Electronic circuit with conductive links and method for making such links

FIELD: engineering of circuits made of several layers, in particular, of substrate, adhesive layer and conductive layer, possible use, mainly, in cards with external contact or without it or in electronic labels; in accordance to invention cards or electronic labels have multiple possible uses, mainly as means of identification, control or payment.

SUBSTANCE: in accordance to invention electronic circuit contains at least one electronic element, substrate, applied to which are adhesive layer and conductive layer with a set of tracks. Electronic element contains at least two connecting zones. One of these connecting zones is electrically connected to conductive layer by means of conductive link, formed by conductive segment, selected from conductive layer. Conductive segment, free of any adhesive substance, is passed through a slit in substrate and is connected to connecting zone.

EFFECT: production of cheap electronic circuit, useable for example in cards or labels, simultaneously maintaining high level of reliability.

3 cl, 12 dwg

 

The technical field

The present invention relates to an electronic circuit containing conductive jumpers, and to a method of manufacturing such bridges. The electronic circuit contains conductive paths that are connected with at least one electronic element. The creation of conductive jumpers need for connection with one of the connecting zones of the element.

The level of technology

The invention relates to circuits, made of several layers, in particular of the substrate, the adhesion layer and the conductive layer. The scheme of this type, mainly used in maps with an external contact or without him or electronic labels. Under the electronic label is understood to mean an Assembly containing at least a flexible base, the antenna and the electronic element, usually the chip. Card or electronic label in accordance with the invention find many applications, in most cases, as a means of identification, control or payment.

The present invention is primarily directed to an electronic circuit containing an insulating base, known as the substrate, on which is engraved with many tracks or frame (loop antenna). They are connected by at least one electronic element, for example with a chip.

An electronic circuit in which the contacts of the electronic element is directly connected by soldering or a conductive adhesive with connection zones underneath, well known. In accordance with the type of the schema containing the conductive track or of the frame, the connection of the contact element with one of these tracks requires a conductive jumper. In particular, such a case occurs when the connection of the frame with an electronic chip.

In fact, both ends of the frame are arranged on the inner and outer side of the coils. One of the contacts of the chip is directly connected to one end of the frame, and the other end should be connected through a conductive jumper with the other end of the frame. This jumper is usually created by means of conductive paths, passing over other tracks. In order to avoid a short circuit, jumper separate part of the insulating film, glued to the tracks, which it crosses. Another solution is that the jumper spend (pass) through the substrate, to create an electrical bridge, carried out on the other side of the substrate under the conductive tracks and then re-spend through the substrate, in order to reach more distant areas of the connection. This transaction usually do through drilled in the track opening, which fill a conductive material that provides the connection to the track. Jumper conducted through the hole, you solder on the other side to one of the conductive paths, which she re is ekaet.

In the patent document JP 2000057289 describes a contactless card that contains the frame, connected to the chip located in the inner area of the orbits of the frame. Here the Assembly diagram glued to a flexible substrate. The inner end of the frame is directly connected to the chip, while its outer end passes through the substrate and under the coils of the frame. In a specific embodiment, a flexible thin substrate portion of the substrate on which glued the outer end of the frame, cut off. Then this end of the curve by conducting coils under the frame until the transaction through the substrate through the hole so that he could be near its inner end. Thus, the chip can be connected at both ends close to each other on the same surface of the schema.

In the patent document US 2900580 describes the channel made in the form of window in the substrate covered with a conductive layer. The window cut out on the substrate, only to have preserved only the conductive layer. The last cut on three sides, the latter side bend over the edge of the window to display the cut part of the layer on the opposite side. On this surface, attach additional insulating layer and then the window is hermetically covered with a resin.

In the patent document JP 10092870 describes the wiring paths through the hole pramogos the Noi form on the substrate, providing the opportunity of establishing contact with a conductive layer on the opposite side. This conductive layer cut on three sides along the edges of the holes and then bent along the fourth side, in order to bring the cut out portion on the top surface.

Known electrical jumpers, described above, have a significant drawback - they require precise and expensive operations. At the same time, producing a large number of diagrams, cards or labels requires minimal cost and high speed operations.

Disclosure of inventions

The aim of the present invention is to eliminate the above disadvantages for receiving electronic circuit (used, for example, in the map or label) low cost and high reliability. In particular the present invention relates to the connection of one or more electronic components with conductive paths through the conductive jumpers, passing through the substrate.

Another objective of the present invention is to provide a method of manufacturing such a conductive jumper.

To achieve the above objectives established an electronic circuit containing at least one electronic element, a substrate formed of a flexible insulating material, at least, one of the n-adhesion layer and a conductive layer with many tracks, and the electronic element contains at least two connecting zones. At least one of the connecting zones is electrically connected with the conductive layer through the conductive jumpers. An electronic circuit according to the invention is characterized by the fact that the substrate contains at least one bar is mostly rectangular in shape, formed by cutting the substrate along three sides. With the remaining side strips connected to the substrate, and the retainer is formed of a conductive segment, isolated from the conductive layer, free from any adhesive conducted through the substrate through one of the cutouts which are formed due to the formation of stripes, and connected to the connecting area.

An electronic circuit in accordance with the present invention includes an insulating layer, called the substrate, at least one adhesive layer and conductive layer, bonded to the substrate. Conductive layer contains many tracks and/or frame (frame antenna), to which is attached an electronic item. The contact element is usually placed close to each other and are placed so that they can be soldered to the connecting zones of tracks located below the element and addressed to the last. To connect track, out of the zone behind the other tracks, the image is concerned, for example, the coils of the frame, it is necessary to cross these tracks. This intersection operates with a jumper, which once carried through the substrate, to bring it to the opposite side under crossed paths. The second wiring through the substrate returns the jumper on the level of the connecting area located under the electronic element.

This strap is formed by the continuation (extension) tracks originating from the conductive layer. This continuation of the track, which forms a segment of the track, not glued to the substrate. After the jumper twice pass through the substrate, the end then you solder to the connection area.

In accordance with the present invention transactions through the substrate is performed through the cutouts in the past, but without removing material, as, for example, when drilling. In the present invention the substrate is made of a flexible thin material. Such a substrate is used commonly in the manufacture of cards or electronic labels.

In electronic circuits, where the transaction through the substrate carry out drilling or cutting (removing substrate material), the hole closed again by re-sealing with adhesives after posting conductive segment through the substrate. In finishing operations, for example when applying a decorative, the CSOs layer (lamination), there are depressions on the level of the holes. To eliminate this disadvantage it is necessary to increase the flow of adhesive and create more pressure or high temperature lamination.

Transactions carried out by cutting the substrate have the advantage consisting in the fact that with this method cuts easier to close after passing through them jumpers. As a consequence, the final lamination of the electronic circuit can be performed at lower pressure and temperature. In addition, simplifies the manufacturing process because there is no need for re-sealing the wiring channel jumper. The resulting scheme has a flat surface without deformation due to the wiring through the substrate. The flatness of the scheme is particularly important for thin circuits, substrates which are mounted electronic components.

Schemes of this type are often used in electronic labels, which must be flexible and reliable and have a low cost in the manufacture.

Wiring segment paths through the cut-out is possible because, on the one hand, the use of thin paths emerging from the conductive layer, and, on the other hand, due to the curved shape of the edges of the cutouts. Such rounded edges produced by a pressure from the side of the cutting tool (blade, punch, used the La cut. The elasticity of the substrate is also used for temporary education neckline sufficient for through him conductive segment.

Transaction of the type described exercise as many times as needed to cross paths.

The length of the jumper depends, therefore, on the number of transactions and the distance to the zone of connection with the electronic element. Multiple tracks can pass through the same cut one after the other, and the length of the cut will depend on the width and number of lanes, passing from one surface of the substrate to another.

Another exemplary embodiment of an electronic circuit in accordance with the present invention provides for the presence of a conductive layer on each surface of the substrate. In this case, conductive transition from one substrate to another and/or jumper, crossing the tracks, make it through the cutouts in the substrate is formed by cutting the substrate, as described above.

The aim of the present invention is also a method of manufacturing an electronic circuit containing a substrate formed of a flexible insulating material, at least one adhesion layer and a conductive layer with many tracks, and the electronic element. The method according to the invention is characterized by the fact that the implementation of bridges between the area of the conducting layer is the target area connection is realized by means of the following operations:

- extend the path in the conductive layer for the formation of a conductive segment,

- form the hole in the pad,

- temporarily open the specified cut

- miss conductive segment through the neckline,

- bend conductive segment, placing it on the opposite side of the substrate,

- close the cut after posting conductive segment,

- connect the conductive segment of the connection with the target area.

The track, leaving a conductive layer which forms a conductive segment, is usually a continuation (extension) track circuits formed on the conductive layer.

The hole in the pad create by cutting using a blade or stamp in order to receive the bar is mostly rectangular in shape, the lower side of which is connected with the substrate. The length of the strips is determined by the thickness and elasticity of the substrate, and a width of a conductive segment (conductive segments forming the jumper (forming jumpers)that must (should) be conducted through the substrate. This bar press up to open neckline and allow the segment(s) to pass through the substrate. The strip then return to the site after the posting of the segments so as to close the opening and to retain the original flatness of the diagram or map. The segments are then bent across the lagoon on the false side of the substrate and directed to the area, specific to the second wiring through the substrate, if necessary. The second strip should be cut so that the segment(s) again was located(were) on the conductive layer through the wiring in the opposite direction. These segments will then be attached to the area of target compound e(s) item(s). On the last operation of the method of manufacturing the adhesive of the adhesive layer thermoactivated and fix the jumper (i.e. conductive segment on the substrate.

In the scheme with double conductive layer on both surfaces of the substrate) required only one strip to provide connection to another surface by means of the track segment extending from the first surface.

From the foregoing it is clear that the method of intersection of the substrate of the electronic circuit through the conductive jumpers, requiring fewer manufacturing operations, is relatively inexpensive. All the strips are necessary, can be cut in the substrate on one and the same operation, with the appropriate tool saves them unbent (open), to ensure the wiring segments. The return of the strips in a flat position and bending of the segments relative to the surface can occur during the laminating operation.

The present invention also provides for the creation of e is ectroni labels, which is characterized by the fact that contains an electronic circuit in any of the above embodiments.

Brief description of drawings

The invention will be clearer from the following detailed description in which reference is made to the accompanying drawings, given as examples, not limiting the scope of protection of the present invention.

Figure 1 shows in perspective a part of the circuit with a jumper, passing under the tracks.

Figure 2 presents a General view of the portion of the circuit with two pre-cut strips and a segment of the track before posting it through the substrate.

Figure 3 shows the cross section of the diagram shown in figure 2.

Figure 4 shows the first curved strip and the track segment, conducted through the notch.

Figure 5 shows a segment of the tracks, bent relative to the substrate, and the first strip is returned to its original position.

Figure 6 presents the second bent strip and the track segment, conducted through the notch.

7 shows the second strip is returned to its original position.

On Fig presents a segment of the track, bent relative to the substrate, and the second strip is returned to its original position.

Figure 9 shows a General view of the bridge in its final form after two transactions Squaw is substrate.

Figure 10 presents a General view of the portion of the circuit with the electronic element placed on the tracks and soldered to them.

Figure 11 presents the cross-section of the diagram shown in figure 10.

On Fig presents a cross section similar to 11, but with the electronic element, placed inside the substrate and soldered under the tracks.

The implementation of the invention

Figure 1 shows a perspective view of a conductive jumper 1 crossing the substrate 5 through the first cut, passing under the tracks 4 and again crossing the substrate 5 through the second cutout. The notches formed by cutting the substrate and cut the strips 2 and 3. As can be seen, the latter is raised, to better demonstrate the passage of paths through the substrate 5. The jumper is formed by the continuation (extension) track or segment 1 track, which is not bonded to the substrate 5. In accordance with the stage, not shown here, the adhesive layer is selectively applied to the substrate so that the area or a conductive track, which will form a conductive segment is free from adhesive.

Figure 2-9 shows the different stages of creation of the jumpers shown in figure 1.

Figure 10-13 shows the connection of the electronic element after creating the bridge.

Figure 2 shows pre-cut strips 2 and 3 of rectangular shape,one of the short sides of which remains associated with the substrate. Cuts are made on each side of the track 4, which must intersect the segment 1 tracks.

Figure 3 shows a cross-section of the Assembly plane a-a in figure 2, which illustrates the first step of the bridge, formed by the segment 1 tracks.

Segment 1 covers the first strip 2, but not attached to it.

Figure 4 shows the first pre-cut strip 2, bent down in order to allow the segment 1 paths formed through the neck. Segment 1 is bent along the edge of the cut formed by the strip, and then sent down through the neckline.

Figure 5 shows the first strip 2, returned again to the same level as the substrate 5, that is in the same position as before posting segment 1 tracks. The last bend on the opposite side of the substrate 5 and is directed under the tracks 4 to the second pre-cut strip of 3.

Figure 6 shows the second wiring segment 1 paths through the notch formed by the second strip 3. This time the strip 3 are bent up to allow the segment 1 to pass through the substrate 5. Segment 1 track then bend at the edge of the neckline, as with the first swing through the substrate 5.

7 shows the second strip is returned to its original position, with segment 1 track, conducted through the substrate 5.

Fig and 9 illustrate the final Polo is giving segment 1 track, bent over the edge of the substrate 5 next to the other tracks. Part of the segment 1 track becomes the connecting area 7 for the electronic element 6. The first contact you solder to the segment 1 of the track, and the other contact to the track next with the specified segment, as shown in figure 10 and 11.

On Fig shows another way of connecting element 6 with the conductive paths.

Item is located in the small window cut in the substrate so that its contacts facing the tracks passing within the window. This Assembly allows you to place the electronic element on the substrate and to get through this electronic label with a minimum thickness.

According to another exemplary embodiment of the present invention, instead of using strips vyshtampovannyj of the substrate, wiring jumper from one side of the substrate to another is performed through the notch formed by removing the substrate material, for example by drilling or cutting. Similarly, as in the case of strips, the jumper is formed using a conductive segment constituting a continuation of the track, formed from the conductive layer. This segment is free of adhesive, passes through the substrate through the neckline and creates a connection to another of its surface.

This method makes possible the production of full-time is inexpensive electronic circuits with a single conductive layer, while maintaining the ability to place one or many tracks, crossing the other tracks.

If, for example, the necessary electronic label or card with a microchip (chip card), then wrap tightly closed with a special sealing substance, for example, epoxy resin. Finish lamination ensures the flatness of the schema.

1. An electronic circuit containing at least one electronic element (6)made of a flexible insulating material substrate (5), at least one adhesion layer and a conductive layer with many tracks (4), and an electronic element (6) contains at least two connecting zones (7), at least one of which is electrically connected with the conductive layer through the conductive jumpers, characterized in that the substrate contains at least one strip (2, 3) predominantly rectangular shape, created by cutting the substrate (5) on the three sides of the strips, and the remaining side strips connected with the substrate (5)and retainer are formed of a conductive segment (1), isolated from the conductive layer, free from any adhesive conducted through the substrate through one of the cutouts which are formed due to the formation of the strips (2, 3), and connected to the connecting area (7).

2. An electronic circuit according to claim 1, characterized in that the substrate (5) has a first surface with a first adhasionsleim and the first conductive layer, and a second surface with a second adhesive layer and the second conductive layer, and the retainer is formed of a conductive segment (1), selected only from the second conductive layer, free from adhesives, passing through the substrate (5) through one of the cutouts which are formed due to the formation of the strips (2, 3), and connected to the connecting area (7) and/or the first conductive layer.

3. An electronic circuit according to claim 1 or 2, characterized in that several bridges formed by segments (1) paths, conducted through the substrate (5) through the same neckline.

4. An electronic circuit according to claim 1 or 2, characterized in that at least one retainer formed by segments (1) paths that passed through the substrate (5) as many times as needed for crossing tracks (4), belonging to the conducting layer to provide a connection zone (7).

5. Electronic label, characterized in that it contains an electronic circuit according to any one of claims 1 to 4.

6. A method of manufacturing an electronic circuit containing a substrate (5), formed of flexible insulating material, at least one adhesion layer and a conductive layer with many tracks (4)and an electronic element (6), characterized in that the running jumpers between the area of the conducting layer and the target connection area (7) implementation is given by the following operations: extend the path in the conductive layer for the formation of a conductive segment (1), cut in the substrate (5) the bar is mostly rectangular in shape, one side of which is connected with the substrate (5), temporarily open the hole in the pad by squeezing the strips (2, 3), which are bent on the side associated with the substrate (5), conduct conductive segment (1) through the specified cut, bend conductive segment (1), placing it on the opposite surface of the substrate (5), close the cut after posting conductive segment (1) return the strip to its original position at the level of the substrate (5), connect the conductive segment (1) connection with the target area (7).

7. The method according to claim 6, characterized in that the target of the connecting zone is located on the conductive layer and conductive segment (1) return to the specified conducting layer by re-wiring through the substrate through the notch formed by the formation of additional strips (2, 3), and then fix the segment (1) on a substrate (5) activation of the adhesive included in the adhesive layer.



 

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