Waterproof connector for accessories

FIELD: physics.

SUBSTANCE: method may involve wearing (202) high-temperature plastic (122) around multiple connector pins (112) to form a base part (120), wearing (204) low-temperature plastic (132) around the base part to form an insertion (130), wearing (206) side pieces (142) of the connector along the perimetre of the insertion to form an interface node (140), and welding (212) the insertion to the housing (151) for movement (153) of the low-temperature plastic into the housing using ultrasound.

EFFECT: provision for interface connections with high degree of wholeness.

14 cl, 11 dwg

 

The technical field to which the invention relates

The present invention relates to mobile devices and, more specifically, to their design.

The level of technology

The use of portable electronic devices and mobile communication devices has increased significantly in recent years. Furthermore, an increasing demand for mobile devices that can be integrated with other devices or systems. Moreover, consumers need reliable interconnect between mobile communication devices and accessories, such as remote microphones. The interface connection between the devices must be very durable, water resistant, inexpensive, reliable and compact.

Mobile devices can connect to each other through wired or wireless interfaces. When you are using a wired interface, it is important to ensure a good connection between the electrical components and the supporting material. For example, a wired interface may include contact pins inserted into the plastic connector. Known methods can use methods of fill to place the pins from sheet metal into the plastic connector. However, the pins of sheet metal, covered with plastic, can create replot what's connections around the contact pins due to different degrees of shrinkage of metal and plastic. Other methods of the prior art use connectors to connect the contact pins. Connectors are a form of pressure contact interconnect. However, the connectors take up space, cost money and lead to reliability issues.

Other known methods use direct soldering of the contact pins. However, high temperatures of the soldering process reflow solder may soften the plastic holding the pins, and degrade the integrity of the molded fill seal surrounding the pins. Heat applied to the metal contact pins, can transfer heat to the plastic and degrade the junction between the contact pins and plastic. One solution to reduce the heat transfer, is to pour the pins high-temperature plastic. However, high-temperature plastic has very poor properties melting when it is welded to the plastic body. The integrity of the coupling between the high-temperature plastic and plastic housing in this case is getting worse. Accordingly, the interface connector is prone to cracking and cause leaks. Therefore, there is a need in the method of mutual connection and processing, Kotor, which provides an interface connection with a high degree of integrity.

The invention

Embodiments of the invention directed to the front-end node and a way to create a watertight seal. One variant of the invention is directed to a connector for accessories. The connector may include multiple connection of the contact pins, high temperature plastic, which is poured around the set of connecting the contact pins to form the base part, and a low-temperature plastic that is molded around the base part to form a paste. The base part may resist the movement of the connecting pin of the pin due to high temperature soldering connection contact pins, and to form a first waterproof seal. Pereformirovana part of the low-temperature plastic and high-temperature plastic may form a second waterproof seal. The connector may further include an adhesive side connector for placement around the perimeter of the insert so that the sidewall of the connector is compressed between the insert and the body of the device to produce a third water-resistant seal. The sidewall of the connector may connect the front-end node with the housing to provide a fourth water-resistant seal. The connector may include ultrasound the commodity connection between the insert and the body of the device. The body material is of the type melting, similar to the low-temperature plasticity, to ensure such melting housing and low-temperature plastic to ensure a reliable waterproof seal. The combination ultrasonic weld and adhesive can form a water-resistant and waterproof seal.

Brief description of drawings

The signs of the system, which are believed to be new are set out in detail in the attached claims. Embodiments of this document may be better understood by reference to the following description, taken together with the accompanying drawings, in which similar numbers of reference positions identify similar elements and in which:

figure 1 - illustration of a mobile device and an interface node in accordance with a variant embodiment of the invention;

figure 2 - chart of a method of forming a front-end node in accordance with a variant embodiment of the invention;

figure 3 is an external view of the connecting contact pins of the interface node 1 in accordance with a variant embodiment of the invention;

4 is an external view of the basic parts of the interface node 1 in accordance with a variant embodiment of the invention;

5 is an external view of the insertion of the interface node 1 in compliance and variant embodiment of the invention;

6 is a view in cross section of an insert figure 5 in accordance with a variant embodiment of the invention;

7 is another view in cross section of an insert figure 5 in accordance with a variant embodiment of the invention;

Fig - appearance of the interface node 1 in accordance with a variant embodiment of the invention;

Fig.9 is a view in cross section of the interface node with Fig in accordance with a variant embodiment of the invention;

figure 10 - internal view of the front-end node with attached flexible ribbon cable in accordance with a variant embodiment of the invention, and

11 is a view in cross section of the interface node with figure 10 in accordance with a variant embodiment of the invention.

Detailed description of the invention

Although the following detailed description, the claims defining the features of embodiments of the invention that are regarded as new, it is believed that the method, system, and other options of implementation will be better understood when considering the following description in conjunction with the drawings, in which similar numbers of reference positions apply to the entire document.

As required, detailed embodiments of the present method and system disclosed herein. However, it should be understood that the disclosed Varian is s implementation are merely exemplary and may be implemented in various forms. Therefore, specific structural and functional details disclosed herein should not be interpreted as limiting, but merely as a basis for the claims and as a typical basis for learning professionals in the art that different to use embodiments of the present invention in virtually any appropriately detailed structure. Moreover, the terms and phrases used in this document are not intended to be limiting, but rather to provide an understandable description of embodiments in this document.

The terms in the singular when used in this document are defined as "one or more"and not as "one". The term "lot" as used in this document is defined as "two or more than two." The term "other" when used in this document is set, at least as a second or more. The terms "comprising" and/or “having" when used in this document are defined as "containing" (i.e. open expression). The term "coupled" when used in this document is defined as "associated", although not necessarily directly, and not necessarily mechanically. The term "fill" can be defined as the process of molding plastic around pre SFD is kavannah metal inserts, which is compatible with thermoplastic and thermosetting materials. The term "reformowanie" can be defined as a process in which a cavity forms partially filled one with plastic and then applied to the second portion, to seal the first portion. The term "high-temperature plastic" can be defined as plastic, which resists softening or deformation due to high temperature brazing one or more metal components in the plastic. The term "low-temperature plastic" can be defined as plastic, which can soften or deform under high temperature soldering one or more metal components in the plastic.

Briefly, the shading is the process of injection under pressure of the polymer around the other material of the Central part. The material of the Central part may be another polymer, ceramic execution or metal component. The resulting molding is dnafragments sealed or molded around the perimeter of the finished part. Design and tolerances achievable when using fill, exhibit good dimensional stability without the use of clamps, adhesives or other methods of Assembly. The process of fill provides the ability to host multiple components within the cavity and is and details with one operation perforovane or injection. Fill allows you to create complex forms that are not achievable with conventional molding techniques. For example, preformed Central part can be placed into the mold cavity and pereformirovana with a compatible polymer, to obtain critical dimensions with a minimum of resizing, due to the shrinkage or contraction in cooling. Reformowana part demonstrates the performance of the used polymers without sinks and voids in thick sections of finished items.

Figure 1 shows a mobile device 100. Mobile device 100 can be a cellular phone, a portable radio transceiver transmitting radio, portable media player, music player, portable gaming device, a radio emergency communications, or any other appropriate communication device. Mobile device 100 can include interface 102, functionally connected with the mobile device 100. The interface 102 may electronically connect the mobile device 100 with one or more other external devices. For example, the interface 102 can provide a wired connection with another device, the receiving connection. In one arrangement, the interface 102 may include a large number of contact pins, to the which can be interfaced with connecting cable, located between the mobile device 100 and an external device.

Briefly, the interface 102 is attached to the mobile device 100 using a multitude of water-resistant and waterproof seals. Seals are the result of a combination of processes reformowania and bonding processes, which provide a waterproof connection between several plastic materials interface 102 and the mobile device 100. In one arrangement, the interface may contain a large number of contact pins filled high temperature plastic to form the base part. The base part can then be placed in the second form, where the low-temperature plastic can be aformula on the base part in order to receive the insert. Rubber sidewall can also be reformowana on the insert button to create the interface and to provide a tight seal. Alternatively, adhesive VHB (very high coupling) can be added around the perimeter of the interface and/or insert to form a watertight seal. Then, on the site of the base part can be soldered flexible belt strap. The interface can be installed in the housing of the mobile device 100 and is welded in place using ultrasound. The process of ultrasonic welding provides the transition to a low-temperature plastic housing, to about asolati waterproof seal. The interface provides a solid mechanical attachment to the body through ultrasonic connection created by the node of ultrasonic welding and rubber sidewall or communication with VHB, which creates a watertight seal. The interface 102 creates an inexpensive, durable hard waterproof universal host connector.

Figure 2 shows a method 200 of creating the interface. The method 200 may be implemented using more or fewer steps than shown. To describe the method 200, reference is made to figure 1 and 3-11, although it should be understood that method 200 may be implemented in any other way by using other suitable components. Furthermore, the method 200 is not limited to the order in which the steps listed in method 200. In addition, the method 200 may contain more or fewer steps than shown in figure 2.

At step 201, the method can begin. Method 200 can begin in a mode in which neformaly many connecting contact pins. The illustration in figure 3 connecting the pins 112 can be placed in the form. The form allows you to secure the connecting contact pins 112 in place until reformowania. In one arrangement, the connecting contact pins 112 may be plated to improve conductivity. Connecting to the stroke of the pins 112 may also have a round shape for tight seal with reformandum high-temperature plastic. The connecting pin 112 may also be grooved belt 114, which passes completely around the contact pin for fitting into the plastic during reformowania. Grooved belt provides reverse current performanace high temperature plastic to surround the grooved belt and to withstand the high temperatures of soldering the contact pins when providing tight seal with reformandum high-temperature plastic.

Returning to method 200 of figure 2, at step 202 high temperature plastic can be molded around the set of connecting the contact pins to form the base part. Namely, high-temperature plastic base part may resist the movement of the connecting pin of the pin due to the high temperature of the soldering connection contact pins. Figure 4 shows the base part 120. High-temperature plastic 122 aformula on the connecting contact pins 112 to form the base portion 120. High-temperature plastic 122 surrounding each pin in the base part 120, forms a tight connection, which may remain intact after soldering connection contact pins 112. Navorovannye high temperature plastic 122 surrounds the pins and leaves, less than the least the tip connection of the contact pins 112 uninsulated to provide conductivity. Grooved belt 114 around the contact pins also provide the installation with pressure, because navorovannye high temperature plastic 122 encloses and surrounds the grooved belt 114 of the contact pin. Reformowanie connecting contact pins 112 in the high-temperature plastic 122 to form the base part 120 provides a first waterproof seal.

Returning to method 200 of figure 2, at step 204 low-temperature plastic can be aformula on the base part in order to receive the insert. Recall that the base part 120 is the result of reformowania high-temperature plastic 122 for connecting the contact pins 112 (see figure 4). The illustration of the figure 5 shows the insert 130. Low-temperature plastic 132 may be aformula on high-temperature plastic 122 of the base portion 120 to form the insert 130. The imposition of low-temperature plastic 132 at high temperature plastic 122 forms a second waterproof seal. The insert 130 may open first end of the set of connecting the contact pins to the outside of the device and to open a second end of the multiple connecting the contact pins to the inside of the machine. Briefly, referring to figure 1, NR is snaa part corresponds to a position outside of the mobile device 100, and the inner part corresponds to the position of the mobile device 100.

On view in cross section of the insert 130 6 shows a first diagram of reformowania low-temperature plastic with a layer of high-temperature plastic. In particular, low-temperature plastic 132 may completely surround the connecting contact pins 112 and to contain a high temperature plastic 122. Reflow soldering for connecting the contact pins may mitigate low-temperature plastic 132 in contact with the connecting contact pins, but waterproof seal high-temperature plastic 122 and the connecting contact pins 112 will be saved. Connecting the pins can be completely surrounded by low-temperature plastic 132 to cover the line in high-temperature plastic 122, resulting molding at step 202 of the method.

7 shows another view in cross section of the insert 130. In particular, it is shown the second circuit forming a low-temperature plastic with a layer of high-temperature plastic. Namely, low-temperature plastic 132 may not be entirely surrounds the connecting contact pins 112 and comprises a high temperature plastic 122. Accordingly, the reflow soldering for connecting the contact pins 112 are not Smage the low-temperature plastic 132, which is not in contact with the connecting contact pins. Waterproof seal high-temperature plastic 122 and connecting the contact pin 112 is stored.

Returning to method 200 of figure 2, at step 206, the sidewall of the connector may be formed along the perimeter of the insert to get the interface. Recall that the insert 130 is the result of reformowania low-temperature plastic 122 on the base part 120 (see figure 5). With reference to the illustration with Fig shows the interface 140. Rubber sidewall 142 may be reformowana to insert 130 to form the interface 140. The sidewall 142 may be rubber or any other material, which adhesive may be coupled with an insert 130 or housing attached to the interface 140. Reformowanie rubber sidewall on the insert 130 can provide the fourth water-resistant seal when the interface is compressed within the body of the unit. In another embodiment, the rubber sidewall may be excluded and might be used instead of adhesive with a very high adhesion (VHB)to ensure a watertight seal. Thus, or rubber sidewall 142, or VHB adhesive may be used to form a waterproof seal.

For example, the cross-section of the interface 140 Fig.9 rubber sidewall 142 can in order to create a tight seal between the low-temperature plastic 132 and the housing 151 of the mobile device. Low-temperature plastic 132 of the insert may include a flange 136 for mating insertion protrusion 137 rubber sidewall 142. Edge 136 facilitates retention of the rubber sidewall 142 in place. In addition, at step 208 of the method 200 with 2 rubber sidewall 142 of the connector attaches the rubber sidewall 142 of the connector to the housing 151 to form the fifth water-resistant seal.

It should also be noted that reformowanie side of the connection and application of VHB-glue is optional. Thus, steps 206 and 208 of the method are optional stages to provide an additional level water-resistant seal, in particular a watertight seal. Namely, the interface 140 may be formed without the rubber sidewall or glue. The interface 140 without sidewall 142 can be installed and welded by means of ultrasound directly into the body. Rubber sidewall 142 forms a waterproof seal that absorbs vibrations of the contact between the interface 140 and the housing 153. For certain applications adding an additional level of water resistance with steps 206 and 208 of the method can be prohibitively expensive and unnecessary.

Returning to method 200 of figure 2, at step 210 of the flexible plate may be soldered to the connecting contact pins of the base part to ensure the system is whom connections the flexible tape connecting the contact pins. For example, figure 10 flexible belt plate 161 may be soldered manually to the connecting contact pins 112 interface 140 (see Fig). Soldering can be done by machine or manually. Incidentally, high temperature brazing does not affect the integrity of the connections in the base part 120, the insert 130 or interface 140. Thus, the waterproof seal is formed by the steps 202-208 way, are not affected by the soldering process. Briefly, on 11 soldered connection 162 flexible pads 161 provides electrical connection with the interior of the mobile device and the external part of the mobile device, as illustrated in figure 1.

Returning to method 200 of figure 2, at step 212, the insert can be welded by means of ultrasound to the body of the device to transition low-temperature plastic housing so as to form a third water-resistant seal. Briefly, ultrasonic welding is the process of Assembly, in which two materials are joined by local application of pressure and high-frequency vibrational energy. Ultrasonic welding provides vysokoreaktsionnye vibration materials, which causes the material to melt together. A good ultrasonic welded connection can be created between the two plastics having similar temperature PLA the population. Joining the two low-temperature plastics can form a strong weld, because the materials have similar types of fusion. Welding of low-temperature plastic with high temperature plastic may not result in a good welded connection. Accordingly, the low-temperature plastic 122 interface 140 is chosen to have a similar type of melting the material of the housing 151. For example, plastic may be of polycarbonate material (for example, a mixture of plastics of the same type of melting for the formation of a strong welded joint. Strong welded connection provides high resistance.

Figure 11 shows in detail the cross-section of the final interface 140. In particular, low-temperature plastic 132 may be welded by means of ultrasound to body material 153. Step 212 ultrasonic welding can create ultrasonic weld 153, which mixes the low-temperature plastic 132 and the housing 151 to form a waterproof seal. Ultrasonic weld 153 provides the first level of water resistance. In addition, the rubber sidewall 142 forms a water tight seal. If rubber sidewall is not used, VHB-grip can form a waterproof seal instead of rubber. The combination in travelog welded joints and seals of rubber sidewall or a strong grip adhesive VHB creates a watertight seal.

Where applicable: the present embodiments of the invention can be implemented in hardware, software or combination of hardware and software. Fits any type of computing system or other device adapted to implement the methods described in this document. A typical combination of hardware and software may be a mobile communication device with a computer program which, when loaded and executed, can control the mobile communication device so that it complied with the methods described in this document. The sections of the present method and system may also be embedded in computer software product, which contains all the characteristics that provide the implementation of the methods described herein, and which, when loaded into a computing system, allows to carry out these methods.

Although illustrated and described the preferred embodiments of the invention, it should be understood that embodiments of the invention are not limited in this way. Many modifications, changes, variations, substitutions and equivalents should be obvious to experts in the art without departure from the spirit and scope of the options implemented the I of the present invention, defined by the attached claims.

1. Water resistant and waterproof connector of the accessory device containing
many of the connecting contact pins;
high-temperature plastic, which aformula around the set of connecting the contact pins to form the base part, the base part is opposed to the movement of the connecting contact pins, due to high temperature soldering connection contact pins, and forms a first waterproof seal; and
low-temperature plastic, which aformula around the base portion to form a box, with reformowana part of the low-temperature plastic and high-temperature plastic to form a second waterproof seal.

2. The accessories connector according to claim 1, additionally containing a rubber sidewall connector for placement around the perimeter of the insert so that the sidewall of the connector is compressed between the insert and the body of the device to produce a third water-resistant seal.

3. The accessories connector according to claim 1, additionally containing an ultrasonic weld connection between the insert and the body of the device, the casing material has a similar low-temperature plastic type melting to agree melting corps nizkotemperaturnogo plastic for the formation of the fourth water-resistant seal.

4. The accessories connector according to claim 1, additionally containing a flexible pad that is soldered to the multiple connection of the contact pins in the device for electrical connection of the contact pins with the device.

5. The accessories connector according to claim 2, in which the insert includes a flange that engages with the protrusion of the adhesive side of the node connector.

6. The accessories connector according to claim 1, in which the low-temperature plastic, navorovannye on the base part, surrounds the pins and leaves the ends of the connecting contact pins isolated to provide conductivity.

7. The accessories connector according to claim 1, in which the multiple connection of the contact pins have a circular shape for tight seal with reformandum high-temperature plastic.

8. The accessories connector according to claim 1, in which the multiple connection of the contact pins are grooved belt for backward flow nevorovannoe high temperature plastic to surround the grooved belt and to withstand the high temperatures of the soldering connection contact pins.

9. The accessories connector according to claim 1, in which the insert is installed flush in the device and opens the first end of the set of connecting the contact pins to the outside of the device, and opens the WTO the second end of the multiple connection of the contact pins inside the device.

10. Water resistant and waterproof connector of the mobile device that contains
many of the connecting contact pins;
high-temperature plastic, which aformula around the set of connecting the contact pins to form the base part, the base part is opposed to the movement of the connecting contact pins, due to high temperature soldering connection contact pins for the formation of the first seal, and
low-temperature plastic, which aformula around the base part to form a paste, with reformowana part of the low-temperature plastic and high-temperature plastic to form a second waterproof seal.

11. The connector of the mobile device of claim 10, further containing a rubber sidewall host connector for placement around the perimeter of the insert so that the sidewall of the node connector is compressed between the insert and the body of the device to produce a third water-resistant seal.

12. The connector of the mobile device of claim 10, in which the insert includes a flange for coupling the insert to the ledge of the sidewall of the node connector.

13. The connector of the mobile device of claim 10, further containing a flexible strap, pripisyvaemo to the multiple connection of the contact pins in the device, when the second connection contact of the pins with the electronic circuit Board of the mobile device, thus reformowanie surrounds the pins and leaves, at least the tips of the connecting contact pins isolated to provide conductivity.

14. The connector of the mobile device of claim 10, wherein a set of connecting the contact pins have a circular shape for tight seal with reformandum high temperature plastic and have a grooved belt for backward flow nevorovannoe high temperature plastic to surround the grooved belt and to withstand the high temperatures of soldering the contact pins to ensure tight seal with reformandum high-temperature plastic.



 

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The invention relates to electrical engineering, and in particular to electrical connectors for electrical contact in electrical apparatus low-voltage (up to 1000) for currents from 15 to 1050 A

FIELD: electric engineering.

SUBSTANCE: instrumental block 1 contains box-shaped body 2 and contact device 4, which is utilized for collapsible connection of instrumental block 1 to immovable conducting buses. Body 2 contains walls 7,8,9 positioned at straight angle to one another with pass aperture 20 for insertion of contact device 4. for supporting contact device 4 relatively to forces of mating and detaching contact body 14 has shelves 19 positioned in two parallel rows, between which distance is present, appropriate for thickness of back wall 8 of body 2. Holding bridge 23 catches contact body 14 on remaining fourth side of perimeter and serves as position holding means. In the body 2 of instrumental block 1, cap for protecting clamps 25 is held by means of fastening lugs 28 for connecting buses of contact device 4.

EFFECT: simplified installation of contact device in instrumental block and maintenance of low load on contact body due to mating and detaching forces.

9 cl, 6 dwg

FIELD: electric engineering.

SUBSTANCE: device belongs to a new generation of electron tracking system devices. Video monitoring electron system has set of video cameras connected with device 1 of video monitoring system. Device 1 has at least one external commutation field which has set of separate outputs, each of which outputs intend for connection of corresponding camera with device 1 of video monitoring system. External commutation field is disposed in flat plate-formed case of removable panel 6. Panel 6 is fixed in recess 11 of case 2 of device 1 of video monitoring system for disconnection to form part of surface of mentioned case 2. Multi-pin internal contact-items 13 are mounted onto flat plate-shaped case 10 of removable panel 6. Internal multi-pin contact-items 13 are connected for disconnection with at least one multi-pin contact-item onto case 2 of device 1 of video monitoring system. Internal outputs 4 of commutation field are electrically connected with internal multi-pin contact-items 13 of removable panel 6. Internal space of case 2 at area of recess 11, intended for mounting removable panel 6, is closed by additional separating wall 12. At least one multi-pin contact-item, disposed onto case 2, is placed onto separating wall 12. Internal multi-pin contact-items 13 of removable panel 6 and at least one mentioned multi-pin item, disposed onto mentioned case 2, have to multi-pin neck or bayonet joints.

EFFECT: ability of replacement of device if required and of connection according to initial circuit of connection of external outputs; reduced number of malfunctions.

7 cl, 7 dwg

FIELD: physics.

SUBSTANCE: method may involve wearing (202) high-temperature plastic (122) around multiple connector pins (112) to form a base part (120), wearing (204) low-temperature plastic (132) around the base part to form an insertion (130), wearing (206) side pieces (142) of the connector along the perimetre of the insertion to form an interface node (140), and welding (212) the insertion to the housing (151) for movement (153) of the low-temperature plastic into the housing using ultrasound.

EFFECT: provision for interface connections with high degree of wholeness.

14 cl, 11 dwg

FIELD: electricity.

SUBSTANCE: plug body consists of the inner (1) and the outer (3) parts that are non-detachably interconnected and insulated from each other a a heat-insulation layer (2). Contact pins (6) are rigidly fixed inside the body with glass sealant (5). The heat-insulation layer (2) is attached to the outer surface of the body inner part (1); then the body inner part (1) with the heat-insulation layer (2) is placed inside the body outer part (3). Then the inner (1) and the outer (3) parts that are non-detachably interconnected with the contact pins (6) fixed inside the body. The body outer part (3) is installed inside the usage object (7), heated with a ring-exploded electron jet and non-detachably fixed.

EFFECT: imparting damping properties to the plug body, decrease of the plug overall dimensions, preservation of glass sealants integrity in the process of the plug connection to the usage object.

7 cl, 1 dwg

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