Methods and systems of microprocessing

FIELD: printing industry.

SUBSTANCE: in method for arrangement of slot for supply of ink into semiconducting substrate for jet printing head, the first structural element is formed by means of multiple application of electric energy discharge to the first side of semiconducting substrate or by means of abrasive material application on the first side of semiconducting substrate, vibration is imparted to tool opposite to the first side, besides tool vibrates with a certain frequency and at a certain distance from the first side for formation of the first structural element, material of semiconducting substrate is removed from the second side for formation of the second structural element, besides at least part of the first and second structural elements crosses for formation of slot for ink feed, which passes through semiconducting substrate, and for removal method is used, which has been selected from group, including wet etching, dry etching, laser treatment, sand drilling, treatment with abrasive jet, rotary-vibration drilling, cutting with saws and mechanical treatment in machines.

EFFECT: fast formation of slot for ink feed in semiconducting substrate for jet printing head with low costs.

19 cl, 14 dwg

 

The technical field

The present invention relates to methods and systems for micromachining.

Prior art

The market of electronic devices is characterized by constant demand for improved operational parameters at low cost. To meet these requirements should produce components that contain a variety of electronic devices, more efficiently and with more narrow tolerances.

A brief statement of the substance of the invention

The present invention is the task of forming devices having such structural elements as the slits made in the device for the discharge of fluid. For the formation of such structural elements required processes that are rapid, do not destroy the substrate, ensuring the formation of the mentioned structural elements and are held in as you lower costs.

Brief description of drawings

The characteristics of the present invention will be easily understood by experts in the art after studying the following detailed description of the possible specific embodiments of the invention illustrated in the accompanying drawings, on which:

figure 1 depicts a General view of a particular variant of implementation of the printhead according to the invention;

figure 2 - section of the printhead 1 according to the invention;

figure 3 is a top view of the print head 1 according to the invention;

figa-4C - process of forming a structural element in a silicon substrate according to the invention;

figa-5F - the process of forming a structural element in a silicon substrate according to the invention;

figa-6D - stages in the process of forming a structural element in a silicon substrate according to the invention;

Fig.7 - ultrasonic grinding machine (front view) according to the invention;

Fig - part ultrasonic grinding machine with another embodiment according to the invention;

figa-9F - profiles of tools that can be used in conjunction with a grinding machine according to the invention;

figa-10D - section through design elements that can make the claimed method according to the invention;

figa-11F - the process of forming a structural element in accordance with still some options for implementation according to the invention;

figa-12C - the process of forming a structural element in accordance with another embodiment according to the invention;

Fig is a front view of the printer according to the invention;

Fig - General view of the cartridge for printing solenoidality.

Detailed description of preferred embodiments of the invention

Described below, specific embodiments of relate to methods and systems for laser micromachining of the substrate. Microprocessing is a technological way managed selective removal of substrate material. Removing substrate material, by laser micromachining to form a structural element having the desired dimensions and extending into the substrate. Such structural elements can be either through structural elements, such as a slot, which pass through the thickness of the substrate or at least two surfaces of the substrate, or deaf structural elements, such as deepening, which pass through the thickness of a substrate or a surface of the substrate.

Examples of structural components will be described mainly in the context of the formation of the slots for ink supply (slots) in the substrate. These substrates with slots included in the inkjet printing or feathers and/or (among other applications) different devices, created by the technology of microelectromechanical systems (MEMS (MEMS)). The various elements described below, illustrated are not to scale.

Below are examples of size, shape and location of Conques is to maintain structural elements. However, using the proposed methods and devices to determine the size and geometry of structural elements of any type.

Printhead 14 (1) in the described embodiment contains an edge step 120 for supplying the fluid from the edge of the resistors (or ejectors fluid) 61. The printhead may also have a recess 124, which is partially recessed into the surface of the substrate. This printhead also shows the slot or channel 126 for supplying the fluid to the resistors 61 and/or the number of holes 127, feed the fluid to the resistors 61, with each slot, and each hole formed by the described process laser ultraviolet range (UV laser). On the print head (1) is possible, at least two of the described structural elements. For example, on the print head 14 can be formed only feed holes 127 and the slot 126 and the alternative embodiment can also be formed regional step 119 and/or the recess 124. In another example, the printhead formed end step 120 and the slot 126 and the alternative embodiment can also be formed in the edge recess 124 and/or the feed holes 127.

Figure 2 shows a cross-section of the printhead 14 in which the slot 126, with wall 123 of the slot (or side walls), passes through the substrate 102. The formation of the slits (or the area of the slot in the substrate described in more detail below. In another embodiment, form many of the slots in a given matrix. Mirrortree gaps or interstices between adjacent slots in the matrix or substrate are small and amount to 10 microns. In one embodiment, the size of 10 microns is almost twice the area of influence of heating for each slot, where the zone of influence of heating - this is the area along the walls of the slot, which is exposed to the laser processing described in this application.

Figure 2 shows that the thin film layers 120 (or active layers of thin-film package, electrically conductive layers or the layers of the microelectronic means) formed by deposition on the front or first side (or surface) 121 of the substrate 102. The first side 121 of the substrate is opposite the second side (or surface) 122 of the substrate 102. Thin-film package 120 includes at least one layer formed on the substrate, and in a particular embodiment, - masks at least a portion of the first side 121 of the substrate 102. In alternative or additional embodiment, the layer 120 electrically isolates at least a portion of the first side 121 of the substrate 102.

As shown in the first VA is iante implementation of the printhead (figure 2), thin-film package 120 includes a sealing layer 104, the resistive layer 107, the conductive layer 108, a passive layer 110, a cavitation barrier layer 111 and the barrier layer 112, each of which is formed or deposited on top of the first side 121 of the substrate 102 and/or the previous layer (the previous layers). In one specific embodiment, the substrate 102 is made of silicon. In other embodiments, the implementation of the substrate can be made from one of the following materials: monocrystalline silicon, polycrystalline silicon, gallium arsenide, glass, silica, ceramic or a semiconductor material. Different material listed as a possible substrate materials are not necessarily interchangeable and are chosen depending on where they should be used. Thin-film layers provided with a drawing and treated properly for forming resistors 61 in the resistive layer, the conductive paths of the conductive layer and the activation of the camera 130, at least in part bounded by a barrier layer. The barrier layer 112 restricts the activation chamber 130 in which fluid is heated by the corresponding resistor, and limits coplowe hole 132 through which the discharged heated fluid medium. In yet another embodiment, powerchallenge layer 112 deposited layer with holes (not shown), having apertures 132. As is known in the art, it is possible to use other patterns and arrangements of layers and components.

Through the layer (s) 120 formed on the substrate, the channel 129 which provides a message through the fluid medium between the activation of the camera 130 and the slot 126 so that fluid flows through the slot 126 and into the activation chamber 130 through the channel 129. Channel 129 for the fluid is not in the center of the slot 129. However, the substrate with the slits, formed as described, essentially the same for the cases when the input 129 is located in the center and not in the center.

Figure 3 shows a top view of the printhead 14 and the slots 126 without the barrier layer 112. Along the slits 126 are resistors 61. Wall 123 of the slot has a notch (or vertical line) and rough zone (or perforated zone) around the middle of the slot 126 formed through different processes of formation of the slits. Roughened area is formed by notching around the middle of the slot 126. In this place, in the middle of the slot is minimized bending movement - compared to some place on the surface of the slot, therefore, the mechanical stress in perforated rough area will be less during processing. As a result, in this perforated cher houtoi zone, so - and across the substrate 102, minimizing the formation of cracks.

On figa-4C illustrate the process of forming a structural element in the silicon substrate 200. The silicon substrate has a thickness t. Describes the different ways of implementation can operate satisfactorily at different values of thickness of the substrate. For example, in some cases, the thickness may range from less than about 100 microns to about 2000 microns. Other options for implementation may have parameters outside this range. The thickness of the substrate in additional embodiments, the implementation can be about 675 microns.

At a distance 208 from the first surface 206 of the silicon substrate 200 is the tool 202. Distance 208 is changed in the range from 25 to 100 microns. In some embodiments, the length 208 may be less than 25 microns. The tool 202 has a width of 210, which may be a length that is used to determine the size or square structural element, for example a slot formed in the silicon substrate 200. The material of the tool 202 is a metal or alloy of metals. The tool 202 contains titanium, low carbon or stainless steel.

Then on the first surface 206 of the silicon substrate 200 serves suspension 212, which contains abrasive materials. The suspension can be served on whole paragraph is pout surface 206 or only on those parts of it, where should form a structural element or structural elements. In some embodiments, the implementation of the suspension 212 contains aluminum oxide, silicon carbide, diamond or boron carbide.

Then the tool 202 during its movement perpendicular to the first surface 206 inform vibration with a frequency in the range from 19 to 25 kHz and with an amplitude in the range from 13 to 63 microns in the process of filing a suspension. You can change the frequency and amplitude, if necessary.

On FIGU shown that, during communication of vibration of the tool 202 suspension 212 is pushed onto the first surface 206, forming a structural element 214, which has a profile, facing to the profile of the tool 202. You may also notice that the width 214 (which may be long) structural element 216 is slightly bigger than the width 210 of the tool 202. In some cases, the width 214 of less than 10 microns greater than the width 210.

Material is removed at a rate of about 2.8 microns per second. In such cases, the structural element can be formed through the second surface 218 of the substrate from the first surface 206 of approximately 4 minutes, if the thickness of the substrate is about 675 microns.

As shown in figs, constructive element 216 is formed over both surfaces of the first 206 and second 218. The structural element may be a chap who chem constructive element, which passes through the first surface 208, but does not reach the second surface 218.

On figa-5F illustrate the process of forming a structural element in accordance with another embodiment of the invention. Through constructive element contains the first recess 302, which starts from the first side 304 of the substrate 300, and the second recess 306 (figs), which starts from the second side 308. To simplify the consideration of these recesses are shown in the respective pairs. For example, on figa shows a part-sectional structural element and shows the length L1and the depth x of the first recess. On FIGU shows part of the cross section orthogonal to the view shown in figa, and shows the width w1the recess 302 and the same depth x of the first recess 302, which is shown in figa.

The first recess 302 may be formed through a process of ultrasonic grinding, shown in figa-4C. Tool and machine to create the recess 302 is presented on Fig.7.

The recess 302 extends approximately 50% of the thickness of the substrate 300 - depth H. In specific embodiments, the implementation, where the substrate 300 has a depth of about 675 microns between the first side 304 and second side 308, the depth of x is at least about 335 microns.

Length L1is wdol the first axis of the recess, and a width along a second axis, transverse to the first axis. On figs and 5D, and file and 5F illustrates the cross-section with dimensions of length and width ratios which are similar to those illustrated in figa and 5th Century

On figs shows a partially completed second recess 306, which is formed from the second side 308. In various embodiments, the implementation of the second recess 306 may be formed by removing substrate material through the second surface 308. In this example, for forming the second recess 306 is possible to use reactive ion etching, which is a type of wet etching.

Another way to create a second recess 306 provides for the processing of sand (drilling), which is a mechanical cutting process, accompanied by removal of the target material particles, such as alumina, supplied from the system air injection under high pressure. In other embodiments, the implementation can be applied one or more of the following methods of forming the second recess: wet etching, dry etching, laser processing, drilling sand processing a stream of abrasive and mechanical processing machines, ultrasonic abrasive polishing and others. Machining on machine tools may include the use of various the silt and drills, which rotate and vibrate, usually used to remove the substrate material.

On five-5F shows a finished second recess 306, having a length L2width w2and depth. This deepening is crossed or otherwise connected with part of the first recess. The combination of these two recesses forms a slot 320 that passes through the thickness of the substrate and through which may leak fluid, for example liquid. Thus, at least for part of the substrate is true that depth (x and y) both recesses, taken together, is equal to the thickness t. The second recess intersects with the first recess along the entire length L2. In other embodiments, implementation of the second recess may overlap with the first recess in length. In addition, a second recess (fige) can be longer than the first recess, thus surrounding the portion of the first grooves, resulting in all its length is within the second recess.

In another embodiment (fig.5F) has a slot 320 formed in the first recess 302 having a generally flat side walls, and a second recess 306 having a generally concave side walls. In this embodiment, the maximum width W1the first recess is smaller than the maximum width W2the first recess. In d the natives implementation options you can use other configurations.

Although the described embodiments of illustrate only the removal of material from a substrate for forming the desired recesses in the intermediate stages is actually possible to add material to the substrate. For example, you can bind the materials, methods of deposition as part of the sequence of formation of the slot and then remove either partially or completely.

One additional procedure, such as reactive ion etching, can be used for polishing the surface of the walls of the slot and also to relieve residual stress for hardening of the substrate 300 after will be formed both depth - first 302 and second 306. In addition, the process of wet etching can be used for cutting the edges of the structural element at the second surface 308 to reduce the likelihood of chipping and potential clogging of the slot or its parts.

Alternative approaches to forming the first recess 302 include applying a wet provide the Etchant on the first side 304 before ultrasonic grinding and forming the first recess by applying a wet provide the Etchant, while the second recess 306 formed through ultrasonic grinding. Such approaches allow to receive the first edge of the recess 302, which may characterizat the Xia minimal risk of chipping. You can use a wet provide the Etchant for the second side 308 and subsequent ultrasonic treatment with either the first side 304 or the second side 308 to complete the formation of the structural element 320. This approach allows to obtain a tapering recess on the second side 308 to make the substrate 300 more flexible and easier to bend toward the first side 304 without cracking of the substrate 300 or the film formed on the substrate 300.

Another approach is the use of ultrasonic abrasive grinding (WAS) for forming the notches 306, and then wet etching for forming the recess 302 in order to obtain structural element 320. This approach gives flexibility when the workpiece does not provide access to the first side 304, for example, if it is formed of a thin-film structure with small holes. Thus, it is possible to use ultrasonic grinding to remove the bulk of material from the second side 308 and the first side for forming a structural element 320.

In the variants of implementation, where the second recess 306 formed by dry etching the first recess 302 formed as described for figa-5D, so that the depth of x is approximately 90% of the total thickness t of the substrate 300. You can then use p is ocess dry etching to create a second recess 306.

In the variants of implementation, where the second recess 306 formed through laser processing, drilling sand processing a stream of abrasive or mechanical processing on the machines, you can use ultrasonic abrasive grinding for forming the first recess 302.

An additional approach may include the use of wet provide the Etchant on the first side 304 or the second side 308, or on both sides to limit the hollows, which have a smaller depth than the depth of the first recess 302 and the second recess 306, followed by ultrasonic vallipunam any of these recesses on either side for forming the through structural element. This will give the optical quality cutting edge and beveled walls of the slot at any one side or on both sides 304 and 308.

The advantage of the processes described with reference to figa-4C and 5A-5C, is that removal of the mass of material can be used more quickly - for example, more than 50%of the processes which are more accurate and cheaper processes. For example, you can use the processes of dry or wet etching to remove less material and create a constructive element to withstand more precisely the ratio of the geometric dimensions and dimensional tolerances, save the I strength of the workpiece, for example, silicon wafers.

It should be noted that although figa-5F entered denote the first recess 302 and the second recess 306, the procedure for manufacturing the recesses need not be the same as in this approach. In addition, the first side 304 and a second side 308 may be integrated circuits or other devices formed on the surface before forming the first recess 302 and the second recess 306.

On figa-6D illustrate the process of forming a structural element in accordance with a more specific implementation options. On figa - 6D shown as formed through structural element 360 having one or more ribs 365. Through constructive element 360 may include a first recess 352, which begins with the first side 354 of the substrate 350, and the second recess 356 (fig.5D), which begins with the second side 358. In these particular embodiments, the implementation of fin 365 is formed during the formation of the first recess 352.

The first recess 352 may be formed through a process of ultrasonic grinding, the tool and the machine used to create recesses 352 depicted in Fig and described in connection with the drawing. To form a single end-to-end structural element 360 are several instrumento is, so in areas of the substrate 350, over which are the instruments that are formed ribs. In addition, the entire first surface 354 is used abrasive material or suspension.

In the embodiment, on FIGU recess 352 passes approximately 50% of the thickness of the substrate 350 in the positions shown by the depth of X. however, the depth of the corresponding areas, over which are the instruments is less than the depth of x, and can be somewhat less than approximately 50% of the thickness of the substrate 350. In specific embodiments, the implementation, where the substrate 350 has a depth of about 675 microns between the first side 354 and the second side 358, the depth of x is at least about 335 microns.

On figs shows a partially completed second recess 356, which is formed from the second side 358. The second recess 356 can be formed by removing substrate material through the second surface 358. In this example, for forming the second recess 356 is possible to use reactive ion etching, which is one type of wet etching.

Another way to create a second recess 356 provides drilling sand, which is a mechanical cutting process, accompanied by removal of the target material particles, for example, aluminum oxide, poda is Emami from the system air injection under high pressure. In other specific embodiments, the implementation can be applied one or more of the following methods of forming the second recess: wet etching, dry etching, laser processing, drilling sand processing a stream of abrasive and mechanical processing machines, ultrasonic abrasive polishing and others. Machining on machine tools may include the use of various saws and drills that rotate and vibrate, usually used to remove the substrate material.

On fig.6D shows a finished second recess 356, having a length L2. This deepening is crossed or otherwise connected with part of the first recess 352. The combination of these two recesses forms a slot 360, which passes through the thickness of the substrate and through which may leak fluid, for example liquid. Thus, at least for part of the substrate is true that depth (x and y) both recesses, taken together, is equal to the thickness t. As shown in a possible specific embodiment, at figa-6D, the second recess intersects with the first recess along the entire length L2. In other embodiments, implementation of the second recess may overlap with the first recess is not along its length.

In the embodiment shown in fig.6D, there is a slot 360 : open the consistent from the first recess 352, having generally flat side walls, and a second recess 356 having a generally concave side walls. In addition, inside the slits 360 formed ribs 365, resulting in a number of sections 370 subprocesses. The presence of ribs 365 causes the enhancement of the mechanical properties of the substrate 350, resulting in reduced likelihood of breakage or deformation. The size and geometric shape of the rib sections 365 and 370 subprocesses can be achieved by optimization of the flow properties of the slot 360 and mechanical properties of the substrate 350.

It should also be noted that the ribs 365 does not have to be equidistant from each other and can have different forms.

Figure 7 shows the ultrasonic grinding machine 400 in accordance with one embodiment, which comprises a frame 405 that is connected with the driving device 410, which may include high-frequency generator with an output of more than 500 watts, which generates high-frequency electric energy at a frequency of about 20 kHz. Energy is transferred to the inverter, which converts it into mechanical energy of vibration of the same frequency, which is transmitted to the tool through a movable guide which is connected to the horn sonotrode 415. In some specific embodiments, the implementation of the sonotrode is 415 consist of Monel-metal, in one specific embodiment, includes corrosion-resistant alloys, having in its composition a containing silver and copper (28%), Nickel (67%) and smaller amounts of such metals as iron, manganese and aluminum. Sonotrode serve to increase the amplitude of oscillations on the front of the Converter with a small loss of amplitude or without its losses, as well as for a message to its actual tool that is installed before sonotrode. The amount used sonotrode - one or more - depends on application needs. The size, shape and design of the sonotrode are implemented in such a way that in combination with a real instrument, they form a node, which can be fine-tuned to the resonant frequency of the transducer. Specifies the device has a capability message vibration sonotrode 415 so that the base 405 vibrates in a direction essentially normal to the first surface 420.

Vibration frame 400 also causes vibration instruments 425, which are connected with the frame, in a direction which is essentially normal to the surface 435 of the substrate 440. When the tools 425 vibrate with simultaneous feed suspension 440 on the surface 435 of the substrate 440, in those areas of the surface 435, which generally opposite the location of each instrument 425, armywide several structural elements, the size and shape of which are "negative image" of sizes and shapes of tools.

The profile of each tool 425 may differ from the profile of any of the other tools 425, so that each generated structural element may be different, or one or more structural elements can be the same. In addition, the number of instruments 425 can be changed depending on the number of formed structural elements, for example it may be equal to one or greater number.

7 each tool is shown as spaced a distance d from the surface 430. The distance between the tool and the partial surface 430 in General is in the range from 0.013 m to 0,063 mm, however, the distance d between one or more instruments 425 and the said surface may be different from the distance d between the other instrument (other instruments) and the said surface.

In other embodiments, the implementation of each tool 425 may be connected to a different frame so that the frequency of vibration of each instrument 425 may differ. In such scenarios, the implementation of each instrument connected to the frame by means of fastening means.

The advantage of ultrasonic grinding machine is that the process preduster is that the use of this machine, essentially, does not depend on the number or geometry created by structural elements. The number of tools 425 and their profile can be changed regardless of any other structural elements that must be established. The time required to create several different structural elements, is essentially the same as the time required to create several similar structural elements or a single structural element.

Furthermore, the single plate, which can be divided with the receipt of several parts, may have structural elements made in these parts simultaneously, so that each part can be formed of one or more structural elements. Thus, in one operation to form structural elements in several parts simultaneously. After this operation, the plate can be divided with the receipt of several parts.

It should be noted that in some embodiments, the implementation of the first recess 302 and the second recess 306 can be formed in any other way, and then you can apply the method of ultrasonic grinding, to select the part, which should create a constructive element.

On Fig shows a portion of the ultrasonic grinding machine in accordance with another variant of the westline, which comprises a frame 455 connected with the driving device 460. Moreover, there is an energy transfer from the transducer located in the master device, to the tools 470, 475 and 480 through a movable guide which is connected to the horn sonotrode 465.

Tools 470 and 480 are located at the first distance from the substrate 490, while the tool 475 is located on the second distance x that is less than the distance from the surface of the substrate. Distances x and y determine the height of the ribs, such as ribs 365, which are formed in the slits. That is, the size and shape of the tool is turned in relation to the size and shape of the resulting structural element. In addition, in some specific embodiments, the implementation of the first distance and the second distance x may be the same. In addition, the tools 470, 475 and 480 may have a beveled sections and straight sections (five).

The surface may be abrasive or slurry 485 during vibration instruments 470, 475 and 480. Ultrasonic grinding machine 450 operates in accordance with the same settings and features, which are described with reference to Fig.7.

On Fig shows three of a tool for forming the slits, and their sizes are a function of the desired number of ribs 365 (figa-6D). Alternatively, in order to use multiple tools on a single frame 455 for the formation of several slots in the ribs.

On figa-9F shows a possible profile of tools that can be used with ultrasonic grinding machine in accordance with several specific options for implementation. It should be noted that the profile of the structural element formed by the instruments depicted on figa-9D, in essence, is reciprocal with respect to the profile of the instruments.

Tools can have square ends (figa), the round ends (pigv), the beveled ends (figs) and/or oval (fig.9D). In addition, you can use other profiles. In addition, one end of each tool can have a profile different from the profile of the other end, if so desired.

On file shown that the tool can have a profile, varying in shape along its length, it is shown that the tool has an essentially square cross section over the first section of its length and essentially triangular cross-section for the second leg of its length. Using this type of profile tool, you can create the geometry of the structural element with the tool, leading him along the depth of the structural element. When the structural element is a slot that supports the flow of fluid, you can create a beveled first or second side of the mentioned items is NTA, depending on the desired profile.

On figa-10D celebrate, here depicted cross-section through structural elements, such as slots, supporting the flow of fluid. On figa depicted through structural element having two different widths along its length, while figv depicted through structural element, which is a step in which the width increases along the length of this end-to-end structural element in one direction. On figs depicted beveled profile for the walls of the slot, which can be decorated with beveled profile tool, such tool, which is shown in fige. On fig.10D depicted through structural element having a partially narrowed cross-section, which tapers, ending essentially square cross-section.

Other profiles of structural elements that can be formed using a variety of instruments that include, but are not in a restrictive sense - slots, which have a square cross-section and essentially the same width throughout the depth of the slots, which have a wall, beveled along the entire depth or some part of the depth of the substrate, and slits, which have two beveled and two essentially straight walls along the depth. In addition, each of the profiles can OEM home button Flex cable is while in General, the presence of a square, half-round, round, beveled or oval holes on the first and/or second sides of the substrate.

On figa-11F illustrates the process of forming a structural element in accordance with additional options for implementation. Through structural element may include a first recess 502, which starts from the first side 504 of the substrate 500, and the second recess 506 (shown in figs), which starts from the second side 508. To simplify the consideration of these recesses are shown in the respective pairs. On figa shows a part-sectional structural element and shows the length L1and the depth x of the first recess. On FIGU shows a part-sectional, essentially orthogonal to the view shown in figa, and shows the width w1recesses 502 and the same depth x of the first recess 502, which is shown in figa.

The first recess 502 is formed by a process of processing an electronic discharge. In variants of the implementation shown in figa-11F, the electrode 510, which has the shape and size of the inverse in relation to the size and shape of the desired structural element embedded in the substrate 500 in the position, which must ensure the formation of the first structural element 502. The drive electrode 510 is performed by the servo motor 512 through persuasion the El 514. Electrode 510 may include any number of conductive materials, including - but not in a restrictive sense - graphite, copper, copper-tungsten, silver-tungsten, brass, steel, carbide, and tungsten. In other specific embodiments, the implementation electrode 510 may be replaced with residential wiring, which in some embodiments may not have a diameter in the range from 0.025 to 0.13 mm.

To form the first structural element 502 of the substrate 500 can be immersed in the dielectric fluid medium 516 or cause a dielectric fluid medium on the first surface 504 during the formation of the first structural element 502. To electrode 510, which discharges electrical energy, for example, in the form of sparks at the tip of the electrode 510, sum up the current or other electrical signal. The electrical energy causes melting of the substrate 500 near the point of contact with the tip electrode 510. When the plunger 514 causes the advancement of the electrode 510 in the substrate 500, is forming a structural element 502 at the desired depth X.

In the embodiment illustrated in figa, the recess 502 passes approximately 50 percent of the thickness of the substrate 500, as shown by the depth X. When the substrate 500 has a depth of about 675 microns between the first side 504 and the second side 508, the depth of x is, what about the least about 335 microns.

Length L1runs along the first axis of the recess and a width along a second axis, transverse to the first axis. On figs and 11D, and file and 11F illustrates the cross-section with dimensions of length and width ratios which are similar to those illustrated in figa and 11th Century

On figs shows a partially completed second recess 506, which is formed from the second side 508. In various specific embodiments, the implementation of the second recess 506 may be formed by removing substrate material through the second surface 508. In this example, for forming the second recess 506 is possible to use reactive ion etching, which is one type of wet etching.

Another way to create a second recess 506 provides drilling sand, which is a mechanical cutting process, accompanied by removal of the target material particles, for example, aluminum oxide, supplied from the system air injection under high pressure. In other specific embodiments, the implementation can be applied one or more of the following methods of forming the second recess: wet etching, dry etching, laser processing, drilling sand processing a stream of abrasive and mechanical processing machines, ultrasonic abrasive grinding and the other. Machining on machine tools may include the use of various saws and drills that rotate and vibrate, usually used to remove the substrate material.

On five-11F shows a finished second recess 506, having a length L2width w2and depth. This deepening is crossed or otherwise connected with part of the first recess. The combination of these two recesses forms a slot 520, which passes through the thickness of the substrate and through which may leak fluid, for example liquid. Thus, at least for part of the substrate is true that depth (x and y) both recesses, taken together, is equal to the thickness t. As shown in this embodiment, and are best seen on file, the second recess intersects with the first recess along the entire length L2. In other embodiments, implementation of the second recess may overlap with the first recess is not along its length. In addition, it is clear from file, the second recess may be longer than the first recess, thus surrounding the portion of the first grooves, resulting in all its length is within the second recess.

In the embodiment shown in fig.11F, there is a slot 520, formed from the first recess 502 having a generally flat side CTE is key, and second recesses 506, having a generally concave side walls. In this case, the maximum width W1the first recess is smaller than the maximum width W2the first recess. In other specific embodiments, the implementation can use other configurations.

Although described specific embodiments of illustrate only the removal of material from a substrate for forming the desired grooves, the intermediate stages in some specific embodiments, the implementation is actually possible to add material to the substrate. For example, you can bind the materials, methods of deposition as part of the sequence of formation of the slot and then remove either partially or completely.

Another one is an additional procedure, such as reactive ion etching, can be used for polishing the surface of the walls of the slot and removal of residual mechanical stresses to strengthen the substrate 500 after will be formed both depth - first 502 and second 506. In addition, the process of wet etching can be used for cutting the edges of the structural element at the second surface 508 to reduce the likelihood of chipping and potential clogging of the slot or its parts.

Alternative approaches to forming the first recess 502 provide the more of the wet deposition of provide the Etchant on the first side 504 before ultrasonic grinding and forming the first recess by applying a wet provide the Etchant, thus the second recess 506 is formed by processing the electronic discharge. Such approaches allow to receive the first edge of the recess 502, which may have a minimal risk of chipping. Another approach may involve the use of wet provide the Etchant for the second side 508 and subsequent ultrasonic treatment with either the first side 504, or from the second side 508, to complete the formation of the structural element 520. This approach allows to obtain a tapering recess on the second side 508, to make the substrate 500 more flexible and easier to bend toward the first side 504 without cracking of the substrate 500 or the film formed on the substrate 500.

In the variants of implementation, where the second recess 506 is formed by dry etching the first recess 502 is formed as described in connection with figa - 11D, so that the depth of x is approximately 90% of the total thickness t of the substrate 500. You can then use the process of dry etching to create a second recess 506.

In the variants of implementation, where the second recess 506 is formed by laser processing, drilling sand processing a stream of abrasive or mechanical processing on the machines, you can use ultrasonic abrasive grinding for forming the first recess 502 after Lenogo etching or both - the first and second sides 504 and 508 before forming the first recess 502 or the second recess 506.

An additional approach may include the use of wet provide the Etchant on both the first and second sides 504 and 508, to limit the hollows, which have a smaller depth than the depth of the first recesses 502 and second recesses 506, followed by processing an electric discharge any of these recesses on either side for forming the through structural element. This will give the optical quality cutting edge and beveled walls of the slot at any one side or on both sides 304 and 308.

It should be noted that although figa-11F introduced the designation of the first recesses 502 and second recesses 506, the procedure for manufacturing the recesses need not be so. In addition, the first side 504, and the second side 508 may be integrated circuits or other devices formed on the surface before forming the first recesses 502 and second recesses 506.

In addition, although figa-11F shows the formation of the first recess 502 and second recesses 506 forming the through structural element 520, this element 520 can be formed by forming the first recess as described with reference to figa and 11, the entire depth of the substrate 500 through the first and with the horon 504, and the second side 508.

On figa-12C illustrate the process of forming a structural element in accordance with still one more specific variants of implementation. On figa-12C is shown as formed through the structural element by a process of processing an electronic discharge as described in relation to figa-11F. The difference of the process illustrated in figa-12C, is that for the formation of cross-cutting structural element 560 use multiple electrodes smaller (these electrodes are not shown, and their size and shape are drawn in relation to the size and shape of the desired structural element).

In the embodiment depicted in figa, the recess 552 is held approximately 50 percent of the thickness of the substrate 550 in the positions shown by the depth of X. however, the depth of the corresponding areas, over which are the instruments is less than the depth of x, and can be somewhat less than approximately 50 percent of the thickness of the substrate 550. In specific embodiments, the implementation, where the substrate 550 has a depth of about 675 microns between the first side 554 and the second side 558, the depth of x is at least about 335 microns.

On FIGU shows a partially completed second recess 556, which is formed from the second the second hand 558. In various specific embodiments, the implementation of the second recess 556 may be formed by removing substrate material through the second surface 558. In this example, for formation of the second recesses 556 can be applied reactive ion etching, which is one type of wet etching.

Another way to create a second recess 556 provides drilling sand, which is a mechanical cutting process, accompanied by removal of the target material particles, for example, aluminum oxide, supplied from the system air injection under high pressure. In other specific embodiments, the implementation can be applied one or more of the following methods of forming the second recess: wet etching, dry etching, laser processing, drilling sand processing a stream of abrasive and mechanical processing machines, ultrasonic abrasive polishing and others. Machining on machine tools may include the use of various saws and drills that rotate and vibrate, usually used to remove the substrate material.

On figs shows a finished second recess 556, having a length L2. This deepening is crossed or otherwise connected with part of the first recess 552. The combination of these two deepened the th forms a slot 560, which passes through the thickness of the substrate and through which may leak fluid, for example liquid. Thus, at least for part of the substrate is true that depth (x and y) both recesses, taken together, is equal to the thickness t. As shown in a possible specific embodiment, at figa - 12C, the second recess intersects with the first recess along the entire length L2. In other specific embodiments, the implementation of the second recess may overlap with the first recess is not along its length.

In the embodiment shown in figs, there is a slot 560 formed from the first recess 552 having generally flat side walls, and a second recess 556 having a generally concave side walls. In addition, inside the slots 560 formed ribs 565, resulting in a number of sections 570 subprocesses. The presence of ribs 565 causes strengthening of the mechanical properties of the substrate 550, resulting in reduced likelihood of breakage or deformation. The size and geometric shape of the ribs 565 and sections 570 subprocesses can be achieved by optimization of the flow properties of the slot 560 and mechanical properties of the substrate 550.

It should also be noted that the ribs 565 does not have to be equidistant from each other, and may also have asnie form.

On Fig and 14 depict examples of products that can be manufactured using at least some of the described embodiments. On Fig shows a schematic view of a printing device in which it is possible to use the cartridge for printing. In this embodiment, printing device is a printer 700 in the form of an inkjet printer. The printer 700 may be performed with the option of black and white and/or color printing. The term "printing device" refers to any type of printing device and/or device imaging, in which a substrate (applied substrate) with slots for implementing at least part of the functionality of the device. Examples of such printing devices may include, but is not in a restrictive sense, printers, Fax machines and photocopiers. In this possible printing device substrate with slots are part of the printhead built into the cartridge for printing, an example of which is described below.

On Fig shows a schematic representation of a possible cartridge 800 for printing, which can be used in a possible printing device, and which contains the print head 802 and the housing 804 cartridge that supports p is tatawwu head. Although this cartridge 800 to print a single print head 802, in other specific embodiments, the implementation of possible multiple printheads on a single cartridge.

The configuration of the cartridge 800 to print determines the presence of an Autonomous source of fluid or ink inside the body 804 of the cartridge. In alternative or additional embodiments, other configurations of the print cartridge may have a configuration that causes the receiving fluid from an external source. Specialists in the art will be aware of other possible configurations.

1. Method of forming a slit for supplying ink in a semiconductor substrate for an inkjet printhead, and the slit passes through the semiconductor substrate from the first side to the second side, namely, that
forming the first structural element by repeated application of the discharge electrical energy to the first side of the semiconductor substrate by the application of abrasive material on the first side of the semiconductor substrate,
inform the vibration of the tool opposite the first side, and the tool vibrates with a certain frequency and at a distance from the first side to the formation of the first structural element, remove the semiconductor material padlock the second side for forming the second structural element, moreover, at least part of the first and second structural elements intersect to form a slit for supplying ink passing through the semiconductor substrate, and to remove using a method selected from the group consisting of wet etching, dry etching, laser processing, drilling sand processing a stream of abrasive, rotary-vibratory drilling, cutting saws and machining on machine tools.

2. The method according to claim 1, characterized in that the first structural element has a first depth from the first side, is equal to at least half the thickness of the semiconductor substrate between the first party and the second party.

3. The method according to claim 1, characterized in that the second structural element has a depth of about 100 μm, and the thickness of the semiconductor substrate is about 675 microns.

4. The method according to claim 1, characterized in that the second structural element has a depth of at least 50 μm, and the thickness of the semiconductor substrate is about 675 microns.

5. The method according to claim 1, wherein removing material of the semiconductor substrate to carry multiple applications of the discharge energy.

6. The method according to claim 1, characterized in that the repeated application of the discharge energy is carried out by application of an electric spark for the formation of the first con is reconstructive element.

7. The method according to claim 1, characterized in that the frequency of vibration is in the range from 19 to 25 kHz.

8. The method according to claim 1, characterized in that the distance from the tool to the first side is in the range of from about 13 to about 100 microns.

9. The method according to claim 1, characterized in that the tool has a profile, which is reciprocal to the profile of the first structural element.

10. The method according to claim 1, characterized in that it contains many tools, one tool of many tools have a profile that differs from the profile of another tool among many tools.

11. The method according to claim 1, characterized in that the structural element, formed one of the many tools that differs from the structural element, formed another tool among many tools.

12. The method according to claim 1, characterized in that for forming the first structural element perform the following steps:
cause the abrasive material slurry on the first surface of the semiconductor substrate,
tell vibration set of tools, each of which is immersed in the abrasive slurry and is in different positions, essentially opposite the first side, each of the many tools vibrates with a certain frequency and at a distance from the first side of deformirovaniya each instrument structural element.

13. The method according to item 12, wherein the vibration frequency is one tool of many tools different from the frequency of vibration of another tool among many tools.

14. The method according to item 12, wherein the vibration frequency is one tool of many tools is in the range from about 19 to about 25 kHz.

15. The method according to item 12, characterized in that the distance from one tool of many tools until the first side is different from the distance from the first side to another tool among many tools.

16. The method according to item 12, characterized in that the distance from one tool of many tools until the first side is in the range of from about 13 to about 100 microns.

17. The method according to item 12, characterized in that it further form a wax support on the second side of the substrate, and the second side is located essentially opposite the first side.

18. The method according to item 12, characterized in that one tool of many tools have a profile that differs from the profile of another tool among many tools.

19. The method according to item 12, characterized in that the structural element, formed one of the many tools that differs from the structural element, formed another of the many tools.



 

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FIELD: technological processes.

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FIELD: printing.

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EFFECT: invention provides stable manufacturing of substrate for fluid ejection heads with form accuracy and high efficiency of technological process.

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FIELD: technological processes.

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FIELD: process engineering.

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FIELD: printing.

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FIELD: chemistry.

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13 cl, 4 dwg, 5 tbl, 9 ex

FIELD: printing.

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14 cl, 13 dwg

FIELD: printing industry.

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EFFECT: improved quality of printing.

16 cl, 8 dwg, 1 tbl

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