Film manufacturing method

FIELD: physics; semiconductors.

SUBSTANCE: invention relates to film with at least one electrical structural member and to method of manufacturing thereof. The method implies application of laser-cured adhesive compound onto a substrate film according to a specific pattern and/or irradiation according to a specific pattern so as to crystallise the adhesive according to a specific pattern. Onto adhesive, a decal film, which consists of substrate and electrical structural member, is applied. Substrate film is separated from the film body, which consists of base film, adhesive layer and electrical functional layer, so that in the first patterned area the electrical functional layer stays on the base film, and in the second patterned area the electric functional layer stays on the substrate and is separated from the base film together with the substrate.

EFFECT: enhanced method for manufacturing structural members using organic semiconductor technology.

30 cl, 5 dwg

 

The invention relates to a film with at least one electrical component, and method of manufacturing such a film.

For the production of electrical structural elements according to the technology of organic semiconductors such as organic field-effect transistors (OFET) or other electrical components from organic polymers, requires structuring at least a conductive electrode layer. The structuring of other layers such structural elements is not required, but may improve the performance of such structural elements according to the technology of organic semiconductors. At the same time to enable the production of the productive electrical structural elements according to the technology of organic semiconductors requires the structuring of layers with high resolution and precision alignment.

In WO 02/25750 described the manufacture of electrodes or PCB lithographic method. When this conductive organic layer of doped polyaniline (PANI) or polyethyleneoxide (PEDOT) is applied by squeegee, spray, centrifugation or flatbed screen printing on a substrate, such as film. After that, apply a thin layer of photoresist and structured fashion exhibit. If p is yavlenie exposed layer of polyaniline deprotonated due to the impact of the developer, and thus, he becomes non-conductive. Using the solvent dissolve the remaining photoresist. Before or after this step, a non-conductive matrix organic layer is dissolved is not the main solvent.

In WO 02/25750 described, which is a flat layer of functional polymer for structuring print chemical compound deproteinised actions. This connection is preferably a base. Due to subsequent leaching non-conductive areas are selectively removed.

In WO 02/47183 for structuring layers of organic field-effect transistor proposed to put into the cavities being formed of a layer of functional polymers. Moldable layer consists of other organic material with insulating properties, which presses the stamp. In these grooves then through squeegee is placed functional polymer. Thus this method can be created extremely thin structures with lateral dimensions in the range from 2 to 5 μm. Doctor blade method, moreover, is not specific to the material, i.e. suitable for structuring all layers in organic field-effect transistor. In addition, the viscosity range of the squeegee is much wider than for printing, so that functional polymers can substantially maintain its consistency. Can be obtained relatively thick layers in the range of 1 micrometer.

In DE 10033112 described method of making electrical structural elements according to the technology of organic semiconductors, in which the functional polymer is applied by the pad printing technique on a substrate or existing layer.

The basis of the present invention have the task of improving productive manufacturing (powerful) structural elements according to the technology of organic semiconductors and/or create structures advanced structural elements according to the technology of organic semiconductors.

This problem is solved by a method of manufacturing a film with at least one electric component, in particular, technology of organic semiconductors, in which the film-based put a layer of radiation-curable adhesive, and this adhesive layer applied to the film-based patterned in a structured form and/or patterned irradiated (e.g., UV radiation) so that the adhesive layer is cured patterned structured adhesive layer is applied the transfer ribbon, comprising a carrier film and an electric functional layer, with the orientation of the electric functional layer to the adhesive layer, and the carrier film is separated from the film body comprising a film base, adhesive layer and electrical functional the th layer, whereby the first patterned structured phase electrical functional layer remains on the substrate, and the second patterned structured phase electrical functional layer remains on the carrier film, and it is separated together with this carrier film from the film base. This problem is solved through the film with at least one electric component, in particular on technology of organic semiconductors containing adhesive layer of the radiation-curable adhesive that is located between the patterned structured electrical functional layer and the film body mentioned film and connects the patterned structured electric functional layer with a film body.

This problem is solved by a method of manufacturing a film with at least one electric component, in particular, technology of organic semiconductors, in which the film is based in patterned structured form is applied radiation curable washable paint, patterned structured layer washed varnish irradiated (for example, ultraviolet (UV) light), so that the layer of rinse-off lacquer is cured, the layer of rinse-off lacquer applied electric functional layer, and in the process of washing the patterned strukturyzowane the th layer washed varnish lying over him plot the electric functional layer is removed, so that the electric functional layer is based on the fact patterned structured plot, which was not caused by a layer of varnish washable.

Thanks to the present invention, it becomes possible structuring of the electric functional layer manufactured by the technology of organic semiconductors structural element with the exact combination and with a higher resolution. For example, it is possible to achieve distances between the electrodes of the source and drain of organic field-effect transistor is less than 25 microns. Other advantages of the present invention consist in the fact that this method is very economical and suitable for use on an industrial scale. So, when using lithographic techniques it is possible to achieve higher resolutions. However, lithographic methods require, on the other hand, the implementation of many technological stages and applying high-quality and more expensive materials. The surface must be covered, masked, exposed, developed, protrain and subjected to removal (photoresist). In addition, when using the method according to the invention is achieved by improving the quality of the resulting technology of organic semiconductors electrical structural elements: the method according to the invention podrazumevaetsya way whereby substantially preventing contamination of the semiconductor layers. Semi-conducting layers of electrical structural element according to the technology of organic semiconductors are extremely sensitive to contamination because they are, for example due to protherough steps, already in low concentrations can change electrical properties of the semiconducting layers. For example, when the lithographic method, it is impossible to avoid contamination of organic semiconducting layers in the inevitable result of the development processes of etching and removing the photoresist. Moreover, it was found that when direct printing of conductive polymers necessary structuring electrical functional layers with high resolution, in particular, from the viewpoint of sufficient reproducibility is achieved only with a very high cost. The reason for this is, first of all, viscosity available imprinted substances, which makes printing with a sufficient thickness and reproducibility, in particular, by using the available methods of printing on an industrial scale. In addition, because the present invention prevents thermal load on the semi-conducting layers during the manufacturing process.

Thus, due to the present of the briteney created cheap, applicable on an industrial scale method of producing films with electrical structural elements of the technology of organic semiconductors that meet high quality requirements. Preferred embodiments of the invention are characterized in the dependent claims.

According to one preferred variant of the invention, the adhesive layer is printed on the tape-based patterned structured by a printing method, the adhesive layer is applied the transfer ribbon, adhesive layer utverjdayut by irradiation of radiation, and then the carrier film is separated from the film body formed by the film base, adhesive layer and electrical functional layer. Thus, the electrical functional layer remains on those areas that are printed with a radiation-curable adhesive. In this case it is advantageous that due to the different properties of the printing substance and achieved various layer thicknesses achieved higher resolution than with the direct printing of conductive polymers. In addition, you can use cost-effective and applicable on an industrial scale methods of printing, such as gravure printing, offset printing and flexographic printing.

According to another preferred variant of the invention from errday UV adhesive is applied on the entire surface of base film, and then patterned exhibit UV light, so that the adhesive layer is cured patterned structured plot. Then on the adhesive layer put the transfer ribbon. Thereafter, the carrier film is separated from the film body formed by the film base, adhesive layer and electrical functional layer. In this case the electric functional layer is patterned on those structured areas where the adhesive layer is not overiden and still has a certain stickiness (tack), remains on the film-based. At the rest area, i.e. the area on which the adhesive layer overiden, electric functional layer remains on the carrier film, and it is separated together with the carrier film. As a result of such action on film-based receive structured electrical functional layers with very high resolution. In addition, this case provides cost advantages in production, as, for example, does not require the use of high-quality cushions with mesh surface for gravure printing.

To ensure sufficient exposure of the adhesive layer when the above method is preferred electrical functional layer of a translucent material, for example a very thin metal layer, and the application is permeable to radiation is essay film. Due to this, it is possible to irradiate the adhesive layer by conversion film through that the transfer ribbon. Alternatively, you can run of base film is transparent to radiation and exposure of the adhesive layer from the side of base film through the film-based.

According to another preferred variant of the invention, the adhesive layer after applying conversion film patterned exhibit, so that the adhesive layer is cured patterned structured plot. Then, the carrier film is separated from the film body formed by film-based and electrical functional layer. In that part where the adhesive layer overiden patterned in a structured manner, the electric functional layer is fixed by this adhesive layer and remains on the body base. At the rest area where the adhesive layer is not overide, electric functional layer remains on the conversion film and is separated together with the carrier film. It is necessary to use radiation-curable adhesive, which in the uncured state has a lower adhesive force in relation to the electric functional layer than the adhesion force between the electrical functional layer and the carrier film.

The advantage of this variant of the method is that the electrical functional layers can be polucheniya film-based with very high resolution, and that there are no restrictive conditions regarding the transparency to radiation of the electric functional layer and the body framework.

The application of the method in the framework of an industrial scale process with roll-to-roll" is provided by use of a drum exposure device or mask exposure device with a rotating mask tape for patterned exposure of the adhesive layer UV-light.

Of particular importance for the method according to the invention is the use of appropriate conversion film, providing quick and accurate separation (peeling) of the electric functional layer from the carrier film. Thus, in particular, proved to be expedient to provide a separating layer between the carrier film and the electrical functional layer.

Electrical functional layer may be a conductive layer. Special exact separation of the electrical functional layer on the transition from areas remaining on the one hand, the film-based, and on the other hand - on the carrier film, is achieved through the use of electrical functional layers containing conductive particles, particularly nanoparticles, such as metal particles, carbon black (carbon black) or graphite. It turned out that, in cha is in the surrounding area, functional layers comprising conductive nanoparticles and a binder, in particular, when a small quantity of binder, allow accurate separation. In addition, appeared to be the predominant compression electrical functional layer when applied to the film base, whereby increases the electrical conductivity by podpisovania nanoparticles.

High accuracy of separation can also be achieved by use of thin metal layers or thin layers of metal alloys as electrical functional layers. In addition, it is feasible to use the electrical functional layers of conductive polymers or inorganic conductive layers, such as, for example, ITO.

Depending on the design made by technology of organic semiconductors structural element, through the use of electrically non-conductive or conductive adhesives for the adhesive layer, it is possible to reduce the number of technological stages in the creation of an electrical structural element. Electrical functional layer performs within the electrical structural element mainly a function of a microstructured electrode layer, forming one or more electrodes in electrical structural element, the sludge is a function of a microstructured semiconductor layer, forming one or more semiconductor components electrical structural element.

The present invention in an example explained below on several specific variants of its implementation with the help of the attached drawings.

Figure 1 shows the block diagram of the processing steps of the method according to the first variant embodiment of the invention.

Figure 2 shows the block diagram of the processing steps of the method according to another variant embodiment of the invention.

Figure 3 shows the block diagram of the processing steps of the method according to another variant embodiment of the invention.

Figa-4d show cross-sections of film bodies when carrying out process steps of the method of figure 1.

Figa-5e show cross-sections of film bodies for clarification of another variant embodiment of the invention.

1 schematically depicts a fragment of the production process "roll-to-roll", by which is produced the film with at least one electric component on the technology of organic semiconductors.

In the present invention under electric structural elements of the technology of organic semiconductors understand such electrical structural elements that contain at least one layer of organic pressurizat Ognianovo material. In this organic semiconductor materials, organic conductive materials and organic insulating materials formed of organic, ORGANOMETALLIC and/or inorganic substances that have the appropriate electrical properties. In the present invention, functional polymers call these organic, ORGANOMETALLIC and/or inorganic materials, which can find application in the construction of structural elements according to the technology of organic semiconductors. Therefore, the concept of "functional polymer" also includes polimernye components. Structural elements containing the organic semiconductor layer or sections of the semiconductor layer as functional components are, for example, transistors, field-effect transistors (FET), symmetric triode thyristors (triacs), diodes, etc. as organic semiconductor material here may find application, for example, polythiophene.

1 shows a section 1 printing section 20 of exposure, Gibney roller three roller 31 and 32, 33, 34. Section 1 printing serves the film base 51. Treated in section 1 print film-based 51 serves as a film 52 oginome the roller 31 to a pair of rollers 32, 33, which causes the film 52 of the transfer ribbon 41, unwinding the roll 40 conversion film. The result is a film 53. Treated in section 20 exposure film 53 serving as a film 54 to the roller 34, where the carrier film 42 is separated from the film 54, and as the remaining film still film 55.

The film base 51 can be represented in the simplest case, the carrier film. This carrier film is preferably made of polymer film thickness of from 6 μm to 200 μm, for example, film complex polyester with a thickness of 19 μm to 38 μm. Usually, however, the film base 51 has, in addition to such carrier film, and even other layers deposited during previous processes. Such layers are, for example, lacquer layers, insulating layers and electrical functional layers. Thus, it is possible that the film base 51 has already had one or more functional polymer layers, for example, layers of organic conducting polymers, such as polyaniline and polypyrrole, semi-conducting layers, for example, polythiophene, and insulating layers, for example, from polyvinyldene. It is possible that these layers were film-based 51 in already structured form.

Section 1 printing ink contains a bath with UV curable adhesive 11. Through multiple transmitting rollers 12 and 13, the adhesive 11 is applied on the printing cylinder 14. Printing cylinder 14 imprints passing between no and the platen 15 backpressure film-based 51 patterned structured adhesive layer of UV curable adhesive 11.

Section 1 printing represents, preferably, the section offset or flexographic printing. However, it is also possible to section 1 printing was a section gravure printing.

The adhesive layer 57 mainly has a thickness of from 0.5 μm to 10 μm.

As a UV curable adhesive 11 can preferably be used the following adhesives: Foilbond UVH 0002 firm AKZO NOBEL INKS and UVAFLEX UV Adhesive VL000ZA company Zeller+Gmelin GmbH.

Preferably, the adhesives applied to the film base 51 in an amount of from 1 g/m2up to 5 g/m2.

In the printing obtained depicted on fig.4b film 52, which at body basics 51 caused patterned structured adhesive layer 57.

However, depending on the type of glue 11 it is also possible that the film 52 passes through a drying tunnel in which the adhesive layer 57 is dried, for example at a temperature of from 100 to 120°C.

On figa shows the structure conversion film 41. The transfer film 41 includes a carrier film 45 separating layer 46 and the electrical functional layer 47.

The carrier film 45 is a polymer film of a thickness of from 4 to 75 microns. Mainly, the carrier film 45 is a film of a complex polyester, polyethylene, acrylate or foamed compositions. The thickness of the carrier film 45 is preferably 12 μm.

Separating the second layer 46 is, preferably, the wax type. From separating layer 46 can also be avoided, if the material of the carrier film 45 and the electrical functional layer 47 is selected so that the forces of adhesion between the electrical functional layer 47 and the carrier film 45 do not interfere reliable and rapid separation of the electrical functional layer 47.

Separating layer 46 can be manufactured, for example, by the following formula:

Separating layer 46 (separation layer)
Toluene99,5 part
Ester wax (dropping point 90°)0.5 parts

Mainly on the carrier film 45 separating layer 46 is applied with a thickness of from 0.01 to 0.2 μm.

Depending on the function that the electric functional layer should be executed inside the manufacture of electrical structural element, the electrical functional layer 47 is composed of a conductive or semi-conductive materials. If the electrical functional layer 47 should form an electrically conductive functional layer, there are the following features of the electrical functional layer 47.

Firstly, it is possible that the electrical functional layer 47 would is formed with a thin metal layer, which cover consisting of a carrier film 45 and the separating layer 46 of the film body, for example by spraying. The thickness of such a thin metal layer is mainly in the range from 5 nm to 50 nm in order to provide sufficiently high-resolution strukturiranost electrical functional layer by means of the method according to the invention. The metal layer may consist in this case, for example, aluminum, silver, copper, gold, chromium, Nickel or alloys of these metals.

Especially good results are achieved when the quality of the electrical functional layer 47 is applied a layer of conductive nanoparticles. Electrically conductive functional layer 47 has, for example, a thickness from 50 nm to 1 μm and consists of conductive nanoparticles and a binder, and to ensure accurate separation layer 47 fraction contained the binder is small. The thickness of the electrical functional layer 47 is determined essentially required from him under electrical structural element electrical properties such as resistivity. It is possible that the conductivity of the layer 47 has reached the desired value only when applied conversion film 41 on the film 52. Due to provide while applying pressure on the electric fu is clonally layer 47 this layer 47 is compressed, in the result, the distance between the conductive nanoparticles decreases, and the electrical conductivity of the layer 47 is substantially increased.

In addition, you can also use as an electrical functional layer 47 a layer of other conductive materials, for example, of ITO materials (ITO=Indium Zinn Oxide, i.e. indium oxide-tin), or other transparent conductive oxides, for example, doped aluminum zinc oxide, or conductive polymers such as polyaniline or polypyrrole.

In addition, it is also possible that the electrical functional layer 47 was formed of semi-conductive material. This organic semiconductor material is applied on the separating layer 46 in a liquid solution or in suspension, and then subjected to hardening. The thickness of such electrical functional layer 47 is determined essentially by the electrical function of this layer within the subject production of electrical structural element.

Conductive nanoparticles applied on the separating layer 46 mainly in the form of slightly diluted dispersion.

Figure 4 depicted with film 53, i.e. a film body, resulting after applying conversion film 41 on the printed patterned structured adhesive layer 57 film base 51. Figure 4 with zobrazen film base 51, the adhesive layer 57, the electrical functional layer 47 separating layer 46 and the carrier film 45. The pressure with which the transfer ribbon 41 is applied on the film 52 by the pressure roller 32 and the roller 33 of the back pressure should be selected so that it essentially does not affect patterned structuring of the adhesive layer 57.

Section 20 of the document in figure 1 contains UV lamp 21 and the reflector 22, which focuses the emitted UV lamp 21 UV radiation on the film 53. The intensity of the UV lamp 21 are chosen so that the adhesive layer 57 passing through the section 20 of the document is irradiated with a sufficient amount of energy, providing a reliable curing of the adhesive layer 57. As shown in figure 1, the film 53 is irradiated with the side of the carrier film 45. This is possible if the electrical functional layer 47 using transparent or semi-transparent layer, for example, performed as described above, a thin metal layer. In addition, this requires that the carrier film 45 and the separating layer 46 consisted of transparent to ultraviolet material. If, due to special structure of the electrical functional layer 47 is impossible to perform it transparent or semi-transparent to ultraviolet radiation, it is possible to irradiate the film 53 UV light from the side of base film 51. In this case, the film-based 51 must be in the being transparent to ultraviolet radiation.

By curing the patterned structured adhesive layer 57 functional layer 47 is glued with film-based 51 in those places, which includes the adhesive layer 57. If subsequently the carrier film 45 is separated from the rest of the film body film 53, the electrical functional layer 47 engages with the film-based 51 on those areas where the printed adhesive layer 57, and thus, in these places is separated from conversion film 41. In other places, the predominant adhesion (adhesion) between the electrical functional layer 47 and the separating layer 46, so that the electric functional layer 47 remains on the conversion film 41.

On fig.4d depicted film 55, i.e. the resulting film body after removal of the carrier film 45. On fig.4d film depicts the base 51, the adhesive layer 57 and the electrical functional layer 47. As shown in fig.4d, the film 55 is now patterned structured electrical functional layer 47, located on the film-based 51 in accordance with patterned structured adhesive layer 57.

With the help of figure 2 will now be explained another variant embodiment of the invention.

Figure 2 shows a section 10 printing section 81 of the document, section 23 of exposure, Gibney roller 31, the pressure roller 32 and the roller 33 backpressure separating roller 34 and the roll 40 conversion film.

Section 10 of the seal is arranged in the same manner as section 1 printing on figure 1, with the difference that the printing cylinder 14 is replaced by the printing cylinder 16, which imprints the adhesive 11 on the entire surface supplied of base film 61. However it is also possible that the adhesive layer is deposited on the film base 61 is not a printing method, and another method of coating, for example, by smearing, pouring or spraying. In addition, it is also possible that the printing of the adhesive layer on the film-based 61 was also patterned, and thus, the described method was combined with the method according to Fig.1.

Film-base 61 and a printed layer of UV-curable adhesive is made in the same manner as the film base 51 and the adhesive layer 57 according fig.4b, with the difference that here the adhesive layer 57 is preferably printed on the entire surface of base film 61. Film body 62, the resulting after application of the adhesive layer on the film base 61, served on oginome the roller 31 to section 81 of the document.

Mainly, used in this forprimary ultraviolet-curable adhesive.

Section 81 of the exposure is, however, mask exposure device that provides exposure from roll to roll through synchronized with the speed of the film 52 of masking tape. Mask is coniraya device 81 includes, thus, several ogylnych rollers 84, mask tape 83 and UV lamp 82. Masking tape 83 is transparent to ultraviolet radiation and opaque or reflective areas. Masking tape forms, thus, infinite UV-a mask that shields the tape 62 from the UV lamp 82 and makes possible a continuous patterned irradiation of the film 62 UV light. The speed of masking tape 83, as discussed above, synchronizes with the speed of the film 62, and the additional optical marks on the film 62 provide exposure with the exact combination. Power UV lamp 82 is selected when you do this so that when passing through the mask exposure device 81 to the film 62 sum sufficient for curing the adhesive layer, the amount of energy UV radiation.

Mostly, the film is irradiated in the mask exposing device 81 collimated UV light.

Instead of working with masking tape to mask exposure device may also use a drum exposure device having a mask in the form of a drum, on which the guide film 62.

Due to the patterned irradiation by ultraviolet light, the resin is cured patterned in a structured manner, resulting in a film with 63 otverzhdennye and uncured areas of the adhesive layer serves to a pair of rollers 32 and 33. By a pair of rollers 32 is 33 on film 63 now put the transfer ribbon 41. When this transfer film 41 is made in the same manner as the transfer film 41 according figa. Thus, it turns out the film 64, comprising of base film 61, the partially cured adhesive layer, the electrical functional layer 47 separating layer 46 and the carrier film 45. In those areas where the adhesive layer is not overide, he is still sticky, so that there are forces of adhesion between the adhesive layer and lying over it electrical functional layer 47. In other areas, where the adhesive layer overiden, this is not happening. By separating the carrier film 45 from the rest of the film body electrical functional layer 47 in those areas where the adhesive layer is not overiden concatenated with the base 51 and, thus, is separated from the carrier film 45. In other areas affected by the forces of adhesion between the separating layer 46 and the electrical functional layer 47, so that in these areas the electrical functional layer 47 is not separated and remains on the carrier film 45. Thus, after removal of the carrier film 45 is obtained film 65 with a partially patterned electrical functional layer 47, which by means located on the entire surface of the adhesive layer is connected to the film-based on 61. Further, in another section 23 of the exposure performed in the same way as section 20 of the scanner according to figure 1, the adhesive with the Oh on the not yet hardened sections utverjdayut to ensure a reliable connection between the electrical functional layer 47 and the film base 61. From section 23 of the exposure you can give.

With the help of figure 3 will now be explained another variant embodiment of the invention.

Figure 3 shows the section 10 printing section 81 of exposure, Gibney roller 31, the pressure roller 32 and the roller 33 backpressure separating roller 34 and the roll 40 conversion film.

Section 10 printing serves the film base 61, which, as in figure 2, cover the adhesive layer, resulting in a film 62 according to figure 2. The film 62 by a pair of rollers 32 and 33 cause the transfer ribbon 41. The transfer film 41 is made according figa. Thus, the obtained film 67, comprising of base film 61 located on the entire surface of the uncured adhesive layer, the electrical functional layer 47 separating layer 46 and the carrier film 45.

Film 67 next exhibit by means of mask exposure device 81, which again made the same way as mask exposure device 81 according to figure 2. After exposure through the mask exposure device 81 is obtained, thereby, the film 68, comprising of base film 61, patterned in a structured manner the cured adhesive layer, the electrical functional layer 47 separating layer 46 and the carrier film 45.

In contrast to the variant of implementation according to IG, they use UV-curable adhesive, the adhesion force of which in relation to the electrical functional layer 47 or film-based 61 is smaller than the adhesion force between the electrical functional layer 47 and the carrier film 45. Of course, you can also use the same adhesive as in figure 1 or figure 2, and by choosing the materials of the carrier film 45, body basics 51 or separating layer 46 to cause the appropriate allocation of forces of adhesion.

By separating the carrier film 45 from the rest of the film body film 68 on the areas where the adhesive layer overiden and, thereby, the electrical functional layer 47 glued to the film base 61, the electrical functional layer remains on the substrate 61. In other parts of the forces of adhesion, preventing the separation of the electrical functional layer 47 from the carrier film 45 is higher than the strength of adhesion between the electrical functional layer 47 and film-based 61, so that the electrical functional layer 47 on these sites is not separated from the carrier film 45.

Thus, it is a film 69 having a patterned structured electrical functional layer 47, which by means of appropriately patterned structured cured adhesive layer connected to the film-based 61.

Using figa-5e in the example illustrated, the AK using one of the methods according to figure 1, figure 2 or figure 3 may be fabricated field-effect transistor according to the technology of organic semiconductors.

On figa shows a film-based 90, consisting of a carrier film 91 and a deposited layer of lacquer 92.

The carrier film 91 is a polymer film, preferably, the complex film of polyester with a thickness of 19 μm to 38 μm. The varnish layer 92 is a lacquer layer of electrically insulating material, acting additionally as a protective lacquer layer. This lacquer layer is applied mainly in thickness from 0.5 to 5 μm on the carrier film 91 or lying between the carrier film 91 and the lacquer layer 92 separating layer.

As shown in fig.5b, using one of the methods according to figure 1, figure 2 or figure 3 on film-based 90 applied electric functional layer 94. Thus, the result is depicted in fig.5b film body, consisting of a carrier film 91, a lacquer layer 92, the adhesive layer 93 and the electric functional layer 94. In this case the electric functional layer 94 is composed of electrically conductive material and perform within the electrical structural element the function of the electrodes of the source and drain. Depending on the type of the applied methods, it is possible patterned structuring of the adhesive layer 93, as shown in fig.5b, in the same way as when the th functional layer 94, or its execution on the adhesive layer 93 in dry condition on the entire surface of the lacquer layer 92.

Then on the film body according to the fig.5b put semi-conducting layer, the result is depicted in figure 5 with a film body, consisting of a carrier film 91, a lacquer layer 92, the adhesive layer 93, the electrical functional layer 94 and the semiconducting layer 95. As the material of the semiconducting layer 95 in this case, apply polythiophene, which is applied on the film body according to the fig.5b in liquid solution or in suspension, and then subjected to hardening. You may also patterned structured application of the semiconducting layer 95.

Film body according to figure 5 with forms now a film-based system, which is using one of the methods according to figure 1, figure 2 or figure 3 applied electric functional layer 97. On fig.5d depicts the resulting film body, consisting of a carrier film 91, a lacquer layer 92, the adhesive layer 93, the electrical functional layer 94, semiconducting layer 95, the adhesive layer 96 and the electrical functional layer 97.

Electrical functional layer 97 is in this case also of electrically conductive material and is in electrical structural element as a gate electrode. The adhesive layer 96 is accomplished patterned structured as lying above it electrical functional layer 97. However, when applying the methods according to figure 2 or figure 3 it is also possible the application of the adhesive layer 96 over the entire surface on the semiconductor layer 95.

In the next step of the method depicted in fig.5d film body put another lacquer layer of electrically insulating material, which subsequently also functions as a protective layer for the semiconductor layer 95. As shown in fige thus obtained film 99, consisting of a carrier film 91, lacquer layers 92 and 98, semiconducting layer 95, the adhesive layer 93 and 96 and the electrical functional layers 94 and 97.

1. A method of manufacturing a film (55, 66, 69, 99) with at least one electric component, in particular, technology of organic semiconductors, in which the film-base (51, 61, 90) put the adhesive layer (57, 93, 96) of the radiation-curable adhesive, and this adhesive layer (57, 93, 96) of the radiation-curable adhesive applied to the film base (51) patterned in a structured form and/or patterned irradiated in such a way that the adhesive layer is cured patterned structured by the way, on the adhesive layer (57, 93, 96) cause the transfer ribbon (41), comprising a carrier film (45) and the electrical functional layer (47, 94, 97), with the orientation of the electrical functional layer 47, 94, 97) to the adhesive layer (57, 93, 96), and the carrier film (45) is separated from the film body (54, 64, 68), which includes a film base (51), the adhesive layer (57, 93, 96) and the electrical functional layer (47, 94, 97), and the first patterned structured phase electrical functional layer (47, 94, 97) as part of the electrical structural element remains on the adhesive layer (57, 93, 96) and the film-based (51, 61, 90), and the second patterned structured phase electrical functional layer (47, 94, 97) remains on the carrier film (45), and it is separated together with the carrier film from the film-base (51, 61, 90), while the adhesive layer of the radiation-curable adhesive after applying conversion film (41) patterned irradiated, whereby the adhesive layer is cured patterned structured plot, and the carrier film is separated from the film body (68), which includes a film base (51), the adhesive layer and the electrical functional layer, so that the electric functional layer on the first patterned indented area on which the adhesive layer overiden remains on the film-based (51)and the second area on which the adhesive layer is not overide, it is separated together with the carrier film (45).

2. A method of manufacturing a film (55, 66, 69, 99) with at least one electric component, in particular, technology organic is poluprovodnikov, if the film-base (51, 61, 90) put the adhesive layer (57, 93, 96) of the radiation-curable adhesive, and this adhesive layer (57, 93, 96) of the radiation-curable adhesive applied to the film base (51) patterned in a structured form and/or patterned irradiated in such a way that the adhesive layer is cured patterned in a structured manner, the adhesive layer (57, 93, 96) cause the transfer ribbon (41), comprising a carrier film (45) and the electrical functional layer (47, 94, 97), with the orientation of the electric functional layer (47, 94, 97) to the adhesive layer (57, 93, 96), and the carrier film (45) is separated from the film body (54, 64, 68), which includes a film base (51), the adhesive layer (57, 93, 96) and the electrical functional layer (47, 94, 97), and the first patterned structured phase electrical functional layer (47, 94, 97) as part of the electric constructive the item remains on the adhesive layer (57, 93, 96) and the film-based (51, 61, 90), and the second patterned structured phase electrical functional layer (47, 94, 97) remains on the carrier film (45), and it is separated together with the carrier film from the film-base (51, 61, 90), and the adhesive layer of the radiation-curable adhesive before applying conversion film (41) patterned irradiated in such a way that the adhesive layer is cured patterned structured plot, the pass-through plank is (41) put on patterned structured cured adhesive layer, and the carrier film (45) is separated from the film body (64), which includes a film base (61), the adhesive layer and the electrical functional layer (47), so that the electric functional layer (47) on the first patterned indented area on which the adhesive layer is not overiden remains on the film-based (61)and the second patterned indented area on which the adhesive layer overiden, it is separated together with the carrier film (45).

3. The method according to claim 1 or 2, characterized in that the adhesive layer (47) of the radiation-curable adhesive applied to the film base (51) patterned in a structured manner by a printing method.

4. The method according to claim 3, characterized in that the adhesive layer is printed on the tape-based (51) by means of gravure printing.

5. The method according to claim 3, characterized in that the adhesive layer (57) print on film-based (51) by offset printing or flexo printing.

6. The method according to claim 3, characterized in that the transfer film (41) is transparent to radiation, and the adhesive layer (57) exhibit through the transfer ribbon (41) from this conversion film (41).

7. The method according to claim 3, characterized in that the film is transparent to radiation, and the adhesive layer exhibit through the film-based on the side of the film base.

8. The method according to any one of claims 1 or 2, characterized in, h the use of radiation-curable adhesive, which in the uncured state has a lower adhesion force with respect to the electric functional layer than the adhesion force between the electrical functional layer and the carrier film.

9. The method according to claim 2, characterized in that the adhesive layer is then irradiated in the second step of exposure to the curing has not yet hardened areas of the adhesive layer.

10. The method according to any one of claims 1 or 2, characterized in that the exposure using mask exposure device, in particular a drum exposure device or mask exposure device (81) with masking tape (83).

11. The method according to any one of claims 1 or 2, characterized in that use the transfer ribbon (41), which includes separating layer (46) between the carrier film (45) and the electrical functional layer (47).

12. The method according to any one of claims 1 or 2, characterized in that the electric functional layer (47, 94, 97) is an electroconductive layer.

13. The method according to item 12, characterized in that the electric functional layer contains conductive particles, in particular metal particles, carbon black or graphite.

14. The method according to item 13, characterized in that the electric functional layer consists of conductive nanoparticles and a binder.

15. The method according to item 13 or 14, characterized in that the electric functional the layer when applied to the film-based compressed, whereby to increase the electrical conductivity of this functional layer.

16. The method according to item 12, characterized in that the electric functional layer contains conductive polymers.

17. The method according to item 12, characterized in that the electric functional layer contains inorganic substances, such as ITO material.

18. The method according to item 12, characterized in that the electric functional layer is a metal layer or a layer of metal alloy.

19. The method according to any one of claims 1 or 2, characterized in that the electric functional layer is an electrically conducting layer containing, in particular, semi-conducting polymers.

20. The method according to any one of claims 1 or 2, characterized in that the adhesive layer consists of an electrically non-conductive glue.

21. The method according to any one of claims 1 or 2, characterized in that the adhesive layer consists of an electrically conductive glue.

22. Film(55, 66, 69, 99), manufactured according to the method according to any one of claims 1 to 21 with at least one electric component, in particular, technology of organic semiconductors, characterized in that the film (55, 66, 69, 99) has an adhesive layer (57, 93, 96) of the radiation-curable adhesive, with the adhesive layer (57, 93, 96) is located between the patterned structured electric functional layer (47, 94, 9) electrical structural element and film-based (51, 90) the above-mentioned film and connects the patterned structured electric functional layer (47, 94, 97) with film-based (51, 90).

23. The film according to item 22, wherein the adhesive layer (57) of the radiation-curable adhesive patterned structured in the same way as structured and patterned electrical functional layer (47).

24. The film according to item 22 or 23, characterized in that the electric functional layer (94, 97) is a microstructured electrode layer, forming one or more electrodes in electrical structural element.

25. The film according to item 22 or 23, characterized in that the electric functional layer is a microstructured semiconductor layer, forming one or more semiconductor components electrical structural element.

26. Film (99) item 22 or 23, characterized in that the electrical component is an organic field-effect transistor.

27. Film (99) according to paragraph 24, wherein the electrical component is an organic field-effect transistor.

28. Film (99) A.25, characterized in that the electrical component is an organic field-effect transistor.

29. A method of manufacturing a film with at least one electrical design the active element, in particular, technology of organic semiconductors, characterized in that the film-based put a layer of radiation-curable varnish washable patterned in a structured form, patterned structured layer washed varnish irradiated, resulting in a layer of washable lacquer cures, and on the layer of rinse-off lacquer applied electric functional layer, wherein in the washing process patterned structured layer washed varnish lying over him plot the electric functional layer is removed, resulting in the electric functional layer is based on the fact patterned structured plot, which was not caused by a layer of varnish washable.

30. The method according to clause 29, wherein the rinse-off varnish is a UV-curable rinse-off lacquer with acid groups, and rinse rinse-off lacquer dissolved by alkali.



 

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SUBSTANCE: embossing or laminating film has at least one circuit component manufactured by using organic semiconductor technology, for instance one or more organic field-effect transistors; circuit component has several layers including electric functional layers with at least one organic semiconductor layer, at least one insulating layer, and electricity conductive layers. One or more layers of circuit component are made by way of thermal or ultraviolet replication including spatial structuring, part of at least one electric functional layer in spatial structuring region being fully separated.

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FIELD: organic semiconductors.

SUBSTANCE: embossing or laminating film has at least one circuit component manufactured by using organic semiconductor technology, for instance one or more organic field-effect transistors; circuit component has several layers including electric functional layers with at least one organic semiconductor layer, at least one insulating layer, and electricity conductive layers. One or more layers of circuit component are made by way of thermal or ultraviolet replication including spatial structuring, part of at least one electric functional layer in spatial structuring region being fully separated.

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1 tbl, 4 ex

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