy cures and shrinks. Around the body of the epoxy resin is an outer casing consisting of fiberglass.

Based on the foregoing, there is a need in the insulation system for electrical devices in which the insulation system has superior insulation properties and wear resistance, and the production is cost effective. The present invention relates to an electrical device having such a system in isolation, and to a method for producing such a device.

Disclosure of inventions

In accordance with the present invention is designed electrical device and method of its formation. This electrical device comprises an electrical element, encapsulated in plastic case. This case has an inner layer and an outer layer. The thickness of the inner layer is greater than the thickness of the outer layer and the inner layer is more flexible than the outer layer. The inner layer contains utverzhdennuyu composition of the first resin having an elongation at break greater than 5%, and the outer layer contains utverzhdennuyu composition of the second resin having a tensile elongation at break of less than 5%.

A brief description of h is of Raja

The present invention is illustrated by drawings, which presents the following:

figure 1 - sectional view of the transformer according to the present invention, schematically;

figure 2 - the inner layer of the transformer, which is formed in the mold, schematically.

The implementation of the invention

Note that in the following detailed description, identical components have the same number of the reference positions regardless of what they are shown in different versions of the present invention. In addition, for a clear and concise disclosure of the present invention does not require that the drawings were made in the scale, and some features of the invention can be shown somewhat in schematic form.

Figure 1 shows a section of the electrical device 10 according to the present invention. It's an electronic device 10 made in the form of an instrument transformer intended for external use. More specifically, the electrical device is a current transformer. Instrument transformers are used for measurements and to protect together with equipment such as meters and relays. Instrument transformer lowers the voltage or current in the system to the given value, which may be used in the combined equipment. For example the EP, instrument current transformer in the range of 10-2500 Amp to power in the range from 1 to 5 Amperes, while the instrument transformer voltage can lower the voltage in the range of 12000-40000 Volts to a voltage in the range from 100 to 120 Volts.

Typically, the electrical device 10 includes a core 12, a primary or high voltage winding 14, the secondary or low voltage winding 16 and the housing 18, formed of several resins, as will be described in more detail below. The core 12, the high voltage winding 14 and the low voltage winding 16 is poured resin to seal inside the housing 18.

The core 12 has an enlarged Central opening and made of a ferromagnetic material such as iron or steel. The core 12 may have a rectangular shape (as shown), or toroidal, or doughnut shape. The core 12 may be formed of sheet steel (such as silicon steel with oriented grain size), which is wound on a mandrel inside the winding. Alternatively, the core 12 may consist of a package or packages of rectangular plates. The low voltage winding 16 contains a long wire such as copper wire, wound on the core 12 with the formation of multiple coils, which are located around the periphery of the core 12. The ends of the low-voltage winding 16 are fixed on Scavolini the conclusions of the transformer (or form conclusions low-voltage transformer), which are connected with the contact pad mounted on the outer side of the housing 18. The high voltage winding 14 is connected with the conclusions of the high-voltage transformer (not shown). The combination of the core 12 and the low voltage winding 16 in the following is called the coil unit with the core 20. The high voltage winding 14 may be rectangular, toroidal or annular shape and is interconnected with a power coil core 20. The high voltage winding is made of conductive metal, such as copper.

The housing 18 includes an inner layer 24 or shell and the outer layer 26 or shell. The outer layer 26 is located on top of the inner layer 24, both layers have the same length. At any given point on the chassis 18, the thickness of the inner layer 24 is larger than the thickness of the outer layer 26. More specifically, the inner layer 24 has a thickness that is at least 25%, preferably at least 50%, more preferably at least 100% greater than the thickness of the outer layer 26. In one embodiment of the present invention the inner layer 24 has a thickness that is approximately 300% more than the thickness of the outer layer 26. The inner layer 24 is more flexible (softer)than the outer layer 26 and inner layer 24 consists of a flexible composition of the first resin 30 (shown in Fig.2), while the outer layer is 26 consists of a rigid composition of the second resin. The composition of the first resin 30 (when fully cured) is flexible, has an elongation at break (as measured by ASTM D638) more than 5%, preferably more than 10%, more preferably more than 20%, most preferably in the range from approximately 20% to 100%. The composition of the second resin (when fully cured) is rigid, has an elongation at break (as measured by ASTM D638) less than 5%, specifically, in the range from approximately 1% to 5%.

The composition of the first resin 30 of the inner layer 24 may be a flexible epoxy composition, flexible aromatic polyurethane composition, butyl rubber or thermoplastic rubber.

Suitable flexible epoxy composition, which can be used for the composition of the first resin 30 of the inner layer 24 may be composed of epoxy resin, one or more plasticizers and one or more hardeners (or cross-linking agents).

Epoxy resin contains polynuclear digitoxigenin (BPA) and halohydrin. Bisphenola, which can be used include bisphenol a, bisphenol F, bisphenol S and 4,4'-dihydroxybiphenyl. Found that bisphenol a is particularly preferred. Halohydrin contain epichlorohydrin, dichlorohydrin and 1,2-dichloro-3-hydroxypropan. It is established that the electronic signature is chlorhydrin is especially preferred. Usually epichlorohydrin taken in excess (molar equivalents), interacts with bisphenol a in such a way that up to two moles of epichlorohydrin to react with bisphenol A.

The plasticizer can interact with the epoxy resin and become part of the crosslinked structure. Such reactive plasticizers may be simple dipicolylamine esters polyalkylated or glycol, which can be obtained from the reaction product of epichlorohydrin and polyalkyleneglycol, such as adducts of ethylene and of propylene oxide with polyols C2-C4. Industrial available reactive plasticizers that may be used include D.E.R. 732, which provides the company the Dow Chemical Company of Midland, Michigan and which is a product of the interaction of epichlorohydrin with polypropylenglycol.

The hardener may be aliphatic polyamines or its adduct, aromatic polyamines, acid anhydride, polyamide, phenolic resin or hardener catalytic type. Suitable aliphatic polyamine include Diethylenetriamine (DETA), Triethylenetetramine (THETA), Tetraethylenepentamine (TERA). Suitable aromatic polyamine contain meta-phenylenediamine, diaminodiphenylsulfone and diethyltoluenediamine. Suitable acid anhydrides include dodecanesulfonyl anhydride, getage softley anhydride, methylhexahydrophthalic anhydride, trimellitic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride and the anhydride metilidinovoe acid.

Suitable flexible aromatic polyurethane composition, which can be used for the composition of the first resin 30 of the inner layer 24, is formed from a polyol, MDI, chain extension and optional catalyst. The polyol is a hydroxyl-containing molecule with a small molecular weight (400-10000) with two or more hydroxyl groups in the chain. This polyol may be a polyol complex polyester, polycaprolactone the polyol or polyether polyol. Examples of polyols complex of the polyester contain poly(Ethylenediamine) and poly(1,4-butylenediamine). Examples of polyether polyols include polyols simple polypropylene ether glycols simple polytetramethylene ether (PTMEG). The polyisocyanate can be a 2,4 - or 2,6-isomaltooligosaccharide (TDI), 4,4'-methylenedianiline (MDI), 1,5-naphthalenedisulfonate (NDI), toluylenediisocyanate (TODI) or paraphenylenediamine (PPDI) or their combination. The chain extension can be an amine and/or a polyol with a short chain. Amin can be bis(2-Chloroaniline)methylene (MSA) or mono-trialkylaluminium, such as mono-treb fileloading. Suitable polyols and short chain include ethylene glycol, propylene glycol, butanediol and glycerol. The catalyst may be used to accelerate the reaction of the polyol, MDI and chain extension. The catalyst may be an ORGANOMETALLIC compound or a tertiary amine such as triethylamine.

Flexible aromatic polyurethane composition can be obtained in one-way or two-stage process prepolymerisation. One-step method runs as a single process in which a polyol, a polyisocyanate, a chain extension and any catalyst are mixed together in distributing the nozzle and immediately injected into the mold. In the two-stage process prepolymerisation has a first stage in which an excessive amount of MDI communicates with the polyol, forming a predecessor or prepolymer with isocyanate end group. Typical prepolymer has a content of isocyanate (NCO) from about 0.5 to 30% by weight. In the second stage prepolymer reacts with chain extension and any catalyst. In addition, this second stage can be used for more number of MDI. Then the mixture from the second stage is injected into the mold and allow time to cure.

In one preferred embodiment of the present invention, guy is Kai aromatic polyurethane composition comprises a polyurethane system, marked as NB2858-91, which is made at the company Loctite Corporation. NB2858-91 is a 100% solids, two-component polyurethane system. After curing NB2858-91 has (at 23°C) density in dry form, equal of 1.62 g/cm3initial hardness shore D 70-75 and, after 10 seconds, the shore hardness D is equal to 55-60, elongation of 90%, thermal conductivity of 18.1 (cal·cm)/(s·cm2·°C) and dielectric strength (thickness of 20 mils (0.5 cm), 1200 Volts/mil.

Thermoplastic rubber, which can be used for the composition of the first resin 30 of the inner layer 24 may be an ethylene-propylene copolymer elastomer or elastomer triple polymer, which is mixed with polyethylene or polypropylene. Other suitable thermoplastic rubber may be a block copolymer having blocks of polystyrene and blocks of polybutadiene or polyisoprene.

The composition of the second resin in the outer layer 26 is a cycloaliphatic epoxy composition, which contains a cycloaliphatic epoxy resin, hardener, accelerator, an optional filler, such as silanizing quartz powder, fused silica powder or silanizing powder fused quartz.

Cycloaliphatic epoxy resin may be polyglycerol question is Oh ether or poly(β-methylglycerol) simple ether, obtained by reacting epichlorohydrin or β-methylephedrine with a compound containing two or more free alcoholic and/or phenolic hydroxyl groups in the molecule. Examples of suitable cycloaliphatic epoxy resins include bis(4-hydroxycyclohexyl)metadirectory simple ether, 2,2-bis(4-hydroxycyclohexyl)perpendicularity simple ether, diglycidyl ether tetrahydrophthalic acid, diglycidyl ether 4-methyltetrahydrophthalic acid, diglycidyl ether 4-methylhexahydrophthalic acid, diglycidyl ether hexahydrophthalic acid and 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, which is industrially available on the company The Dow Chemical Company, trademark ERL-4221.

The curing agent may be an anhydride, such as linear aliphatic polymeric anhydride or a cyclic anhydride of carboxylic acid. Suitable cyclic anhydrides of carboxylic acids include: succinic anhydride, citraconic anhydride, itacademy anhydride, maleic anhydride, tricarballylic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.

The accelerator may be an amine, an acid catalyst (such as octoate tin (II)), imidazole, or hydroxide,or a Quaternary ammonium halide. Particularly suitable accelerators are tertiary amines, such as N,N-dimethylbenzylamine, triethylamine, N,N-dimethylaniline, N-methylmorpholine, N-ethylmorpholine, the imidazole tetrachloroethylene, tetramethylguanidine, triisopropanolamine, pyridine, piperazine, triethylamine, tributylamine, dimethylbenzylamine, triphenylamine, tricyclohexyltin, quinoline, triethylamine, triphenylamine, three(2,3-dimethylcyclohexyl)Amin, benzyldimethylamine, 1,3-tetramethylbutylamine, Tris(dimethylaminomethyl)phenol, triethylenediamine.

To improve the stability of the outer layer 26 against atmospheric influences, cycloaliphatic epoxy composition may further contain one or more polysiloxanes with a hydroxyl end group, cyclic polysiloxane and nonionic, perifericheskie surface-active agent, such as described in U.S. patent No. 6764616 (issued Beisele and others), which is incorporated into this description by reference.

In one specific embodiment, the present invention cycloaliphatic epoxy composition contains components that are industrially available on the company Huntsman Corporation of The Woodlands, Texas, exactly, resin ARALDITE®CY 5622, hardener ARADUR®HY 1235 and accelerator DY 062. Resin ARALDITE®CY 5622 is a complex diglycidyl ether, ARADUR®HY 1235 is the anhydride and DY 062 means tertiary, s is called

The housing 18 is formed over the site of the reel core 20 using the first and second pouring. In the first process of filling the inner layer 24 is formed from the composition of the first resin 30 in the mold. First, the components of the composition of the first resin 30 is heated approximately to the temperature of 40-60°C and mix together by hand or with a mixer to obtain a homogeneous mixture, which then distribute inside of the mold. If the composition of the first resin 30 is a flexible epoxy composition, the first pouring process can be fully automated process of gelation under pressure (APG) or vacuum casting. If the composition of the first resin 30 is a flexible aromatic polyurethane composition, the first process of filling can be a process of filling in an open system or process vacuum casting, each of which is carried out at a temperature of from about 40 to 85°C.

Figure 2 shows the APG system, which can be used for forming the inner layer 24. The composition of the first resin 30 (in liquid or semi-liquid form) Tegaserod under vacuum in the vessel 34, which supports a temperature of approximately from 40 to 60°C. the Node of the coil core 20 and the high voltage winding 14 is placed in the cavity 36 of the mold 40, which is heated to a temperature of AP is sustained fashion from 120 to 160°C. High voltage and low voltage conclusions transformer pulled from the cavity 36 so that they were out of the housing 18 after the filling process. Then degassed and heated composition of the first resin 30 is injected under low pressure into the cavity 36, containing a node of the coil core 20 and the high voltage winding 14. Inside cavity 36 composition of the first resin 30 begins to turn into a gel. However, the composition of the first resin 30 in the cavity 36 remains in contact with the composition of the first resin 30 under pressure, which is introduced from the tank 34. Thus, shrinkage compensated gelatinizing composition of the first resin 30 in the cavity 36 through the subsequent addition of degassed and heated composition of the first resin 30 is received in the cavity 36 under pressure.

In the process of filling in an open system the composition of the first resin 30 is simply poured into an open mould containing the node of the coil core 20 and the high voltage winding 14. The mold is heated to a temperature of from about 40 to 85°C (for flexible aromatic polyurethane composition).

When vacuum-fill site to the coil with the core 20 and the high voltage winding 14 is placed in the mold enclosed in a vacuum chamber or housing. The components of the composition of the first resin 30 are mixed together in a vacuum and injected into the mold in HAC is a smart camera, which is also under vacuum. The mold is heated to a temperature of from about 40 to 85°C for flexible aromatic polyurethane composition, or from about 80 to 100°C for flexible epoxy composition. After the resin is distributed within the mold, the pressure in the vacuum chamber is raised to atmospheric pressure.

After curing of the composition of the first resin 30 (the inner layer 24) within the time required for the formation of a solid state, the inner layer 24 with the hub of the reel core 20 and contained in the high voltage winding 14 is removed from the mold. Then, the inner layer 24 of this intermediate product give time for full cure. After curing of the inner layer 24 intermediate the inner layer 24 is subjected to sanding or give roughness otherwise, in order to facilitate the adhesion of the composition of the second resin in the second process of filling.

The second process of filling is the process APG (such that can be implemented using the system of APG 32) or vacuum casting. In the second process of filling the intermediate product containing the node of the coil core 20 and the high voltage winding 14, is placed in the second mold. Then the composition of the second resin is injected into the second mold to the Yu is heated to a temperature of from about 130 to 150°C for APG process, or from about 80 to 100°C for vacuum casting. After curing of the composition of the second resin (outer layer 26) within the time required for the formation of a solid state, the housing 18 with the hub of the reel core 20 and contained in the high voltage winding 14 is removed from the second mold. Then the outer layer 26 allow to harden completely.

Instead of forming the housing 18 as stated above, the housing 18 can be obtained by first forming the outer layer 26 with the subsequent use of the outer layer 26 as a mold for pressing the inner layer 24 and over the host of the coil core 20 and the high voltage winding 14. More specifically, the composition of the second resin is pressed to form two parts of the outer layer 26 and not fully utverjdayut, i.e. the composition of the second resin remains reactive. Expand the coil core 20 and the high voltage winding 14 is placed inside the reactive outer layer 26, and then the composition of the first resin 30 is injected inside the reactive outer layer 26. This reactive outer layer 26 is heated to a temperature of curing of the composition of the first resin 30 that is approximately equal 40-85°C, if the composition of the first resin 30 is a flexible aromatic polyurethane composition. In addition, such high temperature curing advanced with osobiste the curing composition of the second resin and the formation of chemical bonds between the first and second resin composition.

Note that the above-described preferred embodiments of the presented only to illustrate, but not limited to the present invention. Average person in this technical field will be able to make certain additions, deletions and/or modifications of embodiments of the disclosed subject invention, without deviating from the intent or scope of the invention as defined in the attached claims.

1. A transformer intended for external use, containing a node of the coil core; plastic case, designed for the sealing site of the coil core, and the housing contains an inner layer and an outer layer, the thickness of the inner layer, at least 50% greater than the thickness of the outer layer and the inner layer is made more flexible than the outer layer and the inner layer contains utverzhdennuyu composition of the first resin having an elongation at break greater than 5%, and the outer layer contains utverzhdennuyu composition of the second resin having an elongation at break less than 5%.

2. The transformer of claim 1, wherein the cured composition of the first resin has an elongation at break greater than 10%.

3. The transformer according to claim 1, in which utverzhdennuyu composition of the first resin selected from the group status is the present composition of the polyurethane resin or epoxy resin composition, thermoplastic rubber and butyl rubber.

4. The transformer according to claim 3, in which the cured composition of the second resin is an epoxy resin composition.

5. The transformer according to claim 4, in which the composition of the first resin composition is an aromatic epoxy resin, and the cured composition of the second resin is composed of cycloaliphatic resin.

6. The transformer according to claim 4, in which the cured composition of the first resin is an aromatic polyurethane composition, when cured, the composition of the second resin is composed of cycloaliphatic epoxy resin.

7. The method of forming a transformer intended for external use, which provide a host of coil core; and seal node of the coil core in a plastic case that contains the inner layer and the outer layer, and the thickness of the inner layer, at least 50% greater than the thickness of the outer layer and the inner layer is more flexible than the outer layer, the inner layer contains utverzhdennuyu composition of the first resin having an elongation at break greater than 5%, and the outer layer contains utverzhdennuyu composition of the second resin having a tensile elongation at break less than 5%.

8. The method according to claim 7, in which at the stage of sealing the TRANS is armatura place node of the coil core in the mold; distribute the composition of the first resin inside the mold to seal the site of the coil core; and at least partially utverjdayut composition of the first resin; and delete a node of the coil core, encapsulated, at least partially utverzhdenii composition of the first resin from the mold.

9. The method according to claim 8, in which at the stage of sealing the node core coils with utverjdayut composition of the first resin out of the mold, thus forming the inner layer; give the roughness of the outer surface of the inner layer; placing the inner layer with a roughened outer surface inside the second mold; distribute the composition of the second resin inside the second mold for sealing the site of a coil with a core, located in the inner layer; and at least partially utverjdayut composition of the second resin; and removing the second mold node of the coil core, sealed in the inner layer, and at least partially utverzhdenii composition of the first resin.

10. The method according to claim 8, in which at the stage of sealing the node core coils with distribute the composition of the second resin inside the first mold; at least partially utverjdayut composition of the second resin; and removing partially utverzhdennuyu composition of the second resin in the first mold, vnutrikojnuu distributed composition of the first resin.

11. The method according to claim 7, in which the cured composition of the second resin is an epoxy resin composition, and the cured composition of the first resin composition is a polyurethane resin or epoxy resin composition.

12. The method according to claim 11, in which the cured composition of the first resin has an elongation at break greater than 10%.

13. The method according to item 12, in which the cured composition of the first resin is an aromatic polyurethane composition, and the cured composition of the second resin is composed of cycloaliphatic epoxy resin.

14. The method according to item 12, in which the cured composition of the first resin composition is an aromatic epoxy resin, and the cured composition of the second resin is composed of cycloaliphatic resin.



 

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2 cl, 1 tbl

FIELD: electrical and instrumentation engineering, microelectronics.

SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.

EFFECT: enhanced strength and electric conductivity properties of adhesive composition.

5 cl, 2 tbl

Sealing compound // 2329280

FIELD: chemistry.

SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.

EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.

3 tbl

Insulating enamel // 2342723

FIELD: technological processes.

SUBSTANCE: invention is related to finishing baking enamels intended for production of insulating protective coatings for impregnated windings, units and parts of electric machines and devices with insulation of thermal endurance class of (155°C). Enamel that includes filming agent, coupling agent, siccative, pigments, fillers, desired additives and organic dissolvents, as filming agent it contains epoxy ester produced by reactions of etherification and thermal polymerisation 1.0 Mole of epoxy modified resins with content of epoxy groups of 3.5÷4.5 wt %, 2.4 Mole of fatty acids of bodied oils and 1.3 Mole of colophony, and as active filler for increase of electric strength of enamel coating it additionally contains hydrophobic aerosil at the following ratio: Epoxy ester (55%-solution in xylene) 62.0÷81.0, Hydrophobic aerosil 0.3÷0.6, Hydrophobic aerosol 0.3÷0.6, Pigments and fillers 13.0÷29.0, Hydrophobic aerosil 0.3÷0.6, Coupling agent 4.5÷5.5, Desired additives (dispenser, defoaming agent, thixotropic, anti-flotation, antioxidant) 1.5÷6.5, Siccative (cobalt oktoat) 0.2÷0.5, Organic dissolvents 1.5÷7.5.

EFFECT: higher class of enamel thermal endurance, higher adhesion of enamel coating, improvement of coating dielectric properties.

2 tbl, 7 ex

FIELD: electricity.

SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.

EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).

1 tbl

FIELD: electricity.

SUBSTANCE: housing has inner layer and outer layer. Thickness of inner layer is at least by 50% more than thickness of outer layer, and inner layer is more flexible than outer layer. Inner layer is made from composition of the first resin which at hardening has relative elongation at rupture which is more than 5%, and outer layer is made from composition of the second resin which at hardening has relative elongation at rupture which is less than 5%.

EFFECT: improving insulation and strength properties of electric item, and profitability of its manufacture.

14 cl, 2 dwg

FIELD: chemistry.

SUBSTANCE: surface modified electrical insulation system, comprising a cured synthetic polymer composition including at least one filler and optional additives, wherein the surface of said synthetic polymer composition is modified by applying a thin coating; said thin coating being applied via plasma enhanced chemical vapour deposition (PECVD) with thickness within the range of about 50 nm to about 50 mcm; and/or said thin coating is applied via a sol-gel technique with thickness within the range of about 0.5 mcm to about 2 mm; and wherein said thin coat is an electrically non-conducting polymeric material with melting point which is considerably higher than the melting point or degradation temperature of the synthetic filler containing polymer composition; and a method of making said electrical system involving formation of a hardened or cured synthetic polymer composition, applying a thin coating on the surface of said synthetic polymer composition via plasma enhanced chemical vapour deposition.

EFFECT: improved system.

18 cl, 2 ex, 4 tbl

FIELD: electricity.

SUBSTANCE: electric insulating filling compound contains epoxide diane resin, amine hardener in the form of triethylene tetramine (TETA), and also a modifier - a phosphorus-containing methyl acrylate (PCM), at the following ratio of components, wt parts: epoxide diane resin ED-20 - 100 triethylene tetramine (TETA) - 10-15 phosphorus-containing methyl acrylate (PCM) - 30-40.

EFFECT: reduced viscosity of a filling compound, its higher viability, improved elasticity after hardening, preservation of dielectric properties.

1 tbl

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