Three-dimensional molded flat cable, its manufacturing method and application

FIELD: electrical engineering; cable industry.

SUBSTANCE: proposed flat cable is made of multilayer material incorporating at least one current-carrying track enclosed by two insulating layers and at least one carrier layer both joined together by means of adhesive layer. Multilayer material or all its components are placed on molding tool and molded under action of heat, irradiation, and/or pressure, whereupon they are fixed in three-dimensional mold by cooling below adhesive layer vitrification temperature Tg or its solidification temperature.

EFFECT: facilitated manufacture.

12 cl, 18 ex

 

The invention relates to three-dimensional (3D) formed of a flat cable, method of its manufacture and application.

From the document DE-A 19649972 known method of manufacturing wiring kit for vehicles, in which the wires taped carrier foil and equipped with plugs and fixed on the carrier forms, and at least some of the transactions consist of bare stranded conductors, which are arranged one behind the other and independently of each insulating, provided with the adhesive layer of the carrier foil along a given linear guide, and then or on a carrier foil on the insulating protective foil and glued with carrier foil with application of pressure, or the carrier foil and laid stranded conductor covered by a layer of protective lacquer and finally adjusted the cropping on the contour. The disadvantage of this method is labor-intensive strip of conductive paths and their fastening on the carrier stable forms.

From the document DE-A 19628850 known cable Assembly and method of its manufacture, which has a conductive cables, which are located in the first polymer layer with grooves, and the first polymer layer is made so that it runs along the given line of the strip of conductive cables, and a second layer of polymer, which is hard with azan with the first polymer layer, so that it covers at least the recess of the first layer of polymer is applied by vacuum molding.

Known solutions have the disadvantage that they must be very time-consuming process of manually plotted on the surface of the carrier stable forms, or must be made of separate parts, printed conductors and their position must be recorded by the second polymer.

The invention has as its objective to create a set of three-dimensional (3D) formed flat cable and method of its manufacture, which eliminates the disadvantages of known solutions and allows the intermediate stage to produce flat termostabilno cables that only in the second stage are placed in their places of Assembly.

According to the invention the task is solved by a three-dimensional molded thermostabilizer flat cable consisting of a multilayer material which comprises at least one enclosed between two insulating layers, conductive paths and at least one carrier layer, which are connected to each other through the adhesive layer, and a multilayer material or all of the components for multi-layer material deposited on the forming tool and under the action of heat, irradiation and/or pressure molded, and by ohlord the deposits below the glass transition temperature Tg of the adhesive layer or curing of the adhesive layer is fixed in a three dimensional form.

This 3D cable is also an intermediate item, suitable for storage prior to Assembly. Supporting layer may consist of metal or plastic layers of foil or porous layers.

Preferably as an adhesive layer is used, a thermoplastic adhesive, a thermoplastic adhesive foil and/or adhesive non-woven material with a melting point Tm<180°and/or latent reactive adhesive with temperature stitching <140°C. the Adhesive layers of this type can firmly bind the bearing layer flat cable and shaped intermediate molded parts. Can also be used temperature stitching >140°when by cooling the layer of conductive tracks may be damaged. When using reactive adhesives cooling may be unnecessary, of course must be carried out corresponding to the fixing by the subsequent curing by crosslinking.

For the best use can be provided for forming the coating over the porous layer. The porous layer is preferably made of non-woven material or fabric of the polymeric fiber.

Flat cable according to the invention can at least partially be covered by thermoplastic. Thus, the manufacture of molded parts is possible on site Assembly.

Preferably Roudnice conductive paths before obtaining a multilayer material of the cable (lamination) open at least part of the outer surface for formation of the contact fields.

Especially preferred is a flat cable, which is equipped with electronic components. Thus a very efficient manner can be made functional and technical ready built-in electronic parts.

Fabrication of 3D flat cable as intermediate parts occurs in such a way that the multilayer material consisting of layers of flat cable, adhesive and non-woven material is applied to the molding tool is aligned under the action of heat and/or irradiation and/or pressure molded, and cooled below the glass transition temperature Tg of the adhesive layer or curing of the adhesive layer is fixed in its three dimensional form and are removed from the moulding tool. As a pressure, for example, negative pressure is applied to the back side of the multilayer material.

Preferably fixed in its three-dimensional shape of the multilayer part is further processed by the punches, cutters or cutters and at a particular stage are mounted on the place of use or for easy Assembly at least partially covered by thermoplastic molding under pressure.

To equalize the temperature is preferably in the process of obtaining a multilayer material (glossy is) and/or in the molding tool to use metal foil.

As a non-woven material for the above-mentioned method is preferably used materials from polyester or polyamide, which have a thickness of from 0.1 to 2 mm, a tensile strength of 50 to 250 N/50 mm and the elongation of 30 to 50%. Used as thermoplastic adhesive layer of the adhesive non-woven material should have a softening temperature between 30 and 180°s, and its density should be between 10 and 70 g/m2and it should have a low melt index.

Further, the invention represented by examples.

Example 1

As a material used flexible flat cable (FFC), with the thickness of 1.2-1.4 mm, melting adhesive non-woven material from copolyamids with Tm: 105-110°With a density of 30 g/m2and thermally associated polyethylenterephtalate (PET) spunbond non-woven material with a density of 250 g/m2. On the reverse side of the FFC using an Ironing press laminated non-woven material with an adhesive substance, melting at 140°C. non-Woven material used as a base layer, melting the adhesive substance improves formability. This multilayer material is fixed on the positive forming tool and molded at 140°C/30 C. After cooling the tool multilayer material is removed from the mold as a flat thermostability cable.

Example 2

p> Analogously to example 1 flexible flat cable laminated together with copolyamides density of 45 g/m2with melting point Tm from 105°and thermally connected staple-fiber nonwoven material of polyethylenterephtalate fibers with a density of 100 g/m2using aluminum foil 0.5 mm thickness as a cooling element and at 140°/45 is fixed on the positive forming tool. After cooling the tool multilayer material is removed from the mold as thermostability cable.

Example 3

Analogously to example 1 flexible flat cable laminated together with an adhesive substance, curing by ultraviolet light (UV) and heat-related spunbond nonwoven material of polyethylenterephtalate fibers with a density of 150 g/m2. The formation occurs at room temperature under irradiation of UV-light on the positive forming tool. After cooling the tool multilayer material is removed from the mold as a flat thermostability cable. Then flat cable stable form is partially covered with a polypropylene molding under pressure.

Example 4

Analogously to example 1 flexible flat cable, which is equipped with electronic structural elements, such as light emitting diodes (LED), laminated instead of the e copolyamides density of 25 g/m 2with melting point Tm from 105°and thermally connected spunbond nonwoven material of polyethylenterephtalate fibers with a density of 150 g/m2and at 110°C/120 is fixed on the positive forming tool. After cooling the tool multilayer material is removed from the mold as a flat cable stable forms.

Additional examples are presented in the following tables.

1. Three-dimensional molded thermostability flat cable consisting of a multilayer material which comprises at least one enclosed between two insulating layers, conductive paths and at least one carrier layer, which are connected to each other through the adhesive layer, and a multilayer material or all of the components for multi-layer material deposited on the forming tool and under the action of heat, irradiation and/or pressure molded, and by cooling below the glass transition temperature Tg of the adhesive layer or curing of the adhesive layer is fixed in a three dimensional form.

2. Flat cable according to claim 1, characterized in that the carrier layer consists of a metal or plastic foil.

3. Flat cable according to claim 1, characterized in that the carrier with the ow consists of a porous layer.

4. Flat cable according to one of claims 1 to 3, characterized in that the adhesive layer comprises a thermoplastic adhesive substance, a thermoplastic adhesive foil and/or adhesive non-woven material with a melting point Tm<180°and/or latent reactive adhesive substance with temperature stitching <140°C.

5. Flat cable according to claim 2 or 3, characterized in that the additional porous layer that serves as a covering.

7. Flat cable according to one of claims 1 to 3, characterized in that the flat cable at least partially coated with a thermoplastic.

8. Flat cable according to one of claims 1 to 3, characterized in that the conductors of the conductive paths before receiving the multi-layered material, at least part of their outer surface are open for the formation of the contact fields.

9. Flat cable according to one of claims 1 to 3, characterized in that the flat cable is equipped with an electronic structural elements.

10. Method of making flat thermostabilizer cable according to one of claims 1 to 9, characterized in that the multilayer material consisting of layers of flat cable, the adhesive substance and the base layer, or all of the components for multilayer material separately applied to the molding tool, leveled at a room temperature under the action of heat, irradiation and/or pressure shape, and so is f by cooling below the glass transition temperature Tg of the adhesive layer or curing of the adhesive layer is fixed in three-dimensional form and then removed from the molding tool.

11. The method according to claim 10, characterized in that for equalizing the temperature in the process of obtaining a multilayer material and/or forming tool use metal foil.

12. The method according to claim 10 or 11, characterized in that fixed in its three dimensional form part of the multi-layered material is mounted on a separate stage or covered with a thermoplastic molding under pressure.



 

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