Method for manufacturing a component of a device for precipitation of drops (variants)

FIELD: typewriters, printing devices; drop precipitation components, drop precipitation plates with nozzles.

SUBSTANCE: the method for forming a component of plate contains operations: forming of the body using first material, where aforementioned body has periphery, forming of the cover using second material, around the aforementioned body, in such a way that the cover extends at least across a part of the periphery of aforementioned body, and forming of the nozzle, which passes through aforementioned body. The method for forming a plate, when the plate with nozzles is limited to the plane of plate with nozzles and contains a plate, which has at least one layer of plate with nozzles and a set of nozzles, where each nozzles passes through plastic placed within an aperture in the plate with nozzles, contains operations for forming a set of individual bodies of polymeric material, distributed across the plane of plate with nozzles, and forming of at least one metallic layer of plate with nozzles by galvanoplastic application around aforementioned bodies of polymeric material. The method for forming a component of the plate contains following operations: creation of a layer of first photo-resistive material on a substrate, selective development and removal of photo-resistive material on the substrate to form a mesh of separate bodies of first material on the substrate, creation of first metallic cover around aforementioned bodies to form metallic plate with nozzles, having apertures, each one of which contains a body of aforementioned first material, and creation of a nozzle, which passes through each body.

EFFECT: an improved method is suggested for manufacturing the component meant for usage in a device for drop precipitation.

3 cl, 12 dwg

 

The present invention relates to a device component droplet deposition and, more specifically, to the plate with nozzles of the droplet deposition device. A particularly important example of droplet deposition device is an inkjet printer.

Plate with nozzles usually attached to the device, droplet deposition, with many cameras ejection of ink with the aim to provide each camera corresponding nozzle ejection of droplets. In accordance with the accuracy with which the nozzle ejection must be made in the plate with nozzles, for example, in order to ensure uniformity in size and velocity of droplets ejected from cameras ejection for forming nozzles in the plate with nozzles typically use laser ablation. For forming the plate with nozzles typically use plastics, such as polyimide, polysulfone or other erodible laser plastic, and after coating repels ink layer on one surface of the plate with nozzles each nozzle is formed by exposing the plate to the influence of the laser beam such as excimer laser beam, the desired diameter. Plate with nozzles, which made all the nozzles, then attached to the device, and each nozzle is combined with a corresponding chamber formed in the housing.

The use for the manufacture of a plate with nozzles is lastpass makes the plate with nozzles relatively weak and susceptible so mechanical damage. At the same time, when used for the manufacture of plate with nozzles more durable materials such as metal or ceramics, hampered the formation of precise nozzles in the plate with nozzles.

Earlier it was suggested, for example, in the application WO 02/098666 produce plate with nozzles from the metal plate containing a hole injected polymeric material. The nozzle is then formed in the polymer material.

Some of the options for implementing the present invention aims to offer an improved method of manufacturing a component intended for use in droplet deposition device.

According to one aspect of the present invention proposes a method of forming a component of a plate with a nozzle for droplet deposition device, and the method includes the operations of: forming a body from a first material, and the specified body has a periphery, forming a coating of a second material around the selected body so that the coating extends at least around part of the periphery of a specified body; and forming a nozzle which passes through the specified body.

The coating preferably is formed using electroplating processes.

The first material may be, for example, positive or negative photoresist material. Especially preferred is a negative is wny the photoresist, such as SU-8. The material can be covered with a mask and exposed to a particular radiation, for example visible light, with the purpose of manifestation is not covered by the mask sections.

The photoresist may be printed on a substrate in the form of a layer with subsequent processing with the purpose of obtaining multiple separate phone the Substrate and, if applicable, the seed layer can be formed as a plate material using electroplating processes or galvanothermy. The seed layer may be a sacrificial layer of copper or any other suitable material. Plate with nozzles can be made of Nickel or suitable for processing electroformed Nickel alloy.

The substrate can also be used as a support during subsequent manufacturing operations, such as mounting the actuator to the plate with nozzles, creating a current conductors on the plate with nozzles, etc. Polymeric substrate continue to serve as the basis for a plate with nozzles.

The body can be obtained in the form of a grid and form thus the plate so that the plate material surrounds at least part of the periphery of each of the phone

In a particularly preferred variant of the implementation of end-to-end nozzle is formed in the body using the technique of ablation. The nozzle of the desired quality can be obtained in other ways, such as erveryone or treatment.

Component plate with nozzles can be attached to device droplet deposition before or after forming the through nozzles in the bodies.

The strength of the plate with nozzles can be further enhanced through the use of additional material that extends above the surface of the plate and preferably also above the surface of the body. The location of the additional material that may be applied by electroplating, there may be more that are not solid resist limiting aperture through which droplets are ejected from the nozzles.

In one embodiment, the implement on the surface of the component plate with nozzles placed an insulating layer. The advantage is the possibility of posting on this insulating layer of the conductor current. The conductors can be used to connect the electrodes of the droplet deposition device with the scheme of the remote drive.

In another aspect, features a method of forming a plate with a nozzle for droplet deposition device in which a plate with nozzles is limited to the plane of the plate with nozzles and includes a plate having at least one layer plate with nozzles and a multitude of nozzles, with each nozzle passes through the plastic, placed inside the holes in the plate with nozzles in a way that differs cash is a chiy allocation of many separate bodies of polymeric material, distributed over the plane of the plate with nozzles, and forming at least one metal layer of the plate with the nozzles by applying the electroforming around these bodies of polymeric material.

Preferably the plate with nozzles includes a first layer plate with nozzles, which contains holes, and a polymeric material placed in these holes, through which pass the nozzle, and the second layer plate with nozzles, which contains a protective layer.

According to another aspect of the present invention includes a method of forming a component of a plate with a nozzle for droplet deposition device, and the method includes the following operations: forming a first layer photoresistive material on the substrate; electoral manifestation and destruction photoresistive material with the purpose of getting on the substrate grid of the separate bodies of the first material; forming a first metallic coating around these bodies so as to form a metal plate with nozzles having apertures, each of which contains the body of the first material; and forming a nozzle passing through each body.

The present invention will be described only as an example, with reference to the following drawings, in which:

figure 1 shows the structure of a plate with nozzles, Izv the STN in modern technology;

figa-2E illustrate a method of manufacturing a plate with nozzles according to the present invention;

figa-3E show a technique of forming a protective layer on the plate with nozzles;

figa-4E illustrate a method of manufacturing a plate with nozzles for connection to an electrical circuit.

Figure 1 shows a plate with nozzles according to WO 02/098666. Plate with nozzles 1 is formed from the metal plate 2 with a continuous hole. In the insert hole of the polymer material 4, and then through the perforation or ablation to form the channel 6 of the nozzle.

On figa-e shows a method of forming a component plate with nozzles according to the present invention. The substrate 10 is applied copper seed layer 8. On the seed layer extruded layer 12 of photoresist.

Preferred photoresist material is SU-8, a negative, epoxy-type, designed for long-wavelength region of the ultraviolet radiation, the photoresist on the basis of epoxy resin EPON SU-8 (Shell Chemical), originally developed by IBM and is the subject of U.S. patent No. 4882245. Epoxy resin SU-8 is fully amoxicillinum copolymer Novolac bisphenol-A/formaldehyde, which are representative of its inherent rigid molecular structure. In combination with a suitable photogelatin generator (PAG) it becomes thick the film negative resist. The photoresist SU-8 is supplied on an industrial scale company MicroHem Inc. (previously Microlithography Chemical Corp.), 1254 Chestnut Street, Newton, pieces Massachusetts, USA. Further information can be found at: http:/www.mocrohem.com/products/su_eight.htm

The photoresist covered by the mask, and exhibit show, leaving many separate bodies 4. Then, the coating material 2 is applied using electroplating processes or galvanothermy on the copper seed layer, thus forming a composite node plate with nozzles. The preferred coating material is Nickel or suitable for processing electroformed Nickel alloy.

Node plate with nozzles can be separated from the substrate by etching the copper seed layer to form the component plate with nozzles. Then it is possible to form through nozzles located on the site of photoresistive material or to the mounting plate with nozzles to the Executive node (ex situ), or after the mounting plate with nozzles (in situ).

Found that the photoresist SU-8 can be removed at a constant high flux density (8 j/cm2without damage to the plate with nozzles. The advantage of ablation at high flux density is that it is about three times faster compared with conventional methods.

Excess application part of the resist provides some fur on the technical protection of nozzles from bumps paper, etc.

One additional benefit of this technique is that the structural resists with fotosprivadas image allows you to place on the plate with nozzles additional structure to the ablation nozzle and at a time when they remain bonded to the substrate.

Figure 3 at the plate with nozzles formed a protective coating, thus forming a protective layer. First component plate with nozzle put the second layer of photoresist 12, which localize, exhibit and demonstrate with the purpose to leave areas that protrude above the resist structural. This photoresist material will typically be different from the first photoresistive material, and will be matching a variety photoresistive materials.

Around the photoresist 12 electrocardiac metal layer 14, after which the photoresist is removed in order to leave holes. Then, as described above, form the nozzle.

According to a variant of the nozzle is formed to remove the second photoresist, and nozzle proplast in the photoresist to protect what will be the front surface of the plate with nozzles.

It is also possible formation of other elements, which are arranged on both sides of the plate with nozzles. Figure 4 illustrates the technique of forming the plate with nozzles having attached thereto the wire the next track. Elecrodeposition floor, remaining attached to the substrate, is pressed into an additional layer of electrically insulating material 20, which isolates the metal component plate with nozzles from metal tracks made on a conducting component 22. Conductive component can be conducted in a separate sheet, or may consist of tracks, performed on the insulating sheet 20.

It is possible to make numerous modifications without deviating from the scope of the invention. Thus, the described solutions are just a few examples of layouts of the layers of the plate with nozzles with at least one metal layer plate with nozzles obtained by electrodeposition around these bodies of polymeric material. It is possible to form thereby a protective layer formed on the layer plate with nozzles, for example, one of the methods described in WO 02/098666.

While most preferred is the combination of the Nickel coating nozzle, elecrodeposition around the selected bodies photoresistive material, a specialist in the art recognizes the existence of different ways of forming a body preferably made of plastic, and the specified body has a periphery, and forming a coating of preferably metallic material around the selected body so that the coating about Teresa at least part of the periphery of a specified body. Similarly, the formation of nozzles in different ways, different from the preferred technique of laser ablation.

Each feature described herein can be used individually or in combination with one or more other described features.

1. The method of forming a component of a plate with a nozzle for droplet deposition device that includes an operation of forming the body from a first material, and the specified body has a periphery; forming a coating of a second material around the selected body so that the coating extends at least part of the periphery of a specified body; and forming a nozzle which passes through the specified body.

2. The method according to claim 1, wherein the coating is formed using electroplating processes.

3. The method according to claim 1, wherein the first material is formed as a layer on the substrate, and the layer is subjected to processing with the aim of getting multiple phone

4. The method according to claim 3, in which the indicated many bodies are made in the form of a grid corresponding to the required grid nozzles in the finished plate with nozzles.

5. The method according to claim 3, in which the processing operation includes the steps of applying the mask of the specified layer, processing the specified layer by irradiation and removal of parts of the specified layer.

6. The method according to claim 1, in which the nozzle is obtained by cross-cutting ablation specified what about the body.

7. The method according to claim 1, wherein the first material is plastic.

8. The method according to claim 1, wherein the second material is a metal.

9. The method according to claim 1, wherein the first material is a photoresist and preferably a negative photoresist.

10. The method according to claim 1, in which the plate is attached to the droplet deposition device before the formation of the specified nozzle.

11. The method of forming a plate with a nozzle for droplet deposition device in which a plate with nozzles is limited to the plane of the plate with nozzles and includes a plate having at least one layer plate with nozzles and a multitude of nozzles, with each nozzle passes through the plastic, placed inside the holes in the plate with nozzles, characterized in that it contains operations the formation of many separate bodies of polymeric material, distributed over the plane of the plate with nozzles, and forming at least one metal layer of the plate with the nozzles by applying the electroforming around these bodies of polymeric material.

12. The method according to claim 11, in which the plate with nozzles includes a first layer plate with nozzles containing these holes and polymeric material are placed in these holes, through which pass the nozzle, and the second layer plate with nozzles, which contains a protective layer.

13. With the persons indicated in paragraph 12, in which the protective layer contains for each nozzle protective hole, the size of which in the plane of the nozzle exceeds the dimensions of the nozzle and smaller than the polymer material, which passes through the nozzle.

14. The method according to item 12, in which the second layer plate with nozzles formed in the course of operations, the formation of many separate bodies of polymeric material of the protective layer, distributed over the first layer plate with nozzles; the formation of this protective layer by electroforming around these bodies of polymeric material and the removal of the specified polymer material of the protective layer.

15. The method according to 14, wherein said polymeric material of the protective layer is removed before the formation of the nozzles.

16. The method according to 14, wherein the nozzle is formed by ablation before deleting the specified polymer material of the protective layer.

17. The method according to claim 11, in which the plate with nozzles includes a first layer plate with nozzles containing these holes and polymeric material are placed in these holes, through which pass the nozzle, and the second layer plate with nozzles, which contains a layer of connective conductors.

18. The method of forming a component of a plate with a nozzle for droplet deposition device that contains the following operations: forming a first layer photoresistive material vile who IKE; electoral manifestation and destruction photoresistive material with the purpose of getting on the substrate grid of the separate bodies of the first material; forming a first metallic coating around these bodies so as to form a metal plate with nozzles having apertures, each of which contains the body of the specified first material; and forming a nozzle passing through each body.

19. The method according to p, which also includes the operation of applying a metal layer on the substrate before forming the first layer photoresistive material, and specified the first metal coating is formed by electroplating with the specified metal layer, which serves as the seed layer.

20. The method according to p, which also contains the following operations: forming a layer of the second photoresistive material on the first metal coating; electoral manifestation and destruction photoresistive material with the purpose of obtaining a grid of separate bodies of a second material, combined respectively with the bodies of the first photoresistive material; forming a first metallic coating around these bodies of the second material; and removing the second material for forming holes in the protective coating, respectively aligned with the nozzles.



 

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