Diamond-containing disk for machining materials for electronic-engineering and parts made of them

FIELD: electronic engineering; mechanical treatment of materials for electronic-engineering and parts made of them, including semiconductor and ferrite materials.

SUBSTANCE: proposed diamond-containing disk that can be used in particular for machining hybrid and monolithic microwave integrated circuits and their components which needs high quality and high precision of process to keep within their small dimensions and to avoid chipping on them has grain size specified by material being treated and base of its diamond-containing material is hard material. Disk is built of at least two alternating layers of diamond-containing material with damping sublayer in-between connected to them, thickness of this sublayer being equal to 1/10 - 2/3 of diamond-containing material grain size.

EFFECT: enhanced yield and quality of materials and parts machined with aid of disk, enlarged service life of the latter.

1 cl, 1 dwg, 1 tbl

 

The invention relates to electronic equipment, namely the mechanical processing of electronic materials and products from them, including semiconductor and ferrite materials.

High hardness and brittleness of materials for electronic devices and miniaturization of products of them have special requirements for mechanical processing, including cutting, namely:

- accuracy of the geometric dimensions

the chips.

During mechanical processing of electronic materials and products from them, including cutting, widely used disks from the diamond-containing material, then the diamond blade that is made either of steel or galvanised.

When cutting with diamond disks in the system of the spindle - tool - diamond blade vibrations occur, which increases with increasing cutting speed, and as a consequence vibration occurs:

first, the deterioration in the quality of processing, including increasing as the number of chips and the size of each of them,

- secondly, the reduction efficiency of the diamond disk

- third, reducing the shelf life of the diamond disk.

In order to reduce vibration when cutting use a variety of techniques - both technical and technological.

A device for cutting wafers from silicon, in which the diamond blade is shotable galvanized, with this as the basis for the application of diamond-containing layer using a magnetic material (1).

To reduce vibration and, therefore, decrease as the number of chips and the size of each diamond blade is placed in the solenoid.

However, it is not effective when cutting materials due to their magnetic properties is sticking and clogging of the surface of the diamond ROM chips of the cutting material and the deterioration of cutting its properties, and consequently, cut quality and reduced service life of the diamond disk.

A device for cutting silicon wafers, in which the diamond blade is secured on the mandrel in a certain way, namely, it must not protrude from the mandrel by more than 1.5 from the gage plate (2).

This allowed to reduce vibration of the cutting edge of the diamond disk, but did not reduce the vibration in the system of the spindle - tool - diamond blade, therefore, is not ensured proper quality cutting, including from the point of view of availability of chips.

A device for cutting of single crystal semiconductor material on the plate, in order to improve cut quality, including reducing the availability of chips, mastic, which fix the single crystal semiconductor material on the holder, which is placed in the system of the spindle - tool - and the maznyj disk injected as a filler abrasive powder grain size of 10 μm or more (3).

The presence of abrasive powder in mastic allowed during the cutting process to edit the cutting edge of the diamond disk.

But, on the other hand, the abrasive leads to rapid wear of the protruding grains of the cutting edge of the diamond disk, which reduces its lifetime.

In addition, when cutting viscous semiconductor materials such as indium antimonide, there is a rapid clogging of the cutting edge of the diamond disc, i.e. filling and sealing material cutting space between the protruding diamond grains and thereby reducing the efficiency of the diamond disk, and an increase in the load on it can lead to the destruction of material cutting.

A device for cutting single crystals of semiconductor material on a plate, in which the mastic as filler injected chips of semiconductor materials obtained after cutting diamond disc with the same granularity with which the cut and the single crystal semiconductor material (4).

Mastic with such a filler eliminates the clogging of the protruding grains of the cutting edge of the diamond disk, which ensures the stability and effectiveness of its work and thereby enhances cut quality and prolongs its life.

However, forces in the opacity of the mastic material is difficult to cut hybrid and monolithic integrated circuits microwave (GIS and MIS) and their elements, as it requires additional technical solutions from the point of view of the possibility of the cutting operation.

And if its implementation is not obespechivaetsya high quality, primarily geometrical accuracy, availability of chips and size of each of them, and, consequently, a high yield.

The technical result of the invention is to increase the yield by improving the quality of processing, namely improve the geometrical accuracy and decrease as the number of chips and the size of each of them, especially in the processing of hybrid and monolithic integrated microwave circuits and their elements, as well as increasing the shelf life of the diamond disk.

The technical result is achieved by the fact that in the known drive of the diamond-containing material for processing electronic materials and products made from grain, given the material to be processed, as the basis of diamond-containing material take rigid material, the disc is made of at least two alternating layers of diamond-containing material, between which is located and connected with them the damping layer, while the damping layer is made of elastic material thickness equal to 1/10-2/3 grit diamond-containing material.

The number of alternating layers of Alma is ostergade material defines as the type of machining, for example, either cutting or grinding, and the type of material to be processed.

When cutting their number should be kept to a minimum, and when grinding Vice versa.

The connection of the damping layer with layers of diamond-containing material is performed either by glue or by welding.

The damping layer is made of elastic material, such as heat-resistant rubber.

The invention

As mentioned above, when cutting a diamond disks in the system of the spindle - tool - diamond blade vibrations occur.

Diamond blade, where as the basis of diamond-containing material take rigid material, and the disc is made of at least two alternating layers of diamond-containing material, between which is located and connected with them the damping layer is made of elastic material and with a specified thickness, provides the following effect.

First, the damping layer absorbs part of the energy of oscillation and thus reduces vibration in the system of the spindle - tool - diamond disk.

Consequently, the presence of the damping layer increases the quality of treatment, including decreases as the number of chips and the size of each of them, and, consequently, increases the yield.

While this effect is enhanced with increasing the number of alternating layers of diamond-containing Mat is Rial and accordingly the damping interlayer between them.

Secondly, due to the smaller contact pressure in the cutting zone the depth of penetration of the diamond grains in the surface is reduced. Resulting in cutting with less disruption of the structure of the processed material. This is similar to using a diamond disk with a smaller grain size, i.e. the process of cutting a multilayer disk is less tallapragada, which also reduces the number of chips and the size of each of them along the cutting zone and, consequently, increases the yield.

Execution of diamond-containing material on a rigid Foundation raises:

first, the wear resistance of the diamond disk and, consequently, the stability during the cutting process and thereby provides a high accuracy of geometric dimensions and, consequently, increases the yield,

secondly, the shelf life of the diamond disk.

Execution of the damping layer with a thickness of less than 1/10, and more than 2/3 of grit diamond-containing material is not desirable, because in the first case, lost the damping properties of the diamond disk, the second is its destruction.

The invention is illustrated in the drawing.

Figure 1 shows the diamond blade, consisting of three alternating layers of diamond-containing material, where

- diamond layers - 1,

- damping layer between them - 2.

Example

For processing of electronic materials and products from them are widely used device type DS 150.

The device has a high speed spindle on aerostatic bearings for rotation with frequency 20000-40000 rpm, on which is mounted a mandrel with a diamond disk, the coordinate table with vacuum table for fixing the processed materials and visual display device.

Consider, for example, cutting the ferrite plate 1 mm thick crystal structure of garnet and performed on the elements of GIS on Board.

The ferrite plate adhesively bonded to the carrier in the form of a plate of getinsa, have her on the coordinate table and fix it by means of vacuum.

In the cutting process of the coordinate table with the ferrite plate is moved at a speed which is determined by the material to be processed, in this case equal to 2 mm/sec.

The diamond blade is made of three alternating layers of diamond material 1 made of steel OST 11317000-85, TU2-037-550-86, with granularity equal to 60/40 mm, which was determined experimentally for ferrite materials and is optimal for these materials and damping layers 2 between them, made of material resistant rubber silicone brand Silicone "Krass" thickness equal to 1/3 of the grain size of al is isostearamide material, in this example, it is 20 microns.

Diamond blade fitted and fixed in the frame.

Include installation and carry out the cutting.

For cooling the diamond disk into the cutting zone is supplied water automatically.

Examples 2-3

Analogously to example 1 was carried out similar cutting the ferrite plates, but with different values of the thickness of the damping layers specified in the claims.

Example 4

For comparison similar to example 1 was carried out similar cutting ferrite plates with a diamond disk, made of only one layer of diamond-containing material is performed not on a rigid Foundation, without damping layer, prototype.

The resulting cutting samples cards GIS of ferrite and silicon material were investigated for the presence of chips and their size and output.

The data given in the table.

The table shows:

firstly, decreased as the number of splits along the line of cut does not exceed 2 units/mm, and the size of each of them does not exceed 30 μm (examples 1-3 as for ferrite and silicon material) against 4 pieces/mm and 60 μm, respectively, in the prototype,

- secondly, increased product yield more than 3 times.

Thus, the proposed diamond disk for processing electronic materials the products from them will provide in comparison with prototype:

firstly, the increase of the yield of products is more than 3 times by improving the quality of treatment, including reduction in both the number of chips and the size of each of them,

- secondly, increasing the shelf life of the diamond disk. This is particularly important in the processing of hybrid and monolithic integrated circuits microwave.

Sources of information

1. Auth. St. USSR №255386, CL a. publ. Bull. No. 33, 1969

2. Patent of great Britain No. 1098398, CL NC, B3D.

3. Zaporizhzhya I.P., Lapshinov B.A. Processing of semiconductor materials. - M High school, 1988, p.38-54.

Hatent of the Russian Federation No. 2137251, CL H01L 21/304, publ. 10.09.99,

Table
№ p/pThe settings specified in the claimsThe results of the tests
The processed materialGrain almatadema his material, mcmThe thickness campfireusa layer, μmThe number of splits along the line of cut pieces/mmChips, mcmThe yield, %
1ferrite60/40201,4less than 3095
260/406 1,8less than 3093
360/40401,6less than 3096
1silicon20/14101,3less than 2091
221,6less than 2090
3151,4less than 2093
the placeholderferrite60/40no4less than 6030

1. The drive of the diamond-containing material for processing electronic materials and products made from grain, given the material to be processed, characterized in that as the basis of diamond-containing material take rigid material, the disc is made of at least two alternating layers of diamond-containing material, between which is located and connected with them the damping layer, while the damping layer is made of elastic material, of a thickness of 1/10-2/3 grit diamond-containing material.

2. The drive of the diamond-containing material on the I processing of electronic materials and articles thereof according to claim 1, characterized in that the number of alternating layers of diamond-containing material determines the type of processing, for example, or cutting, or grinding.

3. The drive of the diamond-containing material for processing electronic materials and articles thereof according to claim 1, characterized in that the connection of the damping layer with layers of diamond-containing material is performed either by glue or by welding.

4. The drive of the diamond-containing material for processing electronic materials and articles thereof according to claim 1, characterized in that the damping layer is made of elastic material, such as heat-resistant rubber.



 

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