Laser processing method and processing device based on normal laser-induced material changes

FIELD: electricity.

SUBSTANCE: pulse of ultrafast laser with picosecond or shorter pulse width is associated by time and spatially with a pulse of at least one auxiliary laser that differs from ultrafast laser. Auxiliary laser pulse is controlled in such a manner that it could change in time. In this process, material condition to be processed is changed reversibly using one auxiliary laser beam and changed irreversibly when auxiliary laser beam ultrafast laser beam are associated by time and spatially. Auxiliary laser generator includes electronic communication device which modifies laser beam pulse in time and focusing optical system for spatial association of ultrafast laser beam focal point generated by ultrafast laser generator with focal point of auxiliary laser beam associated with time and for focusing ultrafast laser beam and auxiliary laser beam.

EFFECT: increase in speed of ultrafast laser processing with ultrahigh accuracy.

8 cl, 6 dwg

 

The technical field

The present invention relates to a method of laser processing based on caused by laser transient changes in the material condition, in which the nonlinear increase the speed of processing performed ultrahigh-speed laser micromachining with very high precision processing.

The level of technology

Requirements for microprocessing becoming higher along with the development of electronics and related devices industry. Especially, due to technical trends to increase in size, decrease in film thickness, high capability integration, increased mechanical strength, highly functional component materials and the layered structure of the coating of the substrate, more and more increasing demand for technology for micromachining of the composition during processing and after processing. This technology requires the permission of the processing of approximately 100 μm, and therefore, were commonly used method of cutting with a diamond saw. However, given the current technical trends, the way of cutting with a diamond saw can no longer be used due to physical damage, such as mechanical and thermal damage. Thus, there is an urgent need for new technical development to pre dolet economic problem, such as increased costs due to abrasion expensive diamond saw blade. In order to overcome the conventional technical problems, the recently proposed ultra-violet (UV) laser high power. However, there is a limitation in the use of UV laser high power due to mechanical damage caused by the shock wave and photochemical damage to the material of the object. However, it is required that the processing accuracy of the different treatment processes, including cutting, drilling, scribing (engraving) and slicing semiconductor wafers on crystals has been increased to several tens of microns, without causing changes in the optical-electrical characteristics of the object material in the manufacturing process of semiconductor and display devices of the next generation.

It is known that the technology of ultra-fast laser can be very effectively applied to the microprocessing, because it minimizes thermomechanical damage compared to various traditional processing technologies that use relatively long laser pulse.

In addition, microprocessing, based on high-energy particles, such as electron beam and plasma, can thermally damage the component materials and cannot be used for processing a particular is certain material, depending on the type of processed materials. Accordingly, development of a method of laser processing with ultrashort pulse is carried out actively to solve problems micromachining based on high-energy particles.

As for the method for ultrahigh-speed laser processing is not a method of amplification required and appropriate to increase the processing speed, using sufficient laser power, and the characteristic of the laser beam is changed due to the nonlinear effect of high order in the air between processes, even when the laser pulse has sufficient peak power, there is no way to increase the processing speed.

The premise of a new method for overcoming the above problems is to maintain the characteristics of ultrahigh-speed laser processing free from thermal and mechanical damage. Existing microprocessing, based on ultra-fast laser, and method of processing highly vulnerable in terms of processing speed, and thus, it is strongly required to develop a new processing method in the application of related advanced technologies in the industry. To overcome the limitations of micromachining based on ultra-fast laser, you need a method that uses adaptive optics, to the which in principle is adopted for conventional laser processing with a relatively long pulse, because the pulse duration and the characteristics of the beam source ultrahigh-speed laser completely changed. When using adaptive optics, in particular thermal deformation, which causes a problem in the conventional laser processing with a relatively large pulse duration, may affect the quality of treatment by increasing the pulse duration.

Disclosure of invention

Technical problem

Accordingly, the present invention was created to resolve the above problems occurring in the prior art, and the main purpose of the present invention is the provision of a method of laser processing and the processing device, based on transient changes in the status of the excited laser material, to improve the processing speed for micromachining based on ultrahigh-speed laser.

Another purpose of this invention is the provision of a method of laser processing and the processing device, based on transient changes in the status of the excited laser material, which can significantly reduce the surface roughness caused by microscopic structures with sizes ranging from several tens to several hundreds of nanometers (nm), which are formed on the surface of the material treated, sorbitrate the existing laser process, and provide the ability to implement processing with an accuracy of 1 μm and is generated when the ultrahigh-speed laser process is used to microoptical device.

Technical solution

To achieve the objectives of the present invention, a method of laser processing based on transient changes in the status of the excited laser material, which connects the impulse ultra-fast laser pulse, at least one auxiliary laser, other than ultra-fast laser to reversibly change the material to be processed.

Ultrahigh-speed laser generates a laser pulse duration of less than picoseconds (PS).

The auxiliary pulse laser beam control for changes over time.

The relationship between pulse ultrahigh-speed laser and pulse, at least one auxiliary laser is a temporary connection that controls the relative temporal positions between the pulse ultrahigh-speed laser and the auxiliary pulse laser.

The relationship between pulse ultrahigh-speed laser and pulse, at least one auxiliary laser includes a temporary connectivity and spatial relationships, which is the spatial coordinate focus sverhbystro the operating laser beam focus auxiliary laser beam.

The duration of the auxiliary pulse laser beam is greater than the pulse duration of ultra-fast laser beam.

The method of laser processing is used in the manufacturing process of semiconductors selected from cutting, drilling, scribing and cutting of semiconductor wafers on the crystals.

To achieve the objectives of the present invention also proposed a laser processing device, based on transient changes in the status of the excited laser material, which contains ultra-fast laser generator, an auxiliary laser generator comprising an electronic communication device, which changes the pulse laser beam in time, and a focusing optical system for spatial communication focus of the beam ultrahigh-speed laser generated by ultra-fast laser generator, with focus beam auxiliary laser associated with time, and focusing of the beam ultra-fast laser beam and auxiliary beam of the laser.

The focusing optical system focuses the beam of the auxiliary laser inside the focused beam ultra-fast laser.

The focusing optical system focuses the beam of the auxiliary laser outside of the focused beam ultrahigh-speed manhole.

the device of the laser processing, based on transient changes in the status of the excited laser material further comprises a polarization controller located between the ultrahigh-speed laser generator and the focusing optical system, to control the angle of the half-wave plate using a stepper motor, in order to uniformly maintain the optical power of each port, which has passed through the polarizing beam splitter.

Beneficial effects

The present invention provides a first method of ultra-fast laser processing, can significantly increase the processing speed through space-time connection of conventional commercially available laser, such as nanosecond laser with ultra-fast laser to locally and the transition method to modify the physical state of the material to be processed is, for example, the internal temperature or the density of carriers in the material, and reversible cause a transient change of the physical state using a relatively small amount of energy ultra-fast laser. More specifically, a conventional laser, such as nanosecond laser of the appropriate wavelength, emits on the material to be processed, to a transitional way to increase the internal temperature of the material, or better the ability of the media such as free electrons. The energy of the laser is maintained at the value at which the state of the reversible material is changed so that the condition of the material does not change significantly. This state change material provides the ability to handle ultra-fast laser, simultaneously emitting at the same point in order to significantly increase the processing speed in the same state of energy. Here, the wavelength and pulse width of the auxiliary laser is optimized to a three dimensional way to optimize the distribution of the depths of the physical changes of material, such as internal temperature or density of the media, taking into account the depth of the ablation pulse and processing speed ultrahigh-speed laser. To accomplish this, the present invention over time and over space links pulses of different lasers.

In addition, the present invention can reduce the number of microscopic structures ranging in size from several tens to several hundreds of microns formed on the surface of the material during processing, ultra-fast laser, using associated nanosecond laser to significantly reduce the surface roughness of the material.

Description of the drawings

Other objectives and advantages of the present invention may be the more fully understood from the following detailed description, illustrated by drawings showing the following:

Figa illustrates a hybrid processing nanosecond/ ultrahigh-speed laser;

Figw - photography device of the hybrid processing nanosecond/ultrahigh-speed laser;

Figs shows the pulses at three different time intervals -100 NS, 0 NS +100 NS between pulses of nanosecond and ultrahigh-speed laser;

Figure 2 illustrates the changes in the temperature of the object to be processed, and the carrier density and the degree of light induced reactions in a hybrid processing nanosecond/ultrahigh-speed laser;

Figure 3 is a graph showing the intervals of the pulses of nanosecond laser and ultra-fast laser processing scribing silicon;

Figure 4 - image of the atomic force microscope of the treated silicon surface;

5 is a graph showing the profile of the processed cross-section; and

6 is a graph showing the relationship between changes in intervals of two different lasers and changes in the treated area of the cross section.

Description reference position on drawings

1: ultrahigh-speed laser generator

2: Supporting the laser generator

3: Electronic communication device

4: focusing optical system

Re them of carrying out the invention

The present invention is described in detail below in connection with the preferred options, with reference to the drawings.

Figa illustrates a hybrid processing nanosecond/ ultrahigh-speed laser; Figv - photography device of the hybrid processing nanosecond/ultrahigh-speed laser; Figs shows the pulses at three different time intervals -100 NS, 0 NS +100 NS between pulses of nanosecond and ultrahigh-speed laser; Figure 2 illustrates changes in the temperature of the object to be processed, and the carrier density and the degree of light induced reactions in a hybrid processing nanosecond/ultrahigh-speed laser; figure 3 is a graph showing the intervals of the pulses of nanosecond laser and ultra-fast laser processing scribing silicon; Figure 4 - image of the atomic force microscope of the treated silicon surface; 5 - a graph showing the profile of the processed cross-section; and 6 is a graph showing the relationship between changes in intervals of two different lasers and changes in the treated area of the cross section.

According to Figure 1, the laser processing device, based on transient changes in the status of the excited laser material according to the present invention includes from the high-speed laser generator 1, auxiliary laser oscillator 2 having an electronic device 3 due to change of the pulse laser beam in time, and the focusing optical system 4 for the spatial context of focus of the beam ultrahigh-speed laser generated ultrahigh-speed laser generator 1, the focused beam of the auxiliary laser associated with time, and focusing of the beam ultra-fast laser beam and the auxiliary laser.

Ultrahigh-speed laser 1 can use a femtosecond or picosecond laser, and the auxiliary laser 2 can use nanosecond laser. The pulse duration of the beam of the auxiliary laser is larger than the pulse duration of the beam of ultra-fast laser.

In the present invention, the femtosecond laser is used as an ultrahigh-speed laser 1, and nanosecond laser generator is used as an auxiliary laser oscillator 2.

The temporal relation of a femtosecond laser and nanosecond laser means that the relative temporal positions between femtosecond and nanosecond pulse impulse control, to change the physical state of the transition material when the material is processed by the laser, and the spatial relationship indicates that focuses the beam of femtosecond laser beam and NAS the second laser mirror each other. To get a hybrid effect, at the same time requires the temporal relation and spatial relationship. The femtosecond laser is a Ti:sapphire system amplifier and has a pulse duration of 150 FS, a repetition rate of 1 kHz and a wavelength of 800 nm. Nanosecond laser has a pulse duration of 250 NS, a repetition rate of 1 kHz and a wavelength of 532 nm.

Stabilization nanosecond laser plays a crucial role in the hybrid laser processing system. The present invention creates weresomething stabilization system nanosecond laser. Warezonia stabilization system includes a polarizing beam splitter and half-wave plate and controls the angle of the half-wave plate using a stepper motor to approximate the predetermined power value, controlling the measured value to the target output stage. In the long-term stability of approximately 2% is less than 0.5%, after passing through the active stabilization system, in order to obtain a satisfactory effect of stabilization. The temporal relation of femtosecond and nanosecond pulse of the pulse can be controlled by linking the electrical signal applied to the femtosecond laser and nanosecond laser, using the delay generator and the us is the detuning of the time delay. The photography device of the laser processing executed as described above, is shown in Figv. Figs shows the relative temporal position between femtosecond and nanosecond pulse pulse-driven by the aforementioned method. The time interval approximately equal to from 100 NS to several tens of μs, can be freely set for pulse femtosecond laser and nanosecond laser by associating a trigger pulse applied to the cells of Pockels green laser that is required in the amplification of femtosecond laser trigger pulse nanosecond laser. This is controlled by computer to ensure the optimization of processing speed.

Figure 2 explains that the temporary connection of a femtosecond laser and nanosecond laser causes a local temperature change of the sample when the sample is processed to reduce the threshold ablation energy required for processing by femtosecond laser, and to increase the processing speed. When energy nanosecond laser increases, the physical condition of the processed material, for example the temperature of the material or the carrier density in the material is changed. Here, it is possible to control energy so that nanosecond laser could not bring one any irreversible changed the E. When the associated pulse femtosecond laser is invoked in the same place, irreversible ablation of large quantities of material can be performed with low energy. Accordingly, it is expected that the processing speed for processing the femtosecond laser can be maximized, and the lower energy threshold processing significantly reduces the nonlinearity of high order, which is manifested when a femtosecond laser is focused into the air, and the deterioration of quality due to the nonlinearity of high order. In addition, the increase in processing speed can provide a multiplier effect, and not an additive effect when a method of increasing the repetition rate of the femtosecond laser is improved. In addition, the processing speed can be further increased by optimizing the corresponding spatial variations in the plane of focus nanosecond laser and a pulse width of nanosecond laser.

Figure 2 shows that the beam of nanosecond laser is focused inside the beam of the femtosecond laser focus of the focusing optical system. The focusing optical system can focus the beam of nanosecond laser outside of the focused beam of a femtosecond laser. This is very useful for drilling.

Figure 3 shows the pulses applied to ramnivas plate in a hybrid process. In the present invention is specified pulse interval approximately equal to 800 NS. The surface of the silicon wafer, to which is applied laser pulses were analyzed by AFM. The measured profile of the processed section is shown in Figure 4. According to Figure 4, the change in the treated section is greatest when the time interval between nanosecond laser and femtosecond laser becomes zero. Figure 5 shows the ratio between the measured cross section and the change in the time interval between nanosecond laser and femtosecond laser. According to Figure 5, the processing speed is significantly increased in terms of the cross-section. 6 shows the area of ablation as a function of time intervals (time delay) between pulses of nanosecond and femtosecond laser. According to Fig.6, the processing speed is increased more than ten times in terms of area ablation in its cross section.

A study evaluating the effect of physical changes in the substrate caused by nanosecond laser, femtosecond laser processing and development of method for the optimization of machining conditions were applied to the process of scribing silicon wafer. Needs new processing technology next generation increase as speed up the process of thinning a silicon wafer the various processes including the process of composition. It is difficult to directly apply the traditional method of mechanical sawing for a very thin and solid plates, because a mechanical process, such as diamond sawing, causes mechanical damage, and processing costs are increased because of the abrasion of diamond saw blade, so that the new process technology is urgently needed. Accordingly, the technology proposed in accordance with the present invention, is of great importance.

Therefore, the present invention overcomes the limitation of processing technology in terms of processing speed, which is a disadvantage of conventional micromachining using ultra-fast laser having a high machining accuracy. It is required that the processing speed has been improved, while maintaining the machining characteristics of femtosecond laser free from thermal and mechanical damage caused by the technical limitations of the methods of strengthening the femtosecond laser and the nonlinear effect of high order in the focusing process. The present invention is the first method of ultra-fast laser processing, which allows to significantly increase the processing speed by using a relatively small amount of energy ultra-fast laser p is the tool of the spatial-temporal relationships of conventional commercially available laser, such as nanosecond laser, and ultra-fast laser, and local and transient changes in the physical state of the processed material, such as internal temperature. More specifically, the existing laser, such as nanosecond laser of the appropriate wavelength, emits the treated material to a transient increase of the internal temperature of the material or the density of the medium, such as free electrons. Here, the energy is stimulated (excited) laser is maintained up to the amount at which the state of the reversible material is changed, so that the material does not change significantly. This change in status significantly improves processing using ultra-fast laser, emitting at the same point with the same energy. The wavelength and pulse width of the excited laser optimized in order to optimize the three-dimensional distribution along the depth physical changes, such as the internal temperature of the material, taking into account the depth of the ablation pulse ultrahigh-speed laser and processing speed. To implement this principle, the present invention over time or over space links pulses of different lasers.

Industrial applicability

As described above, the present izaberete the s can overcome the limitations of processing speed traditional micromachining of ultra-fast laser, to significantly improve the processing speed by using a relatively small amount of energy due to the spatial-temporal relationships of conventional commercially available laser, such as nanosecond laser and the femtosecond laser and the local and transient changes in the physical state of the processed material, such as internal temperature and carrier density. Accordingly, the present invention contributes to the industrial applicability of ultra-fast laser micromachining. Especially, the present invention enables the implementation of various processes, including cutting, drilling, scribing, cutting semiconductor wafers on the crystals needed to process the next generation of semiconductors and displays, which cannot be applied to conventional mechanical processing technology. In addition, the present invention can improve the accuracy of up to several tens of microns, without causing changes in the optical-electrical characteristics of the processed material.

Although the present invention has been described with reference to specific illustrative embodiments of, it should not be limited to these options, implementation, and should be defined only in accordance with the attached claims. Clearly, the specialists in the art can change or modify the embodiments of without deviating from the scope and essence of the present invention.

1. The method of laser processing based on transient changes in the status of the excited laser material, wherein the pulse ultrahigh-speed laser with picosecond or shorter pulse duration, associated in time and space, with a pulse of at least one auxiliary laser, different from the ultra-fast laser, with a pulse of the auxiliary laser is controlled so that it changed over time, and the condition of the material to be processed, the change in a reversible way by using one of the auxiliary laser beam, and change in an irreversible way, when the auxiliary beam laser and a beam of ultra-fast laser related in time and space.

2. Method for laser processing according to claim 1, in which the relationship between the pulse ultrahigh-speed laser and pulse at least one auxiliary laser includes the communication time, which controls the relative temporal positions between the pulse ultrahigh-speed laser and the auxiliary pulse laser communication in space, which coordinates in space of the point of focus ultrahigh-speed laser and the focal point of the beam support.

3. Method for laser processing according to claim 2, in which the pulse duration of the beam VSP is service laser more than the pulse duration of the beam of ultra-fast laser.

4. Method for laser processing according to any one of claims 1 to 3, in which the laser processing based on transient changes in the status of the excited laser material used in the manufacturing process of semiconductors selected from the group of: cutting, drilling, scribing and cutting of semiconductor wafers on the crystals.

5. The laser processing device, based on transient changes in the status of the excited laser material, which contains ultra-fast laser generator, an auxiliary laser generator comprising an electronic communication device, which changes the pulse laser beam in time, and a focusing optical system for spatially linking the focal point of the beam of ultra-fast laser generated by ultra-fast laser generator, with the focus point of the beam of the auxiliary laser associated with time, and focusing of the beam ultra-fast laser beam and the auxiliary laser.

6. The laser processing device according to claim 5, in which the focusing optical system focuses the beam of the auxiliary laser inside the focused beam ultra-fast laser.

7. The laser processing device according to claim 5, in which focusing is I optical system focuses the beam of the auxiliary laser outside of the focused beam ultra-fast laser.

8. The laser processing device according to claim 6 or 7, optionally containing a polarization controller located between the ultrahigh-speed laser generator and the focusing optical system, to control the angle of the half-wave plate using a stepper motor, in order to uniformly maintain the optical power of each port, which has passed through the polarizing beam splitter.



 

Same patents:

FIELD: mechanics.

SUBSTANCE: invention is related to hole fabrication methods and may find application in turbine component parts manufacture. Holes are arranged in a multilayer system containing at least a single metal substratum and an external ceramic layer by way of at least a single laser pulse ray. The hole is arranged in several stripping stages by way of long and short pulses. At one of the initial stripping stages one uses pulses whose duration differs from that at one of the last stripping stages. Long pulses duration exceeds 0.4 ms. With long pulses the laser output power is several hundreds W such as 500 W.

EFFECT: improved precision of holes fabrication in layered systems.

41 cl, 18 dwg

FIELD: process engineering.

SUBSTANCE: invention can be used in aircraft engineering. Adapter for working head of the device intended for making holes by laser beam comprises beam focusing appliance, mirror and device to feed auxiliary medium for laser beam. Said adapter has first laser beam inlet hole and second pulse laser beam outlet hole. Beam focusing appliance is arranged ahead of second pulse laser beam outlet hole. Mirror is arranged on laser beam optical path behind said focusing appliance so that outlet beam forms with inlet beam the angle smaller than 180°. Device to feed auxiliary medium for laser beam allows said medium to pass through said second hole along laser beam direction.

EFFECT: higher accuracy of holes produced by laser beam.

9 cl, 4 dwg

FIELD: technological processes.

SUBSTANCE: invention relates to device for cutting of volume parts by fibre laser and may be used in dimensional processing of parts having complex spatial shape. Rotary laser cutting head of device comprises body with vertical axis of rotation (26), body installed on it with horizontal axis of rotation (30) and optical focusing head. Mentioned head is installed on hollow support arranged in the form of vertically moving slider installed on mechanical system of positioning and displacement. Body with vertical axis of rotation and body with horizontal axis of rotation have electric drives, are arranged as hollow and have rotary prisms for transportation of laser beam to optical focusing head. Slider is arranged with a mount seat for installation of collimator (6) with connector arranged on it with fibre cable (2), which transports laser radiation. Hollow shaft (24) of slider (1) is installed coaxially with collimator (6) and bears body with vertical axis of rotation and rotor of vertical electric drive on its lower end. Body with horizontal axis of rotation (30) is installed on hollow shaft (28) installed in bearing supports of intermediate body (21), installed on vertical end of body with vertical axis of rotation, and bearing rotor (27) of horizontal electric drive.

EFFECT: invention provides for high quality of cutting at high speeds and dimensions of processed parts.

1 dwg

FIELD: machine building.

SUBSTANCE: method includes feeding of laser beam on treated surface, feeding co-axially to laser beam of process gas, collimation of laser beam, its embedding into treated product and movement by specified program. Cutting is implemented in liquid field. Product is located in bath with water on cone-shaped pins with exceeding of water level over surface of product equal to 10-15 mm. Cutting is implemented by ytterbium laser with laser beam embedding into treated product for 0.2-0.4 of its thickness. Movement of laser beam is implemented at a rate 1.2-1.8 m/min.

EFFECT: enhancement of manufacturing capabilities and improvement of ecology at treatment of composite materials and it is provided high quality of cutting.

1 dwg, 2 ex

FIELD: technological processes.

SUBSTANCE: invention is related to method and device for automatic control of laser cutting or hole drilling process. Method includes measurement of radiation reflected from zone of processing. Minimum value of reflected radiation amplitude is defined, compared to specified amplitude, and control of laser radiation capacity and/or cutting speed are controlled. Device comprises laser with power supply unit, rotary mirror, focusing lens, 2-coordinate table for fixation of processed part, unit of 2-coordinate table control, photodetector of secondary radiation and transformer of secondary radiation signal from photodetector, connected to unit of laser power supply and unit of 2-coordinate table control.

EFFECT: improved quality and capacity of through laser processing of materials.

2 cl, 1 dwg

Gas-laser cutter // 2368479

FIELD: process engineering.

SUBSTANCE: proposed device comprises focusing lens (1), casing (2), branch pipe (3) for laser beam to pass there through at preset aperture angle and nozzle (5) arranged around aforesaid branch pipe and inclined to the lens optical axis to form gas supersonic jets. Branch pipe (3) has annular grooves (4) to make chamber for gas to be distributed between the nozzles. Axes of nozzles (5) intersect the lens axis at the point which makes that of intersection between processed surface and focusing lens axis to exploit entire kinetic power of supersonic jets onto processed surface.

EFFECT: higher efficiency of processing due to increased efficiency of gas mix effects.

1 dwg

FIELD: agriculture.

SUBSTANCE: device includes bearing structures interconnected with gear-driven means for processing element relocation and program control system. Bearing structures are made as a support and means for processing element relocation is made as a rotary lever system including at least two levers being interconnected by one end with each other by means of hinge joint. The second end of the first lever is connected by means of hinge joint with support and the second end of the second lever has processing element mounted thereon. Another version includes bearing structures interconnected with gear-driven means for processing element relocation and program control system. To achieve the same technical result bearing structures are made as a support capable to move along guide ways, means for processing element relocation is made as a rotary lever system including at least two levers being interconnected by one end with each other by means of hinge joint. The second end of the first lever is fixed rigidly to the support and the second end of the second lever has processing element mounted thereon.

EFFECT: extension of manufacturing capability and increase of positioning accuracy.

10 cl, 4 dwg

FIELD: technological processes.

SUBSTANCE: cutting of sheet materials is realised with the help of cut sheet surface exposure to oxygen jet that flows from supersonic nozzle and laser radiation. Laser radiation is focused so that axis of beam coincides with the nozzle axis, beam focus is located inside the nozzle, and beam diameter on surface of cut plate exceeds output diameter of nozzle. Beam heats the metal to the temperature that is higher than burning temperature but is lower than melt temperature. Thickness of cut sheets is set by condition H/Da≤(0.8-1.2)P/P+5, where H is thickness of cut sheet, mm, Da is output diameter of nozzle, mm. Certain selection of cutting parameters, namely value of pressure in nozzle chamber and gap size between output section of nozzle and cut sheet, makes it possible to increase quality of cutting surface. Selection is done based on the following conditions: P/P=6.15/(D0/Da-A)-7.7 and δ/Da=1-2, where P is excess gas pressure in chamber, MPa; P is pressure of environment, MPa; A=0.2-0.3; D0 is critical diameter of gas nozzle, mm; Da is output diameter of gas nozzle, mm; δ is gap size between output section of nozzle and sheet surface, mm.

EFFECT: higher quality of cutting surface.

1 ex, 3 dwg

FIELD: physics; lasers.

SUBSTANCE: present invention pertains to laser technology, particularly to the method of cutting pyrographite using laser, and can be used in instrument making, and mainly in electronics. Laser radiation with central mode TEM00 is focused on the material. The focus of the beam is directed on the surface of the material, while keeping the density of the incident power within the 106-107 W/cm2 range. The work piece is moved at speed ranging from 1 to 3 mm/s. The cutting process parameters are determined by the expression , where K is the coupling factor of parameters, chosen from the condition 7·10-5≤K≤12·10-5; f is the repetition frequency of the laser radiation, τ is the pulse duration of the laser radiation, d is the diameter of the spot of focused laser radiation, and h is the thickness of the work piece. A laser with yttrium aluminium garnet active element, with controlled distribution of power in the section of the beam is used.

EFFECT: high quality of cutting material with a smaller heat affected zone during optimum process modes.

2 cl, 1 ex

FIELD: processes and equipment for gas-laser cutting of titanium and its alloys, possibly in different branches of power engineering and machine engineering.

SUBSTANCE: method is realized due to using technological gas being mixture of argon and oxygen and containing 15 -25% of oxygen. In order to cut metal of predetermined thickness, oxygen content in technological gas is determined depending upon cutting speed and quality of metal surface according to technological demands for cutting quality at maximally admissible cutting speed.

EFFECT: improved quality of cutting as oxygen content of technological gas in preset range completely prevents occurring of type-metal or makes it rare and small.

1 dwg, 1 ex

FIELD: testing engineering.

SUBSTANCE: device comprises optical quantum generator, system for focusing the laser beam with the unmovable lens, and movable base for securing the object to be cut. The movable base is made of rotating platform mounted on the driving shaft of the mechanism for discrete control of the speed of rotation. The mechanism is made of an assembly of driven and driving pulleys connected by means of the driving belt. The rotating platform is provided with the model of the object to be cut. The driving belt that connects the driven and driving pulleys is made of a vibration insulation material. The driven shaft of the rotating platform is set in bearings, is provided with a mechanism for control of tension of the driving belt, and is mounted on the traverse gear.

EFFECT: decreased time and reduced power consumption of testing.

1 cl, 2 dwg

FIELD: method and apparatus for forming weakening lines in member of automobile lining covering devices with safety cushions in order to create one or more hinged flaps of window for spreading out pneumatic safety cushion when the last is pumped.

SUBSTANCE: method comprises steps of making notch in surface of lining member by means of cutting beam directed from source 12 onto said surface at moving lining member relative to source 12 according to predetermined pattern of notch; tracking cutting result by means of measuring beams irradiated by first pickup 26 and second outer pickup respectively placed in opposite sides relative to lining member 16; combining measuring beam of pickup 26 with cutting beam in such a way that to provide collinear combined segments on surface of lining member and to direct them constantly to the same points of notch pattern; controlling quantity of material removed by means of cutting beam in each point along pattern due to controlling notch cutting process with use of feedback signals generated by first 26 and second 20 pickups. Apparatus for performing the method includes source of cutting beam for making notch on surface of one side of lining member at directing cutting beam to said surface; drive unit imparting mutual relative motion of cutting beam source and lining member according to predetermined pattern; sensor unit for tracking thickness of remained material of lining member; device for combining beams; control unit for tracking process of cutting notch in each point along predetermined pattern and regulating cutting intensity of cutting beam for providing predetermined thickness of material of lining member. Sensor unit includes first inner pickup 26 and second outer pickup 20 arranged at mutually opposite sides of lining member 16 and directed towards each point of lining member to be notched. Inner pickup and cutting beam source are arranged at the same side relative to lining member.

EFFECT: possibility for making weakening lines during one pass at accurate reproducibility regardless of variation of cutting depth, cutting angle, patterns of notch, non-uniformity and color of material, texture of material surface and so on.

41 cl, 8 dwg

FIELD: different branches of machine engineering and metallurgy, possibly working products for modifying or preparing topography of article surface or raw materials.

SUBSTANCE: method comprises steps of relatively moving article and powerful beam in crossing direction in order to act upon several positions on article by means of said beam; at each position moving beam relative to article according to predetermined way; melting material of article and moving it by action of powerful beam for forming recesses or openings; joining article having prepared surface with target part. Product formed by such process has predetermined surface roughness.

EFFECT: possibility for producing article with predetermined surface roughness.

46 cl, 11 dwg, 1 tbl

FIELD: laser working, namely laser cutting, possibly in machine engineering for effective and high-accuracy manufacture of complex-contour parts from sheet blank.

SUBSTANCE: method comprises steps of measuring mean statistic value of limit bending of blank 7; then fastening and tensioning blank at providing tension stresses determined by relation: σtχ ≤ σe GV, where σt - tension stresses created in blank, MPa; χ - thermal conductivity of blank material, mm2/s; σe - elastic limit of blank material, MPa; G - mean statistic value of limit bending of blank, mm; V - cutting speed, mm/s. Focused laser irradiation 1 with preset focal length and gas flow 6 are fed onto sheet blank 7 through nozzle of cutter 5 for moving blank along predetermined contour. Apparatus includes source of laser irradiation 1, mirror 3, cutter 5, platform 8 with clamp 9 for blank 7. Platform 8 is mounted on coordinate table 11 and it includes threaded guides 10 for tensioning blank; said guides are in the form of screw gages with left- and right-hand threads. Coordinate table is number program controlled by system 12 connected with laser irradiation source 1 and with information-computing system 13 through program module 14 correcting contour of cutting in proportion to deformations created in material.

EFFECT: enhanced accuracy of laser cutting due to stable position (on the whole surface of sheet blank) of plane of focusing lens of cutter at cutting process, practically constant gap value between nozzle of cutter and blank surface.

2 cl, 1 dwg, 1 ex, 1 tbl

FIELD: processes and equipment for gas-laser cutting of titanium and its alloys, possibly in different branches of power engineering and machine engineering.

SUBSTANCE: method is realized due to using technological gas being mixture of argon and oxygen and containing 15 -25% of oxygen. In order to cut metal of predetermined thickness, oxygen content in technological gas is determined depending upon cutting speed and quality of metal surface according to technological demands for cutting quality at maximally admissible cutting speed.

EFFECT: improved quality of cutting as oxygen content of technological gas in preset range completely prevents occurring of type-metal or makes it rare and small.

1 dwg, 1 ex

FIELD: physics; lasers.

SUBSTANCE: present invention pertains to laser technology, particularly to the method of cutting pyrographite using laser, and can be used in instrument making, and mainly in electronics. Laser radiation with central mode TEM00 is focused on the material. The focus of the beam is directed on the surface of the material, while keeping the density of the incident power within the 106-107 W/cm2 range. The work piece is moved at speed ranging from 1 to 3 mm/s. The cutting process parameters are determined by the expression , where K is the coupling factor of parameters, chosen from the condition 7·10-5≤K≤12·10-5; f is the repetition frequency of the laser radiation, τ is the pulse duration of the laser radiation, d is the diameter of the spot of focused laser radiation, and h is the thickness of the work piece. A laser with yttrium aluminium garnet active element, with controlled distribution of power in the section of the beam is used.

EFFECT: high quality of cutting material with a smaller heat affected zone during optimum process modes.

2 cl, 1 ex

FIELD: technological processes.

SUBSTANCE: cutting of sheet materials is realised with the help of cut sheet surface exposure to oxygen jet that flows from supersonic nozzle and laser radiation. Laser radiation is focused so that axis of beam coincides with the nozzle axis, beam focus is located inside the nozzle, and beam diameter on surface of cut plate exceeds output diameter of nozzle. Beam heats the metal to the temperature that is higher than burning temperature but is lower than melt temperature. Thickness of cut sheets is set by condition H/Da≤(0.8-1.2)P/P+5, where H is thickness of cut sheet, mm, Da is output diameter of nozzle, mm. Certain selection of cutting parameters, namely value of pressure in nozzle chamber and gap size between output section of nozzle and cut sheet, makes it possible to increase quality of cutting surface. Selection is done based on the following conditions: P/P=6.15/(D0/Da-A)-7.7 and δ/Da=1-2, where P is excess gas pressure in chamber, MPa; P is pressure of environment, MPa; A=0.2-0.3; D0 is critical diameter of gas nozzle, mm; Da is output diameter of gas nozzle, mm; δ is gap size between output section of nozzle and sheet surface, mm.

EFFECT: higher quality of cutting surface.

1 ex, 3 dwg

FIELD: agriculture.

SUBSTANCE: device includes bearing structures interconnected with gear-driven means for processing element relocation and program control system. Bearing structures are made as a support and means for processing element relocation is made as a rotary lever system including at least two levers being interconnected by one end with each other by means of hinge joint. The second end of the first lever is connected by means of hinge joint with support and the second end of the second lever has processing element mounted thereon. Another version includes bearing structures interconnected with gear-driven means for processing element relocation and program control system. To achieve the same technical result bearing structures are made as a support capable to move along guide ways, means for processing element relocation is made as a rotary lever system including at least two levers being interconnected by one end with each other by means of hinge joint. The second end of the first lever is fixed rigidly to the support and the second end of the second lever has processing element mounted thereon.

EFFECT: extension of manufacturing capability and increase of positioning accuracy.

10 cl, 4 dwg

Gas-laser cutter // 2368479

FIELD: process engineering.

SUBSTANCE: proposed device comprises focusing lens (1), casing (2), branch pipe (3) for laser beam to pass there through at preset aperture angle and nozzle (5) arranged around aforesaid branch pipe and inclined to the lens optical axis to form gas supersonic jets. Branch pipe (3) has annular grooves (4) to make chamber for gas to be distributed between the nozzles. Axes of nozzles (5) intersect the lens axis at the point which makes that of intersection between processed surface and focusing lens axis to exploit entire kinetic power of supersonic jets onto processed surface.

EFFECT: higher efficiency of processing due to increased efficiency of gas mix effects.

1 dwg

FIELD: technological processes.

SUBSTANCE: invention is related to method and device for automatic control of laser cutting or hole drilling process. Method includes measurement of radiation reflected from zone of processing. Minimum value of reflected radiation amplitude is defined, compared to specified amplitude, and control of laser radiation capacity and/or cutting speed are controlled. Device comprises laser with power supply unit, rotary mirror, focusing lens, 2-coordinate table for fixation of processed part, unit of 2-coordinate table control, photodetector of secondary radiation and transformer of secondary radiation signal from photodetector, connected to unit of laser power supply and unit of 2-coordinate table control.

EFFECT: improved quality and capacity of through laser processing of materials.

2 cl, 1 dwg

Up!