Film with organic semiconductors

FIELD: organic semiconductors.

SUBSTANCE: embossing or laminating film has at least one circuit component manufactured by using organic semiconductor technology, for instance one or more organic field-effect transistors; circuit component has several layers including electric functional layers with at least one organic semiconductor layer, at least one insulating layer, and electricity conductive layers. One or more layers of circuit component are made by way of thermal or ultraviolet replication including spatial structuring, part of at least one electric functional layer in spatial structuring region being fully separated.

EFFECT: improved circuit component production process using organic semiconductor technology.

28 cl, 9 dwg

 

Organic field-effect transistors (OFET) are composed of an organic semiconductor layer between and over istokov and at least one stock electrodes, the organic insulating layer over the semiconductor layer and gate electrode. Stokowy, drains and gate electrodes can be composed of metals or organic conducting polymers. Organic electrode materials are, for example, polyaniline and polypyrrole. As the semiconductor used, for example, polythiophene, and as insulator - polyvinylene.

For OFET fabrication of transistors or other circuit elements from organic polymers requires the structuring of the conductive electrode layers. The structuring of other layers is optional, but can improve the performance of circuit elements from organic polymers.

In WO 02/25750 described the manufacture of electrodes or conductive tracks lithographic method. On the surface of the substrate, such as film, conductive organic layer of doped polyaniline (PANI) or polyethyleneoxide (PEDOT) is applied with a squeegee, means spraying, centrifugation or screen printing. After that, apply a thin layer of photoresist and structuring, servicepeople manifestation released polyanilines layer due to the impact will show what I deprotonated and becomes, thus, the non-conductive. Before or after this operation, a non-conductive matrix organic layer is dissolved non-alkaline solvent.

Alternatively, it is also possible oxidative destruction of vacant plots before the dissolution of the photoresist by reactive etching.

In WO 02/25750 described below that surface functional polymer layer for structuring cause printing chemical compound, providing deprotonate action. The connection is preferably alkaline. Due to subsequent leaching non-conductive areas are selectively removed.

The disadvantage is that the lithographic method is suitable only for material polyaniline. The prior art further unknown lithographic structuring ways of rolled material. Other ways of structuring such as print, the minimum possible distance between istokov and a drain electrode is at least 30-50 μm. To improve the performance of OFET transistor are desired, however, a length of about 10 microns.

In WO 02/47183 for structuring conductive organic layer, and other layers in OFET-transistor proposed to place the functional polymer in the recess forming layer. Forming a layer made of other organic material with isomerous and properties which presses the punch. This material is, for example, UV or thermoset lacquer deposited on the entire surface of the substrate. Due to irradiation, for example by UV light, the varnish is cured, and in the forming layer formed recess. In these grooves then the rod is placed functional polymer. Using this method, can be created hyperfine structures with lateral sizes in the range of 2-5 microns. Cleaning method is not tied to a particular material, i.e. suitable for structuring all layers OFET transistor. In addition polyaniline squeegee can be applied and, thus, are structured other conducting or semiconducting organic materials, such as polypyrrole, polythiophene or polyvinylene. In addition, the viscosity range for the doctor how immeasurably wider than for printing, so that functional polymers can substantially maintain its consistency. Besides can be obtained relatively thick layers, up to 1 μm. Further it is proposed to apply the method in a continuous printing on role-playing machines. The ribbon consists of the substrate material coated with forming polymer, which may be UV-curable or thermosetting varnish. Deepening of the first squeeze roller punch and forming the polymer due to UV-irradiation the Oia is subjected to preliminary curing. Using installed then UV lamp lacquer is subjected to final curing. In structured lacquer then the rod is placed functional polymer.

In DE 10033112 described a technique in which the filled in form functional polymer taken with a swab, and then applied to the substrate or the already existing layers.

The basis of the invention lies in the task of improving the process of manufacturing the productive circuit elements according to the technology of organic semiconductors and/or create advanced circuit elements according to the technology of organic semiconductors.

This problem is solved by means of films, in particular films for embossing, glossy lamination or film element, which includes at least one circuit element according to the technology of organic semiconductors, in particular one or more organic field-effect transistors (OFET=OrganicFET). This problem is solved further by means of a method of manufacturing such a film, in which the structuring of one or more layers, at least one circuit element according to the technology of organic semiconductors is carried out by thermal or UV replication.

Manufacturing electronic circuits according to the technology of organic semiconductors is not on the plate, as hitherto made, and as part of the film occur in the t large production-technical advantages. Proven and tested methods of film technology, as well as existing production facilities can be used for the manufacture of such electronic circuits, resulting in significant reductions in the cost.

Special advantages arise when implementing such circuit elements according to the technology of organic semiconductors in film for embossing or laminating. This opens up possibilities for a variety of applications such electronic circuits in the finished and intermediate products. Create inexpensive in manufacture of the intermediate product, which can be found further variety of applications and can be adapted to user needs. The manufacturing process is becoming a more flexible, and the production cost is reduced. Next was that used for the manufacture of films for printing and laminating film technology and methods are particularly well suited for the implementation of such electronic circuits.

According to a preferred variant of the invention, such a film for embossing, glossy lamination or film element includes a film base, at least one layer of organic semiconductor material, in particular of polythiophene at least one layer of electrically insulating material and two Il is more marked in some areas of the patterned layers of electrically conductive material, acting as electrode layers. Conductive layers are thus mostly organic conductive material, in particular of polyaniline or polypyrrole. Electrically insulating layer consists mainly of an organic insulating material, in particular of polyvinyldene. Next, the film contains preferably detachable and adhesive layers, and one or more lacquer layers adjacent to the layer of the functional polymer.

Other advantages are achieved due to the fact that the electrically conductive layer, a semiconductor material and an insulating layer is generally transparent. This can affect the appearance of the film due to the additional layers of film for embossing or laminating and simplify universal use film, for example, as an electronic circuit or a decorative element.

According to a preferred variant of the invention, the electrical functionality of the film, in particular at least one electronic circuit element according to the technology of organic semiconductors, combined with optical characteristics. The film contains, on the one hand, the electronic circuit with one or more electronic circuit elements on the technology of organic semiconductors, on the other hand, pre the leaves observer one or more optical protective signs. This film may have, for example, formed between its layers the spatial structure, which, first, a patterned structures one layer electronic circuit element according to the technology of organic semiconductors, and secondly, creates a diffraction-optical effect, which forms the optical characteristic. Spatial structure is formed while overlapping the macrostructure and microstructure and macrostructure responsible for patterned structuring electrical functional layer and the microstructure for the creation of a diffractive optical effect, and thus for the creation of optical protective trait. Thus, the spatial structure performs two functions: first, the implementation of the electronic circuit element according to the technology of organic semiconductors, and secondly, the creation of an optical characteristic for considering the film face.

Further, the film may have one or more holographically-or diffractive optical layers to create a diffraction-optical protective trait, one or more sequences of thin-film layers to create optical protection characteristic through interference, and one or more decorative layers, with which in addition to the electrical functionality implemented) will hinder the functionality for example, the creation of one or more optical (protective) signs or decorative effects.

Done in this manner, the film can serve, therefore, as an optical protective element, for example, to protect identities, banknotes, credit or cash cards, and goods. While this film may have in addition to optical safety signs electrical protective signs. Due to the combination of optical and electrical protective elements greatly increases the security against forgery. Further, it is also possible that the film had two or more spaced on each other, creating optical protection characteristic layers, and one or more functional layers of the electronic circuit element according to the technology of organic semiconductors are located between such optically active layers. This significantly increases the security against forgery, because any attempt of manipulation with optical and electrical protective features can be immediately detected, and these security features, thus, mutually protect each other.

A particularly effective and economical manufacture of the film according to the invention consists in the implementation of structuring one or more layers, at least one circuit element of the and technology of organic semiconductors due to thermal - or UV-replication.

According to a preferred variant embodiment of the invention in a replicated layer replicate the spatial structure, the depth of which is greater than or equal to the thickness of the replicated layer, so that the portion of the replicated layer is completely separated due to replication. By replicating create an electrical functional layer, the patterned structured in accordance with a spatial structure. This method achieves a very high resolution, for example, in the range from 10 μm to 100 nm. Due to the possibility of implementing this kind of small structures it is possible to increase the packing density and performance of the implemented circuit. Other advantages of this method are that a single operation is possible structuring of the electric functional layer with high resolution. Structuring the electrical functional layer can be performed at high speed, in particular in the form of a process roll to the roll position and with relatively low production costs.

According to another preferred variant of the invention in a replicated layer replicate the spatial structure, the depth of which is less than the thickness of the replicated layer. On the replicated layer applied electric functional the second layer of material, experiencing at the specified curing shrinkage in volume. This material is applied to the replicated layer in number, are chosen so that the resulting shrinkage in volume during curing remains patterned structured in accordance with the replicated structure of the functional layer. Next may also be applied to the replicated layer electrical functional layer and then remove the electrical functional layer to a depth selected so that after removal of the remains patterned structured in accordance with the replicated structure of the functional layer. Using this method achieves high resolution electrical functional layers, so that the above advantages arise when these actions.

Alternatively or additionally it is also possible execution in the structure film on a part or the entire surface of one or more necessary for operation of the circuit elements of the electrode, the insulating and semiconductor layers by a printing method, in particular pad printing.

The invention is described below on several variants of implementation with reference to the accompanying drawings, which represent:

- 1 - in the context of the film according to the invention, in the first embodiment of the invention;

- 2 - in the context of plait the ku according to the invention, in the second embodiment of the invention;

- figure 3 is a device for replicating structures electrical circuit elements on the technology of organic semiconductors, in particular organic field-effect transistors;

- figa - process structuring layer circuit element according to the technology of organic semiconductors according to the first variant of implementation;

- fig.4b,is the process of structuring layer according to the first variant of implementation;

- figure 5 - cut the film according to the invention, in which one or more layers of circuit element according to the technology of organic semiconductors replicated the method according to figure 4;

- figa-e - processes structuring layer circuit element according to the technology of organic semiconductors by replicating according to another variant implementation;

- 7 - section of the film, in which one or more layers of circuit element according to the technology of organic semiconductors structured way figa-s;

- figa - replication process layer circuit element according to the technology of organic semiconductors according to another variant implementation;

- fig.8b - replication process layer circuit element according to the technology of organic semiconductors according to another variant implementation;

- figa,b - sections of the films according to the invention, in other embodiments of the invention.

1 shows a film for embossing, comprising at least one circuit element according to the technology of organic semiconductors, in particular organic field effect transistors (OFET). This film for embossing represents, in particular, the foil for hot stamping. Figure 2 shows the structure of a lamination film comprising at least one circuit element according to the technology of organic semiconductors, in particular organic field effect transistors (OFET). The invention is not limited, however, such types of films.

Figure 1 shows the film 1 for stamping with foil-base 11 and a deposited bill of layer 2. Between the film base 11 and a transfer layer 2 is detachable layer 12 that serves to facilitate separation of transferable layer 2 of base film 11. From the detachable layer 12 can also be abandoned.

The conversion layer 2 contains the first 13 and second lacquer layers 18, an insulating layer 15 of electrically insulating material and a layer 16 of the organic semiconductor material. Next, the conversion layer 2 contains two patterned electrode made of a layer of electrically conductive material, of which figure 1 shows a plot of 14, forming a gate electrode, and two sections 17, 19, forming respectively stokowy hundred and the new electrodes.

Alternatively, you can also swap the bolt or stokowy and a drain electrode in the bill of layer 2, i.e. to have stokowy and a drain electrode on the drawing below on the lacquer layer 13 and gate electrode on the drawing at the top, near, and above the semiconductor layer 16.

Figure 2 shows the film 3 for lamination with the same multilayer structure. The exact structure of the layers is illustrated below using only film 1 for stamping.

The film base 11 is a polymer film thickness of 6-200 µm, mostly 19-38 μm. The film base 11 is a predominantly polyester film.

On film-based 11 on the entire surface applied detachable layer 12 with a thickness of 0.01-0.2 μm. It is made mostly in the form razmyagchayuschiesya under thermal influence of the layer, which when applied foil for hot stamping on a substrate provides a separation of the other layers of base film 11.

The first lacquer layer 13 is a protective lacquer layer applied to the detachable layer, mainly over the entire surface, namely a thickness of 0.5-5.0 µm, mostly 1-2 mm.

On the lacquer layer 13 is applied to the first electrode layer with the gate electrode 14. The first electrode layer is thus mainly of a conductive polymer, preferably polyaniline and polypyrrole Further possible application for the first electrode layer of metal, for example gold or silver.

The first electrode layer can be applied partly patterned on the lacquer layer 13, for example, a method of printing (gravure printing, screen printing) or by way of the coating. You can, however, be applied also to the first electrode layer on the whole or on part of the surface of the lacquer layer 13, and then partially re-remove it the following way replicate, the method of exposure and etching, or by ablation, for example, using a pulsed laser.

Depending on the applied method of applying a conductive material is applied on the lacquer layer 13 in the liquid, the dissolved form or in suspension.

The insulating layer 15 is composed primarily of organic insulating material, such as polyvinylidene. Can also be used as a material of the insulating layer 15 of oxide layers, such as metal oxides. Organic insulating layers are applied at the same time one of the above methods on patterned structured electrode layer in the liquid, the dissolved form or in suspension. Then, an insulating layer 15 strengthen by drying or otherwise. Oxide layers applied by thermal spray or cathode sputtering in a vacuum.

On the entire surface or part of the surface of the insulating layer 15 is applied to the layer 16 of organicheskikh the semiconductor material. As the organic semiconductor material can be applied polythiophene. The organic semiconductor material is applied on the insulating layer 15 in the liquid, the dissolved form or in the form of a suspension, and then procreate can also patterned structure layer 16 in the same manner as the first electrode layer, which results depicted in figures 1 and 2, the execution layer 16.

Then on the layer 16 in the manner described above is applied to the second electrode layer istokov 17 and a drain electrodes 19. In relation used for this layer materials and ways of structuring reference should be made to the arguments relating to the first electrode layer.

Thereafter, on the entire surface to cause the lacquer 18 and the adhesive layers 20. The thickness of the layer 18 is mainly 2-10 μm. The adhesive layer 20 is a conventional and known in itself, the transfer films or foils for hot stamping adhesive layer of a thickness of 1-10 μm, and the adhesive layer foils for hot stamping has such a composition that it becomes sticky only when the corresponding heat effect.

Layers 12, 13, 18, 20 can be manufactured by the following formulas.

Detachable layer 12 (separation layer)
toluene99,5 frequent the St
the ester wax (dropping point 90°)0.5 parts
The lacquer layer 13 (protective lacquer layer)
methyl ethyl ketone61,0
dihydroxyacetone9.0 parts
the methyl methacrylate
(the glass transition temperature 122°C)18.0 parts
polyethylene dispersion (23% in xylene)
(softening point 140°)7.5 parts
high-molecular dispersant additive (40%, amine number 20)0.5 parts
the plasticizer (aluminosilicate)20.0 parts
The lacquer layer 18 (intermediate layer)
methyl ethyl ketone40.0 parts
toluene22,0 part
terpolymer of ethylene and vinyl acetate
(temperature fluidity 60°)2.5 parts
polyvinyl chloride5.5 parts
(the glass transition temperature of 89°C)
polyvinyl chloride

(the glass transition temperature of 40°C)
to 3.0 parts
dispersant to the Aqua 1.0
(50%, acid number 51)
titanium dioxide (density of 3.8 to 4.2 g/cm3)26.0 parts
The adhesive layer 20
methyl ethyl ketone55,0 parts
toluene12.5 parts
ethanol3.5 parts
the polyvinyl acetate6.0 parts
(softening point 80°)
butyl/methyl methacrylate

(the glass transition temperature of 80°C)
8.0 parts
utilitarian resin

(the glass transition temperature of 63°C)
to 3.0 parts
a copolymer of methacrylate5.0 parts
(the glass transition temperature of 80°C)
unsaturated polyester resin3.5 parts
(softening temperature 103°)
silicon dioxide3.5 parts

The lacquer layers 13, 18 have here, first, electrical insulating properties and subsequently perform the function of a protective layer surrounded by them for electrical functional polymer layers.

From the first 13 and second 18 layers of lacquer can also be abandoned.

Organic semiconductor materials, organic conductive materials and organic insulating materials formed in this organic, ORGANOMETALLIC and/or inorganic plastics, which have the appropriate electrical properties. Functional polymers are referred to as such organic, ORGANOMETALLIC and/or inorganic materials that can be used when performing circuit elements according to the technology of organic semiconductors. The term "functional polymer" also includes polimernye components.

Depicted in figure 1 a fragment of the film 1 contains a packing 14, stokowy 17 and a drain electrodes 19, so that depicted in figure 1 plot of the film 1 due to the interaction of these electrodes with the insulating layer 15 and the layer 16 of the organic semiconductor material forms an organic field-effect transistor. Depending on the structuring of the first and second electrode layers, and under certain circumstances structuring the insulating layer 15 and the layer 16 of semiconductor material in the film 1 can be implemented in an integrated electronic circuit, consisting of a set of circuit elements according to the technology of organic semiconductors.

Under the circuit element according to the technology of organic poluprovodn the Cove here it is necessary to understand the electronic circuit element, which includes an organic semiconductor layer or a portion of a semiconductor layer as a functional component, such as transistors, MOSFETs, triacs, diodes, etc.

This may also position one above the other few are depicted in figure 1 layers 13-16 for implementation, thus, the film 1 two or more arranged one above the other circuit elements on the technology of organic semiconductors.

For the implementation of the circuit elements on the technology of organic semiconductors both the first and second electrode layers, as already mentioned, can be made in a patterned structured form.

You can also run the insulating layer 15 and the layer 16 of semiconductor material is patterned in a structured manner to achieve a proper electrical functionality. For such patterned strukturirovany proposed the following methods or a combination of the following methods.

The proposed implementation structure film electrode, the insulating and semiconductor layers necessary for operation of the circuit elements on the surface or on the entire surface of the printing methods.

The methods of printing with high resolution, known for printing on part of the surface are present, however, is horizontal the th resolution of 50 µm and therefore only conditionally suitable for the manufacture, in particular, stokovyh and a drain electrode.

The preferred way here, by contrast, provides a first printing on the entire surface, and then the appropriate structuring of the layer by thermal - or UV-replicate. The appropriate device for this purpose is shown in figure 3, and the result is depicted in FIGU-C. For UV-replication should additionally provide UV light and a mask (not shown). Using these methods replicate achieves a very high horizontal resolution in the range from 0.5 to 5 microns.

Figure 3 shows replicate roller 51, second presser roller 52, the film base 41, the layer 42 and a structured layer 43. Film body, consisting of a layer 42 of base film 41, the rotation replicate 51 and the counter-pressure rolls 52 indicated in figure 3 direction is transported in the direction 53 of the feed. In this case, as shown in figure 3, the layer 42 is replicated structure, so that the layer 42 acquires shown in figure 3 structure and forms a structured layer 43.

Layer 42 is a functional layer circuit element according to the technology of organic semiconductors, for example the layer is shown in figure 1 and 2 organic field-effect transistor, for example, the first electrode layer, an insulating material, the second electrode is Loy or the layer of organic semiconductor material. The film base 41 may be a film base 11 or multilayer film body with the film base 11 and one or more overlying layers, such as multi-layer film body with the film base 11, detachable 12 and varnish 13 layers.

As a way of replicating find application mainly thermal and UV replication.

When thermoreflectance the replication process occurs due to thermodeformative layer 42. For the layer 42 is applied to the material with thermoplastic properties. Through the heated roll replicate 51 carry out embossing patterns in the layer 42 corresponding to the shape of the surface replicates the roll 51.

For example, a solution of polyaniline or polypyrrole with applied weight of 2.2 g/m2after drying, put on the body of base film 41 by scanning cylinder gravure printing. Drying is carried out in a drying channel at a temperature of 100-120°C. In the layer 42 is then approximately at 130°With means consisting, for example, of Nickel replicate swath carry out embossing patterns. For stamping patterns replicate swath in this heat, mainly electrically. Instead of replicating the roll can also be used replicate matrix. Such a matrix can be re-cooled before lifting layer 42. After embossing patterns slo is 43 then cures by stitching or otherwise.

When the UV-replicating layer 42 applied UV-curable material. Within a replicate of the roll 51 or have a UV light, which causes curing of the layer 43, molded in accordance with the surface structure replicates the roll 51. Further, it is also possible to replicate roller 51 had a smooth surface, which is in the form of a mask partially illuminates the layer 42. On exposed areas of the layer 42 is cured. Transmission parts layer 42 are not cures, and it is removed in the washing process, so what occurs is shown in figure 3 structuring layer 43.

As shown in figa layer 42 replicate and spatial structure, the depth of which is greater than or equal to the thickness of the replicated layer. The replicated layer 42 partly divided by replication, which results in an electric functional layer 43, patterned structured in accordance with a spatial structure.

It is particularly preferable that when thermoreflectance the structure depth greater than the thickness of the layer 42. Thus, preferably, as shown in fig.4b, application under layer 42 additional lacquer layer 44, mostly from replicated varnish. Matrix for stamping replicate the roll can be realized, thus, the embossed layer 42 without damaging on dasouza under a varnish layer 44 film-based or additional layers. On figs depicts an implementation option, in which the thickness of the layer 42 is selected much smaller replicate. This ensures the achievement of a reliable separation of sections of electric functional layer 43.

Figure 5 shows the film 6 for stamping, in which the first and second electrode layers are patterned structured, as shown in figure 3-4C.

Figure 5 film 6 for stamping is depicted with a film-based 61, detachable layer 62, a lacquer layer 63, the first electrode layer 64, an insulating layer 65, a layer 67 of the organic semiconductor material, the second electrode layer 66, a lacquer layer 68 and the adhesive layer 69.

The varnish layer 63 is composed of replicated varnish. On the entire surface of the lacquer layer 63 is applied to the first electrode layer 64, and then patterned structure using the method of replicating, illustrated in figure 3, 4A, 4b or 4C. Then on the entire surface of the applied insulating layer 65. Then over the entire surface of conduct applying a layer 67 of the organic semiconductor material. Him put the second electrode layer 66 and also patterned structure using the method of replicating in figure 3-4C. It is also possible partial drawing of the second electrode layer 66 using the methods of printing and coating, in particular, if ishikawae and a drain electrode are layered structure of the AI at the bottom, and the gate electrode at the top.

Then, the entire surface shall layers 68 and 69.

As already mentioned, it is also possible structuring as an insulating layer 65, and a layer 67 of the organic semiconductor material using methods figure 3-4C and, thus, the implementation in the film 6 for stamping more complex electronic circuits.

Then you can replicate the replicated layer spatial structure, the depth of which is less than the thickness of the replicated layer. This is depicted, for example, on figa. In the layer 42 using is shown in figure 3 way replication replicate structure, which has not permeated layer 42, and there is, therefore, depicted on figa layer 48 in the form of the replicate. In the next step, as shown in fig.6b, a structured layer 48 by printing, coating or spraying applied electric functional layer 49. For the electrical functional layer 49 is applied while the material of high viscosity, so that the deepening of the layer 48 are completely filled with the layer 49. Further electrical functional layer 49 is applied to the material experiencing a specified reduction in volume during curing. So, for example, can be applied UV-curable material, preferably acrylate system, which when UV curing is experiencing clearly a given the Yu shrinkage in volume. Further, the shrinkage in the volume can also be achieved by evaporation of the solvent in which is dissolved applied functional polymer.

Material layer 49 is applied in such a quantity per unit area at which, on the one hand, the deepening of the layer 48 is completely filled by the material of the layer 49, and on the other hand, however, during curing of the layer 49 is shrinkage in volume, which causes the layer 49 is completely or partially fills the cavities of the layer 48. This is shown as an example on figs where you can see that the layer 49 after curing fills the cavities of the layer 48 only 48-95%. Due to this it is achieved that, after curing of the layer 49 remains patterned structured in accordance with the replicated structure of the electric functional layer 49.

Alternatively or additionally it is also possible, as shown in fig.6d, application of an electric functional layer 50 on the layer 48, which, after curing completely covers the layer 48, and then removing the layer 50, as shown in figa, over the entire surface to a certain depth, leaving patterned structured in accordance with the replicated structure of the electric functional layer 50. Delete the functional layer 50 can be made here, for example, by etching or other method is m ablation, for example by laser ablation.

Layers 49 and 50 can represent, respectively, the organic insulating layer, an organic conductive material or a layer of organic semiconductor material used as the functional layer circuit element according to the technology of organic semiconductors. Layer 48 may be a similar functional layer or auxiliary layer, which only supports the structuring of the electric functional layer.

Figure 7 shows a sample run of the film according to the invention, having an electrical functional layers that are patterned structured explained using figa-e method.

7 film 7 for stamping is depicted with a film-based 71, detachable layer 72, a lacquer layer 73, the insulating layer 75, a layer 76 of organic semiconductor material, the two electrode layers 74, 77, lacquer layer 78 and the adhesive layer 79.

Layer 73 is formed by a replicated layer of varnish, consisting of a transparent thermoplastic.

The varnish layer 73 may be, for example, the following structure.

ComponentMass parts
High molecular weight PMMA-resin2000
Alcide of siloxane oil-free is 300
Non-ionic wetting50
Low viscosity nitrocellulose750
Methyl ethyl ketone1200
Toluene2000
Dihydroxyacetone2500

In the layer 73 replicate the spatial structure, and then by way of the coating applied layer 74 organic conductive material, such as polyaniline or polypyrrole, after which it is subjected to curing, resulting clarified using fig.6b,with effectslab this over the entire surface, for example, a printing method is applied an insulating layer 75. The insulating layer 75 may be composed of the same material as the varnish layer 73. Then, the entire surface shall seal layer 76 organic semiconductor material, such as polythiophene. In the layer 76 replicate the structure and cause and subjected to curing the layer 77 of electrically conductive material, and occurs explained using fig.6b,with effect. After that, the entire surface shall seal lacquer 78 and the adhesive 79 layers, for example, by a gravure cylinder.

Of course, it is possible to manufacture known from the prior art forming layer by means of replicating, and then structuring layers OFET way the doctor is. In this prior art reference should be made to the above in the preamble to the description of the prior art.

There may be additional, not shown in figure 1 and 2 layers, in particular holographic-optical layers, thin-film layers of the optical action, protective layers, and so on

While it is preferable to combine the electrical functionality (organic semiconductor circuits) with optical characteristics. And create in a single operation in the replication process, as shown in figa. It is possible, in particular, the location equipped with a diffractive optical structures of the circuit elements with the possibility of a special optical effect, such as a company logo. Special protection against forgery occurs due to the fact that diffraction patterns can be located at different heights multilayer system, in particular, also one above the other. Arise, therefore, the optical-electric element is perfect, therefore, as a protective element for banknotes, documents, and to protect the goods and media data from a fake.

On figa shows the replication process, which simultaneously perform the diffractive optical structure of the optical protective sign and carry out the structuring of the electric functional layer. On Fig is depicted, therefore, the film base layer 41 and 42 on figa-with or 6A. As shown in figa layer 42 replicate the structure 47, consisting of a blend of macrostructure and microstructure. The macrostructure leads to patterned structure layer 42, resulting in patterned structured electric functional layer. Microstructure describes the fine structuring of the surface of the replicated layer 46. The microstructure formed mainly of diffractive optical structure, which creates, for example, a hologram or a diffraction optical effects, such as Cinerama, cineform etc. Microstructure can represent, of course, and the diffraction structure of the zero order, creating special color and cetoscarus effects. Further, it is also possible the formation of the microstructure of isotropic or anisotropic Matt structure.

It is particularly preferable that when thermoreflectance the depth of the structure is chosen greater than the thickness of the layer 42. Thus, preferably, as shown in fig.8b, placed under layer 42 additional lacquer layer 44, mostly from replicated varnish. Matrix for stamping replicate the roll can be realized, thus, the embossed layer 42 without damaging under lacquer layers 44 a film-based or more layers.

<> The layer 46 is then applied (lacquer) a layer of material, the refractive index of which differs from the refractive index used for the layer 46 of material, so that the generated optical microstructure effects become visible to the observer. Alternatively, the layer 46 may be additionally marked with a reflective layer in the form of applied fully or partially metallic layer or HRI layer (HRI=High Refraction Index of the high refractive index). As materials for the reflective layer are considered, mainly chromium, aluminum, copper, iron, Nickel, silver, gold or an alloy of these materials.

On figa shows another possibility of combining in one film functions of the electronic circuit element according to the technology of organic semiconductors with optical security features.

On figa film 8 for stamping is depicted with a film-based 81, detachable layer 82, the two lacquer layers 83, 84, the first electrode layer 86, an insulating layer 87, a layer 88 of the organic semiconductor material, the second electrode layer 89, lacquer layers 90, 91 and thin-film multilayer system consisting of absorbing 94, intermediate 95, reflecting 96 and adhesive 97 layers.

The first 86 and 89 second electrode layers, an insulating layer 87 and a layer 88 of the organic semiconductor Materialovedenie as the corresponding layers in figure 1 and 2. The structuring of the electrode layers 86, 89 can be carried out, for example, described using figure 3-4C ways replication.

The layer 83 is a replicated layer of varnish, which is embossed diffractive optical structure 85. Then apply the varnish layer 84 composed of a material, the refractive index of which differs from the refractive index of the lacquer layer 83. As shown in figa, the diffraction structure 85 is made not on the entire surface, and partially. Layer 90 is also a replicated layer of varnish, which is embossed diffractive optical structure 93. On the layer 90 and partially patterned to cause the lacquer layer 91, the refractive index of which differs from the refractive index of the layer 90. Also diffractive optical structure 93 is provided only partially, so that the generated diffractive optical structure 93 of the optical characteristic is superimposed on the generated structure 85 optical characteristic and complements it.

Thin-film multilayer system consists of the absorbing layer 94 (primarily with the transmission of 30-65%), transparent intermediate layer 95 in the form of creating a play of light layer (for example, a layer with a quarter or half λand a reflective layer 96 or the optical separation layer, in the case where the thin-film multilayer system should is and to act as a transmitting element.

Layers 94, 95, 96 create through interference dependent on the angle of view cveticanin. Created thin-film multilayer system svetikaite are thus predominantly in the range visible to the observer of light.

It is also possible to perform thin-film element of the sequence of layers with high and low refraction. For example, such a thin-film element can be made from three to nine or ten such layers. The more layers, the better you can customize wavelengths to effect the play of light.

A reflective layer 96 may be made in the form of metal or HRI-layer on all or part of the surface. As materials for the reflective layer are considered, mainly chromium, aluminum, copper, iron, Nickel, silver, gold or an alloy of these materials.

Then perhaps colouring lacquer layers 83, 84, 90, 91. The layers 86, 87, 88, 89 may be predominantly transparent or painted over the entire surface, so that these electrical functional layers do not affect the brilliance of the film element. Then, of course, also the choice when replicating electrode layers 86, 87 method of replicating on figa or 8b, so that explained above with figa optical effects superimposed additional optical effects. Also here, preferably, h is on the thus created optical effects are padded for example, a diffractive structures 85, 93 optical effects, thereby manipulating or changing one of these effects can be directly detected by an observer.

Of course, it is also possible implementation in the film according to the invention is not all explained using figa optical effects, and the implementation of such a film only a selection of these effects.

On fig.9b depicts a variant of the structure of the film, which layer 83 or 90 over the entire surface or partially caused additional reflective layers 98, 99 in the form of metal or HRI-layers. Thus it is not required that the refractive indices used for the layers 83, 84 materials differed. Similarly, you do not want was the difference in the refractive indices used for the layers 90, 91 materials.

1. Film(1, 3, 6, 7, 8, 9) for stamping or lamination, which contains at least one circuit element according to the technology of organic semiconductors, in particular, one or more organic field-effect transistors, and the circuit element comprises multiple layers containing electrical functional layers comprising at least one layer of organic semiconductor material, at least one layer of electrically insulating material and layers of electrically conductive material, wherein ar is n or more layers of circuit element is made by thermo - or UV-replication of spatial structuring, and part of the at least one electrical functional layer in the area of spatial structuring completely separate.

2. Film(1, 3, 6, 7, 8, 9) according to claim 1, characterized in that the film contains a film-based(11, 61, 71, 81), at least one layer (16, 67, 76, 88) organic semiconductor material, in particular of polythiophene at least one layer (15, 65, 75, 87) of electrically insulating material and two or more fulfilled patterned on individual sections of the layers(14, 17, 19, 64, 66, 74, 77, 86, 89) electrically conductive material.

3. Film(1, 3, 6, 7, 8, 9) according to claim 2, characterized in that the layers(14, 17, 19, 64, 66, 74, 77, 86, 89) electrically conductive material consists of organic conductive material, in particular of polyaniline or polypyrrole.

4. Film(1, 3, 6, 7, 8, 9) according to claim 2 or 3, characterized in that the layer (15, 65, 75, 87) electrically insulating material comprises an organic insulating material, in particular of polyvinyldene.

5. Film(1, 3, 6, 7, 8, 9) according to claim 1, characterized in that it is a film for embossing containing film from the base (11) and applied to the film base (11) with the possibility of separation from her conversion layer (2).

6. Film(1, 3, 6, 7, 8, 9) according to claim 5, characterized in that the foil for stamping contains detachable layer (12, 62, 72, 82) and the adhesive layer(20, 69, 79, 97).

7. Film(1, 3, 6, 7, 8, 9) according to claim 1, characterized in that the film contains the Dean or more lacquer layers (13, 18, 63, 68, 73, 78, 84, 90), adjacent to the functional layer, made of polymer.

8. Film(1, 3, 6, 7, 8, 9) according to claim 2, characterized in that the electrically conductive layers, the layer of semiconductor material and the layer of electrically insulating material is made transparent.

9. The film according to claim 1, characterized in that it is a film element containing a layer of organic semiconductor material (16), in particular polythiophene layer (15) of electrically insulating material and two or more fulfilled patterned on individual sections of the layers (14, 17, 19) electrically conductive material.

10. The film according to claim 9, characterized in that it is a film element deposited on the substrate through the film for embossing or laminating.

11. Film (8) according to claim 1, characterized in that it further comprises optical characteristics that create a diffraction-optical effect.

12. Film (8) according to claim 11, characterized in that it contains formed between its layers the spatial structure of (47), first, for the patterned structure layer (46) of the electronic circuit element according to the technology of organic semiconductors, and, secondly, to create a diffractive optical effect as the optical characteristic.

13. The film according to item 12, characterized in that the spatial structure (47) is formed by overlapping m is crostructure and macrostructure, the macrostructure is used for the patterned structure layer (46) of the electronic circuit element according to the technology of organic semiconductors, and microstructure to create optical characteristic.

14. Film (8) according to claim 1, characterized in that it contains holographic-optical or diffractive layer(83, 84, 90, 91).

15. Film (8) according to claim 1, characterized in that it contains a sequence (94, 95) thin-film layers.

16. The film according to claim 1, characterized in that it contains a decorative layer.

17. Film (8) according to claim 1, characterized in that it contains two or more arranged one above the other layers(83, 84, 90, 91, 94, 95) to create optical protection characteristic, and one or more functional layers 86, 87, 88, 89) of the electronic circuit element according to the technology of organic semiconductors are located between such optically active layers.

18. The film according to one of claims 1 to 3, characterized in that it is used as a protective element.

19. A method of manufacturing a film(1, 3, 6, 7, 8, 9) according to claim 1, characterized in that the structuring of one or more layers(42, 43, 48, 49, 50), at least one circuit element according to the technology of organic semiconductors is realized by means of thermal or UV replication.

20. The method according to claim 19, characterized in that the replicated layer (42) replicate space is stannow structure, the depth of which is greater than or equal to the thickness of the replicated layer (42), so that the portion of the replicated layer is completely separated by replicating, and form an electrical functional layer (43), patterned structured in accordance with a spatial structure.

21. The method according to claim 20, characterized in that a similar spatial structure to replicate in an electrode layer of electrically conductive material and this layer is then applied electrical functional layer of non-conductive or semi-conductive material.

22. The method according to claim 19, characterized in that the replicated layer (48) replicate the spatial structure, the depth of which is less than the thickness of the replicated layer (48).

23. The method according to item 22, characterized in that the replicated layer (46) applied electric functional layer (49) of the material experiencing during curing of the specified volume reduction, and this material is applied to the replicated layer (46), in which due to the shrinkage in volume during curing remains the electrical functional layer (49), patterned structured in accordance with the replicated structure.

24. The method according to item 23, characterized in that the electric functional layer is made of a UV curable material.

25. The method according to item 22, wherein replicated on the PSS is (46) applied electric functional layer (50), electric functional layer is removed then at a certain depth, in particular, by etching, leaving the functional layer (50), patterned structured in accordance with the replicated structure.

26. The method according to item 22, wherein the spatial structure replicate in electrical functional layer of non-conductive or semi-conductive material and this layer is applied and then the electrode layer of conductive material.

27. The method according to claim 19, characterized in that all, or one or more of the electrode, the insulating and semiconductor layers necessary for operation of the at least one circuit element according to the technology of organic semiconductors, perform a method of printing in the structure film on a part or the entire surface.

28. The method according to any of PP-27, characterized in that the replication process creates one or more circuit elements according to the technology of organic semiconductors, and one or more optical characteristics, in particular, diffractive optical structure.



 

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FIELD: organic chemistry, chemical technology.

SUBSTANCE: invention relates to novel derivatives of fullerenes comprising organic amines and hydrogen atoms bound to fullerene-C60 molecule by 6,6-double bonds of the general formula: C60Hn(R1R2N)n wherein R1 means -C6H5CH2; R2 means -C6H5CH2; n = 4 (tetra-(dibenzylaminohydro)[60]fullerene); R1 means -C5H9; R2 means hydrogen atom (H); n = 3 (tri-(cyclopentylaminohydro)[60]fullerene). Also, invention relates to using derivatives of fullerenes, in particular, (tetra-(benzylaminohydro)[60]fullerene, (tetra-(dibenzylaminohydro)[60]fullerene, tri-(cyclopentylaminohydro)[60]fullerene, 2-(azahomo[60]fullereno)-5-nitropyrimidine, 1,3-dipropyl-5-[5'-(azahomo[60]fullereno)pentyl]-1,3,5-triazin-2,4,6(1H,3H,5H)-trione, O,O-dibutyl-(azahomo[60]fullereno)phosphate as acceptors of electrons in composites polymer/fullerene designated for photovoltaic cells. Also, invention relates to photovoltaic device comprising mixture of poly-conjugated polymer and abovementioned fullerene derivative or their mixture as an active layer. Also, invention relates to a method for synthesis of derivatives of fullerenes comprising aromatic amines and hydrogen atoms bound to fullerene-C60 molecule by 6,6-double bonds. Method involves interaction of C60 with the corresponding organic amine in solution, and this reaction is carried out in aromatic solvent medium in amine excess at temperature 25-70°C for 2-5 days followed by evaporation of solution and precipitation of the end product by addition of alcohol.

EFFECT: improved method of synthesis.

6 cl, 1 tbl, 2 dwg, 6 ex

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FIELD: organic chemistry, chemical technology.

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EFFECT: improved method of synthesis.

6 cl, 1 tbl, 2 dwg, 6 ex

FIELD: organic semiconductors.

SUBSTANCE: embossing or laminating film has at least one circuit component manufactured by using organic semiconductor technology, for instance one or more organic field-effect transistors; circuit component has several layers including electric functional layers with at least one organic semiconductor layer, at least one insulating layer, and electricity conductive layers. One or more layers of circuit component are made by way of thermal or ultraviolet replication including spatial structuring, part of at least one electric functional layer in spatial structuring region being fully separated.

EFFECT: improved circuit component production process using organic semiconductor technology.

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EFFECT: simplified and cheap making polymeric electroluminescent diodes.

10 cl, 2 dwg

FIELD: physics.

SUBSTANCE: organic light-emitting diode contains the bearing bottom executed in the form of glass or plastic layer with the anode transparent layer disposed on it. The layer of organic substance with hole conductivity (the hole-transport layer) is located on the anode, then the organic radiating (emission) layer, organic layer with n-type conduction (an electro-transport layer) follow. The emission layer can simultaneously carry out function of an electro-transport stratum. Over organic layers the cathode stratum is located. The cathode is executed from the composite material containing ytterbium, doped by thulium or europium in amount of not less than 10%. The device is characterised by high technical characteristics: the insert voltage makes 4 V, a running voltage at luminosity 150 cd/m2, that there corresponds to quantity of the working monitor, 4 V, efficiency of a luminescence - 2 lm/W. At the mentioned running voltage luminosity slope on 10% makes not less than 4000 hours.

EFFECT: expansion of a circle of substances for emission layer, capable to generate all basic and intermediate colours.

4 cl, 1 tbl, 1 dwg

FIELD: physics.

SUBSTANCE: in receiver of optical radiation comprising at least one heterostructure located on transparent substrate and enclosed between two light-transmitting anode and cathode electrodes and consisting of two layers of organic semi-conducting materials with different width of prohibited zone, layers of heterostructure are made of materials with maximums of absorption spectrums located in area λ≤450 nm and high light transmission in visible area of spectrum, at that light transmission of incident flux of radiation from receiver of optical radiation in visible area of spectrum makes at least 30%.

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3 cl, 5 dwg

FIELD: chemistry.

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EFFECT: obtaining new chemical compounds which can be used as electroluminescent (emission) layer in organic light-emitting diodes (OLED).

6 cl, 3 ex

FIELD: physics; optics.

SUBSTANCE: invention relates to organic displays. The organic electroluminescent display has an organic electroluminescent device which has first and second display electrodes and at least one organic functional layer between the display electrodes and consisting of an organic compound; a base for holding the organic electroluminescent device; a film of a high-molecular compound which covers the organic electroluminescent device and the surface of the base along the perimetre of the organic electroluminescent device; and in inorganic barrier film which covers the high-molecular compound film, edges of the high-molecular compound film and the surface of the base along the perimetre of the high-molecular compound film; the high-molecular compound film used is a film made from aliphatic polyurea.

EFFECT: design of an organic electroluminescent display which is not dyed and is shock resistant.

6 cl, 2 dwg, 2 ex, 2 tbl

FIELD: chemistry.

SUBSTANCE: invention can be used in manufacturing organic light-emitting diodes, liquid-crystal displays, plasma display panel, thin-film solar cell and other electronic and semi-conductor devices. Claimed is element, including target of ionic dispersion, where said target includes processed MoO2 plate of high purity. Method of such plate manufacturing includes isostatic pressing of component consisting of more than 99% of stoichiometric MoO2 powder into workpiece, sintering of said workpiece under conditions of supporting more than 99% of MoO2 stoichiometry and formation of plate which includes more than 99% of stoichiometric MoO2. In other version of said plate manufacturing component, consisting of powder, which contains more than 99% of stoichiometric MoO2, is processed under conditions of hot pressing with formation of plate. Method of thin film manufacturing includes stages of sputtering of plate, which contains more than 99% of stoichiometric MoO2, removal of MoO2 molecules from plate and application of MoO2 molecules on substrate. Also claimed is MoO2 powder and method of said plate sputtering with application of magnetron sputtering, pulse laser sputtering, ionic-beam sputtering, triode sputtering and their combination.

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16 cl, 5 ex

FIELD: chemistry.

SUBSTANCE: invention relates to macromolecular compounds with a nucleus-shell structure. The invention discloses macromolecular compounds with a nucleus-shell structure, whereby the nucleus has a macromolecular dendritic and hyperbranched structure based on carbon or based on silicon and carbon is bonded to at least three, in particular at least six external atoms through a carbon-based coupling chain (V) which is selected from a group consisting of straight and branched alkylene chains with 2-20 carbon atoms, straight or branched polyoxyalkylene chains, straight or branched siloxane chains or straight or branched carbosilane chains, with straight chains based on carbon oligomeric chains (L) with conjugated double bonds on the entire length. Conjugated chains (L) in each separate case are bonded at the end opposite the coupling chain (V) to one more, specifically, aliphatic, arylaliphatic or oxyaliphatic chain (R) without conjugated double bonds. The chains (V), (L) and (R) form the shell. The invention also discloses a method for synthesis of the said compounds.

EFFECT: novel organic compounds which can be synthesised using conventional solvents and have good semiconductor properties.

16 cl, 2 ex

FIELD: physics.

SUBSTANCE: invention relates to multilayer organic light-emitting diodes (OLED) and can be used in designing alternative sources of light and new-generation displays and making a light-emitting diode which operates for a long period of time. The invention discloses an OLED consisting of a transparent electrode, a light-emitting layer and a metal electrode. A protective silver layer is sprayed onto the surface of the metal electrode and in the lower part of the housing there are capsules containing water, oxygen and impurity active absorbers.

EFFECT: design of an OLED which enables to make thin-film panel light sources and full-format displays which retain brightness, contrast and working capacity in a long period of time.

5 cl, 1 tbl, 2 dwg

FIELD: organic semiconductors.

SUBSTANCE: embossing or laminating film has at least one circuit component manufactured by using organic semiconductor technology, for instance one or more organic field-effect transistors; circuit component has several layers including electric functional layers with at least one organic semiconductor layer, at least one insulating layer, and electricity conductive layers. One or more layers of circuit component are made by way of thermal or ultraviolet replication including spatial structuring, part of at least one electric functional layer in spatial structuring region being fully separated.

EFFECT: improved circuit component production process using organic semiconductor technology.

28 cl, 9 dwg

FIELD: physics; semiconductors.

SUBSTANCE: invention relates to film with at least one electrical structural member and to method of manufacturing thereof. The method implies application of laser-cured adhesive compound onto a substrate film according to a specific pattern and/or irradiation according to a specific pattern so as to crystallise the adhesive according to a specific pattern. Onto adhesive, a decal film, which consists of substrate and electrical structural member, is applied. Substrate film is separated from the film body, which consists of base film, adhesive layer and electrical functional layer, so that in the first patterned area the electrical functional layer stays on the base film, and in the second patterned area the electric functional layer stays on the substrate and is separated from the base film together with the substrate.

EFFECT: enhanced method for manufacturing structural members using organic semiconductor technology.

30 cl, 5 dwg

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