Electrical embedment compound

FIELD: electricity.

SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.

EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).

1 tbl

 

The invention relates to epoxy insulating filling the hot curing compounds used for electrical insulation and hardening of nodes and blocks high-voltage devices, chokes, metallomesogen transformers, for sealing and protection of items of electronic equipment from moisture and mechanical damage.

Known epoxy compound EPK-1 based on epoxidations resin ED-20, maleic anhydride and accelerator dimethylaniline used for impregnation of the windings of transformers, chokes (OST 92-1006-77) with high insulating characteristics at 20°C: specific volume electric resistance of 1.9·1013Ohm·m; the tangent of dielectric loss angle of 0.15; electric strength not less than 18 kV/mm, but with a large coefficient of linear expansion (TCLE) (55-60)·10-61/deg C. the Compounds with high values of thermal expansion can collapse under the action of internal stresses arising due to the limitations of rigid structures thermal and shrinkage strains of the compound under the action of thermal Cycling during operation. These stresses act over a long period of time flooded with products not at the time of manufacture and during operation [1, s].

Therefore, high electric insulation is elitnyh blocks metallomesogen transformers to avoid stresses due to different thermal expansion of metals and compound must have a minimum thermal expansion. For this part of the compounds injected a significant amount of mineral fillers with a small value of thermal expansion. In particular, insulating material, closest to the proposed invention, patent of Russia 2046413, CL NW 3/16, publ. 20.10.95, including epoxygenase resin, hardener anhydrite type and a large amount of mineral filler is aluminum oxide, has a value of thermal expansion in the temperature range -40 ÷ +40°C=(25,8÷36)·10-61/deg. The disadvantages of this compound are not sufficiently low value of linear thermal expansion coefficient in the temperature range -40 ÷ +40°C and wide temperature range from -60 to +120°C, low specific volume resistance, a large value of tangent of dielectric loss angle. Reduction of the latter index leads to loss of useful energy and, consequently, to reduce overheating of structures and equipment, potted.

The objective of the invention is to provide a dielectric compound with high values of specific volume electrical resistance, low tangent of dielectric loss and temperature coefficient of linear expansion at temperatures from -60 to +120°C.

The technical result is a significant improvement of technological properties and the improvement of working conditions.

The put is fair task is achieved by that insulating molding compound, comprising epoxygenase resin, hardener anhydrite type, oligoether, accelerator and mineral filler, as oligoether contains two oligoether with epoxy groups: triglyceridemia ether of trimethylolpropane and monoglycerol the alkylphenol ether as a hardener contains isomethyltetrahydrophthalic anhydride, as accelerator - 2,4,6 Tris(dimethylaminomethylphenol, as mineral filler is quartz powder, in the following ratio of components, parts by weight:

epoxy Dianova resin60-70
triglycerol ether of trimethylolpropane15-20
monoglycidyl ether of alkylphenol10-20
isomethyltetrahydrophthalic anhydride90-95
2,4,6 Tris(dimethylaminomethyl)phenol0,8-1,0
quartz powder400-500

Compositions for the proposed compound was prepared as follows. As the epoxy resins used a mixture of epoxy Dianova resin ED-20 or ED (GOST 10587-93), oligopeptides: brand Naproxin TMP - triglycidyl ether of trimethylolpropane, and brand Naproxin AF - monoglycidyl ether of alkylphenol, produced by LLC "NPP at macromer according to the technical requirements [2]. As the hardener used isomethyltetrahydrophthalic anhydride (out-MTHFA) grade a (TU 2418-399-05842324-2004) with the addition of accelerator - 2,4,6 Tris(dimethylaminomethyl) phenol brand Alkoven MA TU 6-22-362-96 or product up-606/2 according to TU U 6-00209817.035-96. The composition was filled with powders of quartz ground marks KP or marshallia.

For the experimental characterization of the proposed compound was prepared 4 composition (see table) on the following technology. In a porcelain Cup mixed sample epoxygenase resin, Epoxide TDM, Epoxide AF, added dried filler quartz powder brand KP or marshalled, thoroughly stirred, kept at 60°C for 20 minutes, was evacuated in a heating Cabinet for 10 minutes. Then the hot mixture was added a portion of the hardener from MTHFA and thruster - pack-606/2, all are thoroughly mixed for 10 minutes, was evacuated at a residual pressure of not more than 20 mm Hg in a heating Cabinet for 10 minutes, poured into molds, machined grease, to obtain samples for testing. Samples in the form utverjdali in a heating Cabinet at the following mode: shutter speed etc is 60°C, 0.5 h, 70°C, 0.5 h, 80°C, 0.5 h and at 120°C for 6.5 h After the end of the curing mode heat chamber was removed, covered with an asbestos blanket to ensure the regime of slow reset temperature. The samples were tested one day after they cool down in a heating Cabinet.

Sample discs of the cured molding compound was determined volume resistivity (ρvin accordance with GOST 6433.2-71.

The tangent of dielectric loss angle (tgδ) was determined according to GOST 22372-77 at a frequency of 106Hz on the same samples disks.

Determination of coefficient of linear expansion (TCLE) was performed by OST 3-2342-89 on the bars of the cured compound with dimensions of 10×10×100 mm temperature ranges: -40÷+40°C; -60÷+20°C; 20÷120°C.

The compositions and test results 4 formulations of the proposed compound and the prototype presented in the table. The value of the linear thermal expansion coefficient of the prototype in the temperature range -60 ÷ +20°C were estimated by calculation.

From the data presented in the table shows a positive technical result, since the proposed compound:

- 8-10 times superior to the prototype in specific volume electric resistance;

has more than 2 times smaller value of tangent of dielectric loss angle;

- smaller values of the coefficient of thermal linear expansion is rhenium, than the prototype, in the range of temperature -40÷+40°C and -60÷+20°C.

These benefits compound according to the invention, in combination with its high mechanical tensile strength (65,0 is 67.5 MPa) and compressive (up to 120.0 MPa) is recommended for the insulation by pouring high-voltage devices containing heterogeneous materials: metal-containing transformers, chokes. The proposed compound with a small value of thermal expansion over a broad temperature range from -60 to +120°C useful for increasing resistance of high-voltage devices containing a piezoelectric ceramics for high loads.

Literature

1. Potochkin I.I., Korotkova N, Tarasov V.N., Lebedev V.S. Modifiers for epoxy resins production NPP at macromer.//The adhesives. Sealants. Technology. - 2006 - No. 7. - P.14-17.

2. Chernin I.Z., laughter F.M., Zherdev, J.V. Epoxy polymers and compositions. M.: Chemistry, 1982.

The compositions and properties of the proposed compound and prototype
ExamplesComposition, parts by weightVolume resistivity ρv, Ohm·m (20÷5)°CThe tangent of the dielectric is of other at a frequency of 10 6Hz (20÷5)°CTCLE, 10-6, deg-1in the temperature range
-40 ÷ +40°C- 60 ÷ +20°C20 ÷ +120°C
1ED-22-60; Naproxin TDM-20; Naproxin AF-20; out-MTHFA-92; UE-606/2-1.0; quartz-5005.0·10130.0059242647
2ED-22-70; Naproxin TMP-18; Naproxin AF-12; out-MTHFA-95; UE-606/2-0,9; quartz-4506,0·10130,0075252725
3ED-20-70; Naproxin TDM-20; Naproxin AF-10, out-MTHFA-93; UE-606/2-1.0; quartz-4003,0·10130,0080242638
4ED-20-70; Naproxin TMP-15; Naproxin AF-15; out-MTHFA-90; UE-606/2-0.8; quartz-5008,0·10130,007023 2537
The proto-typeEpoxy Dianova resin - 15,44÷18,60; Oligopyrroles IFG-9 - 5,15÷at 8.36; the Anhydride of maleic acid - 7,25÷total of 8.74; Dimethylaniline - 0,15÷0,20; aluminium Oxide - rest(2÷5)·10120,16÷0,1825,8÷36By calculation 28÷39-

Insulating molding compound, comprising epoxygenase resin, oligoether, hardener anhydrite type accelerator and mineral filler, characterized in that it contains two oligoether: triglyceridemia ether of trimethylolpropane and monoglycidyl ether of alkylphenol, as anhydrite hardener isomethyltetrahydrophthalic anhydride, as an accelerator of 2,4,6-Tris(dimethylaminomethyl)phenol, as a mineral filler is quartz powder in the following ratio of components, parts by weight:

epoxy Dianova resin60-70
triglycerol ether of trimethylolpropane15-20
monoglycidyl ether of alkylphenol10-20
isomethyltetrahydrophthalic anhydride90-95
2,4,6-Tris(dimethylaminomethyl)phenol0,8-1,0
quartz powder400-500



 

Same patents:

Insulating enamel // 2342723

FIELD: technological processes.

SUBSTANCE: invention is related to finishing baking enamels intended for production of insulating protective coatings for impregnated windings, units and parts of electric machines and devices with insulation of thermal endurance class of (155°C). Enamel that includes filming agent, coupling agent, siccative, pigments, fillers, desired additives and organic dissolvents, as filming agent it contains epoxy ester produced by reactions of etherification and thermal polymerisation 1.0 Mole of epoxy modified resins with content of epoxy groups of 3.5÷4.5 wt %, 2.4 Mole of fatty acids of bodied oils and 1.3 Mole of colophony, and as active filler for increase of electric strength of enamel coating it additionally contains hydrophobic aerosil at the following ratio: Epoxy ester (55%-solution in xylene) 62.0÷81.0, Hydrophobic aerosil 0.3÷0.6, Hydrophobic aerosol 0.3÷0.6, Pigments and fillers 13.0÷29.0, Hydrophobic aerosil 0.3÷0.6, Coupling agent 4.5÷5.5, Desired additives (dispenser, defoaming agent, thixotropic, anti-flotation, antioxidant) 1.5÷6.5, Siccative (cobalt oktoat) 0.2÷0.5, Organic dissolvents 1.5÷7.5.

EFFECT: higher class of enamel thermal endurance, higher adhesion of enamel coating, improvement of coating dielectric properties.

2 tbl, 7 ex

Sealing compound // 2329280

FIELD: chemistry.

SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.

EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.

3 tbl

FIELD: electrical and instrumentation engineering, microelectronics.

SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.

EFFECT: enhanced strength and electric conductivity properties of adhesive composition.

5 cl, 2 tbl

FIELD: antenna engineering.

SUBSTANCE: proposed composite dielectric material used, for instance, to produce antenna lenses of desired dielectric constant and density capable of operating under vibrating load conditions at temperatures ranging between -60 and +85 °C has epoxy resin functioning as binder and hollow glass microspheres and titanium, as fillers, their proportion being given in invention specification.

EFFECT: enhanced resistance to vibrations, enlarged operating temperature range.

2 cl, 1 tbl

FIELD: electrical engineering.

SUBSTANCE: proposed method for producing polymeric case of vacuum circuit breaker includes installation of vacuum chamber in mold, locking of the latter, and chamber sealing followed by filling space between chamber and mold with liquid insulator. In the course of molding, prior to filling chamber-to-mold space with liquid insulator, external surface of chamber is covered with flexible shock-absorbing silicon rubber, epoxy compound being used as liquid insulator. Epoxy compound has following composition, parts by mass: epoxy resin, 100; filler, 360; hardener, 85; promoter, 1. Polymeric case is molded at mold temperature of 140 - 145 °C and pole molding time of 27-35 minutes, followed by hardening for 12 h at 140 °C.

EFFECT: facilitated procedure, reduced cost.

3 cl, 3 dwg

FIELD: insulation materials.

SUBSTANCE: method of preparing insulation compound, which can be used for impregnating and pouring high- and low-voltage components of electrical and radio equipment, transformers, and throttle valves, comprises mixing at temperature 50-60°C resin having molecular weight 1000-6000 with phosphorus-containing modifier, in particular triglycidyl phosphate or diglycidyl methyl phosphate, or diglycidyl methyl phosphonate, after which is added stoichiometric amount of hardener, in particular 4,4'-diaminodiphenylmethane or 4,4'-diaminodiphenyl sulfone, or 4,4'-diaminodiphenyl oxide.

EFFECT: reduced viscosity of compound, enhanced insulation and electric-strength properties, and simplified preparation procedure.

2 tbl, 17 ex

The invention relates to a method for insulating self-extinguishing epoxy compounds intended for impregnation and casting high-voltage and low-voltage elements of electrical and radio equipment operating in the range from -60oC to +150oC

The invention relates to the production of a composition of epoxy resin to obtain a flame-retardant laminates, foil mainly used in electronics, electrical engineering, electronic engineering and other industries that require non-combustible insulating materials

FIELD: insulation materials.

SUBSTANCE: method of preparing insulation compound, which can be used for impregnating and pouring high- and low-voltage components of electrical and radio equipment, transformers, and throttle valves, comprises mixing at temperature 50-60°C resin having molecular weight 1000-6000 with phosphorus-containing modifier, in particular triglycidyl phosphate or diglycidyl methyl phosphate, or diglycidyl methyl phosphonate, after which is added stoichiometric amount of hardener, in particular 4,4'-diaminodiphenylmethane or 4,4'-diaminodiphenyl sulfone, or 4,4'-diaminodiphenyl oxide.

EFFECT: reduced viscosity of compound, enhanced insulation and electric-strength properties, and simplified preparation procedure.

2 tbl, 17 ex

FIELD: electrical engineering.

SUBSTANCE: proposed method for producing polymeric case of vacuum circuit breaker includes installation of vacuum chamber in mold, locking of the latter, and chamber sealing followed by filling space between chamber and mold with liquid insulator. In the course of molding, prior to filling chamber-to-mold space with liquid insulator, external surface of chamber is covered with flexible shock-absorbing silicon rubber, epoxy compound being used as liquid insulator. Epoxy compound has following composition, parts by mass: epoxy resin, 100; filler, 360; hardener, 85; promoter, 1. Polymeric case is molded at mold temperature of 140 - 145 °C and pole molding time of 27-35 minutes, followed by hardening for 12 h at 140 °C.

EFFECT: facilitated procedure, reduced cost.

3 cl, 3 dwg

FIELD: antenna engineering.

SUBSTANCE: proposed composite dielectric material used, for instance, to produce antenna lenses of desired dielectric constant and density capable of operating under vibrating load conditions at temperatures ranging between -60 and +85 °C has epoxy resin functioning as binder and hollow glass microspheres and titanium, as fillers, their proportion being given in invention specification.

EFFECT: enhanced resistance to vibrations, enlarged operating temperature range.

2 cl, 1 tbl

FIELD: electrical and instrumentation engineering, microelectronics.

SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.

EFFECT: enhanced strength and electric conductivity properties of adhesive composition.

5 cl, 2 tbl

Sealing compound // 2329280

FIELD: chemistry.

SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.

EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.

3 tbl

Insulating enamel // 2342723

FIELD: technological processes.

SUBSTANCE: invention is related to finishing baking enamels intended for production of insulating protective coatings for impregnated windings, units and parts of electric machines and devices with insulation of thermal endurance class of (155°C). Enamel that includes filming agent, coupling agent, siccative, pigments, fillers, desired additives and organic dissolvents, as filming agent it contains epoxy ester produced by reactions of etherification and thermal polymerisation 1.0 Mole of epoxy modified resins with content of epoxy groups of 3.5÷4.5 wt %, 2.4 Mole of fatty acids of bodied oils and 1.3 Mole of colophony, and as active filler for increase of electric strength of enamel coating it additionally contains hydrophobic aerosil at the following ratio: Epoxy ester (55%-solution in xylene) 62.0÷81.0, Hydrophobic aerosil 0.3÷0.6, Hydrophobic aerosol 0.3÷0.6, Pigments and fillers 13.0÷29.0, Hydrophobic aerosil 0.3÷0.6, Coupling agent 4.5÷5.5, Desired additives (dispenser, defoaming agent, thixotropic, anti-flotation, antioxidant) 1.5÷6.5, Siccative (cobalt oktoat) 0.2÷0.5, Organic dissolvents 1.5÷7.5.

EFFECT: higher class of enamel thermal endurance, higher adhesion of enamel coating, improvement of coating dielectric properties.

2 tbl, 7 ex

FIELD: electricity.

SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.

EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).

1 tbl

FIELD: electricity.

SUBSTANCE: housing has inner layer and outer layer. Thickness of inner layer is at least by 50% more than thickness of outer layer, and inner layer is more flexible than outer layer. Inner layer is made from composition of the first resin which at hardening has relative elongation at rupture which is more than 5%, and outer layer is made from composition of the second resin which at hardening has relative elongation at rupture which is less than 5%.

EFFECT: improving insulation and strength properties of electric item, and profitability of its manufacture.

14 cl, 2 dwg

FIELD: chemistry.

SUBSTANCE: surface modified electrical insulation system, comprising a cured synthetic polymer composition including at least one filler and optional additives, wherein the surface of said synthetic polymer composition is modified by applying a thin coating; said thin coating being applied via plasma enhanced chemical vapour deposition (PECVD) with thickness within the range of about 50 nm to about 50 mcm; and/or said thin coating is applied via a sol-gel technique with thickness within the range of about 0.5 mcm to about 2 mm; and wherein said thin coat is an electrically non-conducting polymeric material with melting point which is considerably higher than the melting point or degradation temperature of the synthetic filler containing polymer composition; and a method of making said electrical system involving formation of a hardened or cured synthetic polymer composition, applying a thin coating on the surface of said synthetic polymer composition via plasma enhanced chemical vapour deposition.

EFFECT: improved system.

18 cl, 2 ex, 4 tbl

FIELD: electricity.

SUBSTANCE: electric insulating filling compound contains epoxide diane resin, amine hardener in the form of triethylene tetramine (TETA), and also a modifier - a phosphorus-containing methyl acrylate (PCM), at the following ratio of components, wt parts: epoxide diane resin ED-20 - 100 triethylene tetramine (TETA) - 10-15 phosphorus-containing methyl acrylate (PCM) - 30-40.

EFFECT: reduced viscosity of a filling compound, its higher viability, improved elasticity after hardening, preservation of dielectric properties.

1 tbl

Up!